JPS58103163U - 部品を取付けた回路板 - Google Patents

部品を取付けた回路板

Info

Publication number
JPS58103163U
JPS58103163U JP1982122152U JP12215282U JPS58103163U JP S58103163 U JPS58103163 U JP S58103163U JP 1982122152 U JP1982122152 U JP 1982122152U JP 12215282 U JP12215282 U JP 12215282U JP S58103163 U JPS58103163 U JP S58103163U
Authority
JP
Japan
Prior art keywords
circuit board
hole
conductor
flange
hole wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982122152U
Other languages
English (en)
Inventor
エリツツ・スタ−ル
Original Assignee
コルモ−ゲン・テクノロジイズ・コ−ポレイシヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コルモ−ゲン・テクノロジイズ・コ−ポレイシヨン filed Critical コルモ−ゲン・テクノロジイズ・コ−ポレイシヨン
Publication of JPS58103163U publication Critical patent/JPS58103163U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は組立素子を取付けてないプリント回路板の一例
を示す部分破断斜視図、第２曲はプリント回路板の他の
一例を示す部分破断斜視図、第３図ないし第５図は本考
案で回路板に組立素子を取付ける方法を示す説明図であ
って、第３図は熱溶融はんだ浴＆千接続線を浸漬する前
の状態を、第４図ははんだ浴に接続線の端を浸漬した状
態を、そして第５図ははんだ付けによって組立素子を回
路板に取付けた状態を示すものであり、第６図は多数の
組立素子を取付けた回路板の部分破断斜視図である。 １・・・・・！回路板、２・・・・・・導体、３・・・
・・・金属層、４・・・・・・はんだ、５□・・・・：
・接続線、６・・・・・・組立素子。

Claims (1)

  1. 【実用新案登録請求の範囲】 穴壁が金属被覆されている、組立素子の接続線などの接
    続素子を収容するためあ穴を具備し、さらに回路板の一
    方の面上に希望する回路パターン通りの導体路を具備し
    ている、組立素子を取り付けた回路板であって、回路板
    の上記導体路を具備している側に組立素子が配置されて
    いること、上記穴を通り抜けて固定されずに突き出して
    いる接続素子の末端を加熱して、回路板の導体路を具備
    していない側からはんだ処理することによって、穴壁の
    金属層と組各素子の接続素子との間の間隙をはんだ付け
    していること、および回路板の上記導体路を具備した側
    で、上記穴の周囲に導体フランジが形成されており、該
    フランジにより上記導体路と穴壁が接続され、かつ上記
    はんだが上記フランジからはみ出すことなぐ上記フラン
    ジ上に上−゛。 記接続素子を中心として盛り上がって、はんだランドを
    形成していることを特徴とする回路。
JP1982122152U 1978-02-28 1982-08-10 部品を取付けた回路板 Pending JPS58103163U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE28090133 1978-02-28
DE2809013A DE2809013C2 (de) 1978-02-28 1978-02-28 Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte

Publications (1)

Publication Number Publication Date
JPS58103163U true JPS58103163U (ja) 1983-07-13

Family

ID=6033380

Family Applications (2)

Application Number Title Priority Date Filing Date
JP12675778A Granted JPS54118573A (en) 1978-02-28 1978-10-14 Circuit board with parts and method of producing same
JP1982122152U Pending JPS58103163U (ja) 1978-02-28 1982-08-10 部品を取付けた回路板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP12675778A Granted JPS54118573A (en) 1978-02-28 1978-10-14 Circuit board with parts and method of producing same

Country Status (9)

Country Link
JP (2) JPS54118573A (ja)
AT (1) AT377889B (ja)
AU (1) AU531356B2 (ja)
CA (1) CA1131746A (ja)
DE (1) DE2809013C2 (ja)
DK (1) DK152480C (ja)
IL (1) IL56306A (ja)
IT (1) IT7947865A0 (ja)
SE (1) SE443276B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (ja) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd トンネルの構築工法
DE4028978C2 (de) * 1990-09-12 1993-10-14 Siemens Ag Lötkontaktelement für Leiterplatten zur Verlötung von oberflächenmontierbaren SMD-Bauteilen, und bevorzugte Verwendung desselben zur Verlötung von übereinanderliegenden Bauteilen
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (de) * 1963-09-30 1967-08-10 Siemens Ag Gedruckte Schaltung
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards
JPS48100660A (ja) * 1972-04-04 1973-12-19
JPS5629805Y2 (ja) * 1974-08-02 1981-07-15

Also Published As

Publication number Publication date
IL56306A (en) 1982-07-30
JPS54118573A (en) 1979-09-14
DK385578A (da) 1979-08-29
DE2809013A1 (de) 1979-08-30
IL56306A0 (en) 1979-03-12
DE2809013C2 (de) 1985-08-01
AU4445479A (en) 1979-09-06
SE443276B (sv) 1986-02-17
SE7809290L (sv) 1979-08-29
DK152480B (da) 1988-02-29
JPS639396B2 (ja) 1988-02-29
DK152480C (da) 1988-07-25
CA1131746A (en) 1982-09-14
AU531356B2 (en) 1983-08-18
AT377889B (de) 1985-05-10
ATA704878A (de) 1984-09-15
IT7947865A0 (it) 1979-02-02

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