FR2317374A1 - Procede pour ameliorer la soudabilite de plaquettes electriques a circuit imprime - Google Patents

Procede pour ameliorer la soudabilite de plaquettes electriques a circuit imprime

Info

Publication number
FR2317374A1
FR2317374A1 FR7619957A FR7619957A FR2317374A1 FR 2317374 A1 FR2317374 A1 FR 2317374A1 FR 7619957 A FR7619957 A FR 7619957A FR 7619957 A FR7619957 A FR 7619957A FR 2317374 A1 FR2317374 A1 FR 2317374A1
Authority
FR
France
Prior art keywords
weldability
improving
printed circuit
electric pads
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7619957A
Other languages
English (en)
Other versions
FR2317374B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2317374A1 publication Critical patent/FR2317374A1/fr
Application granted granted Critical
Publication of FR2317374B1 publication Critical patent/FR2317374B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
FR7619957A 1975-07-11 1976-06-30 Procede pour ameliorer la soudabilite de plaquettes electriques a circuit imprime Granted FR2317374A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2531163A DE2531163C2 (de) 1975-07-11 1975-07-11 Verfahren zur Verbesserung der Lötbarkeit elektrischer Leiterplatten

Publications (2)

Publication Number Publication Date
FR2317374A1 true FR2317374A1 (fr) 1977-02-04
FR2317374B1 FR2317374B1 (fr) 1978-09-01

Family

ID=5951332

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7619957A Granted FR2317374A1 (fr) 1975-07-11 1976-06-30 Procede pour ameliorer la soudabilite de plaquettes electriques a circuit imprime

Country Status (11)

Country Link
US (1) US4046620A (fr)
JP (1) JPS5210845A (fr)
AT (1) AT352206B (fr)
BE (1) BE843979A (fr)
CH (1) CH603298A5 (fr)
DE (1) DE2531163C2 (fr)
FR (1) FR2317374A1 (fr)
GB (1) GB1484542A (fr)
IT (1) IT1067053B (fr)
NL (1) NL7607452A (fr)
SE (1) SE413329B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2849894A1 (de) * 1978-11-17 1980-05-29 Hoechst Ag Verfahren zum reinigen von kupfer enthaltenden metalloberflaechen
US4373656A (en) * 1981-07-17 1983-02-15 Western Electric Company, Inc. Method of preserving the solderability of copper
EP0098701A1 (fr) * 1982-07-01 1984-01-18 Exxon Research And Engineering Company Procédé pour l'hydroxylation des oléfines en présence d'un catalyseur à l'oxyde d'osmium et d'un co-catalyseur au sel d'un acide carboxylique
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4701352A (en) * 1984-05-10 1987-10-20 Kollmorgen Corporation Surface preparation of ceramic substrates for metallization
US4666744A (en) * 1984-05-10 1987-05-19 Kollmorgen Technologies Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4654116A (en) * 1984-11-09 1987-03-31 American Electronic Laboratories, Inc. Method for producing high resolution etched circuit patterns from clad laminates
US4927700A (en) * 1988-02-24 1990-05-22 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces
US6383723B1 (en) * 1998-08-28 2002-05-07 Micron Technology, Inc. Method to clean substrate and improve photoresist profile
US20040147422A1 (en) * 2003-01-23 2004-07-29 Hatch Andrew M. Cleaner composition for formed metal articles

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2040080A5 (en) * 1969-03-28 1971-01-15 Miles Lab Metal tarnish prevention
GB1320589A (en) * 1971-02-05 1973-06-13 Formica Int Surface cleaning compositions for copper and copper alloys

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020175A (en) * 1958-06-12 1962-02-06 Gen Dynamics Corp Chemical cleaning of printed circuits
US3367875A (en) * 1964-08-19 1968-02-06 Hunt Chem Corp Philip A Composition for etching copper and copper-containing alloys
US3887405A (en) * 1974-05-10 1975-06-03 Minnesota Mining & Mfg Method and composition for cleaning copper surfaces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2040080A5 (en) * 1969-03-28 1971-01-15 Miles Lab Metal tarnish prevention
GB1320589A (en) * 1971-02-05 1973-06-13 Formica Int Surface cleaning compositions for copper and copper alloys

Also Published As

Publication number Publication date
US4046620A (en) 1977-09-06
JPS5210845A (en) 1977-01-27
GB1484542A (en) 1977-09-01
CH603298A5 (fr) 1978-08-15
AT352206B (de) 1979-09-10
SE7607677L (sv) 1977-01-12
FR2317374B1 (fr) 1978-09-01
DE2531163C2 (de) 1985-05-15
DE2531163A1 (de) 1977-02-03
BE843979A (fr) 1976-11-03
ATA364276A (de) 1979-02-15
IT1067053B (it) 1985-03-12
NL7607452A (nl) 1977-01-13
SE413329B (sv) 1980-05-19

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Legal Events

Date Code Title Description
ST Notification of lapse