IL56306A - Printed circuit board and its production - Google Patents

Printed circuit board and its production

Info

Publication number
IL56306A
IL56306A IL56306A IL5630678A IL56306A IL 56306 A IL56306 A IL 56306A IL 56306 A IL56306 A IL 56306A IL 5630678 A IL5630678 A IL 5630678A IL 56306 A IL56306 A IL 56306A
Authority
IL
Israel
Prior art keywords
production
circuit board
printed circuit
printed
board
Prior art date
Application number
IL56306A
Other versions
IL56306A0 (en
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of IL56306A0 publication Critical patent/IL56306A0/en
Publication of IL56306A publication Critical patent/IL56306A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IL56306A 1978-02-28 1978-12-26 Printed circuit board and its production IL56306A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2809013A DE2809013C2 (en) 1978-02-28 1978-02-28 Method of manufacturing a printed circuit board loaded with components

Publications (2)

Publication Number Publication Date
IL56306A0 IL56306A0 (en) 1979-03-12
IL56306A true IL56306A (en) 1982-07-30

Family

ID=6033380

Family Applications (1)

Application Number Title Priority Date Filing Date
IL56306A IL56306A (en) 1978-02-28 1978-12-26 Printed circuit board and its production

Country Status (9)

Country Link
JP (2) JPS54118573A (en)
AT (1) AT377889B (en)
AU (1) AU531356B2 (en)
CA (1) CA1131746A (en)
DE (1) DE2809013C2 (en)
DK (1) DK152480C (en)
IL (1) IL56306A (en)
IT (1) IT7947865A0 (en)
SE (1) SE443276B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (en) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd Construction method of tunnel
DE4028978C2 (en) * 1990-09-12 1993-10-14 Siemens Ag Solder contact element for printed circuit boards for soldering surface-mountable SMD components, and preferred use of the same for soldering superimposed components
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (en) * 1963-09-30 1967-08-10 Siemens Ag Printed circuit
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards
JPS48100660A (en) * 1972-04-04 1973-12-19
JPS5629805Y2 (en) * 1974-08-02 1981-07-15

Also Published As

Publication number Publication date
AU531356B2 (en) 1983-08-18
JPS58103163U (en) 1983-07-13
ATA704878A (en) 1984-09-15
CA1131746A (en) 1982-09-14
JPS639396B2 (en) 1988-02-29
DK152480B (en) 1988-02-29
DK152480C (en) 1988-07-25
SE7809290L (en) 1979-08-29
DE2809013A1 (en) 1979-08-30
AU4445479A (en) 1979-09-06
DK385578A (en) 1979-08-29
IL56306A0 (en) 1979-03-12
AT377889B (en) 1985-05-10
JPS54118573A (en) 1979-09-14
SE443276B (en) 1986-02-17
IT7947865A0 (en) 1979-02-02
DE2809013C2 (en) 1985-08-01

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