ATE123371T1 - Plasmaeinschnürungssystem und dessen anwendungsverfahren. - Google Patents

Plasmaeinschnürungssystem und dessen anwendungsverfahren.

Info

Publication number
ATE123371T1
ATE123371T1 AT89901826T AT89901826T ATE123371T1 AT E123371 T1 ATE123371 T1 AT E123371T1 AT 89901826 T AT89901826 T AT 89901826T AT 89901826 T AT89901826 T AT 89901826T AT E123371 T1 ATE123371 T1 AT E123371T1
Authority
AT
Austria
Prior art keywords
plasma
fluid
pinch
establishing
incoherent light
Prior art date
Application number
AT89901826T
Other languages
English (en)
Inventor
John F Asmus
Ralph H Lovberg
Keith Boyer
Original Assignee
Univ California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California filed Critical Univ California
Application granted granted Critical
Publication of ATE123371T1 publication Critical patent/ATE123371T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70016Production of exposure light, i.e. light sources by discharge lamps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00Gas-discharge or vapour-discharge lamps
    • H01J61/70Lamps with low-pressure unconstricted discharge having a cold pressure < 400 Torr
    • H01J61/72Lamps with low-pressure unconstricted discharge having a cold pressure < 400 Torr having a main light-emitting filling of easily vaporisable metal vapour, e.g. mercury
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/02Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma
    • H05H1/04Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma using magnetic fields substantially generated by the discharge in the plasma
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/52Generating plasma using exploding wires or spark gaps
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/045Electric field

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • On-Site Construction Work That Accompanies The Preparation And Application Of Concrete (AREA)
AT89901826T 1987-12-07 1988-12-02 Plasmaeinschnürungssystem und dessen anwendungsverfahren. ATE123371T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/129,152 US4889605A (en) 1987-12-07 1987-12-07 Plasma pinch system

Publications (1)

Publication Number Publication Date
ATE123371T1 true ATE123371T1 (de) 1995-06-15

Family

ID=22438680

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89901826T ATE123371T1 (de) 1987-12-07 1988-12-02 Plasmaeinschnürungssystem und dessen anwendungsverfahren.

Country Status (12)

Country Link
US (1) US4889605A (de)
EP (1) EP0390871B1 (de)
JP (1) JPH03501500A (de)
KR (1) KR930008523B1 (de)
CN (1) CN1043846A (de)
AT (1) ATE123371T1 (de)
AU (1) AU2941389A (de)
CA (1) CA1307356C (de)
DE (1) DE3853919T2 (de)
ES (1) ES2010381A6 (de)
IL (1) IL88546A0 (de)
WO (1) WO1989005515A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE127651T1 (de) * 1989-05-04 1995-09-15 Univ California Vorrichtung und verfahren zur behandlung von materialien.
US5102776A (en) * 1989-11-09 1992-04-07 Cornell Research Foundation, Inc. Method and apparatus for microlithography using x-pinch x-ray source
US6541786B1 (en) * 1997-05-12 2003-04-01 Cymer, Inc. Plasma pinch high energy with debris collector
US6452199B1 (en) * 1997-05-12 2002-09-17 Cymer, Inc. Plasma focus high energy photon source with blast shield
US6277202B1 (en) 1997-08-27 2001-08-21 Environmental Surface Technologies Method and apparatus for utilizing a laser-guided gas-embedded pinchlamp device
MY115490A (en) * 1998-06-26 2003-06-30 Meinan Machinery Works Apparatus and method for centering and feeding log
US6445134B1 (en) 1999-11-30 2002-09-03 Environmental Surface Technologies Inner/outer coaxial tube arrangement for a plasma pinch chamber
US7059249B2 (en) * 2001-01-23 2006-06-13 United Defense Lp Transverse plasma injector ignitor
US8633416B2 (en) * 2005-03-11 2014-01-21 Perkinelmer Health Sciences, Inc. Plasmas and methods of using them
US7557366B2 (en) * 2006-05-04 2009-07-07 Asml Netherlands B.V. Radiation generating device, lithographic apparatus, device manufacturing method and device manufactured thereby
JP2013519211A (ja) 2010-02-09 2013-05-23 エナジェティック・テクノロジー・インコーポレーテッド レーザー駆動の光源

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007430A (en) * 1969-10-14 1977-02-08 Nasa Continuous plasma laser
US3946382A (en) * 1970-01-28 1976-03-23 The United States Of America As Represented By The Secretary Of The Navy Search radar adaptive video processor
US3946332A (en) * 1974-06-13 1976-03-23 Samis Michael A High power density continuous wave plasma glow jet laser system
US4369514A (en) * 1980-10-30 1983-01-18 Bell Telephone Laboratories, Incorporated Recombination laser
US4450568A (en) * 1981-11-13 1984-05-22 Maxwell Laboratories, Inc. Pumping a photolytic laser utilizing a plasma pinch
US4641316A (en) * 1982-03-01 1987-02-03 Applied Electron Corp. D.C. electron beam method and apparatus for continuous laser excitation
US4454835A (en) * 1982-09-13 1984-06-19 The United States Of America As Represented By The Secretary Of The Navy Internal photolysis reactor
JPS59129772A (ja) * 1983-01-18 1984-07-26 Ushio Inc 光化学蒸着装置
US4525381A (en) * 1983-02-09 1985-06-25 Ushio Denki Kabushiki Kaisha Photochemical vapor deposition apparatus
JPS60175351A (ja) * 1984-02-14 1985-09-09 Nippon Telegr & Teleph Corp <Ntt> X線発生装置およびx線露光法

Also Published As

Publication number Publication date
KR900701034A (ko) 1990-08-17
CN1043846A (zh) 1990-07-11
CA1307356C (en) 1992-09-08
US4889605A (en) 1989-12-26
WO1989005515A1 (en) 1989-06-15
EP0390871A4 (en) 1991-12-11
AU2941389A (en) 1989-07-05
IL88546A0 (en) 1989-06-30
DE3853919D1 (de) 1995-07-06
JPH03501500A (ja) 1991-04-04
DE3853919T2 (de) 1996-02-15
KR930008523B1 (ko) 1993-09-09
EP0390871B1 (de) 1995-05-31
ES2010381A6 (es) 1989-11-01
EP0390871A1 (de) 1990-10-10

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