FR2253229A1 - - Google Patents

Info

Publication number
FR2253229A1
FR2253229A1 FR7438987A FR7438987A FR2253229A1 FR 2253229 A1 FR2253229 A1 FR 2253229A1 FR 7438987 A FR7438987 A FR 7438987A FR 7438987 A FR7438987 A FR 7438987A FR 2253229 A1 FR2253229 A1 FR 2253229A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7438987A
Other languages
French (fr)
Other versions
FR2253229B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2253229A1 publication Critical patent/FR2253229A1/fr
Application granted granted Critical
Publication of FR2253229B1 publication Critical patent/FR2253229B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/705—Compositions containing chalcogenides, metals or alloys thereof, as photosensitive substances, e.g. photodope systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Surface Treatment Of Glass (AREA)
  • Photoreceptors In Electrophotography (AREA)
FR7438987A 1973-11-29 1974-11-28 Expired FR2253229B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7316313A NL7316313A (en) 1973-11-29 1973-11-29 PROCESS FOR THE MANUFACTURE OF PHOTOSENSITIVE MATERIAL.

Publications (2)

Publication Number Publication Date
FR2253229A1 true FR2253229A1 (en) 1975-06-27
FR2253229B1 FR2253229B1 (en) 1979-05-25

Family

ID=19820099

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7438987A Expired FR2253229B1 (en) 1973-11-29 1974-11-28

Country Status (11)

Country Link
JP (2) JPS567219B2 (en)
AT (1) AT363540B (en)
BE (1) BE822669A (en)
CA (1) CA1041644A (en)
DE (1) DE2454536A1 (en)
FR (1) FR2253229B1 (en)
GB (1) GB1487227A (en)
HK (1) HK41678A (en)
IT (1) IT1026507B (en)
NL (1) NL7316313A (en)
SE (1) SE404558B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0056093A2 (en) * 1981-01-09 1982-07-21 Kabushiki Kaisha Toshiba Process for producing a printed circuit board

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
JPS5723416A (en) * 1980-07-17 1982-02-06 Suwa Seikosha Kk Method of forming pattern of insulating substrate
JPS5878493A (en) * 1981-11-05 1983-05-12 塩尻工業株式会社 Printed circuit board
JP4147317B2 (en) * 2001-08-31 2008-09-10 関東化成工業株式会社 Plating method for non-conductor products
CN110975865B (en) * 2019-12-20 2022-09-02 绍兴蓝竹新材料科技有限公司 Preparation method of photocatalytic complexing agent for purifying air with high light conductivity and high adsorption performance
CN112479597A (en) * 2020-12-07 2021-03-12 陕西拓日新能源科技有限公司 Double-sided coating process for photovoltaic glass

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0056093A2 (en) * 1981-01-09 1982-07-21 Kabushiki Kaisha Toshiba Process for producing a printed circuit board
EP0056093A3 (en) * 1981-01-09 1984-03-14 Tokyo Shibaura Denki Kabushiki Kaisha Process for producing a printed circuit board

Also Published As

Publication number Publication date
AT363540B (en) 1981-08-10
IT1026507B (en) 1978-10-20
JPS5748879B2 (en) 1982-10-19
GB1487227A (en) 1977-09-28
BE822669A (en) 1975-05-27
SE404558B (en) 1978-10-09
SE7414805L (en) 1975-05-30
HK41678A (en) 1978-07-28
JPS55130197A (en) 1980-10-08
CA1041644A (en) 1978-10-31
DE2454536A1 (en) 1975-06-05
NL7316313A (en) 1975-06-02
ATA945974A (en) 1981-01-15
JPS567219B2 (en) 1981-02-17
JPS5085876A (en) 1975-07-10
FR2253229B1 (en) 1979-05-25

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Legal Events

Date Code Title Description
ST Notification of lapse