SE7412169L - Forfarande vid framstellning av genomgaende hal i ett laminat - Google Patents
Forfarande vid framstellning av genomgaende hal i ett laminatInfo
- Publication number
- SE7412169L SE7412169L SE7412169A SE7412169A SE7412169L SE 7412169 L SE7412169 L SE 7412169L SE 7412169 A SE7412169 A SE 7412169A SE 7412169 A SE7412169 A SE 7412169A SE 7412169 L SE7412169 L SE 7412169L
- Authority
- SE
- Sweden
- Prior art keywords
- laminate
- tail
- preparing
- procedure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1388—Temporary protective conductive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
- Y10T156/1057—Subsequent to assembly of laminae
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE7412169A SE7412169L (sv) | 1974-09-27 | 1974-09-27 | Forfarande vid framstellning av genomgaende hal i ett laminat |
US05/607,939 US4023998A (en) | 1974-09-27 | 1975-08-26 | Method for the production of through holes in a laminate |
NL7510374A NL7510374A (nl) | 1974-09-27 | 1975-09-03 | Werkwijze voor het aanbrengen van doorgaande openingen in een laminaat, alsmede laminaat, waarin openingen zijn aangebracht door middel van deze werkwijze. |
GB36747/75A GB1502975A (en) | 1974-09-27 | 1975-09-05 | Method for the production of through holes in a laminate comprising an insulant base and at least one metal layer |
IT27095/75A IT1042430B (it) | 1974-09-27 | 1975-09-10 | Metodo per la produzione di fori passanti in un laminato |
DE2541282A DE2541282C2 (de) | 1974-09-27 | 1975-09-16 | Verfahren zur Nachbehandlung von Durchgangslöchern in einem Laminat für gedruckte Schaltungen |
CH1246975A CH596733A5 (sv) | 1974-09-27 | 1975-09-25 | |
JP50117074A JPS5842640B2 (ja) | 1974-09-27 | 1975-09-26 | カンツウコウオユウスル プリントハイセンキバン ノ セイゾウホウ |
FR7529527A FR2286578A1 (fr) | 1974-09-27 | 1975-09-26 | Procede pour la realisation de trous tranversants dans un stratifie |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE7412169A SE7412169L (sv) | 1974-09-27 | 1974-09-27 | Forfarande vid framstellning av genomgaende hal i ett laminat |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7412169L true SE7412169L (sv) | 1976-03-29 |
Family
ID=20322242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7412169A SE7412169L (sv) | 1974-09-27 | 1974-09-27 | Forfarande vid framstellning av genomgaende hal i ett laminat |
Country Status (9)
Country | Link |
---|---|
US (1) | US4023998A (sv) |
JP (1) | JPS5842640B2 (sv) |
CH (1) | CH596733A5 (sv) |
DE (1) | DE2541282C2 (sv) |
FR (1) | FR2286578A1 (sv) |
GB (1) | GB1502975A (sv) |
IT (1) | IT1042430B (sv) |
NL (1) | NL7510374A (sv) |
SE (1) | SE7412169L (sv) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5432763A (en) * | 1977-08-18 | 1979-03-10 | Hitachi Ltd | Method of making print wire board |
US4323421A (en) * | 1978-04-28 | 1982-04-06 | Bell Telephone Laboratories, Incorporated | Fabrication of conductor-clad composites using molding compounds and techniques |
US4393111A (en) * | 1980-02-15 | 1983-07-12 | Bell Telephone Laboratories, Incorporated | Fabrication of conductor-clad composites using molding compounds and techniques |
DE3008143C2 (de) * | 1980-03-04 | 1982-04-08 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von gedruckten Leiterplatten mit Lochungen, deren Wandungen metallisiert sind |
JPS60244091A (ja) * | 1984-05-18 | 1985-12-03 | 富士通株式会社 | バリ除去方法 |
JPS627194A (ja) * | 1985-07-04 | 1987-01-14 | 旭化成株式会社 | スル−ホ−ル回路 |
US5004521A (en) * | 1988-11-21 | 1991-04-02 | Yamaha Corporation | Method of making a lead frame by embossing, grinding and etching |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
US5528826A (en) * | 1994-04-04 | 1996-06-25 | Hughes Aircraft Company | Method of constructing high yield, fine line, multilayer printed wiring board panel |
GB9420182D0 (en) * | 1994-10-06 | 1994-11-23 | Int Computers Ltd | Printed circuit manufacture |
US5590854A (en) * | 1994-11-02 | 1997-01-07 | Shatz; Solomon | Movable sheet for laminar flow and deicing |
EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
TNSN97123A1 (fr) * | 1996-07-18 | 1999-12-31 | Droz Francois | Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede |
US6355360B1 (en) | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
US6129998A (en) * | 1998-04-10 | 2000-10-10 | R.E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6127051A (en) * | 1998-04-10 | 2000-10-03 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6129990A (en) | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
EP1250395A4 (en) | 1999-12-09 | 2005-06-08 | Valspar Sourcing Inc | ABRASIVE COATING |
US6783860B1 (en) | 2001-05-11 | 2004-08-31 | R. E. Service Company, Inc. | Laminated entry and exit material for drilling printed circuit boards |
JP2003158358A (ja) * | 2001-11-26 | 2003-05-30 | Hitachi Via Mechanics Ltd | レーザー穴あけ加工方法及び装置 |
US20050112344A1 (en) * | 2003-08-20 | 2005-05-26 | Redfern Sean M. | Apparatus and method for use in printed circuit board drilling applications |
US7618514B2 (en) * | 2006-02-03 | 2009-11-17 | United Technologies Corporation | Photo-etched EDM electrode |
EP2191701B1 (en) | 2007-09-28 | 2013-03-20 | Tri-Star Laminates, Inc. | Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards |
CN103317298A (zh) * | 2013-05-08 | 2013-09-25 | 孙树峰 | 飞秒激光辅助抑制微切削零件毛刺形成的方法 |
KR102192492B1 (ko) * | 2013-06-21 | 2020-12-18 | 산미나 코포레이션 | 제거 가능한 커버 레이어를 사용한 도금된 관통홀을 포함하는 적층 구조의 형성 방법 |
EP2853619A1 (en) | 2013-09-25 | 2015-04-01 | ATOTECH Deutschland GmbH | Method for treatment of recessed structures in dielectric materials for smear removal |
WO2015125873A1 (ja) * | 2014-02-21 | 2015-08-27 | 三井金属鉱業株式会社 | 保護層付銅張積層板及び多層プリント配線板 |
CN104923925B (zh) * | 2015-05-12 | 2017-11-17 | 中国科学院微电子研究所 | 一种降低激光热效应的玻璃通孔制作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3653997A (en) * | 1970-06-22 | 1972-04-04 | North American Rockwell | Conditioning and shaping solution for circuit boards |
US3719536A (en) * | 1971-02-12 | 1973-03-06 | Alumet Corp | Mechanochemical sheet metal blanking system |
US3936548A (en) * | 1973-02-28 | 1976-02-03 | Perstorp Ab | Method for the production of material for printed circuits and material for printed circuits |
-
1974
- 1974-09-27 SE SE7412169A patent/SE7412169L/sv unknown
-
1975
- 1975-08-26 US US05/607,939 patent/US4023998A/en not_active Expired - Lifetime
- 1975-09-03 NL NL7510374A patent/NL7510374A/xx not_active Application Discontinuation
- 1975-09-05 GB GB36747/75A patent/GB1502975A/en not_active Expired
- 1975-09-10 IT IT27095/75A patent/IT1042430B/it active
- 1975-09-16 DE DE2541282A patent/DE2541282C2/de not_active Expired
- 1975-09-25 CH CH1246975A patent/CH596733A5/xx not_active IP Right Cessation
- 1975-09-26 FR FR7529527A patent/FR2286578A1/fr active Granted
- 1975-09-26 JP JP50117074A patent/JPS5842640B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2541282C2 (de) | 1983-11-17 |
GB1502975A (en) | 1978-03-08 |
FR2286578B1 (sv) | 1980-04-11 |
US4023998A (en) | 1977-05-17 |
JPS5842640B2 (ja) | 1983-09-21 |
JPS5160955A (en) | 1976-05-27 |
FR2286578A1 (fr) | 1976-04-23 |
CH596733A5 (sv) | 1978-03-15 |
IT1042430B (it) | 1980-01-30 |
NL7510374A (nl) | 1976-03-30 |
DE2541282A1 (de) | 1976-04-08 |
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