GB1160730A - Improvements in or relating to the Production of Printed Circuits - Google Patents

Improvements in or relating to the Production of Printed Circuits

Info

Publication number
GB1160730A
GB1160730A GB5778666A GB5778666A GB1160730A GB 1160730 A GB1160730 A GB 1160730A GB 5778666 A GB5778666 A GB 5778666A GB 5778666 A GB5778666 A GB 5778666A GB 1160730 A GB1160730 A GB 1160730A
Authority
GB
United Kingdom
Prior art keywords
base
electroless
powder
pattern
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5778666A
Inventor
Hyogo Hirohata
Tsuneshi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to GB5778666A priority Critical patent/GB1160730A/en
Publication of GB1160730A publication Critical patent/GB1160730A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1,160,730. Printed circuits. MATSUSHITA ELECTRIC INDUSTRIAL CO. Ltd. 23 Dec., 1966, No. 57786/66. Heading H1R. [Also in Division C7] In a method of producing a printed circuit on an insulating base 10, and forming a platedthrough hole 13 therein, the desired circuit pattern is formed on the surface of base 10 in adhesive ink 11; metallic powder 12 is applied to the said surface and is retained on the adhesive pattern; the hole 13 is punched through the pattern and the underlying base 10; the whole assembly is immersed successively in solutions of stannous chloride and palladium chloride to deposit an activating layer 14 on all surfaces, which layer is then removed by brushing and washing except from the wall of the hole 13; and finally a conductive layer 15 is deposited by electroless plating on to the powder pattern 12 and the activating layer 14 on the hole wall. The base 10 may be a plate of glass, ceramic, or synthetic resin, or preferably a phenolic resin bonded paper laminate provided on its major surfaces with coatings 16, 17 of cured phenolic resin varnish. The adhesive ink 11, which may be applied by silk screen printing, preferably comprises epoxy resin, polyamide hardener, and carbon in a vehicle of benzyl alcohol. The metallic powder 12 may comprise copper particles, and is secured to the adhesive ink 11 by light pressure, after which surplus powder is removed by shaking and tipping the base and the ink is heat-cured. The stannous chloride and palladium chloride solutions may contain conc. HCl, and the conductive layer 15 may be applied in an electroless Cu plating bath comprising an aqueous solution of cupric sulphate, ethylenediamine tetra-acetic acid, sodium hydroxide, and formaldehyde. The powder 12 may alternatively comprise Ni, Ag, Au, Pt, Pd or their alloys for electroless Cu deposition, or Ni, Fe, Co, Al, Be, Pt, Pd, Rh or their alloys when electroless Ni or Co plating is preferred.
GB5778666A 1966-12-23 1966-12-23 Improvements in or relating to the Production of Printed Circuits Expired GB1160730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5778666A GB1160730A (en) 1966-12-23 1966-12-23 Improvements in or relating to the Production of Printed Circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5778666A GB1160730A (en) 1966-12-23 1966-12-23 Improvements in or relating to the Production of Printed Circuits

Publications (1)

Publication Number Publication Date
GB1160730A true GB1160730A (en) 1969-08-06

Family

ID=10480012

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5778666A Expired GB1160730A (en) 1966-12-23 1966-12-23 Improvements in or relating to the Production of Printed Circuits

Country Status (1)

Country Link
GB (1) GB1160730A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0003364A1 (en) * 1978-02-01 1979-08-08 E.I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
EP0180101A2 (en) * 1984-11-01 1986-05-07 International Business Machines Corporation Deposition of patterns using laser ablation
WO2007017192A1 (en) * 2005-08-09 2007-02-15 Atotech Deutschland Gmbh Method of manufacturing pattern-forming metal structures on a carrier substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0003364A1 (en) * 1978-02-01 1979-08-08 E.I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
EP0180101A2 (en) * 1984-11-01 1986-05-07 International Business Machines Corporation Deposition of patterns using laser ablation
EP0180101A3 (en) * 1984-11-01 1987-10-28 International Business Machines Corporation Deposition of patterns using laser ablation
WO2007017192A1 (en) * 2005-08-09 2007-02-15 Atotech Deutschland Gmbh Method of manufacturing pattern-forming metal structures on a carrier substrate
JP2009505383A (en) * 2005-08-09 2009-02-05 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Method for producing a pattern for forming a metal structure on a carrier substrate
US8202567B2 (en) 2005-08-09 2012-06-19 Atotech Deutschland Gmbh Method of manufacturing pattern-forming metal structures on a carrier substrate
CN101243735B (en) * 2005-08-09 2012-09-26 埃托特克德国有限公司 Method of manufacturing pattern-forming metal structures on a carrier substrate

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PE Patent expired