GB1251285A - - Google Patents
Info
- Publication number
- GB1251285A GB1251285A GB1251285DA GB1251285A GB 1251285 A GB1251285 A GB 1251285A GB 1251285D A GB1251285D A GB 1251285DA GB 1251285 A GB1251285 A GB 1251285A
- Authority
- GB
- United Kingdom
- Prior art keywords
- catalyzing
- adhesive layer
- rubber
- layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6808469A NL6808469A (de) | 1968-06-15 | 1968-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1251285A true GB1251285A (de) | 1971-10-27 |
Family
ID=19803904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1251285D Expired GB1251285A (de) | 1968-06-15 | 1969-06-12 |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE734635A (de) |
DE (1) | DE1926669B2 (de) |
FR (1) | FR2010984A1 (de) |
GB (1) | GB1251285A (de) |
NL (1) | NL6808469A (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1980002222A1 (en) * | 1979-04-11 | 1980-10-16 | Neselco As | A method for drysensitization of an insulating surface and a powder for use with the method |
GB2196992A (en) * | 1986-09-19 | 1988-05-11 | Firan Corp | Production of circuit boards by coating with metal |
CN115464576A (zh) * | 2022-09-06 | 2022-12-13 | 南通市辉鑫玻璃纤维有限公司 | 一种高预应力玻璃纤维砂轮网片的生产工艺 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2131205C3 (de) * | 1971-06-23 | 1981-07-30 | International Electronic Research Corp., Burbank, Calif. | Verfahren zur Herstellung einer gedruckten Schaltung mit einem Metallkern |
US4029845A (en) * | 1974-08-15 | 1977-06-14 | Sumitomo Bakelite Company, Limited | Printed circuit base board and method for manufacturing same |
DE3006117C2 (de) * | 1980-02-19 | 1981-11-26 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen |
DE3145721A1 (de) * | 1981-11-19 | 1983-05-26 | Helmuth 2058 Lauenburg Schmoock | Verfahren zum herstellen von gedruckten schaltungen |
-
1968
- 1968-06-15 NL NL6808469A patent/NL6808469A/xx unknown
-
1969
- 1969-05-24 DE DE19691926669 patent/DE1926669B2/de not_active Ceased
- 1969-06-12 GB GB1251285D patent/GB1251285A/en not_active Expired
- 1969-06-16 FR FR6919947A patent/FR2010984A1/fr not_active Withdrawn
- 1969-06-16 BE BE734635D patent/BE734635A/xx not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1980002222A1 (en) * | 1979-04-11 | 1980-10-16 | Neselco As | A method for drysensitization of an insulating surface and a powder for use with the method |
GB2196992A (en) * | 1986-09-19 | 1988-05-11 | Firan Corp | Production of circuit boards by coating with metal |
AU608245B2 (en) * | 1986-09-19 | 1991-03-28 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
GB2196992B (en) * | 1986-09-19 | 1991-05-01 | Firan Corp | Production of circuit boards and circuit boards so produced |
CN115464576A (zh) * | 2022-09-06 | 2022-12-13 | 南通市辉鑫玻璃纤维有限公司 | 一种高预应力玻璃纤维砂轮网片的生产工艺 |
CN115464576B (zh) * | 2022-09-06 | 2023-11-17 | 南通市辉鑫玻璃纤维有限公司 | 一种高预应力玻璃纤维砂轮网片的生产工艺 |
Also Published As
Publication number | Publication date |
---|---|
DE1926669B2 (de) | 1977-09-29 |
DE1926669A1 (de) | 1969-12-18 |
NL6808469A (de) | 1969-12-17 |
BE734635A (de) | 1969-12-16 |
FR2010984A1 (de) | 1970-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3347724A (en) | Metallizing flexible substrata | |
ES337132A1 (es) | Procedimiento de fabricacion de circuitos impresos. | |
GB1143899A (en) | Improvements relating to the manufacture of printed circuits | |
GB2037488A (en) | Thermoplastics printed circuit board material | |
GB1251285A (de) | ||
US3758304A (en) | Method of producing electrically conductive metal layers | |
GB1209963A (en) | Method of manufacturing printed circuits having metallised holes | |
JPS6350878B2 (de) | ||
GB1421681A (en) | Method of forming metal-coated substrate | |
GB1396481A (en) | Manufacture of printed circuit boards | |
JPS647592A (en) | Manufacture of printed wiring board | |
GB1397615A (en) | Method of manufacturing a base for a printed electrical circuit | |
GB1332041A (en) | Process for forming a conductive coating on a substrate | |
GB2006831A (en) | Depositing film resistors by electroless coating | |
GB1264878A (de) | ||
JPH0449795B2 (de) | ||
GB1355332A (en) | Process for preparing metallised insulating substrates | |
JPS5877286A (ja) | プリント配線板の製造方法 | |
JPS6255997A (ja) | プリント回路用基板の製造方法 | |
GB1343212A (en) | Treatmetn of resin substrates for the reception of metal doposits | |
JPS5856493A (ja) | 印刷配線板の製造方法 | |
GB1321010A (en) | Method of manufacturing metal core printed circuit board | |
JPS6457794A (en) | Manufacture of printed wiring board | |
JPS5967692A (ja) | 印刷配線板の製造方法 | |
JPS56136863A (en) | Adhesive for printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |