WO2023279841A1 - 调光结构及其制作方法、电子设备壳体和电子设备 - Google Patents

调光结构及其制作方法、电子设备壳体和电子设备 Download PDF

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Publication number
WO2023279841A1
WO2023279841A1 PCT/CN2022/092075 CN2022092075W WO2023279841A1 WO 2023279841 A1 WO2023279841 A1 WO 2023279841A1 CN 2022092075 W CN2022092075 W CN 2022092075W WO 2023279841 A1 WO2023279841 A1 WO 2023279841A1
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WIPO (PCT)
Prior art keywords
substrate
conductive film
glue
sealed cavity
pdlc
Prior art date
Application number
PCT/CN2022/092075
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English (en)
French (fr)
Inventor
王雷
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Oppo广东移动通信有限公司
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Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2023279841A1 publication Critical patent/WO2023279841A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1334—Constructional arrangements; Manufacturing methods based on polymer dispersed liquid crystals, e.g. microencapsulated liquid crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • G02F1/13415—Drop filling process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular relates to a light-adjusting structure and a manufacturing method thereof, an electronic equipment casing and an electronic equipment.
  • the present application provides a light-adjusting structure and a manufacturing method thereof, an electronic equipment casing and an electronic equipment.
  • the embodiment of the present application provides a dimming structure, including:
  • the first conductive film and the second conductive film are arranged oppositely at intervals, the first conductive film is arranged on the surface of the first substrate facing the second substrate, and the second conductive film is arranged on the second substrate facing the the surface of the first substrate;
  • Frame glue one side surface of the frame glue is fixedly connected to the first substrate, and the other side surface is fixedly connected to the second substrate, and the frame glue forms a sealed cavity with the first substrate and the second substrate , the first conductive film and the second conductive film are accommodated in the sealed cavity;
  • the PDLC is accommodated in the sealed cavity.
  • the embodiment of the present application also provides a method for fabricating a dimming structure, including the following steps:
  • the first substrate and the second substrate are correspondingly arranged and fixedly connected by a sealant to form a sealed cavity, wherein the first conductive film and the second conductive film are accommodated in the sealed cavity;
  • the PDLC is irradiated with ultraviolet light.
  • the embodiment of the present application also provides an electronic device casing, including:
  • the dimming structure includes a first substrate and a second substrate arranged oppositely at intervals, a first conductive film and a second conductive film arranged oppositely at intervals, a sealant, and a PDLC; the first conductive film is arranged on the first substrate toward the The surface of the second substrate, the second conductive film is arranged on the surface of the second substrate facing the first substrate; one side surface of the sealant is fixedly connected to the first substrate, and the other side surface is connected to the first substrate.
  • the second substrate is fixedly connected, the sealant forms a sealed cavity with the first substrate and the second substrate, and the first conductive film and the second conductive film are accommodated in the sealed cavity.
  • PDLC is housed in the sealed cavity.
  • the fabrication method of the dimming structure provided in the embodiment of the present application can make the PDLC directly pour into the sealed cavity by enclosing the sealing cavity with the first substrate and the second substrate by the sealant, reducing the contact between the PDLC and the first substrate and the second substrate.
  • the direct contact of the two substrates makes the surface of the first substrate and the second substrate not easily polluted by PDLC; in addition, the sealant is directly fixedly connected with the first substrate and the second substrate, which improves the sealing performance of the sealant. Strong performance of the connection.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of an electronic device provided by an embodiment of the present application
  • Fig. 2 is a schematic cross-sectional view of the electronic device shown in Fig. 1 along the A-A direction;
  • Fig. 3 is a partial cross-sectional schematic diagram of the housing of the electronic device in the electronic device shown in Fig. 2;
  • Fig. 4 is a schematic cross-sectional view of a dimming structure in prior art 1;
  • Fig. 5 is a schematic diagram of the interface of the dimming structure in the second prior art
  • Fig. 6 is a schematic cross-sectional view of the housing of the electronic device described in Fig. 3 along the B-B direction;
  • Fig. 7 is a schematic cross-sectional view of the dimming structure in the housing of the electronic device shown in Fig. 6;
  • FIG. 8 is a schematic cross-sectional view of a modification of the dimming structure shown in FIG. 7;
  • Fig. 9 is a schematic cross-sectional view of the housing of the electronic device described in Fig. 3 along the C-C direction;
  • FIG. 10 is a flow chart of a method for fabricating a dimming structure provided in an embodiment of the present application.
  • Fig. 11 is a sub-flowchart of step S02 in the manufacturing method of the dimming structure shown in Fig. 10;
  • Fig. 12 is a sub-flow chart of step S03 in the method for making the dimming structure shown in Fig. 10;
  • FIG. 13-17 are schematic cross-sectional views of the manufacturing method of the dimming structure described in FIG. 10;
  • Fig. 18 is a schematic cross-sectional view of a dimming structure in another embodiment of the present application.
  • FIG. 19 is a schematic cross-sectional view of a modification of the dimming structure shown in FIG. 18 .
  • the present application provides an electronic device 1000 .
  • the electronic device 1000 may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is shown as an example in FIG. 1 ).
  • the electronic device 1000 can be a mobile phone or smart phone (for example, an iPhone TM, an Android TM based phone), a portable game device (for example Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop Computers, PDAs, portable Internet devices, music players and data storage devices, other handheld devices, and such as headphones, etc.
  • the electronic device 1000 can also be used for other wearable devices that need to be charged (for example, such as electronic bracelets, electronic Head-mounted devices (HMDs) such as necklaces, electronic devices, or smart watches).
  • HMDs electronic Head-mounted devices
  • Electronic device 1000 may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders , Video Recorders, Other Media Recorders, Radios, Medical Equipment, Vehicle Transport Instruments, Calculators, Programmable Remote Controls, Pagers, Laptop Computers, Desktop Computers, Printers, Netbook Computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMP), Motion Picture Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) players, portable medical equipment, and digital cameras and combinations thereof.
  • PDAs Personal Digital Assistants
  • PMP Portable Multimedia Players
  • MPEG-1 or MPEG-2 Motion Picture Experts Group
  • MP3 Motion Picture Experts Group
  • the electronic device 1000 may perform various functions (eg, play music, display videos, store pictures, and receive and send phone calls).
  • Electronic device 1000 may be a device such as a cellular phone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device, if desired.
  • the embodiment of the present application provides an electronic device 1000, which may include but not limited to: an electronic device housing 100 and a display screen 200, the display screen 200 is fixedly connected to the electronic device housing 100, and is connected to the electronic device housing 100.
  • the device casing 100 encloses an accommodating space 101 , and the accommodating space 101 can be used for accommodating components such as a battery, a main board, and a camera assembly.
  • the electronic device casing 100 may include a light-adjusting structure 10 and a first decoration film 20 and a second decoration film 30 respectively located on opposite sides of the light-adjustment structure 10 , wherein the first decoration film 20 faces the display screen. 200 side, the second decorative film 30 is away from the side of the display screen 200 .
  • the first decoration film 20 and the second decoration film 30 are respectively fixedly connected to the dimming structure 10 through the optical adhesive 40 .
  • the dimming structure 10 can be in a transparent state when it is powered on, so that the surface of the electronic device housing 100 presents a mixed pattern after the first decorative film 20 and the second decorative film 30 are superimposed; it can be in an opaque milky white state or
  • the semi-transparent state makes the surface of the electronic device housing 100 only present the pattern of the second decoration film 30 . That is, the electronic equipment housing 100 can change the exterior decoration pattern of the electronic equipment housing 100 by adjusting the on-off state of the dimming structure 10 .
  • the electronic device housing 100 using the dimming structure 10 will encounter different scenarios during use, such as high temperature, high humidity, salt spray and other harsh environments, which will easily overflow from the PDLC layer, causing the edge of the electronic device housing 100 to invalidated.
  • the liquid crystal in the PDLC layer usually accounts for 40-60% volume fraction. When the liquid crystal in the PDLC layer overflows, some holes will be generated in the PDLC layer, which will directly affect the bonding force of the PDLC layer. In severe cases, the PDLC layer will be separated. layer. Especially for consumer electronic products that need to be moved frequently, when accidental drop, external impact, micro-vibration, etc., the liquid crystal is prone to overflow and cause the dimming structure 10 to fail.
  • the dimming structure 300 generally includes a first substrate 301 , a first conductive film 302 , a PDLC layer 303 , a second conductive film 304 , and a second substrate 305 stacked in sequence. .
  • the PDLC layer 303 In order to solve the liquid crystal overflow of the PDLC layer 303 in the dimming structure 300, two methods are usually used to package the PDLC layer 303: first, glue is directly coated on the edge of the dimming structure 300, that is, on the first substrate 301, the second The edges of the first conductive film 302 , the PDLC layer 303 , the second conductive film 304 and the second substrate 305 are coated with an encapsulation glue 306 and cured to achieve the purpose of encapsulating the PDLC layer 303 .
  • the glue is only applied to the surface of the dimming structure 300 and it is easy to fall off; surface, causing appearance pollution of the dimming structure 300 (as shown in FIG.
  • the embodiments of the present application provide a new dimming structure.
  • the dimming structure 10 may include a first substrate 11, a first conductive film 12, a polymer dispersed liquid crystal (Polymer Dispersed Liquid Crystal, referred to as PDLC) 13, a frame glue 14, a second conductive film 15 and a second substrate. 16.
  • the first substrate 11 and the second substrate 16 are spaced apart from each other, and the first conductive film 12 and the second conductive film 15 are located between the first substrate 11 and the second substrate 16.
  • the first conductive film 12 is disposed on the first substrate. 11 facing the surface of the second substrate 16
  • the second conductive film 15 is disposed on the surface of the second substrate 16 facing the first substrate 11 .
  • the PDLC 13 is located between the first conductive film 12 and the second conductive film 15, wherein one side surface of the frame glue 14 is fixedly connected to the first substrate 11, and the other side surface is fixedly connected to the second substrate 16, and the frame glue 14 is connected to the first substrate 11.
  • a substrate 11 and a second substrate 16 form a sealed cavity 102, the sealed cavity 102 is used to accommodate the PDLC 13, and is used to prevent the PDLC 13 from overflowing. Apply an electric field.
  • first substrate and second substrate mentioned above and below can be replaced with each other, and both can be represented by “substrate”.
  • second substrate mentioned above and below “A conductive film” and “second conductive film” can be replaced with each other, and both can be represented by “conductive film”.
  • polymer dispersed liquid crystal is liquid crystal dispersed in organic solid polymer matrix in the form of micron-sized droplets.
  • PDLC polymer dispersed liquid crystal
  • its refractive index does not match that of the matrix.
  • the light passes through the matrix, it is strongly scattered by the droplets and presents an opaque milky white state or a translucent state.
  • Applying an electric field can adjust the orientation of the optical axis of the liquid crystal droplet, and when the refractive index of the two is matched, it will appear transparent.
  • the electric field is removed, the liquid crystal microdroplets return to the original state of astigmatism, showing a milky white opaque state.
  • the first conductive film 12 and the second conductive film 15 are respectively located on opposite sides of the PDLC 13 to apply an electric field to the PDLC 13; the first substrate 11 is adjacent to the first conductive film 12 for fixing the first conductive film 12 ; the second substrate 16 is disposed adjacent to the second conductive film 15 for fixing the second conductive film 15 .
  • both the first substrate 11 and the second substrate 16 are transparent, so that light can pass through the first substrate 11 and the second substrate 16 .
  • the first substrate 11 and the second substrate 16 are made of the same material, and the first substrate 11 and the second substrate 16 may include PET (polyethylene terephthalate), PC (polycarbonate), PI (polyamide imine), COP (cyclic cycloolefin copolymer) in one or more.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PI polyamide imine
  • COP cyclic cycloolefin copolymer
  • the first conductive film 12 and the second conductive film 15 are also transparent structures.
  • the first conductive film 12 and the second conductive film 15 may comprise one of ITO (indium tin oxide), FTO (tin oxide doped with fluorine) or Metal mesh (metal grid), and the first conductive film 12 is formed on the first substrate 11.
  • the surface of the second substrate 16 is formed by photoetching, and the second conductive film 15 is formed on the surface of the second substrate 16 by photoetching.
  • the first substrate 11 is made of PET flexible material, and the first conductive film 12 is formed by photolithography of indium tin oxide.
  • the main characteristic of indium tin oxide is its combination of electrical conductivity and optical transparency.
  • Indium tin oxide is a mixture, transparent brown film or yellowish gray block, made of 90% In2O3 and 10% SnO2, which can be used to make liquid crystal displays, flat panel displays, plasma displays, touch screens, electronic paper, organic light-emitting diodes , solar cells, antistatic coatings, transparent conductive coatings for EMI shielding, various optical coatings, etc.
  • the PDLC 13 also includes a first gap structure 17.
  • the first gap structure 17 is located between the first conductive film 12 and the second conductive film 15. On the one hand, it is used to support the first substrate 11 and the second substrate 16, and on the other hand, it is used to control The distance between the first conductive film 12 and the second conductive film 15 .
  • first gap structures 17 may be randomly distributed between the first conductive film 12 and the second conductive film 15 .
  • the first gap structure 17 can be selected from one or more of plastic-based (acrylic resin particles), glass-based (rod-shaped particles), and silicone-based (spherical particles).
  • the particle size of the first gap structure 17 is approximately between 9-20 ⁇ m, such as 9 ⁇ m, 12 ⁇ m, 15 ⁇ m, 20 ⁇ m, etc., which are not listed here, so that the gap between the first conductive film 12 and the second conductive film 15 The distance is between 9-20 ⁇ m. In this embodiment, the particle size of the first gap structure 17 is 15 ⁇ m.
  • the distance between the first conductive film 12 and the second conductive film 15 is ensured, and the thickness of the PDLC 13 is ensured; on the other hand, dimming is minimized.
  • the thickness of the structure 10 makes the housing 100 of the electronic device light and thin.
  • the bonding performance of the sealant 14 to the substrate is much greater than that of the substrate and the conductive film, so the sealant 14 is usually directly bonded to the first substrate 11, the second The substrate 16 is fixedly connected to increase the firmness of the sealant 14 .
  • the first conductive film 12 and the second conductive film 15 are completely accommodated in the sealed cavity 102 (as shown in FIG. 7 ), that is, the first conductive film 12 is located within the orthographic projection of the sealant 14 on the first substrate 11. Within the ring range, the second conductive film 15 is located within the inner ring range of the orthographic projection of the sealant 14 on the second substrate 16 .
  • the sealant 14 can fully contact the first substrate 11 and the second substrate 16 with the first substrate 11 and the second substrate 16, so as to enhance the adhesion between the sealant 14 and the first substrate 11 and the second substrate 16. Firmness and reliability of the sealed cavity 102.
  • the first conductive film 12 and the second conductive film 15 can be partially accommodated in the sealed cavity 102 .
  • the first conductive film 12 is beyond the inner range of the orthographic projection of the sealant 14 on the first substrate 11 but is located within the outer range of the orthographic projection of the sealant 14 on the first substrate 11, and the second conductive film 15 is beyond the frame
  • the sealant 14 is within the inner range of the orthographic projection of the second substrate 16 but is located within the outer ring range of the orthographic projection of the sealant 14 on the second substrate 16 .
  • the range of the electric field between the first conductive film 12 and the second conductive film 15 can be increased as much as possible without affecting the firmness of the sealant 14 bonding with the first substrate 11 and the second substrate 16 and The reliability of the sealed cavity 102.
  • the frame glue 14 includes glue 141 and a second gap structure 142 mixed with the glue 141 .
  • the glue 141 is one of thermosetting glue, ultraviolet curing glue or thermosetting and ultraviolet dual curing glue, so as to facilitate the fast curing of the frame glue 14 .
  • the second gap structure 142 is located between the first substrate 11 and the second substrate 16, wherein the second gap structure 142 accounts for about 0.1-0.5% of the volume of the sealant 14, and is used to support the first substrate 11 and the second substrate on the one hand. 16 . On the other hand, it is used to control the distance between the first substrate 11 and the second substrate 16 .
  • the second gap structure 142 can be selected from one or more of plastic-based (acrylic resin particles), glass-based (rod-shaped particles), and silicone-based (spherical particles).
  • the grain diameter of the second interstitial structure 142 is slightly larger than the grain diameter of the first interstitial structure 17.
  • the particle size of the second gap structure 142 is approximately between 12-25 ⁇ m, such as 12 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, etc.
  • the distance is between 9-20 ⁇ m.
  • the particle size of the first gap structure 17 is 20 ⁇ m.
  • the dimming structure 10 may further include a first electrode 18 and a second electrode 19, the first electrode 18 is electrically connected to the first conductive film 12, and the second electrode 19 is electrically connected to the second conductive film 15. , the first electrode 18 and the second electrode 19 are arranged in dislocation. Specifically, the first electrode 18 is formed on the surface of the first conductive film 12 , and the second electrode 19 is formed on the surface of the second conductive film 15 . The first electrode 18 and the second electrode 19 are formed after heat-curing by silk screen printing silver paste process, which has low cost, simple process and convenient mass production.
  • the first electrode 18 and the second electrode 19 are used to supply power to the electric field between the first conductive film 12 and the second conductive film 15 .
  • the first electrode 18 and the second electrode 19 are arranged in dislocation, so as to prevent the first electrode 18 and the second electrode 19 from blocking light and affecting the ultraviolet curing of the PDLC 13 .
  • the first electrode 18 and the second electrode 19 may include but are not limited to silver/silver paste solidification, copper/copper paste solidification, aluminum, or molybdenum-aluminum-molybdenum and other single-layer or multi-layer composite metal traces, which are not listed here. illustrate.
  • the frame glue 14 may include a first frame 1401 and a second frame glue 1402, wherein the second frame glue 1402 is accommodated in the first frame 1401, and the sealed cavity 102 is controlled by the first frame 1401. , the second sealant 1402 and the first substrate 11 and the second substrate 16 .
  • the area within the second frame 14 is the camera area for accommodating the camera assembly.
  • the sealed cavity 102 is surrounded by the sealant 14 and the first substrate 11 and the second substrate 16, and the sealed cavity 102 accommodates the PDLC 13 to prevent the leakage of the PDLC 13;
  • the sealant 14 is directly fixed to the first substrate 11 and the second substrate 16 , which can enhance the reliability of the sealed cavity 102 .
  • the embodiment of the present application also provides a method for manufacturing a dimming structure, including the following steps:
  • Step S01 providing a first substrate 11 and a second substrate 16 , and forming a first conductive film 12 and a second conductive film 15 on one side surfaces of the first substrate 11 and the second substrate 16 respectively (as shown in FIG. 13 ).
  • both the first substrate 11 and the second substrate 16 are transparent, so that light can pass through the first substrate 11 and the second substrate 16 .
  • the material of the first substrate 11 and the second substrate 16 is the same, and the first substrate 11 and the second substrate 16 may include PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide Amine), COP (cyclic cycloolefin copolymer) in one or more, not specifically limited here.
  • the first conductive film 12 and the second conductive film 15 are formed by photolithography.
  • the first conductive film 12 and the second conductive film 15 can be formed by etching one of ITO (indium tin oxide), FTO (tin oxide doped with fluorine) or Metal mesh (metal mesh).
  • ITO indium tin oxide
  • FTO tin oxide doped with fluorine
  • Metal mesh metal mesh
  • the first substrate 11 is made of PET flexible material
  • the first conductive film 12 is formed by photolithography of indium tin oxide.
  • the main characteristic of indium tin oxide is its combination of electrical conductivity and optical transparency.
  • Indium tin oxide is a mixture, transparent brown film or yellowish gray block, made of 90% In2O3 and 10% SnO2, which can be used to make liquid crystal displays, flat panel displays, plasma displays, touch screens, electronic paper, organic light-emitting diodes , solar cells, antistatic coatings, transparent conductive coatings for EMI shielding, various optical coatings, etc.
  • step S01 further includes the following step: forming a first electrode 18 and a second electrode 19 on the first conductive film 12 and the second conductive film 15 respectively, wherein the first electrode 18 and the second electrode 19 are arranged in a misaligned position.
  • the first electrode 18 and the second electrode 19 are used to supply power to the electric field between the first conductive film 12 and the second conductive film 15 .
  • the first electrode 18 and the second electrode 19 are arranged in dislocation, so as to prevent the first electrode 18 and the second electrode 19 from blocking light and affecting the ultraviolet curing of the PDLC 13 .
  • the first electrode 18 and the second electrode 19 may include but are not limited to silver/silver paste solidification, copper/copper paste solidification, aluminum, or molybdenum-aluminum-molybdenum and other single-layer or multi-layer composite metal traces, which are not listed here. illustrate.
  • Step S02 the first substrate 11 and the second substrate 16 are arranged correspondingly and fixedly connected by the sealant 14 to form a sealed cavity 102 , wherein the first conductive film 12 and the second conductive film 15 are accommodated in the sealed cavity 102 .
  • step S02 may also include the following steps:
  • Step S21 forming a sealant 14 on the surface of the first substrate 11 provided with the first conductive film 12 .
  • step S21 first ensure that the size of the first conductive film 12 is smaller than the size of the first substrate 11 , and the size of the second conductive film 15 is smaller than that of the second substrate 16 . That is, the first conductive film 12 on the edge of the first substrate 11 and the second conductive film 15 on the edge of the second substrate 16 are etched away, so that the sealant 14 can be fixedly connected to the first substrate 11 and the second substrate 16 directly. Because there is a big difference between the materials of the substrate and the conductive film, the bonding performance of the frame glue 14 to the substrate is much greater than that of the substrate and the conductive film, so the frame glue 14 is usually fixedly connected to the first substrate 11 and the second substrate 16 directly. , can increase the firmness of the sealant 14 bonding.
  • the frame glue 14 includes glue 141 and a second gap structure 142 mixed with the glue 141 .
  • the second gap structure 142 is located between the first substrate 11 and the second substrate 16, wherein the second gap structure 142 accounts for about 0.1-0.5% of the volume of the sealant 14, and is used to support the first substrate 11 and the second substrate on the one hand. 16 . On the other hand, it is used to control the distance between the first substrate 11 and the second substrate 16 .
  • the second gap structure 142 can be selected from one or more of plastic-based (acrylic resin particles), glass-based (rod-shaped particles), and silicone-based (spherical particles).
  • the particle size of the second gap structure 142 is approximately between 12-25 ⁇ m, such as 12 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, etc.
  • the distance is between 9-20 ⁇ m.
  • the particle size of the first gap structure 17 is 20 ⁇ m.
  • the glue 141 of the frame glue 14 can be applied to the surface of the first substrate 11 by using a screen printing process or a dispensing process.
  • the viscosity of glue 141 depends on the processing technology.
  • the screen printing process chooses 2000-10000cps, and the dispensing process chooses 1000-5000cps.
  • step S21 includes step S211:
  • An opening 1403 (as shown in FIG. 14 ) is defined on the sealant 14 .
  • the opening 1403 can be used as an exhaust port to discharge the air in the sealed cavity 102 In order to prevent the air in the sealed cavity 102 from being exhausted during the process of the first substrate 11 approaching the second substrate 16 , affecting the reliability of the sealed cavity 102 .
  • the number of openings 1403 is at least one, of course, it can also be two or three, which are not listed here.
  • Step S22 spraying the first gap structure 17 on the surface of the second substrate 16 where the second conductive film 15 is disposed.
  • the first gap structures 17 may be randomly distributed between the first conductive film 12 and the second conductive film 15 .
  • the first gap structure 17 can be selected from one or more of plastic-based (acrylic resin particles), glass-based (rod-shaped particles), and silicone-based (spherical particles).
  • the particle size of the first gap structure 17 is approximately between 9-20 ⁇ m, such as 9 ⁇ m, 12 ⁇ m, 15 ⁇ m, 20 ⁇ m, etc., which are not listed here, so that the gap between the first conductive film 12 and the second conductive film 15 The distance is between 9-20 ⁇ m. In this embodiment, the particle size of the first gap structure 17 is 15 ⁇ m.
  • the thickness of the structure 10 makes the housing 100 of the electronic device light and thin.
  • the particle size of the second gap structure 142 is slightly larger than the particle size of the first gap structure 17, specifically, the particle size of the second gap structure 142 is approximately equal to the particle size of the first gap structure 17, the first conductive film 12 and the second conductive film The sum of the thicknesses of the membrane 15.
  • step S23 the first substrate 11 is disposed corresponding to the second substrate 16 , and the second conductive film 15 is disposed facing the first conductive film 12 .
  • This step is used to adjust the position of the first substrate 11 relative to the second substrate 16 so that the first substrate 11 and the second substrate 16 are arranged correspondingly.
  • step S24 the sealant 14 is fixedly connected to the surface of the second substrate 16 away from the second conductive film 15 to form a sealed cavity 102 (as shown in FIG. 15 ).
  • the surface of the sealant 14 facing away from the first substrate 11 is directly bonded to the surface of the second substrate 16 , so as to improve the reliability of bonding of the sealant 14 .
  • the glue 141 of the frame glue 14 is one of thermosetting glue 141 , ultraviolet curing glue 141 or thermosetting and ultraviolet dual curing glue 141 , so as to facilitate the fast curing of the frame glue 14 .
  • Step S25 curing the sealant 14 .
  • the glue 141 of the frame glue 14 is an ultraviolet curable glue 141 , that is, the glue 141 can be quickly cured by irradiating the first substrate 11 and the second substrate 16 with ultraviolet rays.
  • step S03 vacuumize the sealed cavity 102 and inject PDLC 13 in sequence (as shown in FIG. 16 ).
  • Step S03 includes the following steps:
  • Step S31 vacuumize the sealed cavity 102 through the opening 1403 .
  • the opening 1403 is used as a gas extraction port for exhausting the gas in the sealed cavity 102 .
  • Step S32 filling the sealed cavity 102 with the PDLC 13 through the opening 1403 .
  • step S31 since the sealed cavity 102 is in a vacuum state, the atmospheric pressure can inject the glue 141 into the sealed cavity 102 through the opening 1403 , thereby implementing the filling operation of the sealed cavity 102 .
  • the opening 1403 is used as a filling port for injecting the PDLC 13 into the sealed cavity 102 .
  • Step S04 curing the PDLC13.
  • the PDLC13 needs to be cured to prevent the PDLC13 from overflowing. Specifically, ultraviolet rays are used to irradiate the first substrate 11 and the second substrate 16 simultaneously, thereby curing the PDLC 13 .
  • Step S05 cut off the redundant part according to the preset shape to generate the dimming structure 10 .
  • a camera hole 104 is opened on the mobile phone rear case.
  • a first frame 1401 and a second sealant 1402 are formed on the surface of the first substrate 11 on which the first conductive film 12 is disposed.
  • the first frame 1401 , the second sealant 1402 and the first substrate 11 and the second substrate 16 enclose the sealed cavity 102
  • the second sealant 1402 and the first substrate 11 and the second substrate 16 enclose the camera cavity 103 .
  • the sealed cavity 102 is used for injecting liquid crystal
  • the camera cavity 103 is used for digging a hole to make the camera hole 104 . In this step, part of the structure corresponding to the camera cavity 103 needs to be removed.
  • Step S06 sealing the opening 1403 with glue (as shown in FIG. 17 ).
  • the opening 1403 is a channel through which the sealed cavity 102 communicates with the outside world. If it is not sealed, the liquid crystal molecules in the PDLC 13 are likely to overflow, thereby affecting the stability and reliability of the dimming structure 10 .
  • the glue used to seal the opening 1403 can be the same as the glue 141 used in the frame glue 14, so that the frame glue 14 has a consistent structure, and other glue materials, such as epoxy resin, can also be used, and no specific limitation is made here .
  • Step S07 forming the first decoration film 20 and the second decoration film 30 on the surfaces of the first substrate 11 and the second substrate 16 respectively, so as to generate the housing 100 of the electronic device.
  • a first opening 1403a may be opened on the first frame 1401, and a second opening 1403b communicating with the sealing cavity 102 may be opened on the second sealant 14, wherein
  • the first opening 1403 a is used to communicate the sealed cavity 102 with the outside, so as to realize exhausting and filling of the sealed cavity 102 .
  • the second opening 1403b is used to communicate with the camera cavity 103 and the sealed cavity 102, so that when the first substrate 11 is close to the second substrate 16, the air in the camera cavity 103 can be discharged from the sealed cavity 102, thereby ensuring that the first substrate 11 and the second substrate 16 The stability of the connection between the two substrates 16.
  • first opening 1403 a can be located at any position of the first frame body in the housing 100 of the electronic device.
  • the first opening 1403a is located at the long side of the first frame body, such setting can speed up the filling speed, improve the filling efficiency, and shorten the manufacturing process.
  • Step S03 the camera cavity 103 is evacuated and injected with the PDLC 13 at the same time.
  • Step S04 is to irradiate the PDLC 13 in the sealed cavity 102 and the camera cavity 103 with ultraviolet light.
  • the camera hole 104 is formed by removing the dimming structure 10 at the position of the camera cavity 103 .
  • Step S06 sealing the first opening 1403 a and the second opening 1403 b by dispensing to generate the dimming structure 10 .
  • a first opening 1403a can be opened on the first sealant 14, and a first opening 1403a can be opened on the first substrate 11 or the second substrate 16 corresponding to the camera cavity 103.
  • Two openings 1403b wherein the first opening 1403 a is used to communicate the sealed cavity 102 with the outside, so as to realize exhausting and filling of the sealed cavity 102 .
  • the second opening 1403b is used to communicate with the camera chamber 103 and the outside world, so that when the first substrate 11 is close to the second substrate 16, the air in the camera chamber 103 can be discharged from the second opening 1403b, thereby ensuring that the first substrate 11 and the second The stability of the substrate 16 connection.
  • step S03 only the sealed chamber 102 is evacuated and the PDLC 13 is injected in sequence.
  • Step S04 only irradiates the PDLC 13 in the sealed cavity 102 with ultraviolet light.
  • Step S05 is to cut off the first substrate 11 and the second substrate 16 at the position of the camera cavity 103 .
  • Step S06 sealing the first opening 1403 a with glue to generate the dimming structure 10 .
  • the first conductive film 12 and the second conductive film 15 can be produced based on the process of yellow photolithography in step S02, and the first conductive film 12 can be flexibly adjusted.
  • the size of the film 12 and the second conductive film 15 leaves enough space for the antenna, and such a design can reduce the pressure on the antenna design.
  • the PDLC 13 can be poured directly into the sealed cavity 102, reducing the contact between the PDLC 13 and the second substrate 16.
  • the direct contact of the first substrate 11 and the second substrate 16 makes the surfaces of the first substrate 11 and the second substrate 16 not easily polluted by the PDLC 13; in addition, the sealant 14 is directly fixedly connected with the first substrate 11 and the second substrate 16, improving The strong performance of the frame glue 14 connection is ensured.

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Abstract

本申请提供一种调光结构及其制作方法、电子设备壳体和电子设备。调光结构(10)包括间隔相对设置的第一基板(301)与第二基板(305)、间隔相对设置的第一导电膜(302)与第二导电膜(304)、框胶(308)和PDLC(303)。调光结构(10)制作方法包括以下步骤：提供第一基板(301)和第二基板(305)，并在第一基板(301)与第二基板(305)的一侧表面分别形成第一导电膜(302)和第二导电膜(304)；第一基板(301)与第二基板(305)对应设置并通过框胶(308)固定连接形成密封腔(102)，其中第一导电膜(302)与第二导电膜(304)收容于密封腔(102)中；对密封腔(102)依次进行抽真空、注入PDLC(303)；对PDLC(303)进行紫外光线照射。通过上述方式，可使PDLC(303)直灌注到密封腔(102)中，减少PDLC(303)与第一基板(301)、第二基板(305)的直接接触，使得使第一基板(301)与第二基板(305)的表面不易受到PDLC(303)的污染。

Description

调光结构及其制作方法、电子设备壳体和电子设备 技术领域
本申请涉及电子设备技术领域，具体是涉及调光结构及其制作方法、电子设备壳体和电子设备。
背景技术
受技术发展的限制，电子产品譬如手机的更迭越来越慢，各大厂商产品的同质化越来越高。为寻求产品的差异化，各大厂商纷纷瞄向手机壳体的装饰，譬如采用PDLC的电子设备壳体的手机壳体。采用PDLC的电子设备壳体在高温、高湿度、盐雾等恶劣的环境，PDLC中的液晶分子量很低，很容易从聚合物中逸出，造成边缘失效。
发明内容
本申请提供一种调光结构及其制作方法、电子设备壳体和电子设备。
本申请实施例提供了一种调光结构，包括：
间隔相对设置的第一基板与第二基板；
间隔相对设置的第一导电膜与第二导电膜，所述第一导电膜设置于第一基板朝向所述第二基板的表面，所述第二导电膜设置于所述第二基板朝向所述第一基板的表面；以及
框胶，所述框胶一侧表面与所述第一基板固定连接，另一侧表面与所述第二基板固定连接，所述框胶与所述第一基板、第二基板围成密封腔，所述第一导电膜、所述第二导电膜收容于所述密封腔中；以及
PDLC，所述PDLC收容于所述密封腔中。
本申请实施例还提供一种调光结构的制作方法，包括以下步骤：
提供第一基板和第二基板；
在所述第一基板与所述第二基板的一侧表面分别形成第一导电膜和第二导电膜；
所述第一基板与所述第二基板对应设置并通过框胶固定连接形成密封腔，其中所述第一导电膜与所述第二导电膜收容于所述密封腔中；
对所述密封腔依次进行抽真空、注入PDLC；
对所述PDLC进行紫外光线照射。
本申请实施例还提供一种电子设备壳体，包括：
调光结构；以及
分别位于所述调光结构相背两侧表面的第一装饰膜与第二装饰膜；
其中，调光结构包括间隔相对设置的第一基板与第二基板、间隔相对设置的第一导电膜与第二导电膜、框胶和PDLC；所述第一导电膜设置于第一基板朝向所述第二基板的表面，所述第二导电膜设置于所述第二基板朝向所述第一基板的表面；所述框胶一侧表面与所述第一基板固定连接、另一侧表面与所述第二基板固定连接，所述框胶与所述第一基板、第二基板围成密封腔，所述第一导电膜、所述第二导电膜收容于所述密封腔中，所述PDLC收容于所述密封腔中。
本申请实施例提供的调光结构的制作方法，通过使框胶与所述第一基板、第二基板围成密封腔，可使PDLC直灌注到密封腔中，减少PDLC与第一基板、第二基板的直接接触，使得使所述第一基板与所述第二基板的表面不易受到PDLC的污染；另外所述框胶直接与第一基板、第二基板固定连接，提高了所述框胶连接的牢固性能。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的电子设备的立体结构示意图；
图2是图1所示的电子设备沿A-A方向的截面示意图；
图3是图2所示的电子设备中电子设备壳体的部分截面示意图；
图4是现有技术一中调光结构的截面示意图；
图5是现有技术二中调光结构的界面示意图；
图6是图3所述的电子设备壳体沿B-B方向的截面示意图；
图7是图6所示的电子设备壳体中调光结构的截面示意图；
图8是图7所示的调光结构一个变形的截面示意图；
图9是图3所述的电子设备壳体沿C-C方向的截面示意图；
图10为本申请实施例提供的调光结构制作方法的流程图；
图11是图10所示的调光结构制作方法中步骤S02的子流程图；
图12是图10所示的调光结构制作方法中步骤S03的子流程图；
图13-图17是图10所述的调光结构制作方法的截面示意图；
图18是本申请又一实施例中调光结构的截面示意图；
图19是图18所示的调光结构一个变形的截面示意图。
具体实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域 普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参照图1，本申请提供一种电子设备1000。具体地，该电子设备1000可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图1中只示例性的示出了一种形态)。具体地，电子设备1000可以为移动电话或智能电话(例如，基于iPhone TM，基于Android TM的电话)，便携式游戏设备(例如Nintendo DS TM，PlayStation Portable TM，Gameboy Advance TM，iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备，其他手持设备以及诸如头戴式耳机等，电子设备1000还可以为其他的需要充电的可穿戴设备(例如，诸如电子手镯、电子项链、电子设备或智能手表的头戴式设备(HMD))。
电子设备1000还可以是多个电子设备中的任何一个，多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器，便携式医疗设备以及数码相机及其组合等设备。
在一些情况下，电子设备1000可以执行多种功能(例如，播放音乐，显示视频，存储图片以及接收和发送电话呼叫)。如果需要，电子设备1000可以是诸如蜂窝电话、媒体播放器、其他手持设备、腕表设备、吊坠设备、听筒设备或其他紧凑型便携式的设备。
请参照图2和图3，本申请实施例提供一种电子设备1000，可包括但不限于：电子设备壳体100和显示屏200，显示屏200与电子设备壳体100固定连接，并与电子设备壳体100围成容置空间101，容置空间101可用于收容电池、主板、摄像头组件等器件。
请参照图4，电子设备壳体100可包括调光结构10以及分别位于调光结构10相背两侧表面的第一装饰膜20与第二装饰膜30，其中第一装饰膜20朝向显示屏200一侧，第二装饰膜30背离显示屏200一侧。其中第一装饰膜20与第二装饰膜30分别通过光学胶40与调光结构10固定连接。
调光结构10在通电状态下可呈透明状态，使得电子设备壳体100的表面呈现第一装饰膜20与第二装饰膜30叠加后的混合图案；在断电状态下呈不透明的乳白状态或半透明状态，使得电子设备壳体100的表面仅呈现第二装饰膜30的图案。也即，电子设备壳体100能够通过调节调光结构10的通断电状态，进而改变电子设备壳体100的外表装饰图案。
需要说明的是，本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
应用调光结构10的电子设备壳体100在使用过程中会遇到不同的场景，譬如高温、高湿、盐雾等恶劣环境，很容易从PDLC层中溢出，致使电子设备壳体100的边缘失效。进一步地，PDLC层中的液晶通常占40-60％的体积分数，当PDLC层中的液晶溢出时会使PDLC层产生一些孔洞，进而直接影响PDLC层的结合力，严重时会导致PDLC层分层。尤其是需要频繁移动的消费级电子产品，当发生意外跌落、外力撞击、微振动等都易发生液晶溢出而致使调光结构10失效。
请参照图5和图6，现有技术中，所述调光结构300通常包括依次层叠设置的第一基板301、第一导电膜302、PDLC层303、第二导电膜304、第二基板305。为解决调光结构300中PDLC层303的液晶溢出，通常采用两种方式对PDLC层303进行封装：其一，直接在调光结构300的边缘涂覆胶水，也即在第一基板301、第一导电膜302、PDLC层303、第二导电膜304和第二基板305的边缘涂覆封装胶306并使其固化，以达到封装PDLC层303的目的。上述方式虽然操作简单，但是一方面由于胶水仅仅涂覆于调光结构300的表面极易脱落，另一方面胶水极易自调光结构300的边缘外溢至第一基板301和第二基板305的表面，造成调光结构300的外观污染(如图5所示)。其二，在调光结构300的表面切割形成贯穿第一基板301、第一导电膜302、PDLC层303的封边槽307，并直接在封边槽307中打胶使其固化形成封边框胶308以实现对PDLC层303的封装，然后沿平行于封边框胶308的中心线切割封边框胶308与调光结构300。如此设计，无法保证胶水能够在封边槽307中完全流平，以至于在实际操作发生胶水未填满封边槽307使得封边框胶308背离第二导电膜304的表面与第一基板301背离第一导电层的表面不齐平，或胶水自封边槽307溢出造成电子设备壳体100的外观污染(如图6所示)。鉴于上述问题，本申请实施例提供一种新的调光结构。
请参照图7，调光结构10可包括第一基板11、第一导电膜12、聚合物分散液晶(Polymer Dispersed Liquid Crystal，简称PDLC)13、框 胶14、第二导电膜15与第二基板16。第一基板11与第二基板16间隔相对设置，第一导电膜12与第二导电膜15位于第一基板11与第二基板16之间，具体地，第一导电膜12设置于第一基板11朝向第二基板16的表面，第二导电膜15设置于第二基板16朝向第一基板11的表面。PDLC13位于第一导电膜12与第二导电膜15之间，其中框胶14的一侧表面与第一基板11固定连接，另一侧表面与第二基板16固定连接，且框胶14与第一基板11、第二基板16围成密封腔102，密封腔102用于收容PDLC13，用于防止PDLC13溢出，第一导电膜12、第二导电膜15收容于密封腔102中，用于向PDLC13施加电场。
可以理解地，上文中出现以及下文中提及的“第一基板”、“第二基板”可互相替换，且均可用“基板”表示，同样得，上文中出现以及下文中提及的“第一导电膜”、“第二导电膜”可互相替换，且均可用“导电膜”表示。
其中，聚合物分散液晶(PDLC)，是液晶以微米级液滴分散在有机固态聚合物基体内。液晶自由取向时，其折射率与基体的折射率不匹配，当光通过基体时被微滴强烈散射而呈不透明的乳白状态或半透明状态。施加电场可调节液晶微滴的光轴取向，当两者折射率相匹配时，呈现透明态。除去电场，液晶微滴又恢复最初的散光状态，呈乳白不透明状态。
具体地，第一导电膜12与第二导电膜15分别位于PDLC13的相背两侧，以为PDLC13施加电场；第一基板11与第一导电膜12相邻设置，以用于固定第一导电膜12；第二基板16与第二导电膜15相邻设置，以用于固定第二导电膜15。
可选地，第一基板11与第二基板16均为透明结构，以使光线能够自第一基板11与第二基板16穿过。具体地，第一基板11与第二基板16的材质相同，第一基板11与第二基板16可包括PET(聚对苯二甲酸乙二醇)、PC(聚碳酸酯)、PI(聚酰亚胺)、COP(环状环烯烃共聚物)中的一种或多种。其中，第一基板11用于支撑并保护第一导电膜12，第二基板16用于支撑并保护第二导电膜15。
可选地，第一导电膜12与第二导电膜15也为透明结构。第一导电膜12与第二导电膜15可包括ITO(氧化铟锡)、FTO(氧化锡掺氟)或Metal mesh(金属网格)中的一种，第一导电膜12在第一基板11的表面黄光刻蚀形成，第二导电膜15在第二基板16的表面黄光刻蚀形成。本实施方式中，第一基板11为PET柔性材料，第一导电膜12通过氧化铟锡黄光蚀刻形成。具体地，氧化铟锡主要的特性是其电学传导和光学透明的组合。氧化铟锡是一种混合物，透明茶色薄膜或黄偏灰色块状，由90％In2O3和10％SnO2混合而成，可用于制作液晶显示器、平板显示器、等离子显示器、触摸屏、电子纸、有机发光二极管、太阳能电池、 抗静电镀膜、EMI屏蔽的透明传导镀、各种光学镀膜等。
PDLC13还包括第一间隙结构17，第一间隙结构17位于第一导电膜12与第二导电膜15之间，一方面用于支撑第一基板11与第二基板16，另一方面用于控制第一导电膜12与第二导电膜15之间的距离。
进一步地，第一间隙结构17可随机分布于第一导电膜12与第二导电膜15之间。第一间隙结构17可以选择塑料系(压克力树脂微粒)、玻璃系(棒状粒子)、硅氧系(球状粒子)中的一种或多种。第一间隙结构17的粒径大约在为9-20μm之间，譬如9μm、12μm、15μm、20μm等，在此不一一列举，进而使得第一导电膜12与第二导电膜15之间的距离在9-20μm之间。本实施方式中，第一间隙结构17的粒径为15μm，一方面确保第一导电膜12与第二导电膜15之间的距离，确保PDLC13的厚度，另一方面尽可能地减小调光结构10的厚度，使得电子设备壳体100轻薄。
可以理解地，由于基板与导电膜的材料存在较大区别，框胶14与基板的粘结性能远大于基板与导电膜的粘结性能，因此框胶14通常直接与第一基板11、第二基板16固定连接，以增大框胶14粘结的牢固性。
具体地，第一导电膜12与第二导电膜15完全收容于密封腔102中(如图7所示)，也即第一导电膜12位于框胶14在第一基板11的正投影的内环范围内，第二导电膜15位于框胶14在第二基板16的正投影的内环范围内。通过上述方式，可使框胶14与第一基板11、第二基板16充分与第一基板11、第二基板16接触，以增强框胶14与第一基板11、第二基板16粘结的牢固度以及密封腔102的可靠性。
请参照图8，在另一个实施例中，第一导电膜12与第二导电膜15可部分收容于密封腔102中。具体地，第一导电膜12超出框胶14在第一基板11的正投影的内环范围但位于框胶14在第一基板11的正投影的外环范围内，第二导电膜15超出框胶14在第二基板16的正投影的内环范围但位于框胶14在第二基板16的正投影的外环范围内。通过上述方式，既可尽可能的增大第一导电膜12与第二导电膜15之间的电场范围，又不影响框胶14与第一基板11、第二基板16粘结的牢固性以及密封腔102的可靠性。
框胶14包括胶水141及与胶水141混合的第二间隙结构142。胶水141为热固化胶水、紫外固化胶水或热固、紫外双固化胶水中的一种，以方便框胶14快速固化。第二间隙结构142位于第一基板11与第二基板16之间，其中，第二间隙结构142约占框胶14体积的0.1-0.5％，一方面用于支撑第一基板11与第二基板16，另一方面用于控制第一基板11与第二基板16之间的距离。
具体地，第二间隙结构142可以选择塑料系(压克力树脂微粒)、玻璃系(棒状粒子)、硅氧系(球状粒子)中的一种或多种。第二间隙 结构142的粒径略大于第一间隙结构17的粒径。第二间隙结构142的粒径大约在为12-25μm之间，譬如12μm、15μm、20μm、25μm等，在此不一一列举，进而使得第一导电膜12与第二导电膜15之间的距离在9-20μm之间。本实施方式中，第一间隙结构17的粒径为20μm。
请继续参照图7，调光结构10还可包括第一电极18与第二电极19，第一电极18与第一导电膜12电性连接，第二电极19与第二导电膜15电性连接，第一电极18与第二电极19错位设置。具体地，第一电极18形成于第一导电膜12的表面，第二电极19形成于第二导电膜15的表面。第一电极18、第二电极19采用丝印银浆工艺热固化后形成，成本低、工艺简单且量产方便。
具体地，第一电极18与第二电极19用于为第一导电膜12与第二导电膜15之间的电场供电。第一电极18与第二电极19错位设置，用于防止第一电极18与第二电极19遮挡光线影响PDLC13的紫外线固化。第一电极18与第二电极19可包括但不限于银/银浆固化、铜/铜浆固化、铝、或者钼铝钼等单层或者多层复合的金属走线，在此不一一举例说明。
请参照图9，在一个具体实施例中，框胶14可包括第一框1401与第二框胶1402，其中第二框胶1402收容于第一框1401中，密封腔102由第一框1401、第二框胶1402以及第一基板11、第二基板16围成。以电子设备1000后壳譬如手机后盖为例，第二框胶14范围内为摄像头区域，用于收容摄像头组件。
请参照图7本申请实施例提供的调光结构10，通过框胶14与第一基板11、第二基板16围成密封腔102，并使密封腔102收容PDLC13，以防止PDLC13发生外泄；另外框胶14直接与第一基板11、第二基板16固定，可增强密封腔102的可靠性。
请参照图10至图17，本申请实施例还提供一种调光结构制作方法，包括以下步骤：
步骤S01：提供第一基板11和第二基板16，并在第一基板11与第二基板16的一侧表面分别形成第一导电膜12和第二导电膜15(如图13所示)。
具体地，第一基板11与第二基板16均为透明结构，以使光线能够自第一基板11与第二基板16穿过。其中，第一基板11与第二基板16的材质相同，第一基板11与第二基板16可包括PET(聚对苯二甲酸乙二醇)、PC(聚碳酸酯)、PI(聚酰亚胺)、COP(环状环烯烃共聚物)中的一种或多种，在此不做具体限制。
本步骤中，第一导电膜12与第二导电膜15通过黄光刻蚀形成。具体地，第一导电膜12与第二导电膜15可通过黄光刻蚀ITO(氧化铟锡)、FTO(氧化锡掺氟)或Metal mesh(金属网格)中的一种形成。第一导电膜12在第一基板11的表面黄光刻蚀形成，第二导电膜15在第二基 板16的表面黄光刻蚀形成。
本实施方式中，第一基板11为PET柔性材料，第一导电膜12通过氧化铟锡黄光蚀刻形成。具体地，氧化铟锡主要的特性是其电学传导和光学透明的组合。氧化铟锡是一种混合物，透明茶色薄膜或黄偏灰色块状，由90％In2O3和10％SnO2混合而成，可用于制作液晶显示器、平板显示器、等离子显示器、触摸屏、电子纸、有机发光二极管、太阳能电池、抗静电镀膜、EMI屏蔽的透明传导镀、各种光学镀膜等。
进一步地，步骤S01还包括以下步骤：分别在第一导电膜12与第二导电膜15上形成第一电极18和第二电极19，其中第一电极18与第二电极19错位设置。
具体地，第一电极18与第二电极19用于为第一导电膜12与第二导电膜15之间的电场供电。第一电极18与第二电极19错位设置，用于防止第一电极18与第二电极19遮挡光线影响PDLC13的紫外线固化。第一电极18与第二电极19可包括但不限于银/银浆固化、铜/铜浆固化、铝、或者钼铝钼等单层或者多层复合的金属走线，在此不一一举例说明。
步骤S02，第一基板11与第二基板16对应设置并通过框胶14固定连接形成密封腔102，其中第一导电膜12与第二导电膜15收容于密封腔102中。
具体地，步骤S02还可包括以下步骤：
步骤S21，在第一基板11设置第一导电膜12的表面形成框胶14。
在步骤S21之前，首先确保第一导电膜12的尺寸小于第一基板11的尺寸，第二导电膜15的尺寸小于第二基板16的尺寸。也即将第一基板11边缘的第一导电膜12、第二基板16边缘的第二导电膜15刻蚀掉，以使框胶14能够直接与第一基板11、第二基板16固定连接。由于基板与导电膜的材料存在较大区别，框胶14与基板的粘结性能远大于基板与导电膜的粘结性能，因此框胶14通常直接与第一基板11、第二基板16固定连接，能够增大框胶14粘结的牢固性。
框胶14包括胶水141及与胶水141混合的第二间隙结构142。第二间隙结构142位于第一基板11与第二基板16之间，其中，第二间隙结构142约占框胶14体积的0.1-0.5％，一方面用于支撑第一基板11与第二基板16，另一方面用于控制第一基板11与第二基板16之间的距离。
具体地，第二间隙结构142可以选择塑料系(压克力树脂微粒)、玻璃系(棒状粒子)、硅氧系(球状粒子)中的一种或多种。第二间隙结构142的粒径大约在为12-25μm之间，譬如12μm、15μm、20μm、25μm等，在此不一一列举，进而使得第一导电膜12与第二导电膜15之间的距离在9-20μm之间。本实施方式中，第一间隙结构17的粒径为20μm。
框胶14的胶水141可采用丝印工艺或点胶工艺作用于第一基板11 的表面。胶水141的黏度视加工工艺不同而定，丝印工艺选择2000-10000cps，点胶工艺选择1000-5000cps。
进一步地，步骤S21包括步骤S211：
在框胶14上开设开口1403(如图14所示)。
可以理解地，在后续步骤S24中，当第一基板11与第二基板16通过框胶14固定连接形成密封腔102的过程中，开口1403可用于当做排气口以排出密封腔102中的空气，以避免第一基板11靠近第二基板16的过程中，密封腔102的空气无法排出，影响密封腔102的可靠性。本步骤中，开口1403的数量至少为一个，当然也可以为两个，三个，在此不一一列举。
步骤S22，在第二基板16设置第二导电膜15的表面喷撒第一间隙结构17。
具体地，第一间隙结构17可随机分布于第一导电膜12与第二导电膜15之间。第一间隙结构17可以选择塑料系(压克力树脂微粒)、玻璃系(棒状粒子)、硅氧系(球状粒子)中的一种或多种。第一间隙结构17的粒径大约在为9-20μm之间，譬如9μm、12μm、15μm、20μm等，在此不一一列举，进而使得第一导电膜12与第二导电膜15之间的距离在9-20μm之间。本实施方式中，第一间隙结构17的粒径为15μm，一方面确保第一导电膜12与第二导电膜15之间的距离，确保PDLC13的厚度，另一方面尽可能的减小调光结构10的厚度，使得电子设备壳体100轻薄。第二间隙结构142的粒径略大于第一间隙结构17的粒径，具体地，第二间隙结构142的粒径约等于第一间隙结构17的粒径、第一导电膜12与第二导电膜15的厚度之和。
步骤S23，使第一基板11与第二基板16对应设置，且第二导电膜15朝向第一导电膜12设置。
本步骤用于调整第一基板11相对第二基板16的位置，以使第一基板11与第二基板16对应设置。
步骤S24，使框胶14与第二基板16背离第二导电膜15的表面固定连接并形成密封腔102(如图15所示)。
具体地，框胶14背离第一基板11的表面直接与第二基板16表面粘接，以提高框胶14粘接的可靠性。
可以理解地，此时的框胶14为胶凝状，为确保框胶14粘结的牢固性，需将框胶14快速固化。框胶14的胶水141为热固化胶水141、紫外固化胶水141或热固、紫外双固化胶水141中的一种，以方便框胶14快速固化。
步骤S25，对框胶14进行固化处理。
本实施例中，框胶14的胶水141为紫外固化胶水141，也即通过紫外线照射第一基板11、第二基板16实现胶水141的快速固化。
步骤S03，对密封腔102依次进行抽真空、注入PDLC13(如图16所示)。
步骤S03包括以下步骤：
步骤S31，通过开口1403对密封腔102进行抽真空。
通过开口1403对密封腔102进行抽真空处理，以方便PDLC13能够完全注满密封腔102，防止密封腔102中出现气泡，影响PDLC13的透光性与一致性。本步骤中，开口1403作为抽气口，用于排出密封腔102中的气体。
步骤S32，通过开口1403对密封腔102进行注入PDLC13。
在步骤S31的基础上，由于密封腔102处于真空状态，大气压可将胶水141通过开口1403注入密封腔102中，进而实现密封腔102的灌晶作业。本步骤中，开口1403作为灌晶口，用于向密封腔102中注入PDLC13。
步骤S04，对PDLC13进行固化处理。
由于灌入的PDLC13具有流动性，因此需将PDLC13固化处理，以避免PDLC13溢出。具体地，采用紫外线光线同时照射第一基板11与第二基板16，进而使得PDLC13固化。
步骤S05，按照预设形状切除多余部分，生成调光结构10。
譬如，以电子设备壳体100譬如手机后壳为例，手机后壳上开设有摄像头孔104。在步骤S21中，在第一基板11设置第一导电膜12的表面形成第一框1401与第二框胶1402。其中第一框1401、第二框胶1402与第一基板11、第二基板16围成密封腔102，第二框胶1402与第一基板11第二基板16围成摄像头腔103。其中密封腔102用于注入液晶，摄像头腔103用于挖孔以做摄像头孔104。本步骤中，需切除摄像头腔103对应位置的部分结构。
步骤S06，对开口1403进行点胶封口(如图17所示)。
可以理解地，开口1403是密封腔102连通外界的通道，若不进行密封，PDLC13中的液晶分子容易发生溢出，进而影响调光结构10的稳定性与可靠性。
可选地，对开口1403进行封口所用的胶水可以与框胶14所用胶水141相同，以使框胶14结构一致，也可以采用其他胶质材料，譬如环氧树脂等，在此不做具体限制。
步骤S07，分别在第一基板11与第二基板16的表面形成第一装饰膜20与第二装饰膜30，生成电子设备壳体100。
请参照图18，在一个具体实施例中，在步骤S21中，可在第一框1401上开设第一开口1403a，可在第二框胶14上开设连通密封腔102的第二开口1403b，其中第一开口1403a用于使密封腔102与外界连通，以实现密封腔102的排气与灌晶。第二开口1403b用于连通摄像头腔103 与密封腔102，以使第一基板11靠近第二基板16的过程中，摄像头腔103的空气可从密封腔102排出，进而确保第一基板11与第二基板16连接的稳定性。其中第一开口1403a可位于电子设备壳体100中第一框体的任意位置。本实施方式中，第一开口1403a位于第一框体的长边位置，如此设置可加快灌晶速度，提高灌晶效率，缩短制程。
可以理解地，步骤S03中的对密封腔102依次进行抽真空、注入PDLC13的过程中，同时对摄像头腔103抽真空和注入PDLC13。步骤S04对密封腔102和摄像头腔103中的PDLC13进行紫外光线照射。步骤S05切除摄像头腔103位置的调光结构10已生成摄像头孔104。步骤S06，对第一开口1403a与第二开口1403b进行点胶封口，生成调光结构10。
请参照图19，在另一个具体实施例中，在步骤S21中，可在第一框胶14上开设第一开口1403a，在摄像头腔103对应的第一基板11或第二基板16上开设第二开口1403b。其中第一开口1403a用于使密封腔102与外界连通，以实现密封腔102的排气与灌晶。第二开口1403b用于连通摄像头腔103与外界，以使第一基板11靠近第二基板16的过程中，摄像头腔103的空气可从第二开口1403b排出，进而确保第一基板11与第二基板16连接的稳定性。
可以理解地，步骤S03中仅对密封腔102依次进行抽真空、注入PDLC13。步骤S04仅对密封腔102的PDLC13进行紫外光线照射。步骤S05切除摄像头腔103位置的第一基板11与第二基板16。步骤S06，对第一开口1403a进行点胶封口，生成调光结构10。
在其他实施例中，当调光结构10应用于电子设备1000时，基于步骤S02中可采用黄光刻蚀的工艺生产第一导电膜12与第二导电膜15，可灵活地调整第一导电膜12与第二导电膜15的尺寸，留出足够的天线净空，如此设计可减少对天线设计的压力。
本申请实施例提供的调光结构10的制作方法，通过使框胶14与第一基板11、第二基板16围成密封腔102，可使PDLC13直灌注到密封腔102中，减少PDLC13与第一基板11、第二基板16的直接接触，使得使第一基板11与第二基板16的表面不易受到PDLC13的污染；另外框胶14直接与第一基板11、第二基板16固定连接，提高了框胶14连接的牢固性能。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种调光结构，其特征在于，包括：
    间隔相对设置的第一基板与第二基板；
    间隔相对设置的第一导电膜与第二导电膜，所述第一导电膜设置于第一基板朝向所述第二基板的表面，所述第二导电膜设置于所述第二基板朝向所述第一基板的表面；
    框胶，所述框胶一侧表面与所述第一基板固定连接、另一侧表面与所述第二基板固定连接，所述框胶与所述第一基板、第二基板围成密封腔，所述第一导电膜、所述第二导电膜收容于所述密封腔中；以及
    PDLC，所述PDLC收容于所述密封腔中。
  2. 根据权利要求1所述的调光结构，其特征在于，所述调光结构还包括第一间隙结构，所述第一间隙结构位于所述第一导电膜与所述第二导电膜之间，用于控制所述第一导电膜与所述第二导电膜之间的距离。
  3. 根据权利要求2所述的调光结构，其特征在于，所述第一间隙结构的粒径在为9-20μm之间。
  4. 根据权利要求1所述的调光结构，其特征在于，所述框胶包括胶水及与所述胶水混合的第二间隙结构，所述胶水为热固化胶水、紫外固化胶水或热固、紫外双固化胶水中的一种。
  5. 根据权利要求1任一项所述的调光结构，其特征在于，所述第一基板、所述第一导电膜、所述第二导电膜与所述第二基板均为透明结构。
  6. 根据权利要求1-5任一项所述的调光结构，其特征在于，所述第一基板与所述第二基板包括聚对苯二甲酸乙二醇、聚碳酸酯、聚酰亚胺、环状环烯烃共聚物中的一种或多种。
  7. 根据权利要求1-5任一项所述的调光结构，其特征在于，所述第一导电膜与所述第二导电膜的包括氧化铟锡、氧化锡掺氟或金属网格中的一种或多种。
  8. 根据权利要求1所述的调光结构，其特征在于，所述调光结构还包括第一电极与第二电极，所述第一电极与所述第一导电膜电性连接，所述第二电极与所述第二导电膜电性连接，所述第一电极与所述第二电极错位设置。
  9. 一种调光结构制作方法，其特征在于，包括以下步骤：
    提供第一基板和第二基板，并在所述第一基板与所述第二基板的一侧表面分别形成第一导电膜和第二导电膜；
    所述第一基板与所述第二基板对应设置并通过框胶固定连接形成密封腔，其中所述第一导电膜与所述第二导电膜收容于所述密封腔中；
    对所述密封腔依次进行抽真空、注入PDLC；
    对所述PDLC进行固化处理。
  10. 根据权利要求9所述的调光结构制作方法，其特征在于，
    所述第一基板与所述第二基板对应设置并通过框胶固定连接形成密封腔包括以下步骤：
    在所述第一基板设置所述第一导电膜的表面形成框胶；
    使所述第一基板与所述第二基板对应设置，且所述第二导电膜朝向所述第一导电膜设置；
    使所述框胶与所述第二基板背离所述第二导电膜的表面固定连接并形成密封腔。
  11. 根据权利要求10所述的调光结构制作方法，其特征在于，
    所述第一基板与所述第二基板对应设置，且所述第二导电膜朝向所述第一导电膜设置步骤之前还包括：
    在所述第二基板设置所述第二导电膜的表面喷撒第一间隙结构。
  12. 根据权利要求11所述的调光结构制作方法，其特征在于，
    所述使所述框胶与所述第二基板背离所述第二导电膜的表面固定连接并形成密封腔步骤之前还包括：
    在所述框胶上开设开口；
    所述对所述密封腔依次进行抽真空、注入PDLC的步骤包括：
    通过所述开口对所述密封腔依次进行抽真空、注入PDLC；
    所述对所述PDLC进行紫外光线照射步骤之后还包括：
    对所述开口进行点胶封口。
  13. 根据权利要求9所述的调光结构制作方法，其特征在于，
    所述在所述第一基板与所述第二基板的一侧表面分别形成第一导电膜和第二导电膜步骤之后还包括：
    分别在所述第一基板与所述第二基板上形成第一电极和第二电极；
    其中所述第一电极与所述第二电极错位设置。
  14. 一种电子设备壳体，其特征在于，包括：
    调光结构；以及
    分别位于所述调光结构相背两侧表面的第一装饰膜与第二装饰膜；
    其中，调光结构包括间隔相对设置的第一基板与第二基板、间隔相对设置的第一导电膜与第二导电膜、框胶和PDLC；所述第一导电膜设置于第一基板朝向所述第二基板的表面，所述第二导电膜设置于所述第二基板朝向所述第一基板的表面；所述框胶一侧表面与所述第一基板固定连接、另一侧表面与所述第二基板固定连接，所述框胶与所述第一基板、第二基板围成密封腔，所述第一导电膜、所述第二导电膜收容于所述密封腔中，所述PDLC收容于所述密封腔中。
  15. 根据权利要求14所述的电子设备壳体，其特征在于，所述调光结构还包括第一间隙结构，所述第一间隙结构位于所述第一导电膜与所 述第二导电膜之间，用于控制所述第一导电膜与所述第二导电膜之间的距离。
  16. 根据权利要求14所述的电子设备壳体，其特征在于，所述框胶包括胶水及与所述胶水混合的第二间隙结构，所述胶水为热固化胶水、紫外固化胶水或热固、紫外双固化胶水中的一种。
  17. 根据权利要求14所述的电子设备壳体，其特征在于，所述第一基板、所述第一导电膜、所述第二导电膜与所述第二基板均为透明结构。
  18. 根据权利要求14-17任一项所述的电子设备壳体，其特征在于，所述第一基板与所述第二基板包括聚对本二甲酸乙二醇、聚碳酸酯、聚酰亚胺、环状环烯烃共聚物中的一种或多种。
  19. 根据权利要求14-17任一项所述的电子设备壳体，其特征在于，所述第一导电膜与所述第二导电膜的包括氧化铟锡、氧化锡掺氟或金属网格中的一种或多种。
  20. 根据权利要求14所述的电子设备壳体，其特征在于，所述调光结构还包括第一电极与第二电极，所述第一电极与所述第一导电膜电性连接，所述第二电极与所述第二导电膜电性连接，所述第一电极与所述第二电极错位设置。
PCT/CN2022/092075 2021-07-09 2022-05-10 调光结构及其制作方法、电子设备壳体和电子设备 WO2023279841A1 (zh)

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