IT8147942A0 - Metodo per la fabbricazione di pannelli a circuito stampato con fori aventi pareti metallizzate - Google Patents

Metodo per la fabbricazione di pannelli a circuito stampato con fori aventi pareti metallizzate

Info

Publication number
IT8147942A0
IT8147942A0 IT8147942A IT4794281A IT8147942A0 IT 8147942 A0 IT8147942 A0 IT 8147942A0 IT 8147942 A IT8147942 A IT 8147942A IT 4794281 A IT4794281 A IT 4794281A IT 8147942 A0 IT8147942 A0 IT 8147942A0
Authority
IT
Italy
Prior art keywords
holes
printed circuit
manufacturing printed
circuit panels
metallized walls
Prior art date
Application number
IT8147942A
Other languages
English (en)
Other versions
IT1170779B (it
IT8147942A1 (it
Inventor
Stahl Fritz
Horst Steffen
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of IT8147942A0 publication Critical patent/IT8147942A0/it
Publication of IT8147942A1 publication Critical patent/IT8147942A1/it
Application granted granted Critical
Publication of IT1170779B publication Critical patent/IT1170779B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
IT47942/81A 1980-03-04 1981-03-04 Metodo per la fabbricazione di pannelli a circuito stampato con fori aventi pareti metallizzate IT1170779B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3008143A DE3008143C2 (de) 1980-03-04 1980-03-04 Verfahren zum Herstellen von gedruckten Leiterplatten mit Lochungen, deren Wandungen metallisiert sind

Publications (3)

Publication Number Publication Date
IT8147942A0 true IT8147942A0 (it) 1981-03-04
IT8147942A1 IT8147942A1 (it) 1982-09-04
IT1170779B IT1170779B (it) 1987-06-03

Family

ID=6096154

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47942/81A IT1170779B (it) 1980-03-04 1981-03-04 Metodo per la fabbricazione di pannelli a circuito stampato con fori aventi pareti metallizzate

Country Status (13)

Country Link
US (1) US4374868A (it)
JP (1) JPS56162899A (it)
AT (1) AT384341B (it)
CA (1) CA1158364A (it)
CH (1) CH654161A5 (it)
DE (1) DE3008143C2 (it)
DK (1) DK149295C (it)
FR (1) FR2482406B1 (it)
GB (1) GB2086139B (it)
IT (1) IT1170779B (it)
MX (1) MX150023A (it)
NL (1) NL8101050A (it)
SE (1) SE451105B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE443485B (sv) * 1982-09-17 1986-02-24 Ericsson Telefon Ab L M Sett att framstella elektroniska komponenter
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
DE3537161C2 (de) * 1985-10-18 1995-08-03 Bosch Gmbh Robert Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4707394A (en) * 1986-09-19 1987-11-17 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
JPH07111918B2 (ja) * 1987-07-28 1995-11-29 三菱電機株式会社 マイクロ波放電光源装置
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5158645A (en) * 1991-09-03 1992-10-27 International Business Machines, Inc. Method of external circuitization of a circuit panel
JPH05243735A (ja) * 1992-03-03 1993-09-21 Hitachi Chem Co Ltd 多層配線板の製造法
US5638598A (en) * 1993-06-17 1997-06-17 Hitachi Chemical Company, Ltd. Process for producing a printed wiring board
JP3751625B2 (ja) * 2004-06-29 2006-03-01 新光電気工業株式会社 貫通電極の製造方法
KR100601493B1 (ko) * 2004-12-30 2006-07-18 삼성전기주식회사 하프에칭된 본딩 패드 및 절단된 도금 라인을 구비한ｂｇａ 패키지 및 그 제조 방법
US20170013715A1 (en) * 2015-07-10 2017-01-12 Rohde & Schwarz Gmbh & Co. Kg Printed circuit board and corresponding method for producing a printed circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620933A (en) * 1969-12-31 1971-11-16 Macdermid Inc Forming plastic parts having surfaces receptive to adherent coatings
DE2136212B1 (de) * 1971-07-20 1972-05-31 Aeg Isolier Und Kunststoff Gmbh Verfahren zur Herstellung eines Basismaterials für gedruckte Schaltungen
US4001466A (en) * 1973-11-27 1977-01-04 Formica International Limited Process for preparing printed circuits
SE7412169L (sv) * 1974-09-27 1976-03-29 Perstorp Ab Forfarande vid framstellning av genomgaende hal i ett laminat
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards
US4162932A (en) * 1977-10-26 1979-07-31 Perstorp, Ab Method for removing resin smear in through holes of printed circuit boards
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit

Also Published As

Publication number Publication date
CA1158364A (en) 1983-12-06
SE8101360L (sv) 1981-09-05
NL8101050A (nl) 1981-10-01
FR2482406A1 (fr) 1981-11-13
DE3008143C2 (de) 1982-04-08
SE451105B (sv) 1987-08-31
FR2482406B1 (fr) 1985-11-15
MX150023A (es) 1984-03-02
AT384341B (de) 1987-10-27
JPS56162899A (en) 1981-12-15
DK95181A (da) 1981-09-05
DK149295B (da) 1986-04-21
US4374868A (en) 1983-02-22
GB2086139A (en) 1982-05-06
IT1170779B (it) 1987-06-03
GB2086139B (en) 1984-08-30
IT8147942A1 (it) 1982-09-04
CH654161A5 (de) 1986-01-31
ATA85481A (de) 1987-03-15
DE3008143A1 (de) 1981-09-10
DK149295C (da) 1986-09-29

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