WO2023279840A1 - 调光结构及其制作方法、电子设备壳体和电子设备 - Google Patents

调光结构及其制作方法、电子设备壳体和电子设备 Download PDF

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Publication number
WO2023279840A1
WO2023279840A1 PCT/CN2022/092074 CN2022092074W WO2023279840A1 WO 2023279840 A1 WO2023279840 A1 WO 2023279840A1 CN 2022092074 W CN2022092074 W CN 2022092074W WO 2023279840 A1 WO2023279840 A1 WO 2023279840A1
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WO
WIPO (PCT)
Prior art keywords
substrate
conductive film
edge
dimming structure
glue
Prior art date
Application number
PCT/CN2022/092074
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English (en)
French (fr)
Inventor
王雷
吴中正
侯体波
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Oppo广东移动通信有限公司
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Publication of WO2023279840A1 publication Critical patent/WO2023279840A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1334—Constructional arrangements; Manufacturing methods based on polymer dispersed liquid crystals, e.g. microencapsulated liquid crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular relates to a light-adjusting structure and a manufacturing method thereof, an electronic equipment casing and an electronic equipment.
  • the present application provides a light-adjusting structure and a manufacturing method thereof, an electronic equipment casing and an electronic equipment.
  • the embodiment of the present application provides a dimming structure, including:
  • the first substrate, the first conductive film, the PDLC layer, the second conductive film, and the second substrate are stacked in sequence, and the first substrate is provided with a layer that runs through the first substrate, the first conductive film, and the PDLC. Layer edge grooves; and
  • edge-sealing rubber frame the edge-sealing rubber frame is accommodated in the edge-sealing groove, and the surface of the edge-sealing rubber frame is away from the second conductive film and the surface of the first substrate is away from the first conductive film flush.
  • the embodiment of the present application also provides a method for fabricating a dimming structure, including the following steps:
  • a dimming structure includes a first substrate, a first conductive film, a PDLC layer, a second conductive film, and a second substrate sequentially stacked;
  • the embodiment of the present application further provides an electronic device housing, including:
  • a glass cover plate, the glass cover plate is fixedly connected to the light-adjusting structure through the optical glue;
  • the dimming structure includes a first substrate, a first conductive film, a PDLC layer, a second conductive film, a second substrate and an edge sealant frame; wherein the first substrate, the first conductive film, the PDLC layer, the second conductive film and the second substrate are stacked in sequence, the first substrate is provided with an edge sealing groove that runs through the first substrate, the first conductive film and the PDLC layer, and the edge sealing rubber frame is accommodated in the The surface of the edge sealing rubber frame facing away from the second conductive film in the edge sealing groove is flush with the surface of the first substrate facing away from the first conductive film.
  • the manufacturing method of the dimming structure provided in the embodiment of the present application is to stick a release film on the surface of the dimming structure, and make the release film at least partially cover the edge banding groove to form an edge banding cavity, so as to restrain the glue injected into the edge banding cavity
  • the shape makes the surface of the edge sealing frame formed by curing the glue away from the second conductive film flush with the surface of the dimming structure, and can reduce the appearance pollution of the glue on the surface of the dimming structure.
  • FIG. 1 is a schematic perspective view of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is a schematic cross-sectional view along the A-A direction shown in Fig. 1;
  • FIG. 3 is a schematic perspective view of an electronic device housing in the electronic device shown in FIG. 2;
  • Fig. 4 is a schematic cross-sectional view of the housing of the electronic device shown in Fig. 3 along the B-B direction;
  • Fig. 5 is a schematic cross-sectional view of the dimming structure in the electronic device shown in Fig. 4;
  • Fig. 6 is a schematic cross-sectional view of the cooperation of the dimming structure shown in Fig. 5 with the first decorative film and the second decorative film;
  • Fig. 7 is a schematic cross-sectional view of a deformation of the dimming structure shown in Fig. 6 combined with the first decorative film and the second decorative film;
  • Fig. 8 is a schematic diagram of the interface of the dimming structure in the housing of the electronic equipment in the first prior art
  • Fig. 9 is a schematic diagram of the interface of the dimming structure in the housing of the electronic device in the second prior art.
  • FIG. 10 is a schematic flow chart of a method for fabricating a dimming structure provided in an embodiment of the present application.
  • FIG. 11 is a schematic subflow diagram of step S01 in the manufacturing method of the dimming structure shown in FIG. 10;
  • FIG. 12-18 are schematic cross-sectional views of an embodiment of the manufacturing method of the dimming structure shown in FIG. 9;
  • Fig. 19 is a schematic top view of a deformation of the housing of the electronic device described in Fig. 14;
  • Fig. 20 is a schematic flowchart of a method for fabricating a dimming structure provided by another embodiment of the present application.
  • 21-25 are schematic cross-sectional flow diagrams of the manufacturing method of the dimming structure shown in FIG. 20 .
  • the present application provides an electronic device 1000 .
  • the electronic device 1000 may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is shown as an example in FIG. 1 ).
  • the electronic device 1000 can be a mobile phone or smart phone (for example, an iPhone TM, an Android TM based phone), a portable game device (for example Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop Computers, PDAs, portable Internet devices, music players and data storage devices, other handheld devices, and such as headphones, etc.
  • the electronic device 1000 can also be used for other wearable devices that need to be charged (for example, such as electronic bracelets, electronic Head-mounted devices (HMDs) such as necklaces, electronic devices, or smart watches).
  • HMDs electronic Head-mounted devices
  • Electronic device 1000 may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders , Video Recorders, Other Media Recorders, Radios, Medical Equipment, Vehicle Transport Instruments, Calculators, Programmable Remote Controls, Pagers, Laptop Computers, Desktop Computers, Printers, Netbook Computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMP), Motion Picture Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) players, portable medical equipment, and digital cameras and combinations thereof.
  • PDAs Personal Digital Assistants
  • PMP Portable Multimedia Players
  • MPEG-1 or MPEG-2 Motion Picture Experts Group
  • MP3 Motion Picture Experts Group
  • the electronic device 1000 may perform various functions (eg, play music, display videos, store pictures, and receive and send phone calls).
  • Electronic device 1000 may be a device such as a cellular phone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device, if desired.
  • the embodiment of the present application provides an electronic device 1000, which may include but not limited to: an electronic device housing 100 and a display screen 200, the display screen 200 is fixedly connected to the electronic device housing 100, and is connected to the electronic device housing 100.
  • the device casing 100 encloses an accommodating space 101 , and the accommodating space 101 can be used for accommodating components such as a battery, a main board, and a camera assembly.
  • the housing 100 of the electronic device may include, but is not limited to: a dimming structure 10 , an optical glue 20 and a glass cover 30 .
  • the light-adjusting structure 10 can be in a transparent state when it is in a power-on state, and can be in a milky white state or a translucent state when it is in a power-off state.
  • the glass cover plate 30 is laminated with the dimming structure 10 for protecting the dimming structure 10 .
  • the glass cover 30 is fixedly connected to the dimming structure 10 through optical glue 20 .
  • the housing 100 of the electronic device may further include a first decorative film 40 and a second decorative film 50.
  • the first decorative film 40 is disposed on one side surface of the dimming structure 10
  • the second The second decoration film 50 is disposed on the surface of the other side of the dimming structure 10 away from the first decoration film 40 .
  • the first decoration film 40 faces away from the side of the glass cover 30
  • the second decoration film 50 faces toward the side of the glass cover 30 .
  • first and second in this application are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as “first” and “second” may explicitly or implicitly include at least one of these features. In the description of the present application, “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined.
  • the dimming structure 10 includes a first substrate 11, a first conductive film 12, a polymer dispersed liquid crystal (Polymer Dispersed Liquid Crystal, referred to as PDLC) layer 13, a second conductive film 14, a second substrate 15 and an edge sealant frame 16.
  • PDLC Polymer Dispersed Liquid Crystal
  • the first substrate 11 , the first conductive film 12 , the PDLC layer 13 , the second conductive film 14 and the second substrate 15 are sequentially stacked along a preset direction.
  • the first substrate 11 is provided with an edge seal 102 that runs through the first substrate 11, the first conductive film 12 and the PDLC layer 13, the edge seal frame 16 is accommodated in the edge seal groove 102 and the edge seal frame 16 is away from the second
  • the surface of the conductive film 14 is flush with the surface of the first substrate 11 away from the first conductive film 12, which improves the consistency of the surface of the dimming structure 10 on the one hand, and reduces the appearance pollution of the first substrate 11 by the edge sealant frame 16 on the other hand.
  • the polymer-dispersed liquid crystal is that the liquid crystal is dispersed in the organic solid polymer matrix in the form of micron-sized droplets.
  • the liquid crystal When the liquid crystal is freely oriented, its refractive index does not match that of the matrix.
  • the light passes through the matrix, it is strongly scattered by the droplets and presents an opaque milky white state or a translucent state.
  • Applying an electric field can adjust the orientation of the optical axis of the liquid crystal droplet, and when the refractive index of the two is matched, it will appear transparent.
  • the electric field is removed, the liquid crystal microdroplets return to the original state of astigmatism, showing a milky white opaque state.
  • the first conductive film 12 and the second conductive film 14 are located on opposite sides of the PDLC layer 13 respectively, so as to apply an electric field to the polymer dispersed liquid crystal in the PDLC layer 13; the first substrate 11 is adjacent to the first conductive film 12 It is arranged for fixing the first conductive film 12; the second substrate 15 is arranged adjacent to the second conductive film 14 for fixing the second conductive film 14.
  • the first decorative film 40 is attached to the surface of the first substrate 11 away from the first conductive film 12 and covers the edge sealant frame 16
  • the second decorative film 50 is attached to the surface of the second substrate 15 away from The surface of the second conductive film 14 realizes the fixed connection between the first decoration film 40 , the second decoration film 50 and the dimming structure 10 .
  • the edge sealing groove 102 can penetrate the first decorative film 40 , the first substrate 11 , the first conductive film 12 and the PDLC layer 13 , and the edge sealing rubber frame 16 is accommodated in the edge sealing groove 102 and the surface of the edge sealant frame 16 away from the second conductive film 14 is flush with the surface of the first decorative film 40 away from the first substrate 11, on the one hand, it improves the uniformity of the surface of the dimming structure 10, and on the other hand, it reduces the edge sealant The frame 16 contaminates the appearance of the first decorative surface 16 .
  • the second decoration film 50 is pasted on the surface of the second substrate 15 facing away from the second conductive film 14 to realize the fixed connection between the second decoration film 50 and the dimming structure 10 .
  • the surface of the electronic device housing 100 presents a mixed pattern of superimposed first decorative film 40 and second decorative film 50;
  • the surface of the electronic device housing 100 only presents the pattern of the second decoration film 50 . That is, the electronic equipment housing 100 can change the exterior decoration pattern of the electronic equipment housing 100 by adjusting the on-off state of the dimming structure 10 .
  • the electronic device casing 100 will encounter different scenarios during use, such as high temperature, high humidity, salt spray and other harsh environments, so that the molecular weight of the liquid crystal in the PDLC layer 13 is very low, and it is easy to dissociate from the PDLC layer 13. Spills, causing edge failure of electronics enclosures. Further, the liquid crystal in the PDLC layer 13 usually accounts for 40-60% volume fraction, when the liquid crystal in the PDLC layer 13 overflows, it will cause some holes in the PDLC layer 13, which will directly affect the binding force of the PDLC layer 13, and in severe cases will This results in delamination of the PDLC layer 13 . Especially for consumer electronic products that need to be moved frequently, when accidental drop, external impact, micro-vibration, etc., the liquid crystal is prone to overflow and cause the electronic device casing 100 to fail.
  • the dimming structure 300 includes a first substrate 301 , a first conductive film 302 , a PDLC layer 303 , a second conductive film 304 , and a second substrate 305 which are sequentially stacked.
  • a first conductive film 302 a first conductive film 302
  • a PDLC layer 303 a second conductive film 304
  • a second substrate 305 which are sequentially stacked.
  • two methods are usually used to package the PDLC layer 303 .
  • edge sealing glue directly on the edge of the dimming structure 300, that is, apply edge sealing glue on the edges of the first substrate 301, the first conductive film 302, the PDLC layer 303, the second conductive film 304, and the second substrate 305 306 and make it solidified, so as to achieve the purpose of encapsulating the PDLC layer 303.
  • the edge sealant 306 is only applied to the surface that is easy to fall off; on the other hand, the glue is easy to overflow from the edge of the dimming structure 300 to the surface of the first substrate 301 and the second substrate 305 , resulting in contamination of the appearance of the housing 300 of the electronic device.
  • the embodiment of the present application provides a new method for manufacturing an electronic device casing.
  • the manufacturing method of the dimming structure provided by the embodiment of the present application may include the following steps:
  • the dimming structure 10 includes a first substrate 11, a first conductive film 12, a PDLC layer 13, a second conductive film 14, and a second substrate 15 (as shown in FIG. 12 ) stacked in sequence. .
  • Step S11 forming a first conductive film 12 and a second conductive film 14 on the surfaces of the first substrate 11 and the second substrate 15 respectively.
  • both the first substrate 11 and the second substrate 15 are transparent, so that light can pass through the first substrate 11 and the second substrate 15 .
  • the materials of the first substrate 11 and the second substrate 15 are the same, and the first substrate 11 and the second substrate 15 may include PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide) Amine), COP (cyclic cycloolefin copolymer) in one or more.
  • the first substrate 11 is used to support and protect the first conductive film 12
  • the second substrate 15 is used to support and protect the second conductive film 14 .
  • the first conductive film 12 may include one of ITO (indium tin oxide), FTO (fluorine doped tin oxide) or Metal mesh (metal grid), and is formed on the surface of the first substrate 11 by photolithography.
  • the first substrate 11 is made of PET flexible material, and the first conductive film 12 is formed by photolithography of indium tin oxide.
  • the main characteristic of indium tin oxide is its combination of electrical conductivity and optical transparency.
  • Indium tin oxide is a mixture, transparent brown film or yellowish gray block, made of 90% In2O3 and 10% SnO2, which can be used to make liquid crystal displays, flat panel displays, plasma displays, touch screens, electronic paper, organic light-emitting diodes , solar cells, antistatic coatings, transparent conductive coatings for EMI shielding, various optical coatings, etc.
  • the second conductive film 14 can be formed by photolithography on the surface of the second substrate 15 by one of ITO (indium tin oxide), FTO (fluorine doped tin oxide) or Metal mesh (metal mesh). That is, both the first conductive film 12 and the second conductive film 14 are thin films with a transparent structure.
  • ITO indium tin oxide
  • FTO fluorine doped tin oxide
  • Metal mesh metal mesh
  • Step S12 coating the PDLC layer 13 on the surface of the first conductive film 12 and/or the second conductive film 14 .
  • step S13 the first conductive film 12 and the second conductive film 14 are brought close to each other and bonded through the PDLC layer 13 .
  • step S14 ultraviolet light is used to irradiate the first substrate 11 and the second substrate 15 to cure the PDLC layer 13 and form the dimming structure 10 .
  • the PDLC layer 13 can be cured naturally, but it takes a long time and the degree of curing is greatly affected by environmental factors such as temperature and humidity.
  • the curing of the PDLC layer 13 can be accelerated by ultraviolet irradiation.
  • Step S02 cutting on the dimming structure 10 to form an edge-sealed groove 102 , the edge-sealed groove 102 runs through the first substrate 11 , the first conductive film 12 and the PDLC layer 13 (as shown in FIG. 13 ).
  • step S02 cutting the light-adjusting structure 10 to form the edge groove 102 may include the following steps:
  • step S21 the cutting of the light-adjusting structure 10 may be carried out with a laser cutting machine.
  • the laser laser machine can include millisecond, nanosecond, picosecond, and femtosecond lasers, and a suitable laser can be selected according to needs so that the edge groove 102 can penetrate the first substrate 11, the first conductive film and the PDLC layer 13 without damaging the first substrate 11.
  • the second conductive film 14 realizes precise cutting of the dimming structure 10 .
  • Step S22 cleaning up waste materials in the edge banding tank 102 , and wiping the surface of the PDLC layer 13 in the edge banding tank 102 .
  • a solution such as alcohol and acetone
  • Step S03 attaching a release film 60 on the surface of the first substrate 11 away from the first conductive film 12, the release film 60 at least covers part of the edge sealing groove 102 to form an edge sealing cavity 103, which is used to restrict the filling space of glue (such as Figure 14).
  • the thickness of the release film 60 is approximately 100-125 ⁇ m to facilitate the cutting of the release film 60 after the glue injection is completed; the release film 60 is in a transparent state, allowing ultraviolet rays to pass through the release film 60 to facilitate sealing
  • the glue in the side groove 102 solidifies quickly.
  • the release film 60 can cover part of the edge sealing groove 102 to form the edge sealing cavity 103 .
  • the width of the edge-sealing groove 102 is about 1-2 mm, so as to minimize the impact of the edge-sealing structure on the appearance of the housing of the electronic device.
  • the range where the release film 60 covers the edge banding groove 102 accounts for about one-half to two-thirds of the width of the edge banding groove 102, that is, between 1-1.3 mm, so that the edge banding cavity 103
  • the semi-closed structure with opening 1031 is formed, which is easy to inject glue into the edge sealing cavity 103 from the position of opening 1031; understandably, because the thickness of the release film 60 is thin and the flexibility is good, if the width of the edge sealing groove 102 is too large Otherwise, the edge of the release film 60 will sag, affecting the flatness of the sealing frame.
  • the edge-sealing cavity 103 has a semi-closed structure, so that the glue can evenly fill the edge-sealing groove 102 and is not easy to generate air bubbles.
  • the release film 60 can also completely cover the edge sealing groove 102 to form a sealed edge sealing cavity 103 .
  • a first through hole 1021 and a second through hole 1022 can be opened at the position of the release film 60 corresponding to the edge groove 102, so that glue can be injected into the edge from the first through hole 1021
  • the cavity 103 flows out of the edge sealing cavity 103 from the second through hole 1022 .
  • the glue will fill the sealing chamber (as shown in FIG. 19 ).
  • Step S04 filling the edge sealing chamber 103 with glue, and the glue solidifies to form the edge sealing frame 16 (as shown in Fig. 14 and Fig. 15 ).
  • a dispensing needle is used to dispense glue from the opening 1031, so that the glue can evenly fill the edge-banding cavity 103 and the glue can slightly overflow the edge-banding cavity 103, so as to ensure that the glue can fill the edge-banding cavity 103.
  • an electronic teaching needle to inject glue into the sealing cavity from the first through hole 1021 , so that the glue can evenly fill the edge sealing cavity 103 and the glue can overflow from the second through hole 1022 to ensure that the glue can fill the edge sealing cavity 103 .
  • the viscosity of the glue is generally 50-1000 cps, so that the glue crawls and fills along the wall of the edge-sealing cavity 103 under the action of capillary effect, and finally evenly fills the edge-sealing cavity 103 . Further, the viscosity of the glue is between 100-200cps.
  • the release film 60 can reduce the amount of glue Appearance pollution to the surface of the light-adjusting structure 10 .
  • the glue can be cured naturally, but it takes a long time and the degree of curing is greatly affected by environmental factors such as temperature and humidity.
  • ultraviolet radiation can be used to accelerate the curing of the glue.
  • Step S05 cutting the release film 60 , the edge sealant frame 16 , the second conductive film 14 and the second substrate 15 (as shown in FIG. 16 ).
  • the excess part is cut by using a die-cutting method or a laser to obtain a packaged electronic device casing.
  • part of the glue is flush with the surface of the first substrate 11 away from the first conductive film 12 under the constraints of the release film 60 , and part of the glue is higher than the first substrate 11 .
  • Cutting the release film 60, the edge sealing frame 16, the second conductive film 14 and the second substrate 15 can make the thickness of the edge sealing frame 16 consistent, so as to ensure the consistency and reliability of the surface of the dimming structure 10 sex.
  • the release film 60 is cut to prevent step-like protrusions from appearing on the fixed rubber frame at the edge of the release film 60 , which will affect the consistency of the surface of the edge sealing rubber frame 16 .
  • the edge sealing cavity 103 has a sealed ring structure and a rectangular cross section.
  • the redundant part When cutting the redundant part, it can be cut along the center line of the rectangular section parallel to the edge sealing cavity 103, so that the edge sealing rubber frame 16 The cut surface is flat and the thickness is consistent, so as to improve the consistency and reliability of the surface of the dimming structure 10 .
  • the cross-sectional shape of the edge-sealing cavity can also be circular, trapezoidal or other irregular shapes, and the redundant parts can be cut as required to meet production requirements.
  • Step S06 removing the release film 60 (as shown in FIG. 17 ).
  • the release film 60 is used for the plasticity of the edge-sealing rubber frame 16 , and the release film 60 can be removed after the plasticity of the edge-sealing rubber frame 16 is completed.
  • the release film 60 is removed after cutting the release film 60, the edge sealant frame 16, the second conductive film 14 and the second substrate 15.
  • the first substrate 11 or the first decoration can be realized.
  • the protection of the film 40 can, on the other hand, reduce the debris generated during the cutting process from adhering to the first substrate 11 or the first decorative film 40 .
  • FIG. 20-FIG. 25 Another embodiment of the present application provides a method for manufacturing an electronic device casing, which may include the following steps:
  • the dimming structure 10 includes a first decorative film, a first substrate 11, a first conductive film 12, a PDLC layer 13, a second conductive film, a second substrate 15 and a second Decorative film 50 (as shown in FIG. 21 ).
  • step S10 providing the dimming structure 10 may include the following steps:
  • Step S101 forming a first conductive film 12 and a second conductive film 14 on the surfaces of the first substrate 11 and the second substrate 15 respectively.
  • Step S102 coating the PDLC layer 13 on the surface of the first conductive film 12 and/or the second conductive film 14 .
  • step S103 the first conductive film 12 and the second conductive film 14 are brought close to each other and bonded through the PDLC layer 13 .
  • step S104 the first substrate 11 and the second substrate 15 are irradiated with ultraviolet light to cure the PDLC layer 13 to form the dimming structure 10 .
  • Step S105 forming a first decoration film 40 on the surface of the first substrate 11 away from the first conductive film 12 .
  • the first decoration film 40 can be formed on the surface of the first substrate 11 by spraying, and the first decoration film 40 is used to decorate the casing of the electronic device.
  • Step S106 forming a second decoration film 50 on the surface of the second substrate 15 away from the second conductive film 14 .
  • the second decoration film 50 can be formed on the surface of the second substrate 15 by spraying, and the second decoration film 50 is used to decorate the casing of the electronic device.
  • Step S20 cutting on the dimming structure 10 to form an edge sealing groove 102 , the edge sealing groove 102 runs through the first decoration film 40 , the first substrate 11 , the first conductive film 12 and the PDLC layer 13 (as shown in FIG. 22 ).
  • step S30 a release film 60 is pasted on the surface of the first decorative film 40 away from the first conductive film 12, and the release film 60 covers part of the edge sealing groove 102 to form an edge sealing cavity 103 for constraining the filling space of glue (such as Figure 23).
  • Step S40 filling the edge sealing chamber 103 with glue, and the glue solidifies to form the edge sealing frame 16 (as shown in Fig. 23 and Fig. 24 ).
  • Step S50 cutting the release film 60 , the edge sealing frame 16 , the second conductive film 14 and the second substrate 15 parallel to the center line of the edge sealing cavity 103 (as shown in FIG. 25 ).
  • Step S60 removing the release film 60 .
  • the release film 60 is pasted on the surface of the dimming structure 10, and the release film 60 at least partially covers the edge sealing groove 102 to form the edge sealing cavity 103 to constrain the injection sealing.
  • the shape of the glue in the side cavity 103 makes the surface of the edge sealing frame 16 formed by curing the glue away from the second conductive film 14 flush with the surface of the dimming structure 10, and can reduce the appearance pollution of the glue to the surface of the dimming structure 10 .

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Abstract

一种调光结构（10）及其制作方法、电子设备壳体（100）和电子设备（1000）。调光结构（10）制作方法包括以下步骤：提供调光结构（10），调光结构（10）包括依次层叠设置的第一基板（11）、第一导电膜（12）、PDLC层（13）、第二导电膜（14）和第二基板（15）；在调光结构（10）上进行切割形成封边槽（102），封边槽（102）贯穿第一基板（11）、第一导电膜（12）和PDLC层（13）；在第一基板（11）背离第一导电膜（12）的表面贴设离型膜（60），离型膜（60）至少遮盖部分封边槽（102）形成封边腔（103）；向封边腔（103）中注满胶水，胶水固化形成封边胶框（16）；去除离型膜（60）。通过上述方式，使得胶水固化形成的封边胶框（16）背离第二导电膜（14）的表面与调光结构（10）的表面平齐，并能够减少胶水对调光结构（10）表面的外观污染。

Description

调光结构及其制作方法、电子设备壳体和电子设备 技术领域
本申请涉及电子设备技术领域，具体是涉及调光结构及其制作方法、电子设备壳体和电子设备。
背景技术
受技术发展的限制，电子产品譬如手机的更迭越来越慢，各大厂商产品的同质化越来越高。为寻求产品的差异化，各大厂商纷纷瞄向手机壳体的装饰，譬如采用PDLC的电子设备壳体的手机壳体。采用PDLC的电子设备壳体在高温、高湿度、盐雾等恶劣的环境，PDLC中的液晶分子量很低，很容易从聚合物中逸出，造成边缘失效。
发明内容
本申请提供一种调光结构及其制作方法、电子设备壳体和电子设备。
本申请实施例提供了一种调光结构，包括：
依次层叠设置的第一基板、第一导电膜、PDLC层、第二导电膜和第二基板，所述第一基板上设有贯穿所述第一基板、所述第一导电膜和所述PDLC层的封边槽；以及
封边胶框，所述封边胶框收容于所述封边槽中且所述封边胶框背离所述第二导电膜的表面与所述第一基板背离所述第一导电膜的表面平齐。
本申请实施例还提供一种调光结构制作方法，包括以下步骤：
提供调光结构，所述调光结构包括依次层叠设置的第一基板、第一导电膜、PDLC层、第二导电膜和第二基板；
在所述调光结构上进行切割形成封边槽，所述封边槽贯穿所述第一基板、所述第一导电膜和所述PDLC层；
在所述第一基板背离所述第一导电膜的表面贴设离型膜，所述离型膜至少遮盖部分所述封边槽形成封边腔；
向所述封边腔中注满胶水，所述胶水固化形成封边胶框；
去除所述离型膜。
本申请实施例再提供一种电子设备壳体，包括：
调光结构；
光学胶；以及
玻璃盖板，所述玻璃盖板通过所述光学胶与所述调光结构固定连 接；
其中，所述调光结构包括第一基板、第一导电膜、PDLC层、第二导电膜、第二基板和封边胶框；其中第一基板、第一导电膜、PDLC层、第二导电膜、第二基板依次层叠设置，所述第一基板上设有贯穿所述第一基板、所述第一导电膜和所述PDLC层的封边槽，所述封边胶框收容于所述封边槽中且所述封边胶框背离所述第二导电膜的表面与所述第一基板背离所述第一导电膜的表面平齐。
本申请实施例提供的调光结构制作方法，通过在调光结构的表面贴设离型膜，并使离型膜至少部分遮盖封边槽形成封边腔，以约束注入封边腔中的胶水的形状，使得胶水固化形成的封边胶框背离第二导电膜的表面与调光结构的表面平齐，并能够减少胶水对调光结构表面的外观污染。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的电子设备的立体示意图；
图2是图1所示的沿A-A方向的截面示意图；
图3是图2所示的电子设备中电子设备壳体的立体示意图；
图4是图3所示的电子设备壳体沿B-B方向的截面示意图；
图5是图4所示的电子设备中调光结构的截面示意图；
图6是图5所示的调光结构与第一装饰膜、第二装饰膜配合的截面示意图；
图7是图6所示的调光结构与第一装饰膜、第二装饰膜配合一个变形的截面示意图；
图8是现有技术一中电子设备壳体中调光结构的界面示意图；
图9是现有技术二中电子设备壳体中调光结构的界面示意图；
图10是本申请实施例提供的调光结构制作方法的流程示意图；
图11是图10所示的调光结构制作方法中步骤S01的子流程示意图；
图12-图18是图9所示的调光结构制作方法一实施例的截面示意图；
图19是图14所述的电子设备壳体一个变形的俯视示意图；
图20是本申请又一实施例提供的调光结构制作方法的流程示意图；
图21-图25是图20所示的调光结构制作方法的流程截面示意图。
具体实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参照图1，本申请提供一种电子设备1000。具体地，该电子设备1000可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图1中只示例性的示出了一种形态)。具体地，电子设备1000可以为移动电话或智能电话(例如，基于iPhone TM，基于Android TM的电话)，便携式游戏设备(例如Nintendo DS TM，PlayStation Portable TM，Gameboy Advance TM，iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备，其他手持设备以及诸如头戴式耳机等，电子设备1000还可以为其他的需要充电的可穿戴设备(例如，诸如电子手镯、电子项链、电子设备或智能手表的头戴式设备(HMD))。
电子设备1000还可以是多个电子设备中的任何一个，多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器，便携式医疗设备以及数码相机及其组合等设备。
在一些情况下，电子设备1000可以执行多种功能(例如，播放音乐，显示视频，存储图片以及接收和发送电话呼叫)。如果需要，电子设备1000可以是诸如蜂窝电话、媒体播放器、其他手持设备、腕表设备、吊坠设备、听筒设备或其他紧凑型便携式的设备。
请参照图2和图3，本申请实施例提供一种电子设备1000，可包括但不限于：电子设备壳体100和显示屏200，显示屏200与电子设备壳体100固定连接，并与电子设备壳体100围成容置空间101，容置空间101可用于收容电池、主板、摄像头组件等器件。
请参照图4，电子设备壳体100可包括但不限于：调光结构10、光学胶20和玻璃盖板30。调光结构10处于通电状态时可呈透明状态，处 于断电状态时可呈乳白状态或半透明状态。玻璃盖板30与调光结构10层叠设置，用于保护调光结构10。玻璃盖板30通过光学胶20与调光结构10固定连接。
请一并参照图5，在其他实施例中，电子设备壳体100还可包括第一装饰膜40和第二装饰膜50，第一装饰膜40设置于调光结构10的一侧表面，第二装饰膜50设置于调光结构10背离第一装饰膜40的另一侧表面。其中第一装饰膜40背离玻璃盖板30一侧，第二装饰膜50朝向玻璃盖板30一侧。
需要说明的是，本申请中的术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
具体地，调光结构10包括第一基板11、第一导电膜12、聚合物分散液晶(Polymer Dispersed Liquid Crystal，简称PDLC)层13、第二导电膜14、第二基板15和封边胶框16。其中，第一基板11、第一导电膜12、PDLC层13、第二导电膜14和第二基板15沿预设方向依次层叠设置。第一基板11上设有贯穿第一基板11、第一导电膜12和PDLC层13的封边槽封102，封边胶框16收容于封边槽102中且封边胶框16背离第二导电膜14的表面与第一基板11背离第一导电膜12的表面平齐，一方面提高调光结构10表面的一致性，另一方面减少封边胶框16对第一基板11的外观污染。
其中，聚合物分散液晶，是液晶以微米级液滴分散在有机固态聚合物基体内。液晶自由取向时，其折射率与基体的折射率不匹配，当光通过基体时被微滴强烈散射而呈不透明的乳白状态或半透明状态。施加电场可调节液晶微滴的光轴取向，当两者折射率相匹配时，呈现透明态。除去电场，液晶微滴又恢复最初的散光状态，呈乳白不透明状态。
具体地，第一导电膜12与第二导电膜14分别位于PDLC层13的相背两侧，以为PDLC层13中的聚合物分散液晶施加电场；第一基板11与第一导电膜12相邻设置，以用于固定第一导电膜12；第二基板15与第二导电膜14相邻设置，以用于固定第二导电膜14。
请参照图6，可选地，第一装饰膜40贴设于第一基板11背离第一导电膜12的表面并覆盖封边胶框16，第二装饰膜50贴设于第二基板15背离第二导电膜14的表面，实现第一装饰膜40、第二装饰膜50与调光结构10的固定连接。
请参照图7，再又一个实施例中，封边槽102可贯穿第一装饰膜40、第一基板11、第一导电膜12和PDLC层13，封边胶框16收容于封边槽102中且封边胶框16背离第二导电膜14的表面平齐于第一装饰膜40 背离第一基板11的表面，一方面提高调光结构10表面的一致性，另一方面减少封边胶框16对第一装饰面16的外观污染。第二装饰膜50贴设于第二基板15背离第二导电膜14的表面，实现第二装饰膜50与调光结构10的固定连接。
当调光结构10呈透明状态时，电子设备壳体100的表面呈现第一装饰膜40与第二装饰膜50叠加后的混合图案；当调光结构10呈不透明的乳白状态或半透明状态，使得电子设备壳体100的表面仅呈现第二装饰膜50的图案。也即，电子设备壳体100能够通过调节调光结构10的通断电状态，进而改变电子设备壳体100的外表装饰图案。
可以理解地，电子设备壳体100在使用过程中会遇到不同的场景，譬如高温、高湿、盐雾等恶劣环境，使得PDLC层13中的液晶分子量很低，很容易从PDLC层13中溢出，致使电子设备壳体的边缘失效。进一步地，PDLC层13中的液晶通常占40-60％的体积分数，当PDLC层13中的液晶溢出时会使PDLC层13产生一些孔洞，进而直接影响PDLC层13的结合力，严重时会导致PDLC层13分层。尤其是需要频繁移动的消费级电子产品，当发生意外跌落、外力撞击、微振动等都易发生液晶溢出而致使电子设备壳体100失效。
请参照图8和图9，现有技术中，调光结构300包括依次层叠设置的第一基板301、第一导电膜302、PDLC层303、第二导电膜304、第二基板305。为解决电子设备壳体300中PDLC层303的液晶溢出，通常采用两种方式对PDLC层303进行封装。其一，直接在调光结构300的边缘涂覆胶水，也即在第一基板301、第一导电膜302、PDLC层303、第二导电膜304和第二基板305的边缘涂覆封边胶306并使其固化，以达到封装PDLC层303的目的。上述方式虽然操作简单，但是一方面由于封边胶306仅仅涂覆于的表面极易脱落，另一方面胶水极易自调光结构300的边缘外溢至第一基板301和第二基板305的表面，造成电子设备壳体300的外观污染。其二，在调光结构300的表面切割形成贯穿第一基板301、第一导电膜302、PDLC层303的封边槽307，并直接在封边槽307中打胶使其固化形成封边胶框308以实现对PDLC层303的封装，然后沿平行于封边胶框308的中心线切割封边胶框308与调光结构300。如此设计，无法保证胶水能够在封边槽307中完全流平，以至于在实际操作发生胶水未填满封边槽307使得封边胶框308背离第二导电膜304的表面与第一基板301背离第一导电膜的表面不齐平，或胶水自封边槽307溢出造成电子设备壳体300的外观污染。鉴于上述问题，本申请实施例提供一种新的电子设备壳体,的制作方法。
请参照图10至图18，本申请实施例提供的调光结构制作方法可包括以下步骤：
S01，提供调光结构10，其中调光结构10包括依次层叠设置的第一基板11、第一导电膜12、PDLC层13、第二导电膜14和第二基板15(如图12所示)。
在步骤S01中，提供调光结构10可包括以下步骤：
步骤S11，在第一基板11、第二基板15的表面分别形成第一导电膜12和第二导电膜14。
在步骤S11中，第一基板11与第二基板15均为透明结构，以使光线能够自第一基板11与第二基板15穿过。具体地，第一基板11与第二基板15的材质相同，第一基板11与第二基板15可包括PET(聚对本二甲酸乙二醇)、PC(聚碳酸酯)、PI(聚酰亚胺)、COP(环状环烯烃共聚物)中的一种或多种。其中，第一基板11用于支撑并保护第一导电膜12，第二基板15用于支撑并保护第二导电膜14。
第一导电膜12可包括ITO(氧化铟锡)、FTO(氧化锡掺氟)或Metal mesh(金属网格)中的一种并在第一基板11的表面黄光刻蚀形成。本实施方式中，第一基板11为PET柔性材料，第一导电膜12通过氧化铟锡黄光蚀刻形成。具体地，氧化铟锡主要的特性是其电学传导和光学透明的组合。氧化铟锡是一种混合物，透明茶色薄膜或黄偏灰色块状，由90％In2O3和10％SnO2混合而成，可用于制作液晶显示器、平板显示器、等离子显示器、触摸屏、电子纸、有机发光二极管、太阳能电池、抗静电镀膜、EMI屏蔽的透明传导镀、各种光学镀膜等。
同样地，第二导电膜14可通过ITO(氧化铟锡)、FTO(氧化锡掺氟)或Metal mesh(金属网格)中的一种在第二基板15的表面黄光刻蚀形成。也即，第一导电膜12与第二导电膜14均为透明结构的薄膜。
步骤S12，在第一导电膜12和/或第二导电膜14的表面涂覆PDLC层13。
步骤S13，使第一导电膜12与第二导电膜14相互靠近并通过PDLC层13粘接连接。
步骤S14，利用紫外线光照射第一基板11和第二基板15，使PDLC层13固化，形成调光结构10。
可以理解地，PDLC层13可自然固化，但需要时间较长且固化程度受温度、湿度等环境因素影响较大。本实施方式中，为提高生产效率以及确保PDLC层13固化程度的一致性，可采用紫外线照射的方式加速PDLC层13的固化。
步骤S02，在调光结构10上进行切割形成封边槽102，封边槽102贯穿第一基板11、第一导电膜12和PDLC层13(如图13所示)。
在步骤S02中，在调光结构10上进行切割形成封边槽102可包括以下步骤：
步骤S21，对调光结构10的切割可采用激光镭射机进行切割。
激光镭射机可包括毫秒、纳秒、皮秒、飞秒激光器，可根据需要挑选合适的激光器使得封边槽102既能够贯穿第一基板11、第一导电膜和PDLC层13，又不损伤第二导电膜14，实现对调光结构10的精确切割。
步骤S22，清除封边槽102中的废料，并擦拭位于封边槽102中的PDLC层13的表面。
可以理解地，对调光结构10进行切割形成封边槽102的过程中，封边槽102中会形成许多第一基板11、第一导电膜12以及PDLC层13的碎屑，如果不进行清理，影响后续封边槽102的注胶作业。另外，调光结构10在切割的过程中，调光结构10的碎屑可粘附于PDLC层13的表面，影响后续注胶的质量。本实施方式中，擦拭位于封边槽102中的PDLC层13的表面采用无尘布蘸能够溶解PDLC的溶液(譬如酒精和丙酮)，以将PDLC层13边缘粘附的碎屑清理干净，使胶水与封边槽102充分接触，进而提高胶水乃至封边胶框16与调光结构10连接的可靠性。
步骤S03，在第一基板11背离第一导电膜12的表面贴设离型膜60，离型膜60至少遮盖部分封边槽102形成封边腔103，以用于约束胶水的填充空间(如图14所示)。
具体地，离型膜60的厚度大致在100-125μm，以方便注胶完成后对离型膜60的切割；离型膜60为透明状态，能够使紫外光线穿过离型膜60，方便封边槽102中的胶水快速固化。
可选地，离型膜60可遮盖部分封边槽102以形成封边腔103。例如，封边槽102的槽宽大约在1-2mm之间，以尽可能的减少封边结构对电子设备壳体外观的影响。对应地，离型膜60遮盖封边槽102的范围大约占封边槽102宽度的二分之一到三分之二之间，也即1-1.3mm之间，以使封边腔103形成有开口1031的半封闭结构，易于使胶水自开口1031位置注入封边腔103中；可以理解地，由于离型膜60的厚度薄，柔韧性较好，若封边槽102的宽度过大则会使离型膜60的边缘出现下垂，影响封胶框的平整性。另外，封边腔103呈半封闭结构，使得胶水能够均匀地填充封边槽102且不易产生气泡。
可选地，离型膜60还可完全遮盖封边槽102以形成密封的封边腔103。为方便密封的封边腔103能够注入胶水，可在离型膜60对应封边槽102的位置开设第一通孔1021和第二通孔1022，使胶水能够自第一通孔1021注入封边腔103、自第二通孔1022流出封边腔103。可以理解地，当胶水能够自第一通孔1021注入封边腔103、自第二通孔1022流出封边腔103时，胶水注满密封腔(如图19所示)。
步骤S04，向封边腔103中注满胶水，胶水固化形成封边胶框16(如图14、图15所示)。
具体地，采用点胶针头自开口1031处点胶，使胶水均匀地填充封 边腔103且胶水能够轻微溢出封边腔103，以确保胶水能够充满封边腔103。或者采用电教针头自第一通孔1021向密封腔内注入胶水，使胶水均匀地填充封边腔103且胶水能够自第二通孔1022溢出，以确保胶水能够充满封边腔103。
本实施例中，胶水的黏度一般在50-1000cps，以方便胶水在毛细效应的作用下沿封边腔103的墙壁进行爬行填充，最终均匀填满封边腔103。进一步地，胶水的黏度在100-200cps之间。
可以理解地，即使发生胶水溢出的情况，由于离型膜60的隔离阻挡，胶水至多蔓延至离型膜60表面，对调光结构10的表面并无影响，也即离型膜60能够减少胶水对调光结构10表面的外观污染。
胶水在可自然固化，但需要时间较长且固化程度受温度、湿度等环境因素影响较大。本实施方式中，为提高生产效率可采用紫外线照射的方式加速胶水的固化。
步骤S05，对离型膜60、封边胶框16、第二导电膜14及第二基板15进行切割(如图16所示)。
本步骤中，使用刀模或者激光镭射的方法把多余的部分切割，以得到封装好的电子设备壳体。可以理解地，封边腔103填充胶水后，部分胶水在离型膜60的约束下与第一基板11背离第一导电膜12的表面平齐，部分胶水高出第一基板11。对离型膜60、封边胶框16、第二导电膜14及第二基板15进行切割进行切割，可使封边胶框16的厚度一致，以确保调光结构10表面的一致性与可靠性。同时对离型膜60进行切割，防止离型膜60的边缘的固定胶框出现阶梯状凸起，影响封边胶框16表面的一致性。
在一个实施例中，封边腔103呈密封环状结构且截面呈矩形，对多余的部分进行切割时可沿平行于封边腔103的矩形截面中心线进行切割，以使封边胶框16切面平整且厚度一致，以提高调光结构10表面的一致性与可靠性。可以理解地，封边腔的截面形状还可以成圆形、梯形或其他不规则形状，对多余的部分进行切割时可根据需要进行切割，以满足生产需求为宜。
步骤S06，去除离型膜60(如图17所示)。
可以理解地，离型膜60用于封边胶框16的塑性，当封边胶框16塑性完成后，即可去除离型膜60。本实施例中，在对离型膜60、封边胶框16、第二导电膜14及第二基板15进行切割后去除离型膜60，一方面可实现对第一基板11或第一装饰膜40的保护，另一方面可减少切割过程中产生的碎屑粘附于第一基板11或第一装饰膜40上。
请参照图20-图25，本申请又一实施例提供一种电子设备壳体制作方法可包括以下步骤：
S10，提供调光结构10，其中调光结构10包括依次层叠设置的第一 装饰膜、第一基板11、第一导电膜12、PDLC层13、第二导电膜和第二基板15和第二装饰膜50(如图21所示)。
在步骤S10中，提供调光结构10可包括以下步骤：
步骤S101，在第一基板11、第二基板15的表面分别形成第一导电膜12和第二导电膜14。
步骤S102，在第一导电膜12和/或第二导电膜14的表面涂覆PDLC层13。
步骤S103，使第一导电膜12与第二导电膜14相互靠近并通过PDLC层13粘接连接。
步骤S104，利用紫外线光照射第一基板11和第二基板15，使PDLC层13固化，形成调光结构10。
步骤S105，在第一基板11背离第一导电膜12的表面形成第一装饰膜40。第一装饰膜40可通过喷涂的方式形成于第一基板11的表面，第一装饰膜40用于装饰电子设备壳体。
步骤S106，在第二基板15背离第二导电膜14的表面形成第二装饰膜50。第二装饰膜50可通过喷涂的方式形成于第二基板15的表面，第二装饰膜50用于装饰电子设备壳体。
步骤S20，在调光结构10上进行切割形成封边槽102，封边槽102贯穿第一装饰膜40、第一基板11、第一导电膜12和PDLC层13(如图22所示)。
步骤S30，在第一装饰膜40背离第一导电膜12的表面贴设离型膜60，离型膜60遮盖部分封边槽102形成封边腔103，以用于约束胶水的填充空间(如图23所示)。
步骤S40，向封边腔103中注满胶水，胶水固化形成封边胶框16(如图23、图24所示)。
步骤S50，沿平行于封边腔103中心线对离型膜60、封边胶框16、第二导电膜14及第二基板15进行切割(如图25所示)。
步骤S60，去除离型膜60。
本申请实施例提供的调光结构制作方法，通过在调光结构10的表面贴设离型膜60，并使离型膜60至少部分遮盖封边槽102形成封边腔103，以约束注入封边腔103中的胶水的形状，使得胶水固化形成的封边胶框16背离第二导电膜14的表面与调光结构10的表面平齐，并能够减少胶水对调光结构10表面的外观污染。
以上仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种调光结构，其特征在于，包括：
    依次层叠设置的第一基板、第一导电膜、PDLC层、第二导电膜和第二基板，所述第一基板上设有贯穿所述第一基板、所述第一导电膜和所述PDLC层的封边槽；以及
    封边胶框，所述封边胶框收容于所述封边槽中且所述封边胶框背离所述第二导电膜的表面与所述第一基板背离所述第一导电膜的表面平齐。
  2. 根据权利要求1所述的调光结构，其特征在于，所述第一基板、所述第一导电膜、所述第二导电膜与所述第二基板均为透明结构。
  3. 根据权利要求1所述的调光结构，其特征在于，所述封边胶框由黏度在50-1000cps的胶水通过固化形成。
  4. 根据权利要求1所述的调光结构，其特征在于，所述封边胶框由黏度在100-200cps的胶水通过固化形成。
  5. 根据权利要求1所述的调光结构，其特征在于，所述封边槽的槽宽在1-2mm之间。
  6. 一种调光结构制作方法，其特征在于，包括以下步骤：
    提供调光结构，所述调光结构包括依次层叠设置的第一基板、第一导电膜、PDLC层、第二导电膜和第二基板；
    在所述调光结构上进行切割形成封边槽，所述封边槽贯穿所述第一基板、所述第一导电膜和所述PDLC层；
    在所述第一基板背离所述第一导电膜的表面贴设离型膜，所述离型膜至少遮盖部分所述封边槽形成封边腔；
    向所述封边腔中注满胶水，所述胶水固化形成封边胶框；
    去除所述离型膜。
  7. 根据权利要求6所述的调光结构制作方法，其特征在于，所述提供调光结构，所述调光结构包括依次层叠设置的第一基板、第一导电膜、PDLC层、第二导电膜和第二基板包括以下步骤：
    在所述第一基板的表面形成第一导电膜，在第二基板的表面形成所述第二导电膜；
    在所述第一导电膜和/或所述第二导电膜的表面所述涂覆PDLC层；
    使所述第一导电膜与所述第二导电膜相互靠近并通过所述PDLC层粘接连接；
    利用紫外线光照射所述第一基板和所述第二基板，使所述PDLC层固化，形成调光结构。
  8. 根据权利要求6所述的调光结构制作方法，其特征在于，所述在 所述第一基板背离所述第一导电膜的表面贴设离型膜，所述离型膜至少遮盖部分所述封边槽形成封边腔包括以下步骤：
    对所述调光结构采用激光镭射机进行切割，形成所述封边槽；
    清除所述封边槽中的废料，并擦拭位于所述封边槽中的所述PDLC层的表面。
  9. 根据权利要求8所述的调光结构制作方法，其特征在于，所述封边槽的槽宽在1-2mm之间。
  10. 根据权利要求6所述的调光结构制作方法，其特征在于，所述向所述封边腔中注满胶水，所述胶水固化形成封边胶框的步骤包括：
    让所述胶水均匀的填充所述封边腔且能够溢出所述封边腔；
    采用紫外线照射的方式使所述胶水完全固化。
  11. 根据权利要求10所述的调光结构制作方法，其特征在于，所述向所述封边腔中注满胶水，所述胶水固化形成封边胶框步骤之后还包括：
    对所述离型膜、所述封边胶、所述第二导电膜及所述第二基板进行切割。
  12. 根据权利要求6所述的调光结构制作方法，其特征在于，所述胶水的黏度为50-1000cps。
  13. 根据权利要求12所述的调光结构制作方法，其特征在于，所述胶水的黏度在100-200cps之间。
  14. 一种电子设备壳体，其特征在于，包括：
    调光结构；
    光学胶；以及
    玻璃盖板，所述玻璃盖板通过所述光学胶与所述调光结构固定连接；
    其中，所述调光结构包括第一基板、第一导电膜、PDLC层、第二导电膜、第二基板和封边胶框；其中第一基板、第一导电膜、PDLC层、第二导电膜、第二基板依次层叠设置，所述第一基板上设有贯穿所述第一基板、所述第一导电膜和所述PDLC层的封边槽，所述封边胶框收容于所述封边槽中且所述封边胶框背离所述第二导电膜的表面与所述第一基板背离所述第一导电膜的表面平齐。
  15. 根据权利要求14所述的电子设备壳体，其特征在于，所述电子设备壳体还包括第一装饰膜，所述第一装饰膜设置于所述第一基板背离所述第一导电膜表面；所述封边槽贯穿所述第一装饰膜，所述封边胶框背离所述第二导电膜的表面与所述第一装饰膜背离所述第一基板的表面平齐。
  16. 根据权利要求14所述的电子设备壳体，其特征在于，所述调光结构还包括第二装饰膜，所述第二装饰膜设置于所述第二基板背离所述 第二导电膜的表面。
  17. 根据权利要求14所述的电子设备壳体，其特征在于，所述第一基板、所述第一导电膜、所述第二导电膜与所述第二基板均为透明结构。
  18. 根据权利要求14所述的电子设备壳体，其特征在于，所述封边胶框由黏度在50-1000cps的胶水通过固化形成。
  19. 根据权利要求18所述的电子设备壳体，其特征在于，所述封边胶框由黏度在100-200cps的胶水通过固化形成。
  20. 根据权利要求14所述的电子设备壳体，其特征在于，所述封边槽的槽宽在1-2mm之间。
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Publication number Priority date Publication date Assignee Title
CN113568210A (zh) * 2021-07-09 2021-10-29 Oppo广东移动通信有限公司 调光结构及其制作方法、电子设备壳体和电子设备

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000267118A (ja) * 2000-01-01 2000-09-29 Matsushita Electric Ind Co Ltd 液晶パネル
CN102270059A (zh) * 2011-06-21 2011-12-07 信利半导体有限公司 一种触摸屏与显示屏贴合的方法
CN205958872U (zh) * 2016-06-30 2017-02-15 上海天马有机发光显示技术有限公司 一种显示面板及其显示装置
CN106896561A (zh) * 2017-04-20 2017-06-27 信利半导体有限公司 Pdlc显示面板及其制造方法
CN107390436A (zh) * 2017-08-09 2017-11-24 珠海兴业应用材料科技有限公司 一种pvb夹胶调光玻璃用调光膜封边工艺
CN109541825A (zh) * 2018-09-30 2019-03-29 重庆惠科金渝光电科技有限公司 一种显示面板的制作方法和显示面板
CN110794608A (zh) * 2019-11-06 2020-02-14 福耀玻璃工业集团股份有限公司 一种pdlc调光膜及其封边工艺
CN111221172A (zh) * 2020-03-09 2020-06-02 深圳市华星光电半导体显示技术有限公司 显示装置及其制备方法
CN112612158A (zh) * 2020-12-30 2021-04-06 安徽精卓光显技术有限责任公司 具有导电层内封边的电致调光后盖、电子设备及其制备方法
CN113556910A (zh) * 2021-07-09 2021-10-26 Oppo广东移动通信有限公司 调光结构及其制作方法、电子设备壳体和电子设备
CN113568210A (zh) * 2021-07-09 2021-10-29 Oppo广东移动通信有限公司 调光结构及其制作方法、电子设备壳体和电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7135312B2 (ja) * 2017-12-11 2022-09-13 凸版印刷株式会社 調光装置
CN108274731A (zh) * 2017-12-15 2018-07-13 广州市华惠材料科技有限公司 一种车用pdlc膜的贴合方法
JP2019159139A (ja) * 2018-03-14 2019-09-19 凸版印刷株式会社 調光フィルム
US10630824B2 (en) * 2018-03-22 2020-04-21 Apple Inc. Electronic devices with adjustable decoration
JP7172262B2 (ja) * 2018-08-03 2022-11-16 凸版印刷株式会社 調光フィルムおよびその製造方法
CN110201858A (zh) * 2019-05-10 2019-09-06 江苏同辉新材料有限公司 一种电致液晶贴膜用封边工艺
CN111708200A (zh) * 2020-07-01 2020-09-25 福耀玻璃工业集团股份有限公司 一种pdlc调光膜及其封边方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000267118A (ja) * 2000-01-01 2000-09-29 Matsushita Electric Ind Co Ltd 液晶パネル
CN102270059A (zh) * 2011-06-21 2011-12-07 信利半导体有限公司 一种触摸屏与显示屏贴合的方法
CN205958872U (zh) * 2016-06-30 2017-02-15 上海天马有机发光显示技术有限公司 一种显示面板及其显示装置
CN106896561A (zh) * 2017-04-20 2017-06-27 信利半导体有限公司 Pdlc显示面板及其制造方法
CN107390436A (zh) * 2017-08-09 2017-11-24 珠海兴业应用材料科技有限公司 一种pvb夹胶调光玻璃用调光膜封边工艺
CN109541825A (zh) * 2018-09-30 2019-03-29 重庆惠科金渝光电科技有限公司 一种显示面板的制作方法和显示面板
CN110794608A (zh) * 2019-11-06 2020-02-14 福耀玻璃工业集团股份有限公司 一种pdlc调光膜及其封边工艺
CN111221172A (zh) * 2020-03-09 2020-06-02 深圳市华星光电半导体显示技术有限公司 显示装置及其制备方法
CN112612158A (zh) * 2020-12-30 2021-04-06 安徽精卓光显技术有限责任公司 具有导电层内封边的电致调光后盖、电子设备及其制备方法
CN113556910A (zh) * 2021-07-09 2021-10-26 Oppo广东移动通信有限公司 调光结构及其制作方法、电子设备壳体和电子设备
CN113568210A (zh) * 2021-07-09 2021-10-29 Oppo广东移动通信有限公司 调光结构及其制作方法、电子设备壳体和电子设备

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