GB2006831A - Depositing film resistors by electroless coating - Google Patents

Depositing film resistors by electroless coating

Info

Publication number
GB2006831A
GB2006831A GB7839089A GB7839089A GB2006831A GB 2006831 A GB2006831 A GB 2006831A GB 7839089 A GB7839089 A GB 7839089A GB 7839089 A GB7839089 A GB 7839089A GB 2006831 A GB2006831 A GB 2006831A
Authority
GB
United Kingdom
Prior art keywords
electroless plating
film resistors
electroless coating
substrate
depositing film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7839089A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2006831A publication Critical patent/GB2006831A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A film resistor having a high specific resistance is deposited on a substrate for printed circuit by electroless plating with an electroless plating solution containing at least one of nickel salt and cobalt salt, and a zinc salt together with a complexing agent and a reducing agent as main components. When the substrate is treated with a pretreating solution, an acid mixture of inorganic acid and aliphatic carboxylic acid before the electroless plating a film resistor having fewer fluctuations in resistance in addition to the high specific resistance is obtained.
GB7839089A 1977-10-07 1978-10-03 Depositing film resistors by electroless coating Withdrawn GB2006831A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11992777A JPS5453629A (en) 1977-10-07 1977-10-07 Resistance chemical plating method

Publications (1)

Publication Number Publication Date
GB2006831A true GB2006831A (en) 1979-05-10

Family

ID=14773607

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7839089A Withdrawn GB2006831A (en) 1977-10-07 1978-10-03 Depositing film resistors by electroless coating

Country Status (5)

Country Link
JP (1) JPS5453629A (en)
DE (1) DE2843582A1 (en)
FR (1) FR2405613A1 (en)
GB (1) GB2006831A (en)
NL (1) NL7810123A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004009869A2 (en) * 2002-07-24 2004-01-29 University Of Dayton Corrosion-inhibiting coating for metal surfaces

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712592A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Method of metallizing sic board
JPS58193354A (en) * 1982-04-30 1983-11-11 Hitachi Chem Co Ltd Plating bath

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1508104A (en) * 1965-06-28 1968-01-05 Ibm Acid corrosion
GB1266729A (en) * 1969-08-29 1972-03-15
NL7301044A (en) * 1973-01-25 1974-07-29

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004009869A2 (en) * 2002-07-24 2004-01-29 University Of Dayton Corrosion-inhibiting coating for metal surfaces
WO2004009869A3 (en) * 2002-07-24 2004-06-24 Univ Dayton Corrosion-inhibiting coating for metal surfaces
US6818313B2 (en) 2002-07-24 2004-11-16 University Of Dayton Corrosion-inhibiting coating
US7537663B2 (en) 2002-07-24 2009-05-26 University Of Dayton Corrosion-inhibiting coating

Also Published As

Publication number Publication date
FR2405613A1 (en) 1979-05-04
DE2843582A1 (en) 1979-04-12
NL7810123A (en) 1979-04-10
JPS5453629A (en) 1979-04-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)