GB1251285A - - Google Patents

Info

Publication number
GB1251285A
GB1251285A GB1251285DA GB1251285A GB 1251285 A GB1251285 A GB 1251285A GB 1251285D A GB1251285D A GB 1251285DA GB 1251285 A GB1251285 A GB 1251285A
Authority
GB
United Kingdom
Prior art keywords
catalyzing
adhesive layer
rubber
layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1251285A publication Critical patent/GB1251285A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB1251285D 1968-06-15 1969-06-12 Expired GB1251285A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6808469A NL6808469A (de) 1968-06-15 1968-06-15

Publications (1)

Publication Number Publication Date
GB1251285A true GB1251285A (de) 1971-10-27

Family

ID=19803904

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1251285D Expired GB1251285A (de) 1968-06-15 1969-06-12

Country Status (5)

Country Link
BE (1) BE734635A (de)
DE (1) DE1926669B2 (de)
FR (1) FR2010984A1 (de)
GB (1) GB1251285A (de)
NL (1) NL6808469A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980002222A1 (en) * 1979-04-11 1980-10-16 Neselco As A method for drysensitization of an insulating surface and a powder for use with the method
GB2196992A (en) * 1986-09-19 1988-05-11 Firan Corp Production of circuit boards by coating with metal
CN115464576A (zh) * 2022-09-06 2022-12-13 南通市辉鑫玻璃纤维有限公司 一种高预应力玻璃纤维砂轮网片的生产工艺

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2131205C3 (de) * 1971-06-23 1981-07-30 International Electronic Research Corp., Burbank, Calif. Verfahren zur Herstellung einer gedruckten Schaltung mit einem Metallkern
US4029845A (en) * 1974-08-15 1977-06-14 Sumitomo Bakelite Company, Limited Printed circuit base board and method for manufacturing same
DE3006117C2 (de) * 1980-02-19 1981-11-26 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen
DE3145721A1 (de) * 1981-11-19 1983-05-26 Helmuth 2058 Lauenburg Schmoock Verfahren zum herstellen von gedruckten schaltungen

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980002222A1 (en) * 1979-04-11 1980-10-16 Neselco As A method for drysensitization of an insulating surface and a powder for use with the method
GB2196992A (en) * 1986-09-19 1988-05-11 Firan Corp Production of circuit boards by coating with metal
AU608245B2 (en) * 1986-09-19 1991-03-28 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
GB2196992B (en) * 1986-09-19 1991-05-01 Firan Corp Production of circuit boards and circuit boards so produced
CN115464576A (zh) * 2022-09-06 2022-12-13 南通市辉鑫玻璃纤维有限公司 一种高预应力玻璃纤维砂轮网片的生产工艺
CN115464576B (zh) * 2022-09-06 2023-11-17 南通市辉鑫玻璃纤维有限公司 一种高预应力玻璃纤维砂轮网片的生产工艺

Also Published As

Publication number Publication date
DE1926669B2 (de) 1977-09-29
DE1926669A1 (de) 1969-12-18
NL6808469A (de) 1969-12-17
BE734635A (de) 1969-12-16
FR2010984A1 (de) 1970-02-20

Similar Documents

Publication Publication Date Title
US3347724A (en) Metallizing flexible substrata
ES337132A1 (es) Procedimiento de fabricacion de circuitos impresos.
GB1143899A (en) Improvements relating to the manufacture of printed circuits
GB2037488A (en) Thermoplastics printed circuit board material
GB1251285A (de)
US3758304A (en) Method of producing electrically conductive metal layers
GB1209963A (en) Method of manufacturing printed circuits having metallised holes
JPS6350878B2 (de)
GB1421681A (en) Method of forming metal-coated substrate
GB1396481A (en) Manufacture of printed circuit boards
JPS647592A (en) Manufacture of printed wiring board
GB1397615A (en) Method of manufacturing a base for a printed electrical circuit
GB1332041A (en) Process for forming a conductive coating on a substrate
GB2006831A (en) Depositing film resistors by electroless coating
GB1264878A (de)
JPH0449795B2 (de)
GB1355332A (en) Process for preparing metallised insulating substrates
JPS5877286A (ja) プリント配線板の製造方法
JPS6255997A (ja) プリント回路用基板の製造方法
GB1343212A (en) Treatmetn of resin substrates for the reception of metal doposits
JPS5856493A (ja) 印刷配線板の製造方法
GB1321010A (en) Method of manufacturing metal core printed circuit board
JPS6457794A (en) Manufacture of printed wiring board
JPS5967692A (ja) 印刷配線板の製造方法
JPS56136863A (en) Adhesive for printed circuit board

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee