AT384341B - Verfahren zum herstellen von leiterplatten mit metallisierten lochungen - Google Patents

Verfahren zum herstellen von leiterplatten mit metallisierten lochungen

Info

Publication number
AT384341B
AT384341B AT0085481A AT85481A AT384341B AT 384341 B AT384341 B AT 384341B AT 0085481 A AT0085481 A AT 0085481A AT 85481 A AT85481 A AT 85481A AT 384341 B AT384341 B AT 384341B
Authority
AT
Austria
Prior art keywords
metalized holes
producing pcbs
pcbs
producing
metalized
Prior art date
Application number
AT0085481A
Other languages
English (en)
Other versions
ATA85481A (de
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA85481A publication Critical patent/ATA85481A/de
Application granted granted Critical
Publication of AT384341B publication Critical patent/AT384341B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
AT0085481A 1980-03-04 1981-02-24 Verfahren zum herstellen von leiterplatten mit metallisierten lochungen AT384341B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3008143A DE3008143C2 (de) 1980-03-04 1980-03-04 Verfahren zum Herstellen von gedruckten Leiterplatten mit Lochungen, deren Wandungen metallisiert sind

Publications (2)

Publication Number Publication Date
ATA85481A ATA85481A (de) 1987-03-15
AT384341B true AT384341B (de) 1987-10-27

Family

ID=6096154

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0085481A AT384341B (de) 1980-03-04 1981-02-24 Verfahren zum herstellen von leiterplatten mit metallisierten lochungen

Country Status (13)

Country Link
US (1) US4374868A (de)
JP (1) JPS56162899A (de)
AT (1) AT384341B (de)
CA (1) CA1158364A (de)
CH (1) CH654161A5 (de)
DE (1) DE3008143C2 (de)
DK (1) DK149295C (de)
FR (1) FR2482406B1 (de)
GB (1) GB2086139B (de)
IT (1) IT1170779B (de)
MX (1) MX150023A (de)
NL (1) NL8101050A (de)
SE (1) SE451105B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE443485B (sv) * 1982-09-17 1986-02-24 Ericsson Telefon Ab L M Sett att framstella elektroniska komponenter
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
DE3537161C2 (de) * 1985-10-18 1995-08-03 Bosch Gmbh Robert Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik
US4707394A (en) * 1986-09-19 1987-11-17 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
JPH07111918B2 (ja) * 1987-07-28 1995-11-29 三菱電機株式会社 マイクロ波放電光源装置
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5158645A (en) * 1991-09-03 1992-10-27 International Business Machines, Inc. Method of external circuitization of a circuit panel
JPH05243735A (ja) * 1992-03-03 1993-09-21 Hitachi Chem Co Ltd 多層配線板の製造法
US5638598A (en) * 1993-06-17 1997-06-17 Hitachi Chemical Company, Ltd. Process for producing a printed wiring board
RU2153784C1 (ru) * 1999-08-16 2000-07-27 Открытое акционерное общество "Интеграл" Способ металлизации отверстий печатных плат
JP3751625B2 (ja) * 2004-06-29 2006-03-01 新光電気工業株式会社 貫通電極の製造方法
KR100601493B1 (ko) * 2004-12-30 2006-07-18 삼성전기주식회사 하프에칭된 본딩 패드 및 절단된 도금 라인을 구비한ｂｇａ 패키지 및 그 제조 방법
US20170013715A1 (en) 2015-07-10 2017-01-12 Rohde & Schwarz Gmbh & Co. Kg Printed circuit board and corresponding method for producing a printed circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620933A (en) * 1969-12-31 1971-11-16 Macdermid Inc Forming plastic parts having surfaces receptive to adherent coatings
DE2136212B1 (de) * 1971-07-20 1972-05-31 Aeg Isolier Und Kunststoff Gmbh Verfahren zur Herstellung eines Basismaterials für gedruckte Schaltungen
US4001466A (en) * 1973-11-27 1977-01-04 Formica International Limited Process for preparing printed circuits
SE7412169L (sv) * 1974-09-27 1976-03-29 Perstorp Ab Forfarande vid framstellning av genomgaende hal i ett laminat
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards
US4162932A (en) * 1977-10-26 1979-07-31 Perstorp, Ab Method for removing resin smear in through holes of printed circuit boards
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit

Also Published As

Publication number Publication date
NL8101050A (nl) 1981-10-01
SE451105B (sv) 1987-08-31
MX150023A (es) 1984-03-02
US4374868A (en) 1983-02-22
IT8147942A1 (it) 1982-09-04
GB2086139B (en) 1984-08-30
CH654161A5 (de) 1986-01-31
DE3008143A1 (de) 1981-09-10
FR2482406B1 (fr) 1985-11-15
GB2086139A (en) 1982-05-06
IT8147942A0 (it) 1981-03-04
DE3008143C2 (de) 1982-04-08
DK149295C (da) 1986-09-29
DK95181A (da) 1981-09-05
DK149295B (da) 1986-04-21
ATA85481A (de) 1987-03-15
IT1170779B (it) 1987-06-03
FR2482406A1 (fr) 1981-11-13
SE8101360L (sv) 1981-09-05
CA1158364A (en) 1983-12-06
JPS56162899A (en) 1981-12-15

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee