AT377889B - Verfahren zum herstellen einer mit bauelementen bestueckten leiterplatte - Google Patents

Verfahren zum herstellen einer mit bauelementen bestueckten leiterplatte

Info

Publication number
AT377889B
AT377889B AT0704878A AT704878A AT377889B AT 377889 B AT377889 B AT 377889B AT 0704878 A AT0704878 A AT 0704878A AT 704878 A AT704878 A AT 704878A AT 377889 B AT377889 B AT 377889B
Authority
AT
Austria
Prior art keywords
producing
components
circuit board
board assembled
assembled
Prior art date
Application number
AT0704878A
Other languages
English (en)
Other versions
ATA704878A (de
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA704878A publication Critical patent/ATA704878A/de
Application granted granted Critical
Publication of AT377889B publication Critical patent/AT377889B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT0704878A 1978-02-28 1978-09-29 Verfahren zum herstellen einer mit bauelementen bestueckten leiterplatte AT377889B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2809013A DE2809013C2 (de) 1978-02-28 1978-02-28 Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte

Publications (2)

Publication Number Publication Date
ATA704878A ATA704878A (de) 1984-09-15
AT377889B true AT377889B (de) 1985-05-10

Family

ID=6033380

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0704878A AT377889B (de) 1978-02-28 1978-09-29 Verfahren zum herstellen einer mit bauelementen bestueckten leiterplatte

Country Status (9)

Country Link
JP (2) JPS54118573A (de)
AT (1) AT377889B (de)
AU (1) AU531356B2 (de)
CA (1) CA1131746A (de)
DE (1) DE2809013C2 (de)
DK (1) DK152480C (de)
IL (1) IL56306A (de)
IT (1) IT7947865A0 (de)
SE (1) SE443276B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (ja) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd トンネルの構築工法
DE4028978C2 (de) * 1990-09-12 1993-10-14 Siemens Ag Lötkontaktelement für Leiterplatten zur Verlötung von oberflächenmontierbaren SMD-Bauteilen, und bevorzugte Verwendung desselben zur Verlötung von übereinanderliegenden Bauteilen
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (de) * 1963-09-30 1967-08-10 Siemens Ag Gedruckte Schaltung
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards
JPS48100660A (de) * 1972-04-04 1973-12-19
JPS5629805Y2 (de) * 1974-08-02 1981-07-15

Also Published As

Publication number Publication date
DK152480C (da) 1988-07-25
JPS58103163U (ja) 1983-07-13
AU531356B2 (en) 1983-08-18
DK152480B (da) 1988-02-29
IT7947865A0 (it) 1979-02-02
JPS639396B2 (de) 1988-02-29
CA1131746A (en) 1982-09-14
SE443276B (sv) 1986-02-17
AU4445479A (en) 1979-09-06
ATA704878A (de) 1984-09-15
DE2809013C2 (de) 1985-08-01
SE7809290L (sv) 1979-08-29
DK385578A (da) 1979-08-29
JPS54118573A (en) 1979-09-14
DE2809013A1 (de) 1979-08-30
IL56306A0 (en) 1979-03-12
IL56306A (en) 1982-07-30

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee