AU8107987A - Electrically conductive structure with applied metallization - Google Patents

Electrically conductive structure with applied metallization

Info

Publication number
AU8107987A
AU8107987A AU81079/87A AU8107987A AU8107987A AU 8107987 A AU8107987 A AU 8107987A AU 81079/87 A AU81079/87 A AU 81079/87A AU 8107987 A AU8107987 A AU 8107987A AU 8107987 A AU8107987 A AU 8107987A
Authority
AU
Australia
Prior art keywords
electrically conductive
conductive structure
applied metallization
metallization
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU81079/87A
Inventor
Armin Bonack
Horst Dieter Wilde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wilde Membran Impulstechnik GmbH
Original Assignee
WILDE MEMBRAN IMPULSTECH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WILDE MEMBRAN IMPULSTECH filed Critical WILDE MEMBRAN IMPULSTECH
Publication of AU8107987A publication Critical patent/AU8107987A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
AU81079/87A 1986-09-30 1987-09-30 Electrically conductive structure with applied metallization Abandoned AU8107987A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3633258 1986-09-30
DE3633258 1986-09-30

Publications (1)

Publication Number Publication Date
AU8107987A true AU8107987A (en) 1988-04-21

Family

ID=6310716

Family Applications (1)

Application Number Title Priority Date Filing Date
AU81079/87A Abandoned AU8107987A (en) 1986-09-30 1987-09-30 Electrically conductive structure with applied metallization

Country Status (3)

Country Link
EP (1) EP0268781A1 (en)
AU (1) AU8107987A (en)
WO (1) WO1988002592A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3625587A1 (en) * 1986-07-29 1988-02-04 Bayer Ag METHOD FOR IMPROVING THE ADHESIVITY OF ELECTRICALLY DEPOSED METAL LAYERS ON PLASTIC SURFACES
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
DE3932017A1 (en) * 1988-10-27 1990-05-03 Bayer Ag ELECTRICALLY LEADING STRUCTURES
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
DE19812880A1 (en) 1998-03-24 1999-09-30 Bayer Ag Shaped part and flexible film with protected conductor track and process for its production

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits
US3745045A (en) * 1971-01-06 1973-07-10 R Brenneman Electrical contact surface using an ink containing a plating catalyst
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
DE2812497C3 (en) * 1978-03-22 1982-03-11 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Printed circuit
DE3241579A1 (en) * 1982-11-10 1984-05-10 Amp Inc., Harrisburg, Pa. Printed circuit and printing ink for the conductor tracks thereof
US4595606A (en) * 1984-07-18 1986-06-17 Rohm And Haas Company Solderable conductive compositions having high adhesive strength

Also Published As

Publication number Publication date
WO1988002592A1 (en) 1988-04-07
EP0268781A1 (en) 1988-06-01

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