ES254803A1 - Method of making printed circuits - Google Patents

Method of making printed circuits

Info

Publication number
ES254803A1
ES254803A1 ES0254803A ES254803A ES254803A1 ES 254803 A1 ES254803 A1 ES 254803A1 ES 0254803 A ES0254803 A ES 0254803A ES 254803 A ES254803 A ES 254803A ES 254803 A1 ES254803 A1 ES 254803A1
Authority
ES
Spain
Prior art keywords
metal
specifications
phenol
titanium
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0254803A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES254803A1 publication Critical patent/ES254803A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

Exemplified viscous adhesive compositions which are applied to insulating bases prior to deposition of metal coatings thereon in the production of printed circuits (see Group II) comprise (1) and (2) phenol-formaldehyde, polyvinyl butyral, powdered cuprous oxide or zinc dust, powdered silica, diethyl carbonate and ethanol and (3) epoxy modified phenol-aldehyde, butadiene-acrylonitrile, aluminium powder, hexamethylene tetramine, diethyl carbonate and diacetone alcohol. Specifications 674,630, 924,049 and U.S.A. Specifications 2,534,374 and 2,758,953 are referred to.ALSO:In a process of forming a printed circuit, selected areas of an insulating base are coated with a viscous liquid composition containing an adhesive component and particles which act as such, or after activation, as sites for the decomposition of, and deposition of metal from, a currentless metal deposition bath, and the base then immersed in such a bath to deposit metal on the said selected areas. The insulating base may be of ceramic, rubber, phenol-formaldehyde impregnated material, melamine-urea, vinyl acetate-chloride copolymer, cellulose acetate, epoxy resin, glass cloth or epoxy-coated glass. Specified viscous liquid compositions contain phenolformaldehyde or phenol-aldehyde/epoxy resin together with polyvinyl butyral or butadiene acrylonitrile alternatively, they may be based on cellulose acetate lacquer or gum arabic. Specified active particles are of titanium, aluminium, copper, iron, cobalt, zinc, titanium oxide, copper oxides, stannous chloride, stannous fluoroborate, stannous sulphate or titanium trichloride. Particles which may be activated (successively in stannous chloride and titanium chloride) are of silica, clay, alumina or wood flour. Metals which may be currentlessly deposited are copper, nickel, silver and rhodium. A suitable bath contains copper sulphate, sodium hydroxide, Rochelle salts and formaldehyde. After the metal is deposited, the structure may be heated and the circuit then built up e.g. with silver and rhodium by electrodeposition, or by immersion in molten metal or alloy. Specifications 674,630, 924,049 and U.S.A. Specifications 2,534,374 and 2,758,953 are referred to.
ES0254803A 1959-01-08 1960-01-07 Method of making printed circuits Expired ES254803A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78570359A 1959-01-08 1959-01-08

Publications (1)

Publication Number Publication Date
ES254803A1 true ES254803A1 (en) 1960-05-01

Family

ID=25136361

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0254803A Expired ES254803A1 (en) 1959-01-08 1960-01-07 Method of making printed circuits

Country Status (8)

Country Link
AT (1) AT238283B (en)
BE (1) BE586392A (en)
CH (1) CH381293A (en)
DE (1) DE1176731B (en)
DK (1) DK98445C (en)
ES (1) ES254803A1 (en)
FR (1) FR1237098A (en)
GB (1) GB938365A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT314010B (en) * 1966-06-28 1974-03-11 Photocircuits Corp Starting material for metallizing by means of electroless metal-plating baths, preferably for the production of printed circuit boards, and a method for its production
DE2131205C3 (en) * 1971-06-23 1981-07-30 International Electronic Research Corp., Burbank, Calif. Process for the production of a printed circuit with a metal core
FR2397469A1 (en) * 1977-02-22 1979-02-09 Panoduz Anstalt PROCEDURE FOR DEPOSING A LAYER OF CONDUCTIVE METAL ON AN INSULATING SUPPORT
GB2038101B (en) * 1978-12-19 1983-02-09 Standard Telephones Cables Ltd Printed circuits
DE3733002A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Electroconductive pattern metallised additively
AU8107987A (en) * 1986-09-30 1988-04-21 Wilde Membran Impulstechnik G.m.b.H. Electrically conductive structure with applied metallization
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
TW218430B (en) * 1992-01-30 1994-01-01 Motorola Inc
DE10241137B4 (en) * 2002-09-03 2008-05-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for the metallization of plastics
GB201212407D0 (en) * 2012-07-12 2012-08-22 Intrinsiq Materials Ltd Composition for forming a seed layer
WO2020075152A2 (en) * 2018-10-11 2020-04-16 Shell Oil Company A composition and uses thereof

Also Published As

Publication number Publication date
FR1237098A (en) 1960-07-22
BE586392A (en) 1960-07-08
DE1176731B (en) 1964-08-27
CH381293A (en) 1964-08-31
AT238283B (en) 1965-02-10
GB938365A (en) 1963-10-02
DK98445C (en) 1964-04-13

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