SE456388B - Forfarande for framstellning av monsterkort - Google Patents

Forfarande for framstellning av monsterkort

Info

Publication number
SE456388B
SE456388B SE8100733A SE8100733A SE456388B SE 456388 B SE456388 B SE 456388B SE 8100733 A SE8100733 A SE 8100733A SE 8100733 A SE8100733 A SE 8100733A SE 456388 B SE456388 B SE 456388B
Authority
SE
Sweden
Prior art keywords
wiring
layer
metal
plane
adhesive
Prior art date
Application number
SE8100733A
Other languages
English (en)
Swedish (sv)
Other versions
SE8100733L (sv
Inventor
G Kisters
F Stahl
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE8100733L publication Critical patent/SE8100733L/xx
Publication of SE456388B publication Critical patent/SE456388B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
SE8100733A 1980-02-19 1981-01-30 Forfarande for framstellning av monsterkort SE456388B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3006117A DE3006117C2 (de) 1980-02-19 1980-02-19 Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen

Publications (2)

Publication Number Publication Date
SE8100733L SE8100733L (sv) 1981-08-20
SE456388B true SE456388B (sv) 1988-09-26

Family

ID=6094962

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8100733A SE456388B (sv) 1980-02-19 1981-01-30 Forfarande for framstellning av monsterkort

Country Status (12)

Country Link
US (1) US4751105A (de)
JP (1) JPS56150900A (de)
AT (1) AT378308B (de)
CA (1) CA1162323A (de)
CH (1) CH658157A5 (de)
DE (1) DE3006117C2 (de)
DK (1) DK71481A (de)
FR (1) FR2476427A1 (de)
IL (1) IL62169A (de)
IT (1) IT1170737B (de)
NL (1) NL8100807A (de)
SE (1) SE456388B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4735676A (en) * 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
DE3812414A1 (de) * 1988-04-14 1989-10-26 Standard Elektrik Lorenz Ag Verfahren zum herstellen einer allseitig geschirmten signalleitung
BR0210147A (pt) * 2001-06-04 2004-06-08 Qinetiq Ltd Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta
DE102006008050A1 (de) * 2006-02-21 2007-08-23 Imi Intelligent Medical Implants Ag Vorrichtung mit flexiblem Mehrschichtsystem zur Kontaktierung oder Elektrostimulation von lebenden Gewebezellen oder Nerven

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1073197B (de) * 1955-06-28 1960-01-14
US3102213A (en) * 1960-05-13 1963-08-27 Hazeltine Research Inc Multiplanar printed circuits and methods for their manufacture
DE1142926B (de) * 1961-11-15 1963-01-31 Telefunken Patent Verfahren zur Herstellung gedruckter Schaltungsplatten
FR1345163A (fr) * 1962-10-29 1963-12-06 Intellux Circuits électriques en couches multiples et procédé pour leur fabrication
DE1267738B (de) * 1962-10-29 1968-05-09 Intellux Inc Verfahren zur Herstellung von elektrischen Verbindungen zwischen den Stromkreisen von mehrlagigen gedruckten elektrischen Schaltungen
US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
US3350498A (en) * 1965-01-04 1967-10-31 Intellux Inc Multilayer circuit and method of making the same
DE1590753A1 (de) * 1966-10-01 1970-05-14 Telefunken Patent Verfahren zur Herstellung einer doppelseitig mit Leitungszuegen bedeckten Isolierstoffplatte mit metallisierten Loechern
US3597834A (en) * 1968-02-14 1971-08-10 Texas Instruments Inc Method in forming electrically continuous circuit through insulating layer
NL6808469A (de) * 1968-06-15 1969-12-17
US3640853A (en) * 1968-12-27 1972-02-08 Rca Corp Adhesion of nonconducting and conducting materials
US3672986A (en) * 1969-12-19 1972-06-27 Day Co Nv Metallization of insulating substrates
US3697319A (en) * 1970-12-09 1972-10-10 Rca Corp Method of metallizing an electrically insulating surface
US4005238A (en) * 1973-10-25 1977-01-25 Akademie Der Wissenschaften Der Ddr Metallized articles and method of producing the same
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
JPS528504A (en) * 1975-07-09 1977-01-22 Toshiba Corp Electro magnetic pump
JPS5288772A (en) * 1976-01-20 1977-07-25 Matsushita Electric Ind Co Ltd Method of producing printed circuit board
JPS5388960A (en) * 1977-01-14 1978-08-04 Matsushita Electric Ind Co Ltd Method of producing printed circuit board

Also Published As

Publication number Publication date
CA1162323A (en) 1984-02-14
IL62169A0 (en) 1981-03-31
ATA15881A (de) 1984-11-15
DE3006117A1 (de) 1981-08-27
JPS56150900A (en) 1981-11-21
NL8100807A (nl) 1981-09-16
IL62169A (en) 1986-04-29
US4751105A (en) 1988-06-14
JPH0261160B2 (de) 1990-12-19
CH658157A5 (de) 1986-10-15
DE3006117C2 (de) 1981-11-26
DK71481A (da) 1981-08-20
SE8100733L (sv) 1981-08-20
FR2476427A1 (fr) 1981-08-21
IT8147843A0 (it) 1981-02-19
IT1170737B (it) 1987-06-03
FR2476427B1 (de) 1985-02-01
IT8147843A1 (it) 1982-08-19
AT378308B (de) 1985-07-25

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