JPS53111472A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS53111472A JPS53111472A JP2169277A JP2169277A JPS53111472A JP S53111472 A JPS53111472 A JP S53111472A JP 2169277 A JP2169277 A JP 2169277A JP 2169277 A JP2169277 A JP 2169277A JP S53111472 A JPS53111472 A JP S53111472A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2169277A JPS53111472A (en) | 1977-03-01 | 1977-03-01 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2169277A JPS53111472A (en) | 1977-03-01 | 1977-03-01 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53111472A true JPS53111472A (en) | 1978-09-29 |
Family
ID=12062112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2169277A Pending JPS53111472A (en) | 1977-03-01 | 1977-03-01 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53111472A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187098A (en) * | 1984-03-07 | 1985-09-24 | イビデン株式会社 | Plug-in package substrate |
JPS6140047A (en) * | 1984-07-31 | 1986-02-26 | Hitachi Chem Co Ltd | Package for mounting semiconductor element |
JPS61140593U (en) * | 1985-02-21 | 1986-08-30 | ||
JPS63111691A (en) * | 1986-10-30 | 1988-05-16 | オ−ケ−プリント配線株式会社 | Electronic parts fitting board |
JPH01296689A (en) * | 1988-05-25 | 1989-11-30 | Ibiden Co Ltd | Metal core printed wiring board |
JPH01319995A (en) * | 1988-06-21 | 1989-12-26 | Ibiden Co Ltd | Substrate for loading electronic part and manufacture thereof |
JPH06334343A (en) * | 1992-09-04 | 1994-12-02 | Hitachi Ltd | Manufacture of multilayered wiring board and high density multilayered wiring board |
US6767616B2 (en) | 2002-05-14 | 2004-07-27 | Shinko Electric Industries Co., Ltd. | Metal core substrate and process for manufacturing same |
-
1977
- 1977-03-01 JP JP2169277A patent/JPS53111472A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187098A (en) * | 1984-03-07 | 1985-09-24 | イビデン株式会社 | Plug-in package substrate |
JPH0525200B2 (en) * | 1984-03-07 | 1993-04-12 | Ibiden Co Ltd | |
JPS6140047A (en) * | 1984-07-31 | 1986-02-26 | Hitachi Chem Co Ltd | Package for mounting semiconductor element |
JPH0548628B2 (en) * | 1984-07-31 | 1993-07-22 | Hitachi Chemical Co Ltd | |
JPS61140593U (en) * | 1985-02-21 | 1986-08-30 | ||
JPS63111691A (en) * | 1986-10-30 | 1988-05-16 | オ−ケ−プリント配線株式会社 | Electronic parts fitting board |
JPH01296689A (en) * | 1988-05-25 | 1989-11-30 | Ibiden Co Ltd | Metal core printed wiring board |
JPH01319995A (en) * | 1988-06-21 | 1989-12-26 | Ibiden Co Ltd | Substrate for loading electronic part and manufacture thereof |
JPH06334343A (en) * | 1992-09-04 | 1994-12-02 | Hitachi Ltd | Manufacture of multilayered wiring board and high density multilayered wiring board |
US6767616B2 (en) | 2002-05-14 | 2004-07-27 | Shinko Electric Industries Co., Ltd. | Metal core substrate and process for manufacturing same |
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