AT346958B - Verfahren zum verzinnen von leiterplatten - Google Patents

Verfahren zum verzinnen von leiterplatten

Info

Publication number
AT346958B
AT346958B AT599276A AT599276A AT346958B AT 346958 B AT346958 B AT 346958B AT 599276 A AT599276 A AT 599276A AT 599276 A AT599276 A AT 599276A AT 346958 B AT346958 B AT 346958B
Authority
AT
Austria
Prior art keywords
circuit boards
tinning
tinning circuit
boards
circuit
Prior art date
Application number
AT599276A
Other languages
English (en)
Other versions
ATA599276A (de
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA599276A publication Critical patent/ATA599276A/de
Application granted granted Critical
Publication of AT346958B publication Critical patent/AT346958B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT599276A 1975-09-30 1976-08-12 Verfahren zum verzinnen von leiterplatten AT346958B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2543674A DE2543674B2 (de) 1975-09-30 1975-09-30 Verfahren zum Verzinnen von Leiterplatten

Publications (2)

Publication Number Publication Date
ATA599276A ATA599276A (de) 1978-04-15
AT346958B true AT346958B (de) 1978-12-11

Family

ID=5957879

Family Applications (1)

Application Number Title Priority Date Filing Date
AT599276A AT346958B (de) 1975-09-30 1976-08-12 Verfahren zum verzinnen von leiterplatten

Country Status (6)

Country Link
US (1) US4084022A (de)
AT (1) AT346958B (de)
CH (1) CH610172A5 (de)
DE (1) DE2543674B2 (de)
FR (1) FR2326829A1 (de)
IT (1) IT1072549B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152962A (zh) * 2013-07-23 2014-11-19 皆利士多层线路版(中山)有限公司 印制线路板的电镀锡方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4486466A (en) * 1979-01-12 1984-12-04 Kollmorgen Technologies Corporation High resolution screen printable resists
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US5316788A (en) * 1991-07-26 1994-05-31 International Business Machines Corporation Applying solder to high density substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB893479A (en) * 1957-08-06 1962-04-11 Pye Ltd Improvements in or relating to printed circuit boards
GB915181A (en) * 1958-12-12 1963-01-09 Coates Brothers & Co Printing process
US3090706A (en) * 1959-07-03 1963-05-21 Motorola Inc Printed circuit process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152962A (zh) * 2013-07-23 2014-11-19 皆利士多层线路版(中山)有限公司 印制线路板的电镀锡方法

Also Published As

Publication number Publication date
DE2543674A1 (de) 1977-03-31
CH610172A5 (de) 1979-03-30
US4084022A (en) 1978-04-11
IT1072549B (it) 1985-04-10
DE2543674B2 (de) 1978-11-23
FR2326829A1 (fr) 1977-04-29
ATA599276A (de) 1978-04-15

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee