ZA200900374B - Method for depositing electrically insulating layers - Google Patents

Method for depositing electrically insulating layers

Info

Publication number
ZA200900374B
ZA200900374B ZA200900374A ZA200900374A ZA200900374B ZA 200900374 B ZA200900374 B ZA 200900374B ZA 200900374 A ZA200900374 A ZA 200900374A ZA 200900374 A ZA200900374 A ZA 200900374A ZA 200900374 B ZA200900374 B ZA 200900374B
Authority
ZA
South Africa
Prior art keywords
electrically insulating
insulating layers
depositing electrically
depositing
layers
Prior art date
Application number
ZA200900374A
Other languages
English (en)
Inventor
Juergen Ramm
Beno Widrig
Christian Wohlrab
Original Assignee
Oerlikon Trading Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag filed Critical Oerlikon Trading Ag
Publication of ZA200900374B publication Critical patent/ZA200900374B/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325Electric arc evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/081Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055Arc discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3417Arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3447Collimators, shutters, apertures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464Operating strategies
    • H01J37/3467Pulsed operation, e.g. HIPIMS

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
ZA200900374A 2006-07-19 2007-07-12 Method for depositing electrically insulating layers ZA200900374B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH11662006 2006-07-19

Publications (1)

Publication Number Publication Date
ZA200900374B true ZA200900374B (en) 2010-04-28

Family

ID=37174179

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200900374A ZA200900374B (en) 2006-07-19 2007-07-12 Method for depositing electrically insulating layers

Country Status (20)

Country Link
US (1) US8197648B2 (ru)
EP (2) EP2599891A3 (ru)
JP (1) JP5306198B2 (ru)
KR (1) KR101361234B1 (ru)
CN (1) CN101490305B (ru)
AU (1) AU2007276186B2 (ru)
BR (1) BRPI0714437B1 (ru)
CA (1) CA2657726C (ru)
ES (1) ES2527877T3 (ru)
HK (1) HK1129910A1 (ru)
IL (1) IL196488A (ru)
MX (1) MX2009000593A (ru)
MY (1) MY167043A (ru)
NZ (1) NZ573694A (ru)
PT (1) PT2041331E (ru)
RU (1) RU2461664C2 (ru)
TW (1) TWI411696B (ru)
UA (1) UA95809C2 (ru)
WO (1) WO2008009619A1 (ru)
ZA (1) ZA200900374B (ru)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2166128B1 (de) * 2008-09-19 2011-11-09 Oerlikon Trading AG, Trübbach Verfahren zum Herstellen von Metalloxidschichten durch Funkenverdampfung
DE102009022982A1 (de) * 2009-05-28 2010-12-02 Oerlikon Trading Ag, Trübbach Verfahren zum Aufbringen eines Hochtemperaturschmiermittels
US9416438B2 (en) 2009-07-22 2016-08-16 Oerlikon Surface Solutions Ag, Pfaffikon Method for producing coatings with a single composite target
EP2369031B1 (de) 2010-03-18 2016-05-04 Oerlikon Trading AG, Trübbach Beschichtung auf nial2o4 basis in spinellstruktur
DE102010042828A1 (de) * 2010-10-22 2012-04-26 Walter Ag Target für Lichtbogenverfahren
US9447488B2 (en) * 2011-09-30 2016-09-20 Oerlikon Surface Solutions Ag, Pfaffikon Aluminum titanium nitride coating with adapted morphology for enhanced wear resistance in machining operations and method thereof
US9953808B2 (en) 2013-04-30 2018-04-24 Nippon Itf, Inc. Arc evaporation source
CN108368618B (zh) 2015-12-22 2020-12-11 山特维克知识产权股份有限公司 制造pvd层的方法和涂覆的切削工具
JP7179291B2 (ja) * 2016-04-22 2022-11-29 エリコン サーフェス ソリューションズ アーゲー、 プフェフィコン HiPIMSを用いて成長欠陥を低減させたTiCN
EP3556901B1 (en) * 2018-04-20 2021-03-31 Plansee Composite Materials Gmbh Vacuum arc source
DE102018112335A1 (de) * 2018-05-23 2019-11-28 Hartmetall-Werkzeugfabrik Paul Horn Gmbh Magnetronsputtervorrichtung
RU2761900C1 (ru) * 2021-02-08 2021-12-13 Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук Магнетронное распылительное устройство
CN114324369B (zh) * 2022-03-11 2022-06-07 北京新研创能科技有限公司 双极板表面划痕检测系统及方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3625848A (en) * 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
JPS63501646A (ja) * 1985-09-30 1988-06-23 ユニオン カ−バイド コ−ポレ−シヨン 真空室内でコ−テイングをア−ク蒸着する為の装置及び方法
EP0285745B1 (de) * 1987-03-06 1993-05-26 Balzers Aktiengesellschaft Verfahren und Vorrichtungen zum Vakuumbeschichten mittels einer elektrischen Bogenentladung
JPH0699799B2 (ja) * 1988-03-18 1994-12-07 株式会社神戸製鋼所 真空蒸着方法
JP2718731B2 (ja) * 1988-12-21 1998-02-25 株式会社神戸製鋼所 真空アーク蒸着装置及び真空アーク蒸着方法
RU2176681C2 (ru) * 1989-11-22 2001-12-10 Волков Валерий Венедиктович Способ получения покрытий в вакууме, устройство для получения покрытий в вакууме, способ изготовления устройства для получения покрытий в вакууме
DE4223592C2 (de) 1992-06-24 2001-05-17 Leybold Ag Lichtbogen-Verdampfungsvorrichtung
US5744017A (en) * 1993-12-17 1998-04-28 Kabushiki Kaisha Kobe Seiko Sho Vacuum arc deposition apparatus
JP3243357B2 (ja) * 1993-12-21 2002-01-07 株式会社神戸製鋼所 真空アーク蒸着装置
CH688863A5 (de) * 1994-06-24 1998-04-30 Balzers Hochvakuum Verfahren zum Beschichten mindestens eines Werkstueckes und Anlage hierfuer.
JP3060876B2 (ja) * 1995-02-15 2000-07-10 日新電機株式会社 金属イオン注入装置
JP2878997B2 (ja) * 1995-09-26 1999-04-05 株式会社神戸製鋼所 真空蒸着装置
CA2256847A1 (en) * 1998-12-22 2000-06-22 Munther Kandah Particle-free cathodic arc carbon ion source
TWI242049B (en) 1999-01-14 2005-10-21 Kobe Steel Ltd Vacuum arc evaporation source and vacuum arc vapor deposition apparatus
JP3104701B1 (ja) * 1999-08-18 2000-10-30 日新電機株式会社 アーク式蒸発源
JP2002069664A (ja) * 2000-08-28 2002-03-08 Hiroshi Takigawa プラズマ加工方法及びプラズマ加工装置
JP2002254207A (ja) * 2001-02-23 2002-09-10 Mmc Kobelco Tool Kk 切粉に対する表面潤滑性にすぐれた表面被覆超硬合金製切削工具
WO2004057642A2 (de) 2002-12-19 2004-07-08 Unaxis Balzers Aktiengesellschaft Vacuumarcquelle mit magnetfelderzeugungseinrichtung
EP1627094B1 (de) * 2003-04-28 2018-10-24 Oerlikon Surface Solutions AG, Pfäffikon Werkstück mit alcr-haltiger hartstoffschicht
US7857948B2 (en) * 2006-07-19 2010-12-28 Oerlikon Trading Ag, Trubbach Method for manufacturing poorly conductive layers

Also Published As

Publication number Publication date
UA95809C2 (ru) 2011-09-12
PT2041331E (pt) 2015-01-14
AU2007276186B2 (en) 2012-03-01
NZ573694A (en) 2012-02-24
TW200806803A (en) 2008-02-01
CA2657726C (en) 2015-05-26
CA2657726A1 (en) 2008-01-24
EP2041331A1 (de) 2009-04-01
MX2009000593A (es) 2009-04-07
KR20090031904A (ko) 2009-03-30
BRPI0714437A2 (pt) 2013-03-12
KR101361234B1 (ko) 2014-02-11
RU2461664C2 (ru) 2012-09-20
ES2527877T3 (es) 2015-02-02
IL196488A (en) 2014-11-30
BRPI0714437B1 (pt) 2018-06-05
MY167043A (en) 2018-08-02
RU2009105668A (ru) 2010-08-27
WO2008009619A1 (de) 2008-01-24
US20090166188A1 (en) 2009-07-02
EP2599891A3 (de) 2013-08-07
HK1129910A1 (en) 2009-12-11
TWI411696B (zh) 2013-10-11
US8197648B2 (en) 2012-06-12
WO2008009619A9 (de) 2009-04-16
AU2007276186A1 (en) 2008-01-24
JP2009543951A (ja) 2009-12-10
EP2599891A2 (de) 2013-06-05
CN101490305B (zh) 2014-02-12
EP2041331B1 (de) 2014-10-22
CN101490305A (zh) 2009-07-22
IL196488A0 (en) 2009-09-22
JP5306198B2 (ja) 2013-10-02

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