GB1487227A - Method of manufacturing photosensitive material - Google Patents

Method of manufacturing photosensitive material

Info

Publication number
GB1487227A
GB1487227A GB51132/74A GB5113274A GB1487227A GB 1487227 A GB1487227 A GB 1487227A GB 51132/74 A GB51132/74 A GB 51132/74A GB 5113274 A GB5113274 A GB 5113274A GB 1487227 A GB1487227 A GB 1487227A
Authority
GB
United Kingdom
Prior art keywords
dispersion
particles
photosensitive
substrate
rinsing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB51132/74A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1487227A publication Critical patent/GB1487227A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/705—Compositions containing chalcogenides, metals or alloys thereof, as photosensitive substances, e.g. photodope systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Surface Treatment Of Glass (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Photoreceptors In Electrophotography (AREA)

Abstract

1487227 Photoconductive coatings PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 26 Nov 1974 [29 Nov 1973] 51132/74 Heading B2E [Also in Divisions G2 and H1] A method of manufacturing a photosensitive material comprising a non-conductive hydrophobic substrate bearing a photosensitive semiconducting metal oxide having a light-reaction product capable of separating copper and/or Hg, Ag, Au, Pt or Pd from a solution of the relevant metal salt, comprises the step of contacting the substrate with a dispersion of particles of the photosensitive semiconducting metal oxide in a dispersion medium, said particles having a charge sign opposite to the charge sign of the substrate material on the surface in the dispersion medium, the excess photosensitive semiconducting metal oxide particles which are only loosely adherent to the substrate material being subsequently removed by rinsing and the product thus obtained being heated to a temperature of more than 50‹C but less than the softening point or the decomposition point of the substrate material for a period sufficient at that temperature to bond the particles to the substrate material, A photosensitive coating having a thickness of one grain is provided. Suitable charge conditions can be achieved by controlling the pH of the dispersion. The material may be used as starting material for the manufacture of printed circuit boards. The particles may be catalysts for electroless deposition of metal coatings; alternatively the photo-sensitive semiconducting compound after contacting with a solution of a noble metal salt and exposure to light produces noble metal nuclei that can be plated. In one embodiment glass-fibre reinforced epoxy board material with a monograin layer of TiO 2 of particle size less than 0.5mm provided by a dispersion of pH between 1 and 6 is used and after drilling of holes a similar TiO 2 dispersion is applied in the holes. A dispersion of ZnO particles can also be used. After rinsing and drying in air at 80‹C an nuclei-forming soln. containing PdCl 2 is applied. Following imagewise exposure palladium ions are removed from non- exposed areas by rinsing and the image is then intensified with a soln. containing copper sulphate, EDTA and ultrasodium salt, NaOH and formaldehyde to form an adhering pattern. Plates of glass, yttrium-gadolinium-iron garnet, Al 2 O 3 and a ceramic composed of TiO 3 , BaO and ZrO 3 are other specified substrates.
GB51132/74A 1973-11-29 1974-11-26 Method of manufacturing photosensitive material Expired GB1487227A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7316313A NL7316313A (en) 1973-11-29 1973-11-29 PROCESS FOR THE MANUFACTURE OF PHOTOSENSITIVE MATERIAL.

Publications (1)

Publication Number Publication Date
GB1487227A true GB1487227A (en) 1977-09-28

Family

ID=19820099

Family Applications (1)

Application Number Title Priority Date Filing Date
GB51132/74A Expired GB1487227A (en) 1973-11-29 1974-11-26 Method of manufacturing photosensitive material

Country Status (11)

Country Link
JP (2) JPS567219B2 (en)
AT (1) AT363540B (en)
BE (1) BE822669A (en)
CA (1) CA1041644A (en)
DE (1) DE2454536A1 (en)
FR (1) FR2253229B1 (en)
GB (1) GB1487227A (en)
HK (1) HK41678A (en)
IT (1) IT1026507B (en)
NL (1) NL7316313A (en)
SE (1) SE404558B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1445347A1 (en) * 2001-08-31 2004-08-11 Kanto Kasei Co., Ltd. Method of plating nonconductor product
CN112479597A (en) * 2020-12-07 2021-03-12 陕西拓日新能源科技有限公司 Double-sided coating process for photovoltaic glass

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
JPS5723416A (en) * 1980-07-17 1982-02-06 Suwa Seikosha Kk Method of forming pattern of insulating substrate
JPS5831760B2 (en) * 1981-01-09 1983-07-08 株式会社東芝 Manufacturing method of printed wiring board
JPS5878493A (en) * 1981-11-05 1983-05-12 塩尻工業株式会社 Printed circuit board
CN110975865B (en) * 2019-12-20 2022-09-02 绍兴蓝竹新材料科技有限公司 Preparation method of photocatalytic complexing agent for purifying air with high light conductivity and high adsorption performance

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1445347A1 (en) * 2001-08-31 2004-08-11 Kanto Kasei Co., Ltd. Method of plating nonconductor product
EP1445347A4 (en) * 2001-08-31 2008-04-16 Kanto Kasei Kogyo Method of plating nonconductor product
CN112479597A (en) * 2020-12-07 2021-03-12 陕西拓日新能源科技有限公司 Double-sided coating process for photovoltaic glass

Also Published As

Publication number Publication date
HK41678A (en) 1978-07-28
CA1041644A (en) 1978-10-31
NL7316313A (en) 1975-06-02
JPS55130197A (en) 1980-10-08
JPS5748879B2 (en) 1982-10-19
JPS5085876A (en) 1975-07-10
SE7414805L (en) 1975-05-30
FR2253229B1 (en) 1979-05-25
FR2253229A1 (en) 1975-06-27
SE404558B (en) 1978-10-09
JPS567219B2 (en) 1981-02-17
ATA945974A (en) 1981-01-15
DE2454536A1 (en) 1975-06-05
AT363540B (en) 1981-08-10
BE822669A (en) 1975-05-27
IT1026507B (en) 1978-10-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee