AU8107987A - Electrically conductive structure with applied metallization - Google Patents
Electrically conductive structure with applied metallizationInfo
- Publication number
- AU8107987A AU8107987A AU81079/87A AU8107987A AU8107987A AU 8107987 A AU8107987 A AU 8107987A AU 81079/87 A AU81079/87 A AU 81079/87A AU 8107987 A AU8107987 A AU 8107987A AU 8107987 A AU8107987 A AU 8107987A
- Authority
- AU
- Australia
- Prior art keywords
- electrically conductive
- conductive structure
- applied metallization
- metallization
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3633258 | 1986-09-30 | ||
DE3633258 | 1986-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
AU8107987A true AU8107987A (en) | 1988-04-21 |
Family
ID=6310716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU81079/87A Abandoned AU8107987A (en) | 1986-09-30 | 1987-09-30 | Electrically conductive structure with applied metallization |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0268781A1 (en) |
AU (1) | AU8107987A (en) |
WO (1) | WO1988002592A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3625587A1 (en) * | 1986-07-29 | 1988-02-04 | Bayer Ag | METHOD FOR IMPROVING THE ADHESIVITY OF ELECTRICALLY DEPOSED METAL LAYERS ON PLASTIC SURFACES |
US5238702A (en) * | 1988-10-27 | 1993-08-24 | Henning Giesecke | Electrically conductive patterns |
DE3932017A1 (en) * | 1988-10-27 | 1990-05-03 | Bayer Ag | ELECTRICALLY LEADING STRUCTURES |
US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
DE19812880A1 (en) | 1998-03-24 | 1999-09-30 | Bayer Ag | Shaped part and flexible film with protected conductor track and process for its production |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB938365A (en) * | 1959-01-08 | 1963-10-02 | Photocircuits Corp | Method of making printed circuits |
US3668003A (en) * | 1969-11-26 | 1972-06-06 | Cirkitrite Ltd | Printed circuits |
US3745045A (en) * | 1971-01-06 | 1973-07-10 | R Brenneman | Electrical contact surface using an ink containing a plating catalyst |
JPS5210568A (en) * | 1974-12-28 | 1977-01-26 | Hideo Machida | Method of manufacturing multilayered printed wiring substrate |
DE2812497C3 (en) * | 1978-03-22 | 1982-03-11 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Printed circuit |
DE3241579A1 (en) * | 1982-11-10 | 1984-05-10 | Amp Inc., Harrisburg, Pa. | Printed circuit and printing ink for the conductor tracks thereof |
US4595606A (en) * | 1984-07-18 | 1986-06-17 | Rohm And Haas Company | Solderable conductive compositions having high adhesive strength |
-
1987
- 1987-09-30 AU AU81079/87A patent/AU8107987A/en not_active Abandoned
- 1987-09-30 EP EP87114275A patent/EP0268781A1/en not_active Withdrawn
- 1987-09-30 WO PCT/EP1987/000561 patent/WO1988002592A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1988002592A1 (en) | 1988-04-07 |
EP0268781A1 (en) | 1988-06-01 |
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