DE2856954T1 - Process for manufacturing printed circuit boards - Google Patents

Process for manufacturing printed circuit boards

Info

Publication number
DE2856954T1
DE2856954T1 DE782856954T DE2856954T DE2856954T1 DE 2856954 T1 DE2856954 T1 DE 2856954T1 DE 782856954 T DE782856954 T DE 782856954T DE 2856954 T DE2856954 T DE 2856954T DE 2856954 T1 DE2856954 T1 DE 2856954T1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
manufacturing printed
manufacturing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE782856954T
Other languages
English (en)
Other versions
DE2856954C2 (de
Inventor
R Mack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE2856954T1 publication Critical patent/DE2856954T1/de
Application granted granted Critical
Publication of DE2856954C2 publication Critical patent/DE2856954C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE782856954T 1977-08-03 1978-07-27 Process for manufacturing printed circuit boards Granted DE2856954T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/821,604 US4104111A (en) 1977-08-03 1977-08-03 Process for manufacturing printed circuit boards
PCT/US1978/000055 WO1979000083A1 (en) 1977-08-03 1978-07-27 Process for manufacturing printed circuit boards

Publications (2)

Publication Number Publication Date
DE2856954T1 true DE2856954T1 (de) 1982-01-28
DE2856954C2 DE2856954C2 (de) 1988-03-10

Family

ID=25233813

Family Applications (1)

Application Number Title Priority Date Filing Date
DE782856954T Granted DE2856954T1 (de) 1977-08-03 1978-07-27 Process for manufacturing printed circuit boards

Country Status (9)

Country Link
US (1) US4104111A (de)
EP (1) EP0006884A1 (de)
JP (1) JPS5435364A (de)
AU (1) AU523960B2 (de)
CA (1) CA1108306A (de)
DE (1) DE2856954T1 (de)
GB (1) GB2021324B (de)
SE (1) SE429914B (de)
WO (1) WO1979000083A1 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
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JPS54158661A (en) * 1978-06-01 1979-12-14 Tokyo Purinto Kougiyou Kk Printed circuit board
JPS5559795A (en) * 1978-10-30 1980-05-06 Nippon Electric Co Printed circuit board and method of manufacturing same
US4283248A (en) * 1979-02-01 1981-08-11 Nitto Electric Industrial Co., Ltd. Etching solution for tin-nickel alloy and process for etching the same
US4303798A (en) * 1979-04-27 1981-12-01 Kollmorgen Technologies Corporation Heat shock resistant printed circuit board assemblies
DE2920940A1 (de) * 1979-05-21 1980-12-04 Schering Ag Verfahren zur herstellung von gedruckten schaltungen
JPS5619696A (en) * 1979-07-25 1981-02-24 Nippon Electric Co Method of manufacturing printed circuit board
US4278511A (en) * 1980-02-28 1981-07-14 General Dynamics, Pomona Division Plug plating
US4374708A (en) * 1980-02-28 1983-02-22 General Dynamics, Pomona Division Fine line circuitry probes and method of manufacture
US4649338A (en) * 1980-02-28 1987-03-10 General Dynamics, Pomona Division Fine line circuitry probes and method of manufacture
US4374003A (en) * 1980-02-28 1983-02-15 General Dynamics, Pomona Division Fine line circuitry probes and method of manufacture
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
US4325780A (en) * 1980-09-16 1982-04-20 Schulz Sr Robert M Method of making a printed circuit board
DE3110528A1 (de) * 1981-03-18 1982-10-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur herstellung gedruckter schaltungen
DE3202447A1 (de) * 1982-01-26 1983-07-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zur galvanischen und aetztechnischen strukturierung von scheiben mit isolierenden ringzonen im muendungsbereich von bohrungen
GB2113477B (en) * 1981-12-31 1985-04-17 Hara J B O Method of producing printed circuits
US4525246A (en) * 1982-06-24 1985-06-25 Hadco Corporation Making solderable printed circuit boards
CH650373A5 (fr) * 1982-07-16 1985-07-15 Jean Paul Strobel Circuit imprime et procede de fabrication du circuit.
US4608274A (en) * 1982-08-06 1986-08-26 Faultless Pcbs Method of manufacturing circuit boards
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4543715A (en) * 1983-02-28 1985-10-01 Allied Corporation Method of forming vertical traces on printed circuit board
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits
GB2141879B (en) * 1983-06-01 1988-03-09 Ferranti Plc Manufacture of printed circuit boards
US4487828A (en) * 1983-06-03 1984-12-11 At&T Technologies, Inc. Method of manufacturing printed circuit boards
US4487654A (en) * 1983-10-27 1984-12-11 Ael Microtel Limited Method of manufacturing printed wiring boards
FR2565760B1 (fr) * 1984-06-08 1988-05-20 Aerospatiale Procede pour la realisation d'un circuit imprime et circuit imprime obtenu par la mise en oeuvre dudit procede
DE3427015A1 (de) * 1984-07-21 1986-01-30 Nippon Mektron, Ltd., Tokio/Tokyo Verfahren zur herstellung von durchkontaktierungen in gedruckten schaltungen
US4759822A (en) * 1984-10-12 1988-07-26 Triquint Semiconductor Inc. Methods for producing an aperture in a surface
DE3440668A1 (de) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
GB8500906D0 (en) * 1985-01-15 1985-02-20 Prestwick Circuits Ltd Printed circuit boards
US4600480A (en) * 1985-05-09 1986-07-15 Crown City Plating Method for selectively plating plastics
US4804615A (en) * 1985-08-08 1989-02-14 Macdermid, Incorporated Method for manufacture of printed circuit boards
US4720324A (en) * 1985-10-03 1988-01-19 Hayward John S Process for manufacturing printed circuit boards
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
ZA873845B (en) * 1986-06-18 1987-11-24 Macdermid, Incorporated Method for manufacture of printed circuit boards
US4735694A (en) * 1986-06-18 1988-04-05 Macdermid, Incorporated Method for manufacture of printed circuit boards
DE3623505A1 (de) * 1986-07-09 1988-01-21 Deutsche Telephonwerk Kabel Verfahren zum herstellen von leiterplatten mit selektiv auf den loetaugen und lochwandungen aufgebrachten galvanischen blei-zinn-schichten
US4756795A (en) * 1986-10-31 1988-07-12 International Business Machines Corporation Raw card fabrication process with nickel overplate
JPS63222497A (ja) * 1987-03-12 1988-09-16 株式会社　コサク ニツケル・スズ合金スル−ホ−ル二層めつきによるプリント配線板の製造方法
EP0370133A1 (de) * 1988-11-24 1990-05-30 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterplatten
US5024734A (en) * 1989-12-27 1991-06-18 Westinghouse Electric Corp. Solder pad/circuit trace interface and a method for generating the same
JPH0423485A (ja) * 1990-05-18 1992-01-27 Cmk Corp プリント配線板とその製造法
US5536908A (en) * 1993-01-05 1996-07-16 Schlumberger Technology Corporation Lead-free printed circuit assembly
JPH07170029A (ja) * 1993-12-15 1995-07-04 Nippon Avionics Co Ltd フレキシブル・プリント配線板およびその製造方法
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
AU1357797A (en) * 1996-01-11 1997-08-01 Gregory E. Ross Perimeter coating alignment
US6015482A (en) * 1997-12-18 2000-01-18 Circuit Research Corp. Printed circuit manufacturing process using tin-nickel plating
WO2000003305A1 (en) * 1998-07-10 2000-01-20 Photocircuits Corporation A method for making a printed wiring board with heavy and thin conductive traces
SG82591A1 (en) * 1998-12-17 2001-08-21 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
EP1246773A2 (de) 2000-01-07 2002-10-09 President And Fellows Of Harvard College Herstellung von metallenen mikrostrukturen durch belichtung einer lichtempfindlichen zusammensetzung
US6360434B1 (en) * 2000-02-23 2002-03-26 Telaxis Communications Corporation Circuit fabrication
DE10018025A1 (de) * 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern
US6586683B2 (en) * 2001-04-27 2003-07-01 International Business Machines Corporation Printed circuit board with mixed metallurgy pads and method of fabrication
TW560231B (en) * 2002-03-27 2003-11-01 United Test Ct Inc Fabrication method of circuit board
JP4133560B2 (ja) * 2003-05-07 2008-08-13 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板の製造方法およびプリント配線基板
US7132303B2 (en) * 2003-12-18 2006-11-07 Freescale Semiconductor, Inc. Stacked semiconductor device assembly and method for forming
EP1702502A2 (de) * 2003-12-30 2006-09-20 3M Innovative Properties Company Strukturierte schaltungen und herstellungsverfahren dafür
US7279407B2 (en) 2004-09-02 2007-10-09 Micron Technology, Inc. Selective nickel plating of aluminum, copper, and tungsten structures
ATE460829T1 (de) * 2005-06-24 2010-03-15 Taiwan Semiconductor Mfg Substrate zur verhinderung von wellungen und herstellungsverfahren dafür
US20070090170A1 (en) * 2005-10-20 2007-04-26 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having a plurality of solder connection sites thereon
TWI377656B (en) * 2007-09-19 2012-11-21 Method for manufacturing packaging substrate
DE102016216308B4 (de) * 2016-08-30 2022-06-15 Schweizer Electronic Ag Leiterplatte und Verfahren zu deren Herstellung
KR20210000161A (ko) * 2019-06-24 2021-01-04 삼성전기주식회사 인쇄회로기판 및 그 제조방법

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DE1690265B2 (de) * 1967-05-23 1975-10-30 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zur Erzeugung von gedruckten Leitungszügen
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
JPS4876061A (de) * 1972-01-19 1973-10-13
US3772101A (en) * 1972-05-01 1973-11-13 Ibm Landless plated-through hole photoresist making process
JPS5650437B2 (de) * 1973-10-19 1981-11-28
US4024631A (en) * 1975-11-24 1977-05-24 Xerox Corporation Printed circuit board plating process

Also Published As

Publication number Publication date
SE429914B (sv) 1983-10-03
GB2021324A (en) 1979-02-22
DE2856954C2 (de) 1988-03-10
SE7902938L (sv) 1979-04-03
AU523960B2 (en) 1982-08-26
JPS5435364A (en) 1979-03-15
WO1979000083A1 (en) 1979-02-22
GB2021324B (en) 1982-04-21
AU3859278A (en) 1980-02-07
CA1108306A (en) 1981-09-01
US4104111A (en) 1978-08-01
EP0006884A1 (de) 1980-01-23

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8170 Reinstatement of the former position
8128 New person/name/address of the agent

Representative=s name: BERNHARDT, K., DIPL.-ING., PAT.-ANW., 8000 MUENCHE

D2 Grant after examination
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee