GB1299102A - Pretreating non-conductive material before currentless deposition of nickel-boron - Google Patents
Pretreating non-conductive material before currentless deposition of nickel-boronInfo
- Publication number
- GB1299102A GB1299102A GB923270A GB923270A GB1299102A GB 1299102 A GB1299102 A GB 1299102A GB 923270 A GB923270 A GB 923270A GB 923270 A GB923270 A GB 923270A GB 1299102 A GB1299102 A GB 1299102A
- Authority
- GB
- United Kingdom
- Prior art keywords
- boron
- nickel
- electroless
- acid
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1299102 Electroless electrolytic plating of plastics FARBENFABRIKEN BAYER A G 26 Feb 1970 [28 Feb 1969] 9232/70 Headings C7F and C7B A non-conductive substrate, e.g. an A. B. S. graft polymer is coated with nickel-boron by cleaning and pickling in e.g. chromo-sulphuric acid, dipping in an acid palladium chloride solution at a temperature of 15 to 60‹ C., a solution of a reducing agent at 15 to 40‹ C. and finally in an electroless nickel plating solution. The pH of the palladium chloride solution is 0À5 to 2À7 and the acid is sulphuric, hydrochloric, phosphoric, hydrofluoroboric or acetic. The reducing agent may be a boron hydride compound or diethylamine borane. The Ni may be subsequently electro-plated with layers of Cu, semibright and bright Ni and finally Cr. The electroless Ni and the Cu may be descaled in H 2 SO 4 .
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691910106 DE1910106C3 (en) | 1969-02-28 | Process for the pretreatment of dielectric materials prior to electroless nickel-boron deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1299102A true GB1299102A (en) | 1972-12-06 |
Family
ID=5726608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB923270A Expired GB1299102A (en) | 1969-02-28 | 1970-02-26 | Pretreating non-conductive material before currentless deposition of nickel-boron |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA933819A (en) |
| FR (1) | FR2033157A5 (en) |
| GB (1) | GB1299102A (en) |
| NL (1) | NL7002849A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2725118A3 (en) * | 2012-10-26 | 2017-02-15 | Rohm and Haas Electronic Materials LLC | A process for electroless plating and a solution used for the same |
| CN114774896A (en) * | 2022-06-20 | 2022-07-22 | 安丘市翼鑫机械有限公司 | Preparation method of composite coating of filter screen |
-
1970
- 1970-02-19 CA CA075273A patent/CA933819A/en not_active Expired
- 1970-02-26 GB GB923270A patent/GB1299102A/en not_active Expired
- 1970-02-27 NL NL7002849A patent/NL7002849A/xx unknown
- 1970-02-27 FR FR7007267A patent/FR2033157A5/fr not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2725118A3 (en) * | 2012-10-26 | 2017-02-15 | Rohm and Haas Electronic Materials LLC | A process for electroless plating and a solution used for the same |
| US9783890B2 (en) | 2012-10-26 | 2017-10-10 | Rohm And Haas Electronic Materials Llc | Process for electroless plating and a solution used for the same |
| CN114774896A (en) * | 2022-06-20 | 2022-07-22 | 安丘市翼鑫机械有限公司 | Preparation method of composite coating of filter screen |
Also Published As
| Publication number | Publication date |
|---|---|
| CA933819A (en) | 1973-09-18 |
| DE1910106A1 (en) | 1970-09-10 |
| DE1910106B2 (en) | 1975-06-12 |
| FR2033157A5 (en) | 1970-11-27 |
| NL7002849A (en) | 1970-09-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |