FI941951A0 - Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi - Google Patents

Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi

Info

Publication number
FI941951A0
FI941951A0 FI941951A FI941951A FI941951A0 FI 941951 A0 FI941951 A0 FI 941951A0 FI 941951 A FI941951 A FI 941951A FI 941951 A FI941951 A FI 941951A FI 941951 A0 FI941951 A0 FI 941951A0
Authority
FI
Finland
Prior art keywords
manufacturing
same
circuit component
chip type
type circuit
Prior art date
Application number
FI941951A
Other languages
English (en)
Swedish (sv)
Other versions
FI941951A (fi
FI113909B (fi
Inventor
Osamu Kanoh
Atsuo Senda
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of FI941951A0 publication Critical patent/FI941951A0/fi
Publication of FI941951A publication Critical patent/FI941951A/fi
Application granted granted Critical
Publication of FI113909B publication Critical patent/FI113909B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
FI941951A 1993-04-30 1994-04-27 Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi FI113909B (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10450393 1993-04-30
JP5104503A JPH06314622A (ja) 1993-04-30 1993-04-30 チップ型回路部品及びその製造方法

Publications (3)

Publication Number Publication Date
FI941951A0 true FI941951A0 (fi) 1994-04-27
FI941951A FI941951A (fi) 1994-10-31
FI113909B FI113909B (fi) 2004-06-30

Family

ID=14382316

Family Applications (1)

Application Number Title Priority Date Filing Date
FI941951A FI113909B (fi) 1993-04-30 1994-04-27 Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi

Country Status (5)

Country Link
US (2) US5699025A (fi)
EP (1) EP0622848B1 (fi)
JP (1) JPH06314622A (fi)
DE (1) DE69421209T2 (fi)
FI (1) FI113909B (fi)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7231238B2 (en) 1989-01-13 2007-06-12 Superconductor Technologies, Inc. High temperature spiral snake superconducting resonator having wider runs with higher current density
US6026311A (en) * 1993-05-28 2000-02-15 Superconductor Technologies, Inc. High temperature superconducting structures and methods for high Q, reduced intermodulation resonators and filters
US5879812A (en) * 1995-06-06 1999-03-09 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor and method of producing the same
US20080039333A1 (en) * 1997-06-30 2008-02-14 Willemsen Cortes Balam Q A High temperature superconducting structures and methods for high Q, reduced intermodulation structures
US6194248B1 (en) * 1997-09-02 2001-02-27 Murata Manufacturing Co., Ltd. Chip electronic part
JP3250503B2 (ja) * 1997-11-11 2002-01-28 株式会社村田製作所 可変インダクタ素子
FR2797089B1 (fr) * 1999-07-29 2002-09-20 Cit Alcatel Procede pour l'obtention d'un module incluant un bobinage inductif et module correspondant
DE20011223U1 (de) * 2000-06-26 2000-10-05 Kindler, Ulrich, Prof. Dr.-Ing., 22143 Hamburg Vorrichtung zur berührungslosen Wegmessung, insbesondere zur Stellungs- und Bewegungserfassung
JP2002261561A (ja) * 2001-02-27 2002-09-13 Matsushita Electric Ind Co Ltd フィルタ部品
US20030222732A1 (en) * 2002-05-29 2003-12-04 Superconductor Technologies, Inc. Narrow-band filters with zig-zag hairpin resonator
AU2003267835A1 (en) * 2002-09-27 2004-04-19 Hwang, Soon Ha Piezoelectric vibrator and fabricating method thereof
US20060091534A1 (en) * 2002-12-13 2006-05-04 Matsushita Electric Industrial Co., Ltd. Chip part manufacturing method and chip parts
JP3827311B2 (ja) * 2003-02-26 2006-09-27 Ｔｄｋ株式会社 コモンモードチョークコイルの製造方法
TWI262041B (en) * 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
JP4250718B2 (ja) * 2004-04-30 2009-04-08 富士通コンポーネント株式会社 フィルタ装置及び回路モジュール
US7612641B2 (en) * 2004-09-21 2009-11-03 Pulse Engineering, Inc. Simplified surface-mount devices and methods
JP4438659B2 (ja) * 2005-03-24 2010-03-24 Ｔｄｋ株式会社 積層セラミック電子部品の製造方法
US20070065964A1 (en) * 2005-09-22 2007-03-22 Yinon Degani Integrated passive devices
US7355264B2 (en) * 2006-09-13 2008-04-08 Sychip Inc. Integrated passive devices with high Q inductors
WO2009011168A1 (ja) * 2007-07-13 2009-01-22 Murata Manufacturing Co., Ltd. マイクロストリップラインフィルタおよびその製造方法
KR20160019265A (ko) * 2014-08-11 2016-02-19 삼성전기주식회사 칩형 코일 부품 및 그 제조방법
TWI580806B (zh) * 2015-05-29 2017-05-01 Production method of wafer - type thin film resistors
RU182125U1 (ru) * 2017-12-26 2018-08-03 Федеральное государственное автономное образовательное учреждение высшего образования "Уральский федеральный университет имени первого Президента России Б.Н. Ельцина" Микрополосковый полосно-пропускающий фильтр

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3061501A (en) * 1957-01-11 1962-10-30 Servel Inc Production of electrical resistor elements
US3416994A (en) * 1967-01-12 1968-12-17 Du Pont Cross-linked polyimide
US4157517A (en) * 1977-12-19 1979-06-05 Motorola, Inc. Adjustable transmission line filter and method of constructing same
DE3382208D1 (de) * 1982-12-15 1991-04-18 Nec Corp Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur.
US4468857A (en) * 1983-06-27 1984-09-04 Teletype Corporation Method of manufacturing an integrated circuit device
JPH082612B2 (ja) 1985-05-30 1996-01-17 三井東圧化学株式会社 金属ベースプリント配線基板及びその製造方法
US4916417A (en) * 1985-09-24 1990-04-10 Murata Mfg. Co., Ltd. Microstripline filter
JPS6412510A (en) * 1987-07-07 1989-01-17 Matsushita Electric Ind Co Ltd Lc composite component and manufacture thereof
JPH0666407B2 (ja) 1987-10-09 1994-08-24 シャープ株式会社 立体型半導体装置の製造方法
JPH01151311A (ja) * 1987-12-08 1989-06-14 Murata Mfg Co Ltd Ｌｃフィルタ
JP2615151B2 (ja) * 1988-08-19 1997-05-28 株式会社村田製作所 チップ型コイル及びその製造方法
FR2635920B1 (fr) * 1988-08-30 1990-10-12 Thomson Csf Procede de fabrication d'une zone de connexion pour un circuit hyperfrequence de type triplaque et circuit ainsi obtenu
US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
JP2789567B2 (ja) * 1989-08-16 1998-08-20 株式会社村田製作所 誘電体共振器
JPH04348045A (ja) * 1990-05-20 1992-12-03 Hitachi Ltd 半導体装置及びその製造方法
JPH04297092A (ja) * 1991-03-26 1992-10-21 Matsushita Electric Works Ltd セラミック多層回路板の製造方法
JPH0514101A (ja) 1991-07-01 1993-01-22 Murata Mfg Co Ltd Ｌｃ共振子
US5412865A (en) * 1991-08-30 1995-05-09 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer electronic component
JP2798148B2 (ja) * 1991-10-16 1998-09-17 日立金属株式会社 静磁波素子
US5309122A (en) * 1992-10-28 1994-05-03 Ball Corporation Multiple-layer microstrip assembly with inter-layer connections
JP3083416B2 (ja) * 1992-11-06 2000-09-04 進工業株式会社 ディレイライン素子およびその製造方法
US5506551A (en) * 1993-07-05 1996-04-09 Murata Manufacturing Co., Ltd. Resonator and chip type filter using the resonator

Also Published As

Publication number Publication date
US6478920B1 (en) 2002-11-12
DE69421209D1 (de) 1999-11-25
DE69421209T2 (de) 2000-05-18
JPH06314622A (ja) 1994-11-08
US5699025A (en) 1997-12-16
FI941951A (fi) 1994-10-31
FI113909B (fi) 2004-06-30
EP0622848B1 (en) 1999-10-20
EP0622848A1 (en) 1994-11-02

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Legal Events

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MA Patent expired