AT352206B - Verfahren zur verbesserung der loetbarkeit elektrischer leiterplatten - Google Patents

Verfahren zur verbesserung der loetbarkeit elektrischer leiterplatten

Info

Publication number
AT352206B
AT352206B AT364276A AT364276A AT352206B AT 352206 B AT352206 B AT 352206B AT 364276 A AT364276 A AT 364276A AT 364276 A AT364276 A AT 364276A AT 352206 B AT352206 B AT 352206B
Authority
AT
Austria
Prior art keywords
solderability
improving
circuit boards
electric circuit
boards
Prior art date
Application number
AT364276A
Other languages
English (en)
Other versions
ATA364276A (de
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA364276A publication Critical patent/ATA364276A/de
Application granted granted Critical
Publication of AT352206B publication Critical patent/AT352206B/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
AT364276A 1975-07-11 1976-05-19 Verfahren zur verbesserung der loetbarkeit elektrischer leiterplatten AT352206B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2531163A DE2531163C2 (de) 1975-07-11 1975-07-11 Verfahren zur Verbesserung der Lötbarkeit elektrischer Leiterplatten

Publications (2)

Publication Number Publication Date
ATA364276A ATA364276A (de) 1979-02-15
AT352206B true AT352206B (de) 1979-09-10

Family

ID=5951332

Family Applications (1)

Application Number Title Priority Date Filing Date
AT364276A AT352206B (de) 1975-07-11 1976-05-19 Verfahren zur verbesserung der loetbarkeit elektrischer leiterplatten

Country Status (11)

Country Link
US (1) US4046620A (de)
JP (1) JPS5210845A (de)
AT (1) AT352206B (de)
BE (1) BE843979A (de)
CH (1) CH603298A5 (de)
DE (1) DE2531163C2 (de)
FR (1) FR2317374A1 (de)
GB (1) GB1484542A (de)
IT (1) IT1067053B (de)
NL (1) NL7607452A (de)
SE (1) SE413329B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2849894A1 (de) * 1978-11-17 1980-05-29 Hoechst Ag Verfahren zum reinigen von kupfer enthaltenden metalloberflaechen
US4373656A (en) * 1981-07-17 1983-02-15 Western Electric Company, Inc. Method of preserving the solderability of copper
EP0098701A1 (de) * 1982-07-01 1984-01-18 Exxon Research And Engineering Company Verfahren zur Hydroxylierung von Olefinen in Gegenwart eines Osmiumoxidkatalysators und eines Carbonsäuresalzes als Kokatalysator
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4666744A (en) * 1984-05-10 1987-05-19 Kollmorgen Technologies Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4701352A (en) * 1984-05-10 1987-10-20 Kollmorgen Corporation Surface preparation of ceramic substrates for metallization
US4654116A (en) * 1984-11-09 1987-03-31 American Electronic Laboratories, Inc. Method for producing high resolution etched circuit patterns from clad laminates
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4927700A (en) * 1988-02-24 1990-05-22 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces
US6383723B1 (en) * 1998-08-28 2002-05-07 Micron Technology, Inc. Method to clean substrate and improve photoresist profile
US20040147422A1 (en) 2003-01-23 2004-07-29 Hatch Andrew M. Cleaner composition for formed metal articles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020175A (en) * 1958-06-12 1962-02-06 Gen Dynamics Corp Chemical cleaning of printed circuits
US3367875A (en) * 1964-08-19 1968-02-06 Hunt Chem Corp Philip A Composition for etching copper and copper-containing alloys
IL33876A0 (en) * 1969-03-28 1970-04-20 Miles Lab Anti-tarnish composition for metal surfaces and process for its use
GB1320589A (en) * 1971-02-05 1973-06-13 Formica Int Surface cleaning compositions for copper and copper alloys
US3887405A (en) * 1974-05-10 1975-06-03 Minnesota Mining & Mfg Method and composition for cleaning copper surfaces

Also Published As

Publication number Publication date
NL7607452A (nl) 1977-01-13
FR2317374B1 (de) 1978-09-01
FR2317374A1 (fr) 1977-02-04
CH603298A5 (de) 1978-08-15
BE843979A (fr) 1976-11-03
SE7607677L (sv) 1977-01-12
US4046620A (en) 1977-09-06
JPS5210845A (en) 1977-01-27
DE2531163A1 (de) 1977-02-03
IT1067053B (it) 1985-03-12
SE413329B (sv) 1980-05-19
GB1484542A (en) 1977-09-01
DE2531163C2 (de) 1985-05-15
ATA364276A (de) 1979-02-15

Similar Documents

Publication Publication Date Title
AT312731B (de) Verfahren zur Herstellung elektrischer Leiterplatten
ATA579978A (de) Verfahren zum herstellen von elektrischer leiterplatten
JPS51150068A (en) Electronic circuit block
FR2314594A1 (fr) Douille pour plaquette de circuit
IT1057161B (it) Connettore per circuiti stampati
AT352206B (de) Verfahren zur verbesserung der loetbarkeit elektrischer leiterplatten
JPS5278243A (en) Method of coating electric parts or electronic parts
SE414259B (sv) Elektronisk kopplingsanordning for styrbar frekvensdelning
AT346958B (de) Verfahren zum verzinnen von leiterplatten
IL54900A0 (en) The manufacture of wire scribed circuit boards
JPS523164A (en) Method of securing electric components printed circuit board
JPS5234365A (en) Method of insulating printed board
JPS5214874A (en) Method of manufacturing printed electric parts
GB1551985A (en) Manufacture of insulating boards
JPS51136809A (en) Method of rendering woody board nonnconbustible
CH512869A (de) Verfahren zur Herstellung einer elektrischen Schaltplatte von der Art einer gedruckten Schaltung
JPS523160A (en) Method of connecting electronic circuits
AT354966B (de) Verfahren zur bildung von bioproteinen
AT340526B (de) Verfahren zur herstellung von isolierten kupferflachleitern
JPS5281562A (en) Method of fixing electric part interval on circuit board
JPS5233076A (en) Method of forming multiilayer wiring circuit
AT301665B (de) Verfahren zur Herstellung elektrischer Leiterplatten
JPS51121772A (en) Method of soldering wiring
JPS5221672A (en) Method of mounting electronic parts
JPS5229816A (en) Method of manufacturing asbestosscement boards

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
ELJ Ceased due to non-payment of the annual fee