NL6808469A - - Google Patents

Info

Publication number
NL6808469A
NL6808469A NL6808469A NL6808469A NL6808469A NL 6808469 A NL6808469 A NL 6808469A NL 6808469 A NL6808469 A NL 6808469A NL 6808469 A NL6808469 A NL 6808469A NL 6808469 A NL6808469 A NL 6808469A
Authority
NL
Netherlands
Application number
NL6808469A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6808469A priority Critical patent/NL6808469A/xx
Priority to DE19691926669 priority patent/DE1926669B2/de
Priority to GB1251285D priority patent/GB1251285A/en
Priority to FR6919947A priority patent/FR2010984A1/fr
Priority to BE734635D priority patent/BE734635A/xx
Publication of NL6808469A publication Critical patent/NL6808469A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
NL6808469A 1968-06-15 1968-06-15 NL6808469A (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL6808469A NL6808469A (de) 1968-06-15 1968-06-15
DE19691926669 DE1926669B2 (de) 1968-06-15 1969-05-24 Verfahren zur herstellung elektrisch leitender metallmuster
GB1251285D GB1251285A (de) 1968-06-15 1969-06-12
FR6919947A FR2010984A1 (de) 1968-06-15 1969-06-16
BE734635D BE734635A (de) 1968-06-15 1969-06-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6808469A NL6808469A (de) 1968-06-15 1968-06-15

Publications (1)

Publication Number Publication Date
NL6808469A true NL6808469A (de) 1969-12-17

Family

ID=19803904

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6808469A NL6808469A (de) 1968-06-15 1968-06-15

Country Status (5)

Country Link
BE (1) BE734635A (de)
DE (1) DE1926669B2 (de)
FR (1) FR2010984A1 (de)
GB (1) GB1251285A (de)
NL (1) NL6808469A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2131205C3 (de) * 1971-06-23 1981-07-30 International Electronic Research Corp., Burbank, Calif. Verfahren zur Herstellung einer gedruckten Schaltung mit einem Metallkern
US4029845A (en) * 1974-08-15 1977-06-14 Sumitomo Bakelite Company, Limited Printed circuit base board and method for manufacturing same
DK153337C (da) * 1979-04-11 1988-11-14 Platonec Aps Fremgangsmaade til toer sensibilisering af en isolerende overflade
DE3006117C2 (de) * 1980-02-19 1981-11-26 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen
DE3145721A1 (de) * 1981-11-19 1983-05-26 Helmuth 2058 Lauenburg Schmoock Verfahren zum herstellen von gedruckten schaltungen
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
CN115464576B (zh) * 2022-09-06 2023-11-17 南通市辉鑫玻璃纤维有限公司 一种高预应力玻璃纤维砂轮网片的生产工艺

Also Published As

Publication number Publication date
FR2010984A1 (de) 1970-02-20
GB1251285A (de) 1971-10-27
DE1926669A1 (de) 1969-12-18
DE1926669B2 (de) 1977-09-29
BE734635A (de) 1969-12-16

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