AT378308B - Verfahren zum herstellen von leiterplatten mit mindestens zwei leiterzugebenen - Google Patents
Verfahren zum herstellen von leiterplatten mit mindestens zwei leiterzugebenenInfo
- Publication number
- AT378308B AT378308B AT0015881A AT15881A AT378308B AT 378308 B AT378308 B AT 378308B AT 0015881 A AT0015881 A AT 0015881A AT 15881 A AT15881 A AT 15881A AT 378308 B AT378308 B AT 378308B
- Authority
- AT
- Austria
- Prior art keywords
- circuits
- added
- production
- circuit boards
- boards
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3006117A DE3006117C2 (de) | 1980-02-19 | 1980-02-19 | Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA15881A ATA15881A (de) | 1984-11-15 |
AT378308B true AT378308B (de) | 1985-07-25 |
Family
ID=6094962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0015881A AT378308B (de) | 1980-02-19 | 1981-01-16 | Verfahren zum herstellen von leiterplatten mit mindestens zwei leiterzugebenen |
Country Status (12)
Country | Link |
---|---|
US (1) | US4751105A (de) |
JP (1) | JPS56150900A (de) |
AT (1) | AT378308B (de) |
CA (1) | CA1162323A (de) |
CH (1) | CH658157A5 (de) |
DE (1) | DE3006117C2 (de) |
DK (1) | DK71481A (de) |
FR (1) | FR2476427A1 (de) |
IL (1) | IL62169A (de) |
IT (1) | IT1170737B (de) |
NL (1) | NL8100807A (de) |
SE (1) | SE456388B (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4735676A (en) * | 1986-01-14 | 1988-04-05 | Asahi Chemical Research Laboratory Co., Ltd. | Method for forming electric circuits on a base board |
DE3733002A1 (de) * | 1986-09-30 | 1988-04-07 | Wilde Membran Impuls Tech | Additiv metallisierte elektrisch leitfaehige struktur |
US4804575A (en) * | 1987-01-14 | 1989-02-14 | Kollmorgen Corporation | Multilayer printed wiring boards |
DE3812414A1 (de) * | 1988-04-14 | 1989-10-26 | Standard Elektrik Lorenz Ag | Verfahren zum herstellen einer allseitig geschirmten signalleitung |
EP1392886A2 (de) * | 2001-06-04 | 2004-03-03 | Qinetiq Limited | Strukturierungsverfahren |
DE102006008050A1 (de) * | 2006-02-21 | 2007-08-23 | Imi Intelligent Medical Implants Ag | Vorrichtung mit flexiblem Mehrschichtsystem zur Kontaktierung oder Elektrostimulation von lebenden Gewebezellen oder Nerven |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1073197B (de) * | 1955-06-28 | 1960-01-14 | ||
US3102213A (en) * | 1960-05-13 | 1963-08-27 | Hazeltine Research Inc | Multiplanar printed circuits and methods for their manufacture |
DE1142926B (de) * | 1961-11-15 | 1963-01-31 | Telefunken Patent | Verfahren zur Herstellung gedruckter Schaltungsplatten |
DE1267738B (de) * | 1962-10-29 | 1968-05-09 | Intellux Inc | Verfahren zur Herstellung von elektrischen Verbindungen zwischen den Stromkreisen von mehrlagigen gedruckten elektrischen Schaltungen |
FR1345163A (fr) * | 1962-10-29 | 1963-12-06 | Intellux | Circuits électriques en couches multiples et procédé pour leur fabrication |
US3226256A (en) * | 1963-01-02 | 1965-12-28 | Jr Frederick W Schneble | Method of making printed circuits |
US3350498A (en) * | 1965-01-04 | 1967-10-31 | Intellux Inc | Multilayer circuit and method of making the same |
DE1590753A1 (de) * | 1966-10-01 | 1970-05-14 | Telefunken Patent | Verfahren zur Herstellung einer doppelseitig mit Leitungszuegen bedeckten Isolierstoffplatte mit metallisierten Loechern |
US3597834A (en) * | 1968-02-14 | 1971-08-10 | Texas Instruments Inc | Method in forming electrically continuous circuit through insulating layer |
NL6808469A (de) * | 1968-06-15 | 1969-12-17 | ||
US3640853A (en) * | 1968-12-27 | 1972-02-08 | Rca Corp | Adhesion of nonconducting and conducting materials |
US3672986A (en) * | 1969-12-19 | 1972-06-27 | Day Co Nv | Metallization of insulating substrates |
US3697319A (en) * | 1970-12-09 | 1972-10-10 | Rca Corp | Method of metallizing an electrically insulating surface |
US4005238A (en) * | 1973-10-25 | 1977-01-25 | Akademie Der Wissenschaften Der Ddr | Metallized articles and method of producing the same |
JPS5210568A (en) * | 1974-12-28 | 1977-01-26 | Hideo Machida | Method of manufacturing multilayered printed wiring substrate |
JPS528504A (en) * | 1975-07-09 | 1977-01-22 | Toshiba Corp | Electro magnetic pump |
JPS5288772A (en) * | 1976-01-20 | 1977-07-25 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
JPS5388960A (en) * | 1977-01-14 | 1978-08-04 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
-
1980
- 1980-02-19 DE DE3006117A patent/DE3006117C2/de not_active Expired
-
1981
- 1981-01-16 AT AT0015881A patent/AT378308B/de not_active IP Right Cessation
- 1981-01-30 SE SE8100733A patent/SE456388B/sv not_active IP Right Cessation
- 1981-02-18 FR FR8103174A patent/FR2476427A1/fr active Granted
- 1981-02-18 DK DK71481A patent/DK71481A/da not_active Application Discontinuation
- 1981-02-18 CH CH1074/81A patent/CH658157A5/de not_active IP Right Cessation
- 1981-02-18 NL NL8100807A patent/NL8100807A/nl not_active Application Discontinuation
- 1981-02-18 CA CA000371147A patent/CA1162323A/en not_active Expired
- 1981-02-19 IL IL62169A patent/IL62169A/xx unknown
- 1981-02-19 IT IT47843/81A patent/IT1170737B/it active
- 1981-02-19 JP JP2481981A patent/JPS56150900A/ja active Granted
-
1983
- 1983-12-07 US US06/558,710 patent/US4751105A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CH658157A5 (de) | 1986-10-15 |
IT1170737B (it) | 1987-06-03 |
IL62169A (en) | 1986-04-29 |
FR2476427A1 (fr) | 1981-08-21 |
DE3006117A1 (de) | 1981-08-27 |
NL8100807A (nl) | 1981-09-16 |
IT8147843A1 (it) | 1982-08-19 |
FR2476427B1 (de) | 1985-02-01 |
ATA15881A (de) | 1984-11-15 |
DK71481A (da) | 1981-08-20 |
JPH0261160B2 (de) | 1990-12-19 |
IL62169A0 (en) | 1981-03-31 |
DE3006117C2 (de) | 1981-11-26 |
SE456388B (sv) | 1988-09-26 |
JPS56150900A (en) | 1981-11-21 |
IT8147843A0 (it) | 1981-02-19 |
CA1162323A (en) | 1984-02-14 |
US4751105A (en) | 1988-06-14 |
SE8100733L (sv) | 1981-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee | ||
REN | Ceased due to non-payment of the annual fee |