JPH0449795B2 - - Google Patents
Info
- Publication number
- JPH0449795B2 JPH0449795B2 JP60191201A JP19120185A JPH0449795B2 JP H0449795 B2 JPH0449795 B2 JP H0449795B2 JP 60191201 A JP60191201 A JP 60191201A JP 19120185 A JP19120185 A JP 19120185A JP H0449795 B2 JPH0449795 B2 JP H0449795B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating sheet
- plating
- printed wiring
- wiring board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007772 electroless plating Methods 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19120185A JPS6251288A (ja) | 1985-08-30 | 1985-08-30 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19120185A JPS6251288A (ja) | 1985-08-30 | 1985-08-30 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6251288A JPS6251288A (ja) | 1987-03-05 |
| JPH0449795B2 true JPH0449795B2 (de) | 1992-08-12 |
Family
ID=16270587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19120185A Granted JPS6251288A (ja) | 1985-08-30 | 1985-08-30 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6251288A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009057446A1 (ja) | 2007-10-30 | 2009-05-07 | Tokai Riken Co., Ltd. | 電子キー |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0760922B2 (ja) * | 1988-07-15 | 1995-06-28 | 横浜ゴム株式会社 | アディティブ法配線板用複層フィルム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51149564A (en) * | 1975-06-17 | 1976-12-22 | Tokyo Shibaura Electric Co | Method of manufacturing circuit substrate |
| JPS5943594A (ja) * | 1982-09-03 | 1984-03-10 | 大日本印刷株式会社 | 導電回路シ−ト |
-
1985
- 1985-08-30 JP JP19120185A patent/JPS6251288A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51149564A (en) * | 1975-06-17 | 1976-12-22 | Tokyo Shibaura Electric Co | Method of manufacturing circuit substrate |
| JPS5943594A (ja) * | 1982-09-03 | 1984-03-10 | 大日本印刷株式会社 | 導電回路シ−ト |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009057446A1 (ja) | 2007-10-30 | 2009-05-07 | Tokai Riken Co., Ltd. | 電子キー |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6251288A (ja) | 1987-03-05 |
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