SE443276B - Forfarande for framstellning av en med kopplingskomponenter bestyckad ledningsplatta - Google Patents

Forfarande for framstellning av en med kopplingskomponenter bestyckad ledningsplatta

Info

Publication number
SE443276B
SE443276B SE7809290A SE7809290A SE443276B SE 443276 B SE443276 B SE 443276B SE 7809290 A SE7809290 A SE 7809290A SE 7809290 A SE7809290 A SE 7809290A SE 443276 B SE443276 B SE 443276B
Authority
SE
Sweden
Prior art keywords
plate
layer
solder
metal
holes
Prior art date
Application number
SE7809290A
Other languages
English (en)
Swedish (sv)
Other versions
SE7809290L (sv
Inventor
F Stahl
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7809290L publication Critical patent/SE7809290L/xx
Publication of SE443276B publication Critical patent/SE443276B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE7809290A 1978-02-28 1978-09-04 Forfarande for framstellning av en med kopplingskomponenter bestyckad ledningsplatta SE443276B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2809013A DE2809013C2 (de) 1978-02-28 1978-02-28 Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte

Publications (2)

Publication Number Publication Date
SE7809290L SE7809290L (sv) 1979-08-29
SE443276B true SE443276B (sv) 1986-02-17

Family

ID=6033380

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7809290A SE443276B (sv) 1978-02-28 1978-09-04 Forfarande for framstellning av en med kopplingskomponenter bestyckad ledningsplatta

Country Status (9)

Country Link
JP (2) JPS54118573A (ja)
AT (1) AT377889B (ja)
AU (1) AU531356B2 (ja)
CA (1) CA1131746A (ja)
DE (1) DE2809013C2 (ja)
DK (1) DK152480C (ja)
IL (1) IL56306A (ja)
IT (1) IT7947865A0 (ja)
SE (1) SE443276B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (ja) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd トンネルの構築工法
DE4028978C2 (de) * 1990-09-12 1993-10-14 Siemens Ag Lötkontaktelement für Leiterplatten zur Verlötung von oberflächenmontierbaren SMD-Bauteilen, und bevorzugte Verwendung desselben zur Verlötung von übereinanderliegenden Bauteilen
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (de) * 1963-09-30 1967-08-10 Siemens Ag Gedruckte Schaltung
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards
JPS48100660A (ja) * 1972-04-04 1973-12-19
JPS5629805Y2 (ja) * 1974-08-02 1981-07-15

Also Published As

Publication number Publication date
DK152480B (da) 1988-02-29
DK385578A (da) 1979-08-29
JPS639396B2 (ja) 1988-02-29
IL56306A0 (en) 1979-03-12
SE7809290L (sv) 1979-08-29
AU531356B2 (en) 1983-08-18
IT7947865A0 (it) 1979-02-02
AU4445479A (en) 1979-09-06
DE2809013C2 (de) 1985-08-01
DE2809013A1 (de) 1979-08-30
CA1131746A (en) 1982-09-14
IL56306A (en) 1982-07-30
ATA704878A (de) 1984-09-15
JPS54118573A (en) 1979-09-14
AT377889B (de) 1985-05-10
JPS58103163U (ja) 1983-07-13
DK152480C (da) 1988-07-25

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