WO2023204235A1 - Particules de sel d'acide tantalitique, méthode de production de particules de sel d'acide tantalitique, composition de résine et objet moulé - Google Patents
Particules de sel d'acide tantalitique, méthode de production de particules de sel d'acide tantalitique, composition de résine et objet moulé Download PDFInfo
- Publication number
- WO2023204235A1 WO2023204235A1 PCT/JP2023/015559 JP2023015559W WO2023204235A1 WO 2023204235 A1 WO2023204235 A1 WO 2023204235A1 JP 2023015559 W JP2023015559 W JP 2023015559W WO 2023204235 A1 WO2023204235 A1 WO 2023204235A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tantalate
- particles
- compound
- potassium
- tantalate particles
- Prior art date
Links
- 239000002245 particle Substances 0.000 title claims abstract description 313
- 150000003839 salts Chemical class 0.000 title claims abstract description 11
- 239000002253 acid Substances 0.000 title claims abstract 6
- 238000004519 manufacturing process Methods 0.000 title claims description 56
- 239000011342 resin composition Substances 0.000 title claims description 25
- 239000013078 crystal Substances 0.000 claims abstract description 68
- 238000002441 X-ray diffraction Methods 0.000 claims abstract description 16
- 239000011734 sodium Substances 0.000 claims description 97
- 229920005989 resin Polymers 0.000 claims description 75
- 239000011347 resin Substances 0.000 claims description 75
- 239000005078 molybdenum compound Substances 0.000 claims description 64
- 150000002752 molybdenum compounds Chemical class 0.000 claims description 64
- 238000010304 firing Methods 0.000 claims description 60
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 43
- 239000000203 mixture Substances 0.000 claims description 43
- 150000003482 tantalum compounds Chemical class 0.000 claims description 40
- 150000003112 potassium compounds Chemical class 0.000 claims description 39
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 38
- 239000011591 potassium Substances 0.000 claims description 38
- 229910052700 potassium Inorganic materials 0.000 claims description 38
- 150000003388 sodium compounds Chemical class 0.000 claims description 38
- 229910052750 molybdenum Inorganic materials 0.000 claims description 35
- 239000011733 molybdenum Substances 0.000 claims description 35
- 238000002156 mixing Methods 0.000 claims description 32
- 229910052708 sodium Inorganic materials 0.000 claims description 32
- 150000001875 compounds Chemical class 0.000 claims description 28
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 28
- 238000004458 analytical method Methods 0.000 claims description 26
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 24
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 24
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 24
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 22
- 229910052715 tantalum Inorganic materials 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 14
- 239000011684 sodium molybdate Substances 0.000 claims description 14
- 235000015393 sodium molybdate Nutrition 0.000 claims description 14
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 14
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 12
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 12
- 238000007561 laser diffraction method Methods 0.000 claims description 7
- 238000000790 scattering method Methods 0.000 claims description 7
- 125000004436 sodium atom Chemical group 0.000 claims description 6
- 238000000034 method Methods 0.000 description 40
- UOZGXGHEICQKSP-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[Ta+5] UOZGXGHEICQKSP-UHFFFAOYSA-N 0.000 description 37
- 229960003975 potassium Drugs 0.000 description 36
- 239000003795 chemical substances by application Substances 0.000 description 34
- 230000004907 flux Effects 0.000 description 31
- -1 potassium molybdate Chemical compound 0.000 description 29
- 239000000843 powder Substances 0.000 description 28
- 238000004876 x-ray fluorescence Methods 0.000 description 24
- 238000005259 measurement Methods 0.000 description 19
- 239000002994 raw material Substances 0.000 description 16
- 238000001878 scanning electron micrograph Methods 0.000 description 14
- 229920001187 thermosetting polymer Polymers 0.000 description 14
- 238000001816 cooling Methods 0.000 description 12
- 238000001723 curing Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 238000009826 distribution Methods 0.000 description 11
- 235000011181 potassium carbonates Nutrition 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 10
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 10
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 229910001936 tantalum oxide Inorganic materials 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000001354 calcination Methods 0.000 description 6
- 238000007716 flux method Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 235000002639 sodium chloride Nutrition 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000011164 primary particle Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000011088 calibration curve Methods 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- 238000004438 BET method Methods 0.000 description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 3
- 239000001103 potassium chloride Substances 0.000 description 3
- 235000011164 potassium chloride Nutrition 0.000 description 3
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 229920000856 Amylose Polymers 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004373 Pullulan Substances 0.000 description 2
- 229920001218 Pullulan Polymers 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- 238000010332 dry classification Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- NMHMDUCCVHOJQI-UHFFFAOYSA-N lithium molybdate Chemical compound [Li+].[Li+].[O-][Mo]([O-])(=O)=O NMHMDUCCVHOJQI-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 239000011736 potassium bicarbonate Substances 0.000 description 2
- 235000015497 potassium bicarbonate Nutrition 0.000 description 2
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 229940093956 potassium carbonate Drugs 0.000 description 2
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 2
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 2
- 235000011118 potassium hydroxide Nutrition 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 229910001950 potassium oxide Inorganic materials 0.000 description 2
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 2
- 229910052939 potassium sulfate Inorganic materials 0.000 description 2
- 235000011151 potassium sulphates Nutrition 0.000 description 2
- 235000019423 pullulan Nutrition 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- ZIRLXLUNCURZTP-UHFFFAOYSA-I tantalum(5+);pentahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[Ta+5] ZIRLXLUNCURZTP-UHFFFAOYSA-I 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MHWAJHABMBTNHS-UHFFFAOYSA-N 1,1-difluoroethene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C.FC(F)=C(F)F MHWAJHABMBTNHS-UHFFFAOYSA-N 0.000 description 1
- KXJGSNRAQWDDJT-UHFFFAOYSA-N 1-acetyl-5-bromo-2h-indol-3-one Chemical compound BrC1=CC=C2N(C(=O)C)CC(=O)C2=C1 KXJGSNRAQWDDJT-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SFRDXVJWXWOTEW-UHFFFAOYSA-N 2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)CO SFRDXVJWXWOTEW-UHFFFAOYSA-N 0.000 description 1
- VKNASXZDGZNEDA-UHFFFAOYSA-N 2-cyanoethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC#N VKNASXZDGZNEDA-UHFFFAOYSA-N 0.000 description 1
- AEPWOCLBLLCOGZ-UHFFFAOYSA-N 2-cyanoethyl prop-2-enoate Chemical compound C=CC(=O)OCCC#N AEPWOCLBLLCOGZ-UHFFFAOYSA-N 0.000 description 1
- GSKNLOOGBYYDHV-UHFFFAOYSA-N 2-methylphenol;naphthalen-1-ol Chemical compound CC1=CC=CC=C1O.C1=CC=C2C(O)=CC=CC2=C1 GSKNLOOGBYYDHV-UHFFFAOYSA-N 0.000 description 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical group C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- XWNSFEAWWGGSKJ-UHFFFAOYSA-N 4-acetyl-4-methylheptanedinitrile Chemical compound N#CCCC(C)(C(=O)C)CCC#N XWNSFEAWWGGSKJ-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004605 External Lubricant Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 239000004610 Internal Lubricant Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004153 Potassium bromate Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 235000019498 Walnut oil Nutrition 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 229920001923 acrylonitrile-ethylene-styrene Polymers 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- ZNRKKSGNBIJSRT-UHFFFAOYSA-L dibromotantalum Chemical compound Br[Ta]Br ZNRKKSGNBIJSRT-UHFFFAOYSA-L 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 235000013681 dietary sucrose Nutrition 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- NQKXFODBPINZFK-UHFFFAOYSA-N dioxotantalum Chemical compound O=[Ta]=O NQKXFODBPINZFK-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- 229910000396 dipotassium phosphate Inorganic materials 0.000 description 1
- 235000019797 dipotassium phosphate Nutrition 0.000 description 1
- AAQNGTNRWPXMPB-UHFFFAOYSA-N dipotassium;dioxido(dioxo)tungsten Chemical compound [K+].[K+].[O-][W]([O-])(=O)=O AAQNGTNRWPXMPB-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- VSWALKINGSNVAR-UHFFFAOYSA-N naphthalen-1-ol;phenol Chemical compound OC1=CC=CC=C1.C1=CC=C2C(O)=CC=CC2=C1 VSWALKINGSNVAR-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920003196 poly(1,3-dioxolane) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 229960004109 potassium acetate Drugs 0.000 description 1
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- DJEHXEMURTVAOE-UHFFFAOYSA-M potassium bisulfite Chemical compound [K+].OS([O-])=O DJEHXEMURTVAOE-UHFFFAOYSA-M 0.000 description 1
- 229940094037 potassium bromate Drugs 0.000 description 1
- 235000019396 potassium bromate Nutrition 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 235000010259 potassium hydrogen sulphite Nutrition 0.000 description 1
- ZOCLAPYLSUCOGI-UHFFFAOYSA-M potassium hydrosulfide Chemical compound [SH-].[K+] ZOCLAPYLSUCOGI-UHFFFAOYSA-M 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 229940093928 potassium nitrate Drugs 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 235000019252 potassium sulphite Nutrition 0.000 description 1
- VISKNDGJUCDNMS-UHFFFAOYSA-M potassium;chlorite Chemical compound [K+].[O-]Cl=O VISKNDGJUCDNMS-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229960004793 sucrose Drugs 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- MISXNQITXACHNJ-UHFFFAOYSA-I tantalum(5+);pentaiodide Chemical compound [I-].[I-].[I-].[I-].[I-].[Ta+5] MISXNQITXACHNJ-UHFFFAOYSA-I 0.000 description 1
- FAWYJKSBSAKOFP-UHFFFAOYSA-N tantalum(iv) sulfide Chemical compound S=[Ta]=S FAWYJKSBSAKOFP-UHFFFAOYSA-N 0.000 description 1
- OEIMLTQPLAGXMX-UHFFFAOYSA-I tantalum(v) chloride Chemical compound Cl[Ta](Cl)(Cl)(Cl)Cl OEIMLTQPLAGXMX-UHFFFAOYSA-I 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000008170 walnut oil Substances 0.000 description 1
- 238000004736 wide-angle X-ray diffraction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G35/00—Compounds of tantalum
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G39/00—Compounds of molybdenum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
Definitions
- the present invention relates to tantalate particles, a method for producing tantalate particles, a resin composition, and a molded article.
- This application claims priority based on Japanese Patent Application No. 2022-070230, filed in Japan on April 21, 2022, the contents of which are incorporated herein.
- Alkali metal tantalate salts are widely used as piezoelectric bodies, fillers, catalysts, semiconductor photoelectrodes, etc.
- Patent Document 1 describes a method for producing tantalate crystal particles having a layered perovskite structure and represented by a specific formula, in which crystals are precipitated and grown by mixing raw materials and flux and heating the mixture.
- a method for producing tantalate crystal particles is disclosed. Also. It is exemplified that the flux contains potassium chloride or strontium chloride.
- Patent Document 2 shows a catalyst composition comprising sodium tantalate (NaTaO 3 ) as a base catalyst, a modifier, and at least one cocatalyst as an application example for photocatalytic reduction of carbon dioxide.
- NaTaO 3 sodium tantalate
- K x Na (1-x) TaO 3 (0 ⁇ x ⁇ 1) has a perovskite structure and can be used, for example, as a piezoelectric material.
- a piezoelectric material it is expected that the larger the crystallite size, the more excellent the piezoelectric effect can be exhibited.
- the present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide tantalate particles having an excellent degree of crystal growth.
- the present invention has the following aspects.
- (2) The tantalate particles according to (1) above, wherein the crystal structure includes a perovskite crystal structure.
- (3) The tantalate particles according to (1) or (2) above, which have a cubic shape.
- the content of tantalum in the tantalate particles is determined by XRF analysis of the tantalate particles, and is the content in terms of Ta 2 O 5 based on 100% by mass of the total mass of the tantalate particles.
- the potassium and/or sodium content in the tantalate particles is determined by XRF analysis of the tantalate particles, calculated as K 2 O and Na based on 100% by mass of the tantalate particles.
- the molybdenum content in the tantalate particles is determined by XRF analysis of the tantalate particles, and the content ratio in terms of MoO 3 is 0.5% based on 100% by mass of the total mass of the tantalate particles.
- Method of manufacturing particles (15) tantalate particles according to any one of (1) to (9) above; A resin composition comprising a resin. (16) A molded article obtained by molding the resin composition according to (15) above.
- tantalate particles having an excellent degree of crystal growth can be provided. Further, according to the present invention, a method for producing the tantalate particles can be provided. Moreover, according to the present invention, a resin composition containing the tantalate particles and a molded article thereof can be provided.
- 3 is a SEM image of NaTaO 3 particles of Example 1.
- 3 is a SEM image of KTaO 3 particles of Example 2.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 3.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 4.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 5.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 6.
- 3 is a SEM image of KTaO 3 particles of Example 7.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 8.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 9.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 10.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 11.
- 3 is a SEM image of K x Na (1-x) TaO 3 particles of Example 12.
- 1 is an X-ray diffraction (XRD) pattern of powder samples of Examples 1-2.
- 3 is an X-ray diffraction (XRD) pattern of powder samples of Examples 3 to 6.
- 3 is an X-ray diffraction (XRD) pattern of powder samples of Examples 7-8.
- Figure 3 is an X-ray diffraction (XRD) pattern of powder samples of Examples 9-12.
- the tantalate particles of embodiments include a tantalate compound represented by K x Na (1-x) TaO 3 .
- K x Na (1-x) TaO 3 x satisfies 0 ⁇ x ⁇ 1.
- K x Na (1-x) TaO 3 is potassium sodium tantalate.
- K x Na (1-x) TaO 3 is sodium tantalate (NaTaO 3 ).
- K x Na (1-x) TaO 3 is potassium tantalate (KTaO 3 ).
- the raw material may contain an element such as Fe as an unavoidable impurity.
- the type, composition, and crystal structure of the tantalate contained in the tantalate particles of the embodiment can be specified by the XRD pattern of the spectrum obtained by XRD analysis.
- the average crystallite size of the crystal structure contained in the tantalate particles of the embodiment can be determined by the following measurement method.
- Measurement is performed using an X-ray diffractometer (for example, SmartLab, manufactured by Rigaku Corporation), a high-intensity, high-resolution crystal analyzer (CALSA) as a detector, and analysis software.
- the measurement method is the 2 ⁇ / ⁇ method, and the average crystallite size is calculated from the half-value width of the target peak (a peak having a peak top in the target 2 ⁇ range) using the Scherrer equation.
- the measurement conditions are: scan speed is 0.05 degrees/min, scan range is 20 to 70 degrees, step is 0.002 degrees, and device standard width is 0.028 degrees (Si). .
- K x Na (1-x) TaO 3 can exhibit a crystal system different from monoclinic, rectangular, or tetragonal depending on the composition, and the plane assignment differs depending on the crystal system.
- plane indices are expressed assuming that the crystal structure is a cubic system.
- the position corresponds to the (100) plane of If the peak is split, define the crystallite size using the peak with the highest intensity.
- the average crystallite size of the tantalate particles is greater than or equal to the above lower limit, even more excellent piezoelectric performance is exhibited.
- the position corresponds to the (110) plane of If the peak is split, define the crystallite size using the peak with the highest intensity.
- the average crystallite size of the tantalate particles is greater than or equal to the above lower limit, even more excellent piezoelectric performance is exhibited.
- the position corresponds to the (211) plane of If the target peak is split, the crystallite size is defined by the peak with the highest intensity.
- the crystal growth of the tantalate particles to be manufactured is excellently controlled, and tantalate particles with an improved average crystallite size can be easily obtained.
- the average crystallite size can be controlled by the amount and type of flux agent used and firing conditions in the manufacturing method described below.
- the crystal structure of the tantalate particles of the embodiment can include a perovskite crystal structure.
- the tantalate particles of embodiments can have a cubic shape.
- cubic shape may be a shape derived from a perovskite structure, preferably a substantially cubic hexahedral shape, and each face constituting the hexahedron may be a flat surface. , it may be a curved or uneven surface.
- tantalate particles having a perovskite crystal structure and a cubic shape can be manufactured.
- tantalate particles with a larger average crystallite size and larger particle size tend to be obtained.
- the particle size is preferably 0.1 ⁇ m or more, more preferably 0.5 ⁇ m or more, and even more preferably 1 ⁇ m or more.
- the upper limit of the particle size when the tantalate particles have a cubic shape is not particularly limited, but may be, for example, 100 ⁇ m or less, 80 ⁇ m or less, 50 ⁇ m or less. It's good.
- An example of the upper numerical range of the particle size when the tantalate particles have a cubic shape is 0.1 to 100 ⁇ m, 0.5 to 80 ⁇ m, and 1 to 50 ⁇ m. It's fine.
- the "particle size" of tantalate particles having a cubic shape refers to the particle size of the tantalate particles as determined from the particle image of the primary particles of the tantalate particles in a two-dimensional image taken with a scanning electron microscope (SEM). This is the length of one side of the hexahedron to be determined.
- the value of the tantalate particle size having a cubic shape is the average value obtained from 50 or more tantalate particles randomly selected from among the euhedral particles to be measured above. do.
- tantalate particles having a cubic shape When tantalate particles having a cubic shape are included, it is preferable that 50% or more of the particles have a cubic shape based on mass or number, and it is preferable that 80% or more of the particles have a cubic shape. More preferably, 90% or more of the particles have a cubic shape.
- the median diameter D50 of the tantalate particles of the embodiment calculated by a laser diffraction/scattering method may be 0.1 to 100 ⁇ m, may be 0.5 to 80 ⁇ m, and may be 1 to 50 ⁇ m. good.
- D 10 of the tantalate particles of the embodiments calculated by laser diffraction/scattering method may be 0.05 to 70 ⁇ m, may be 0.1 to 50 ⁇ m, and may be 0.5 to 20 ⁇ m. good.
- the median diameter D 90 of the tantalate particles of the embodiment calculated by a laser diffraction/scattering method may be 0.5 to 150 ⁇ m, 1 to 100 ⁇ m, or 3 to 70 ⁇ m.
- the median diameter D 50 of the tantalate particle sample calculated by the laser diffraction/scattering method is based on the particle size distribution measured dry using a laser diffraction particle size distribution analyzer when the volume integrated % ratio is 50%. It can be determined as the particle size.
- D10 which is calculated by the laser diffraction/scattering method of a tantalate particle sample, can be determined as the particle diameter at the point where the volume integration % distribution curve intersects the horizontal axis of 10% from the small particle side.
- 90 can be determined as the particle diameter at the point where the volume integration % distribution curve intersects the 90% horizontal axis from the small particle side.
- the specific surface area of the tantalate particles of the embodiment determined by the BET method may be 0.02 to 20 m 2 /g, 0.04 to 10 m 2 /g, 0.05 to 10 m 2 /g. It may be 3 m 2 /g.
- the above specific surface area is measured using a specific surface area meter (for example, BELSORP-mini manufactured by Microtrac Bell Co., Ltd.), and the sample is measured from the amount of nitrogen gas adsorbed by the BET method (Brunauer-Emmett-Teller method).
- the surface area per 1 g is calculated as the specific surface area (m 2 /g).
- the tantalate particles of the embodiment include K x Na (1-x) TaO 3 (0 ⁇ x ⁇ 1).
- the tantalate particles of the embodiment preferably contain 65% by mass or more, and preferably 65 to 99.999% by mass, of the K x Na (1-x) TaO 3 based on 100% by mass of the tantalate particles.
- the content is preferably from 70 to 99.97% by mass, and even more preferably from 75 to 99.95% by mass.
- the tantalum content in the tantalate particles is determined by XRF analysis of the tantalate particles, and the content in terms of Ta 2 O 5 based on 100% by mass of the tantalate particles is: It may be 50% by mass or more, 50 to 99% by mass, 60 to 98% by mass, or 70 to 95% by mass.
- the content in terms of Ta 2 O 5 refers to the value obtained from the amount of Ta 2 O 5 obtained by converting the tantalum content determined by XRF analysis using a calibration curve in terms of Ta 2 O 5 .
- the tantalate particles of embodiments include potassium and/or sodium.
- the potassium and/or sodium content in the tantalate particles is determined by XRF analysis of the tantalate particles, calculated in terms of K2O and Na2O based on 100% by mass of the tantalate particles.
- the total content in terms of conversion may be 0.5% by mass or more, 0.5 to 40% by mass, 1 to 30% by mass, or 3 to 25% by mass. It's okay.
- the tantalate particles of embodiments can further include molybdenum.
- the tantalate particles of the embodiment can contain molybdenum derived from a molybdenum compound that may be used in the manufacturing method described below. Moreover, the tantalate particles of the embodiment can achieve highly efficient crystal growth by using a molybdenum compound in the manufacturing method described below.
- the molybdenum contained in the tantalate particles of the embodiment is not particularly limited in its existence state or amount, and may be contained in the tantalate particles as molybdenum metal, molybdenum oxide, partially reduced molybdenum compounds, etc. It's fine. Molybdenum is considered to be contained in the tantalate particles as MoO 3 , but it may also be contained in the tantalate particles as MoO 2 , MoO, etc. in addition to MoO 3 .
- molybdenum is contained in a form attached to the surface of the tantalate particles or in a form substituted with a part of the crystal structure of the tantalate particles, It may be contained in an amorphous state or a combination thereof.
- the molybdenum content is determined by XRF analysis of the tantalate particles, and is calculated as MoO 3 based on 100% by mass of the tantalate particles.
- the ratio may be 0.01% by mass or more, 0.01 to 20% by mass, 0.05 to 15% by mass, or 0.06 to 10% by mass. Good too.
- the content in terms of MoO 3 is a value obtained from the amount of MoO 3 obtained by converting the molybdenum content determined by XRF analysis using a calibration curve in terms of MoO 3 .
- the content rate of molybdenum in terms of MoO 3 is 0 to 100% by mass of the tantalate particles, as determined by XRF analysis of the tantalate particles. 20% by mass, the content of tantalum in terms of Ta 2 O 5 is 50 to 99% by mass, and the content of potassium and sodium in terms of K 2 O and Na 2 O is 0.5 to 40% by mass % of tantalate particles. As another example of the tantalate particles of the embodiment, the content of molybdenum in terms of MoO 3 based on 100% by mass of the total mass of the tantalate particles is determined by XRF analysis of the tantalate particles.
- the content of tantalum in terms of Ta 2 O 5 is 50 to 99% by mass, and the content of potassium and sodium in terms of K 2 O and Na 2 O is 0.01 to 20% by mass.
- An example is tantalate particles having a content of 5 to 40% by mass.
- the content of molybdenum in terms of MoO 3 based on 100% by mass of the total mass of the tantalate particles is determined by XRF analysis of the tantalate particles.
- the content of tantalum in terms of Ta 2 O 5 is 60 to 98% by mass, and the content of potassium and sodium in terms of K 2 O and Na 2 O is 1 to 1.
- An example may be tantalate particles having a content of 30% by mass.
- the content of molybdenum in terms of MoO 3 based on 100% by mass of the total mass of the tantalate particles is determined by XRF analysis of the tantalate particles.
- the content of tantalum in terms of Ta 2 O 5 is 70 to 95% by mass, and the content of potassium and sodium in terms of K 2 O and Na 2 O is 3 to 10% by mass.
- An example may be tantalate particles having a content of 25% by mass.
- the tantalate particles of the embodiments can be provided as an aggregate of tantalate particles.
- values of crystallite size, particle size distribution, specific surface area, value of x, molybdenum content, tantalum content, potassium content, and sodium content adopt the values determined using the above aggregate as a sample. I can do it.
- the tantalate particles of the embodiment can be manufactured, for example, by the ⁇ method for manufacturing tantalate particles>> described below. Note that the tantalate particles of the present invention are not limited to those produced by the method for producing tantalate particles of the embodiment below.
- the tantalate particles of the embodiments can be used as piezoelectric bodies, catalysts, water purification materials, and the like.
- a method for producing tantalate particles of an embodiment includes firing a tantalum compound in the presence of a potassium compound and/or a sodium compound.
- the degree of crystal growth of the tantalate particles produced can be controlled. Excellent. Furthermore, according to the method for producing tantalate particles of the present embodiment, by firing the tantalum compound in the presence of potassium carbonate and/or sodium carbonate, the degree of crystal growth of the tantalate particles produced depends on the degree of crystal growth. Excellent.
- a preferred method for producing tantalate particles includes a step of mixing a tantalum compound and a potassium compound and/or a sodium compound to form a mixture (mixing step), and a step of firing the mixture (calcination step). can be included.
- a molybdenum compound In the method for producing tantalate particles of the embodiment, it is preferable to further use a molybdenum compound.
- a molybdenum compound By using a molybdenum compound, crystal growth of tantalate particles can be further promoted and tantalate particles can be manufactured with high efficiency.
- An example of a method for producing such tantalate particles is a method that includes firing a tantalum compound in the presence of a molybdenum compound and a potassium compound and/or a sodium compound.
- a preferred method for producing tantalate particles includes a step of mixing a tantalum compound, a molybdenum compound, a potassium compound and/or a sodium compound to form a mixture (mixing step), and a step of firing the mixture (calcining step). ) and can include.
- a compound containing molybdenum and potassium such as potassium molybdate
- a compound containing molybdenum and potassium can also be used in place of at least some of the molybdenum compounds and potassium compounds.
- compounds containing molybdenum and sodium such as sodium molybdate. Therefore, mixing molybdenum and a compound containing potassium and/or sodium is also considered to be mixing a molybdenum compound and a potassium compound and/or a sodium compound.
- the mixing step is a step of mixing a tantalum compound, optionally a molybdenum compound, and a potassium compound and/or a sodium compound to form a mixture.
- the tantalate particles to be produced include potassium sodium tantalate
- it may include a step (mixing step) of mixing the tantalum compound, optionally a molybdenum compound, a potassium compound, and a sodium compound to form a mixture.
- the tantalate particles to be produced may include a step (mixing step) of mixing the tantalum compound, optionally a molybdenum compound, and a potassium compound to form a mixture.
- the tantalate particles to be produced may include a step (mixing step) of mixing the tantalum compound, optionally a molybdenum compound, and a sodium compound to form a mixture.
- tantalum compound The tantalum compound is not limited as long as it can be fired with a raw material compound to form a tantalate, and includes tantalum oxide, tantalum hydroxide, tantalum sulfide, tantalum nitride, tantalum fluoride, tantalum chloride, tantalum bromide, Examples include tantalum halides such as tantalum iodide, tantalum alkoxides, tantalum hydroxide and tantalum oxide are preferred, and tantalum oxide is more preferred. Examples of tantalum oxide include tantalum pentoxide (Ta 2 O 5 ), tantalum dioxide (TaO 2 ), and tantalum monoxide (TaO).
- any tantalum oxide having a different valence can be used.
- the physical form such as the shape, particle size, specific surface area, etc. of the tantalum compound as a precursor.
- the shape after firing hardly reflects the shape of the raw tantalum compound, so it may be spherical, amorphous, a structure with an aspect (wire, fiber, ribbon, tube, etc.), or a sheet. can also be suitably used.
- molybdenum compound examples include molybdenum oxide, molybdic acid, molybdenum sulfide, and molybdate compounds, with molybdenum oxide or molybdate compounds being preferred.
- molybdenum oxide examples include molybdenum dioxide (MoO 2 ), molybdenum trioxide (MoO 3 ), and molybdenum trioxide is preferred.
- the molybdate compound is preferably an alkali metal salt of molybdenum oxoanion, more preferably lithium molybdate, potassium molybdate, or sodium molybdate, and even more preferably potassium molybdate or sodium molybdate.
- the molybdenum compound may be a hydrate.
- the molybdenum compound is preferably at least one compound selected from the group consisting of molybdenum trioxide, lithium molybdate, potassium molybdate, and sodium molybdate, and preferably from the group consisting of molybdenum trioxide, potassium molybdate, and sodium molybdate. More preferably, it is at least one selected compound.
- a compound containing molybdenum and potassium that is suitable as a fluxing agent can be produced, for example, in the firing process using cheaper and more easily available molybdenum compounds and potassium compounds as raw materials.
- a molybdenum compound and a potassium compound as a fluxing agent
- when using a compound containing molybdenum and potassium as a fluxing agent when using a combination of both, when using a molybdenum compound and a potassium compound as a fluxing agent, that is, Considered to be in the presence of molybdenum compounds and potassium compounds.
- a compound containing molybdenum and sodium suitable as a fluxing agent can be produced, for example, in the firing process using cheaper and more easily available molybdenum compounds and sodium compounds as raw materials.
- a molybdenum compound and a sodium compound as a fluxing agent when using a compound containing molybdenum and sodium as a fluxing agent, when using a combination of both, when using a molybdenum compound and a sodium compound as a fluxing agent, that is, Considered to be in the presence of molybdenum compounds and sodium compounds.
- molybdenum compounds may be used alone or in combination of two or more types.
- Potassium compounds include, but are not limited to, potassium chloride, potassium chlorite, potassium chlorate, potassium sulfate, potassium hydrogen sulfate, potassium sulfite, potassium hydrogen sulfite, potassium nitrate, potassium carbonate, potassium hydrogen carbonate, potassium acetate, and potassium oxide. , potassium bromide, potassium bromate, potassium hydroxide, potassium silicate, potassium phosphate, potassium hydrogen phosphate, potassium sulfide, potassium hydrogen sulfide, potassium molybdate, potassium tungstate, and the like.
- the potassium compound includes isomers as in the case of the molybdenum compound.
- potassium carbonate potassium hydrogen carbonate
- potassium oxide potassium hydroxide
- potassium hydroxide potassium hydroxide
- potassium chloride potassium sulfate
- potassium molybdate it is preferable to use potassium carbonate and/or potassium molybdate.
- potassium molybdate contains molybdenum, it can also function as the above-mentioned molybdenum compound.
- sodium compound examples include, but are not limited to, sodium carbonate, sodium molybdate, sodium oxide, sodium sulfate, sodium hydroxide, sodium nitrate, sodium chloride, sodium metal, and the like. Among these, it is preferable to use sodium carbonate, sodium molybdate, sodium oxide, and sodium sulfate from the viewpoint of easy industrial availability and handling, and it is more preferable to use sodium carbonate and/or sodium molybdate. .
- sodium molybdate contains molybdenum, it can also function as the above-mentioned molybdenum compound.
- the molybdenum compound may be described twice as a molybdenum compound in terms of classification, but as an example, the molybdenum compound is at least one compound selected from the group consisting of molybdenum trioxide, potassium molybdate, and sodium molybdate.
- the molybdenum compound is at least one compound selected from the group consisting of molybdenum trioxide, potassium molybdate, and sodium molybdate.
- the sodium compound is sodium carbonate or sodium molybdate
- the potassium compound is potassium carbonate or potassium molybdate.
- a method for producing potassium sodium tantalate particles can be exemplified, which includes firing a tantalum compound in the presence of a molybdenum compound, a potassium compound, and a sodium compound.
- An example of a method for producing sodium tantalate particles preferably includes firing a tantalum compound in the presence of a molybdenum compound and a sodium compound.
- An example of a method for producing potassium tantalate particles preferably includes firing a tantalum compound in the presence of a molybdenum compound and a potassium compound.
- a potassium compound, a sodium compound, and a molybdenum compound are used as a fluxing agent.
- oxides Na 2 O and K 2 O
- tantalate crystal growth progresses.
- oxides (Na 2 O and K 2 O) and/or CO 2 are formed from some potassium carbonate and/or sodium carbonate. It is presumed that these oxides and/or CO 2 function as a flux to promote crystal growth of tantalate particles.
- tantalate particles (K x Na (1-x) TaO 3 ) are formed along with the formation of oxides (Na 2 O and K 2 O) and/or CO 2 that function as fluxes. it is conceivable that.
- the flux function of oxides (Na 2 O and K 2 O) and/or CO 2 promotes the formation of tantalate particles (K x Na (1-x) TaO 3 ) with large crystallite sizes. It is thought that there are.
- a molybdenum compound is used as a fluxing agent, by such baking, a tantalum compound, a molybdenum compound, a sodium compound or a potassium compound (a compound containing molybdenum and sodium, or a compound containing molybdenum and potassium) ), which react at high temperatures and function as fluxes (e.g., K a Mo b O c , Na a Mo b O c , K a Na a' Mo b O c ) is thought to form tantalate particles (K x Na (1-x) TaO 3 ). It is believed that some molybdenum compounds are incorporated into the tantalate particles when they are formed (crystal growth).
- molybdenum compounds contained in tantalate particles we will explain the formation and decomposition of Mo-O-Ta in the system during calcination, or the generation mechanism of molybdenum compounds contained in tantalate particles. It is believed that molybdenum compounds, such as molybdenum oxides, are formed during the crystal growth of the particles. Furthermore, considering the above mechanism, it is also possible that molybdenum oxide exists on the surface of the tantalate particles through Mo--O--Ta bonds. Inclusion of a molybdenum compound (for example, molybdenum oxide) in the tantalate particles leads to improvement in the physical properties of the tantalate particles, and for example, the catalytic performance of the tantalate particles can be improved.
- a molybdenum compound for example, molybdenum oxide
- the molybdate compound used as the above-mentioned flux does not vaporize even in the firing temperature range and can be easily recovered by cleaning after firing, which reduces the amount of molybdenum compound released outside the firing furnace and significantly reduces production costs. can be reduced to
- the total amount of the raw materials molybdenum compound, potassium compound, and sodium compound (hereinafter also referred to as fluxing agent) and the amount of tantalum compound used, which are considered to function as fluxing agents are considered to function as fluxing agents.
- 10 parts by mass or more of a fluxing agent is mixed with 100 parts by mass of the tantalum compound used as a raw material to form a mixture, and the mixture is fired. can. More preferably, 20 to 5,000 parts by mass of a fluxing agent are mixed with 100 parts by mass of the tantalum compound used to form a mixture, and the mixture is fired. More preferably, 100 to 1000 parts by mass of a fluxing agent is mixed with 100 parts by mass of the tantalum compound used to form a mixture, and the mixture is fired.
- the amount of fluxing agent used with respect to the tantalum compound as a raw material is equal to or more than the above lower limit.
- the amount of fluxing agent used with respect to the tantalum compound as a raw material By increasing the amount of fluxing agent used with respect to the tantalum compound as a raw material, the crystallite size of the tantalate particles to be produced can be easily controlled, and tantalate particles with improved crystallite size can be easily obtained.
- the above upper limit or less is preferable. If the amount of flux agent is large, large single crystals may be produced, which may reduce productivity. Therefore, select the amount of flux appropriately so that the particle size of the tantalate particles produced is the desired size. can do.
- the molar ratio (K+Na)/Ta of potassium atoms and sodium atoms to tantalum atoms in the mixture is 1.1 or more. , more preferably from 1.5 to 10, and even more preferably from 2.0 to 5.
- the molar ratio (K+Na)/Ta is within the above range, tantalate particles with improved crystallite size can be easily obtained.
- the excess (K+Na) in the mixture is considered to contribute to good crystal growth of tantalate as so-called self-flux.
- the K/Na ratio of the tantalate particles to be produced can be changed depending on the K/Na blending ratio of the raw materials.
- the molar ratio of potassium and/or sodium atoms to molybdenum atoms in the mixture depends on the desired values of X and 1-X of K x Na (1-x) TaO 3 in the tantalate particles produced. You may set it as appropriate.
- the X is 0 ⁇ X ⁇ 1
- the larger the value of K/Na the larger the particle size of the tantalate particles produced tends to be.
- the amount of molybdenum compound contained in the obtained tantalate particles becomes more appropriate, and tantalate particles with a controlled crystal shape can be easily obtained.
- the firing step is a step of firing the mixture.
- the tantalate particles according to the embodiment are obtained by firing the mixture.
- this manufacturing method is called the flux method.
- the flux method is classified as a solution method. More specifically, the flux method is a crystal growth method that utilizes the fact that a crystal-flux binary phase diagram shows a eutectic type.
- the mechanism of the flux method is presumed to be as follows. That is, when a mixture of solute and flux is heated, the solute and flux become a liquid phase. At this time, since the flux is a flux, in other words, the solute-flux binary phase diagram shows a eutectic type, so the solute melts at a temperature lower than its melting point and forms a liquid phase. becomes.
- the flux method has advantages such as being able to grow crystals at a temperature much lower than the melting point, being able to precisely control the crystal structure, and being able to form euhedral crystals.
- oxides (Na 2 O and K 2 O ) is formed, which functions as a flux and is presumed to promote the crystal growth of tantalate particles.
- oxides (Na 2 O and K 2 O) and/or CO 2 are formed from some potassium carbonate and/or sodium carbonate. It is presumed that these oxides and/or CO 2 function as a flux to promote crystal growth of tantalate particles.
- tantalate crystals can be grown at a temperature lower than the melting point of tantalate due to the flux function of molybdate.
- partially formed tantalum molybdate decomposes and promotes crystal growth of tantalate particles. That is, a molybdenum compound (molybdate) functions as a flux, and tantalate particles are produced via an intermediate called tantalum molybdate.
- the firing method is not particularly limited and can be performed by any known and commonly used method.
- a molybdenum compound when used, when the firing temperature exceeds 500°C, some tantalum compounds react with the molybdenum compound to form tantalum molybdate, etc., and the molybdenum compound produces molybdate (K a Mo b O c , Na a Mo b O c , K a Na a' Mo b O c ) are thought to be formed.
- the firing temperature reaches 800° C. or higher, it is thought that the partially formed tantalum molybdate and the like decomposes, and tantalate particles are formed due to the flux function of the molybdate.
- molybdenum compounds are considered to be incorporated into the tantalate particles during the decomposition of tantalum molybdate and the growth of particle crystals.
- the state of the tantalum compound, molybdenum compound, sodium compound, potassium compound, etc. that can be used during firing is not particularly limited, and the raw material compounds such as the molybdenum compound, tantalum compound, sodium compound, potassium compound, etc. can interact with each other. It suffices if it exists in the space of Specifically, it may be simple mixing of powdered raw material compounds, mechanical mixing using a grinder or the like, mixing using a mortar or the like, and mixing in a dry state or a wet state. It's okay.
- the firing temperature conditions are not particularly limited, and are appropriately determined in consideration of the target particle size of the tantalate particles, the formation of molybdenum compounds in the tantalate particles, the shape of the tantalate particles, and the like.
- the firing temperature may be 700°C or higher, which is close to the temperature at which the molybdate can function as a flux, may be 750°C or higher, 800°C or higher, or 850°C or higher. , 900°C or higher. From the viewpoint of efficiently producing tantalate particles with improved crystallite size, the firing temperature is preferably 800°C or higher, more preferably 900°C or higher, and even more preferably 1000°C or higher.
- tantalate particles can be formed efficiently at low cost even under conditions where the maximum firing temperature for firing a tantalum compound is 1500° C. or lower. Further, according to the method for producing tantalate particles of the embodiment, even when the firing temperature is 1300° C. or lower, which is much lower than the melting point of tantalum oxide, the precursor has an automorphic shape regardless of the shape of the precursor. Tantalate particles can be formed. Moreover, from the viewpoint of efficiently producing tantalate particles, the above-mentioned firing temperature is preferably 1200°C or lower, more preferably 1100°C or lower.
- the numerical range of the firing temperature for firing the tantalum compound may be, for example, 700 to 1300°C, 750 to 1300°C, 800 to 1200°C, and 850 to 1300°C.
- the temperature may be 1200°C to 1200°C, 900 to 1100°C, or 1000 to 1100°C.
- the temperature increase rate may be 20 to 600°C/h, 40 to 500°C/h, or 80 to 400°C/h.
- the heating time to a predetermined firing temperature be carried out in the range of 15 minutes to 10 hours, and the holding time at the firing temperature be carried out in the range of 5 minutes to 30 hours.
- the firing temperature is preferably held for 2 hours or more, and more preferably from 2 to 15 hours. Tantalate particles with improved crystallite size can be easily obtained by selecting the conditions of a calcination temperature of 700 to 1100° C. and a calcination temperature holding time of 2 to 15 hours.
- the firing atmosphere is not particularly limited as long as the effects of the present invention can be obtained, but for example, an oxygen-containing atmosphere such as air or oxygen, or an inert atmosphere such as nitrogen, argon, or carbon dioxide is preferable, and from a cost perspective. Taking this into consideration, an air atmosphere is more preferable.
- the device for firing is not necessarily limited, and a so-called firing furnace can be used.
- the firing furnace is preferably made of a material that does not react with sublimated molybdenum oxide, and it is also preferable to use a highly airtight firing furnace so that molybdenum oxide can be used efficiently.
- the method for producing tantalate particles may include a cooling step.
- the cooling step is a step of cooling the tantalate particles that have grown crystals in the firing step.
- the cooling rate is not particularly limited, but is preferably 1 to 1000°C/hour, more preferably 5 to 500°C/hour, and even more preferably 50 to 100°C/hour. It is preferable that the cooling rate is 1° C./hour or more because the manufacturing time can be shortened. On the other hand, it is preferable that the cooling rate is 1000° C./hour or less because the firing container is less likely to crack due to heat shock and can be used for a long time.
- the cooling method is not particularly limited, and may be natural cooling or a cooling device may be used.
- the manufacturing method of this embodiment may include a post-processing step.
- the post-treatment step may be a step of separating the tantalate particles and the flux agent contained in the fired product, and can be performed by taking out the fired product from the firing container.
- the post-treatment step can be performed after the above-mentioned firing step. Further, if necessary, the process may be repeated two or more times.
- Methods for removing the fluxing agent include washing, high temperature treatment, etc. These can be done in combination.
- the washing method is not particularly limited, but when the flux is water-soluble like the potassium compound, sodium compound, or molybdate compound mentioned above, washing with water may be used.
- examples of the high temperature treatment method include a method of raising the temperature to a temperature higher than the sublimation point or boiling point of the flux.
- the tantalate particles may aggregate and the particle size may not meet the preferred particle size range for the intended use. Therefore, the tantalate particles may be pulverized to satisfy a suitable particle size range, if necessary.
- the method for pulverizing the baked product is not particularly limited, and conventionally known pulverizing methods such as a ball mill, jaw crusher, jet mill, disk mill, spectro mill, grinder, mixer mill, etc. can be applied.
- the fired product containing tantalate particles obtained by the firing step may be appropriately classified in order to adjust the particle size range.
- Classification processing refers to an operation of dividing particles into groups according to their size. Classification may be performed either wet or dry, but from the viewpoint of productivity, dry classification is preferred. In addition to classification using a sieve, dry classification includes wind classification that uses the difference between centrifugal force and fluid drag, but from the perspective of classification accuracy, wind classification is preferable, and air classifiers that use the Coanda effect, This can be carried out using a classifier such as a swirling airflow classifier, a forced vortex centrifugal classifier, or a semi-free vortex centrifugal classifier.
- the above-described pulverization process and classification process can be performed at necessary stages. For example, the average particle size of the obtained tantalate particles can be adjusted by whether or not these pulverization and classification are performed and by selecting the conditions thereof.
- the tantalate particles of the embodiment or the tantalate particles obtained by the production method of the embodiment have less agglomeration or are not agglomerated, which are more likely to exhibit their original properties and are easier to handle. Moreover, when used after being dispersed in a medium to be dispersed, it is preferable from the viewpoint of more excellent dispersibility.
- tantalate particles of the above embodiment it is possible to easily produce tantalate particles with little or no agglomeration, so even if the above-mentioned crushing step and classification step are not performed, It has the excellent advantage that tantalate particles having the desired excellent properties can be produced with high productivity.
- the tantalate particles of embodiments can be blended with a resin to provide a resin composition.
- a resin composition containing the tantalate particles of the embodiment and a resin is provided.
- the resin is not particularly limited, and may be a polymer, an oligomer, or a monomer, a thermosetting resin or a thermoplastic resin, or an active energy ray-curable resin.
- thermosetting resins are resins that have the property of becoming substantially insoluble and infusible when cured by means such as heating, radiation, or catalysts.
- it may be a known and commonly used resin used for molding materials and the like.
- novolac-type phenolic resins such as phenol novolac resins and cresol novolac resins
- resol-type phenolic resins such as unmodified resol phenolic resins, oil-modified resol phenolic resins modified with tung oil, linseed oil, walnut oil, etc.
- Phenol resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, etc.; novolac epoxy resins such as fatty chain modified bisphenol epoxy resins, novolac epoxy resins, cresol novolac epoxy resins; biphenyl epoxy resins, Epoxy resins such as alkylene glycol type epoxy resins; resins with triazine rings such as urea resins and melamine resins; vinyl resins such as (meth)acrylic resins and vinyl ester resins: unsaturated polyester resins, bismaleimide resins, Examples include polyurethane resins, diallyl phthalate resins, silicone resins, resins having benzoxazine rings, cyanate ester resins, and they may be polymers, oligomers, or monomers.
- thermosetting resin described above may be used together with a curing agent.
- the curing agent used in this case can be used in a known and commonly used combination with a thermosetting resin.
- the thermosetting resin is an epoxy resin
- any compound commonly used as a curing agent can be used, such as amine compounds, amide compounds, acid anhydride compounds, phenol compounds, etc.
- the amine compound include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF 3 -amine complex, and guanidine derivatives.
- Examples of the amide compound include dicyandiamide, a polyamide resin synthesized from a dimer of linolenic acid, and ethylenediamine, and the like.
- acid anhydride compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydro.
- Examples include phthalic anhydride.
- phenolic compounds include polyhydric hydroxyl compounds such as phenol novolak resin, cresol novolac resin, aromatic hydrocarbon formaldehyde resin-modified phenol resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin (Zyrock resin), and resorcin novolak resin.
- polyhydric hydroxyl compounds such as phenol novolak resin, cresol novolac resin, aromatic hydrocarbon formaldehyde resin-modified phenol resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin (Zyrock resin), and resorcin novolak resin.
- thermosetting resin and the curing agent in the resin composition of the embodiment are not particularly limited, but for example, when the curable resin is an epoxy resin, the properties of the resulting cured product are good. Therefore, it is preferable to use an amount such that the amount of active groups in the curing agent is 0.7 to 1.5 equivalents per total equivalent of epoxy groups in the epoxy resin.
- a curing accelerator can be appropriately used in combination with the thermosetting resin in the resin composition of the embodiment.
- the curable resin is an epoxy resin
- various curing accelerators can be used, including phosphorus compounds, tertiary amines, imidazole, organic acid metal salts, Lewis acids, amine complex salts, etc. It will be done.
- thermosetting resin including known and commonly used thermal polymerization initiators and active energy ray polymerization initiators.
- thermoplastic resin examples include known and commonly used resins used in molding materials and the like. Specifically, for example, polyethylene resin, polypropylene resin, polymethyl methacrylate resin, polyvinyl acetate resin, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, polyvinyl chloride resin, polystyrene resin, polyacrylonitrile resin.
- thermoplastic polyimide resin thermoplastic urethane resin
- polyamino bismaleimide resin polyamideimide resin
- polyetherimide resin bismaleimide triazine resin
- polymethylpentene resin fluorinated resin
- liquid crystal polymer olefin-vinyl alcohol copolymer, ionomer resin, polyarylate resin, acrylonitrile-ethylene -styrene copolymer, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, etc.
- At least one type of thermoplastic resin can be selected and used, but depending on the purpose, it is also possible to use
- the resin When provided as a piezoelectric material, the resin preferably exhibits a high dielectric constant, and the resin is preferably a polymer having an electron-withdrawing group, such as polyvinylidene fluoride (PVDF), vinylidene fluoride-tetrafluoroethylene, etc.
- PVDF polyvinylidene fluoride
- vinylidene fluoride-tetrafluoroethylene etc.
- Copolymers fluorine-containing polymers such as vinylidene fluoride-trifluoroethylene copolymers, cyanoethylated polyvinyl alcohol, vinylidene cyanide-vinyl acetate copolymers, cyanoethylcellulose, cyanoethylhydroxysucrose, cyanoethylhydroxycellulose, cyanoethylhydroxypullulan , cyanoethyl methacrylate, cyanoethyl acrylate, cyanoethyl hydroxyethyl cellulose, cyanoethyl amylose, cyanoethyl hydroxypropyl cellulose, cyanoethyl dihydroxypropyl cellulose, cyanoethyl hydroxypropyl amylose, cyanoethyl polyacrylamide, cyanoethyl polyacrylate, cyanoethyl pullulan, cyanoethyl polyhydroxymethylene, cyano
- the resin composition of the embodiment may contain other compounds as necessary, and may contain an external lubricant, an internal lubricant, an antioxidant, a flame retardant, a light stabilizer, and ultraviolet rays to the extent that the effects of the invention can be obtained.
- An absorbent, a silane-based, titanate-based, or aluminate-based coupling agent, a reinforcing material such as glass fiber or carbon fiber, a filler, various coloring agents, etc. may be added.
- stress reducing agents such as silicone oil, liquid rubber, rubber powder, butadiene copolymer rubber such as methyl acrylate-butadiene-styrene copolymer, methyl methacrylate-butadiene-styrene copolymer, and silicone compounds (stress relaxation agents) can also be used.
- the resin composition of the embodiment can be obtained by mixing the tantalate particles of the embodiment, a resin, and, if necessary, other compounds.
- mixing method There is no particular limitation on the mixing method, and the mixing may be carried out by any known and commonly used method.
- the general method is to thoroughly mix the thermosetting resin, the tantalate particles of the embodiment, and other components as necessary using a mixer, etc., and then mix the three Knead with a roll or the like to form a fluid liquid composition, or mix a predetermined amount of thermosetting resin, the tantalate particles of the embodiment, and other components as necessary with a mixer or the like. After that, the mixture is melt-kneaded using a mixing roll, an extruder, etc., and then cooled to obtain a solid composition. Regarding the mixing state, when a curing agent, a catalyst, etc. are blended, it is preferable that the curable resin and those compounds are sufficiently uniformly mixed, and the tantalate particles of the embodiment are also uniformly dispersed and mixed. It is more preferable.
- thermoplastic resin When the resin is a thermoplastic resin, a common method is to mix the thermoplastic resin, the tantalate particles of the embodiment, and other ingredients as necessary using various mixers such as a tumbler or a Henschel mixer. Examples include a method of premixing and then melt-kneading with a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, a kneader, and a mixing roll. Note that the melt-kneading temperature is not particularly limited, but may be in the range of 240 to 320°C.
- the mixing ratio of the tantalate particles of the embodiment and the nonvolatile content of the resin is not particularly limited, but per 100 parts by mass of the nonvolatile content of the resin, For example, it may range from 0.1 to 1800 parts of tantalate particles, and it may range from 10 to 900 parts.
- the content ratio of the tantalate particles to the total mass (100% by mass) of the resin composition of the embodiment may be 30% by mass or more, 50 to 90% by mass, and 60 to 85% by mass. It may be %.
- a molded article can be obtained by molding the resin composition of the embodiment.
- a molded article formed by molding the resin composition of the embodiment is provided.
- the resin molded article can be obtained by any known and commonly used method.
- thermosetting resin compositions such as epoxy resin compositions
- a resin composition in which the resin is an epoxy resin can be cured by heat, and the heating temperature conditions at that time may be selected as appropriate depending on the type of curing agent to be combined and the intended use. It may be heated within a temperature range of approximately °C.
- active energy ray-curable resins they can be cured and molded by irradiation with active energy rays such as ultraviolet rays and infrared rays.
- the resin of the embodiment is a thermoplastic resin
- it can be made into a molded article by a known and commonly used molding method.
- injection molding method, ultra-high speed injection molding method, injection compression molding method, two-color molding method, blow molding method such as gas assist, molding method using insulation mold, molding method using rapid heating mold, foaming Examples include molding (including supercritical fluid), insert molding, IMC (in-mold coating molding), extrusion molding, sheet molding, rotary molding, lamination molding, press molding, and the like.
- a molding method using a hot runner method can also be used. There are no restrictions on the shape, pattern, color, size, etc. of the molded product, and they may be set arbitrarily depending on the purpose of the molded product.
- the molded article of the resin composition When the molded article of the resin composition is in the form of a sheet or layer, its thickness may be from 10 to 100 ⁇ m, or from 10 to 80 ⁇ m.
- the resin composition of the embodiment and its molded article can be provided and used as a piezoelectric body by appropriately performing polarization treatment.
- the sample powder was subjected to XRF analysis to determine the tantalum content in the sample powder, and the tantalum content was calculated as the content (mass%) in terms of Ta 2 O 5 based on 100 mass% of the total mass of the sample powder.
- the sample powder was subjected to XRF analysis to determine the molybdenum content in the sample powder, and the molybdenum content was calculated as the content (mass %) in terms of MoO 3 based on the total mass 100 mass % of the sample powder.
- the sample powder was subjected to XRF analysis to determine the potassium content in the sample powder, and calculated as a content rate (mass%) in terms of K 2 O with respect to 100 mass% of the total mass of the sample powder.
- the sample powder was subjected to XRF analysis to determine the sodium content in the sample powder, and calculated as the content (mass%) in terms of Na 2 O with respect to the total mass of the sample powder (100% by mass).
- Measurements were performed using SmartLab (manufactured by Rigaku Co., Ltd.) as an X-ray diffractometer, a high-intensity, high-resolution crystal analyzer (CALSA) as a detector, and PDXL as analysis software.
- the average crystallite size was calculated from the half-width of the peak appearing at ° using the Scherrer equation.
- the measurement conditions were: scan speed was 0.05 degrees/min, scan range was 20 to 70 degrees, step was 0.002 degrees, and device standard width was 0.028 degrees (Si). .
- the particle size distribution of the sample powder was measured in a dry manner using a laser diffraction type dry particle size distribution meter (HELOS (H3355) & RODOS manufactured by Nippon Laser Co., Ltd.) under conditions of a dispersion pressure of 3 bar and a suction pressure of 90 mbar.
- the particle diameter at the point where the volume integration % distribution curve intersects the 50% horizontal axis was determined as D50 .
- the particle diameter at the point where the volume integration % distribution curve intersects the horizontal axis of 10% from the small particle side was determined as D10 .
- the particle diameter at the point where the volume integration % distribution curve intersects the 90% horizontal axis from the small particle side was determined as D90 .
- the specific surface area of the sample powder is measured using a specific surface area meter (BELSORP-mini, manufactured by Microtrac Bell Co., Ltd.), and the surface area per 1 g of the sample measured from the amount of nitrogen gas adsorbed by the BET method is calculated as the specific surface area ( m 2 /g).
- Tantalum oxide (Kanto Kagaku Co., Ltd. reagent, Ta 2 O 5 ) 10.0 g, molybdenum oxide (Kanto Kagaku Co., Ltd. reagent, MoO 3 ) 6.8 g, and sodium carbonate (Kanto Kagaku Co., Ltd. reagent, Na 2 CO 3 ) 11.5 g were mixed in a mortar to obtain a mixture.
- the obtained mixture was placed in a crucible and fired in a ceramic electric furnace at 1000° C. for 10 hours. After cooling, the crucible was taken out from the ceramic electric furnace. Subsequently, the obtained fired product was ultrasonically cleaned with water five times, and then washed with water to remove the cleaning water by filtration, and dried to remove the remaining fluxing agent and prepare powder 9 of Example 1. .1g was obtained.
- Example 2 to 12 Powders of Examples 2 to 12 were obtained in the same manner as in Example 1, except that the composition of the raw material compounds and the firing temperature were changed as shown in Table 1.
- K 2 CO 3 potassium carbonate (reagent manufactured by Kanto Kagaku Co., Ltd., K 2 CO 3 ) was used.
- Table 2 shows the shape and size of the particles of each example as determined from the SEM image. When particles of different shapes are found to be mixed, the representative shape (the shape most often observed) is noted. Aggregates of cubic particles are also included in those having a cubic shape.
- each of the powders obtained in Examples 1 to 12 has a cubic shape and consists of K x Na (1-x) TaO 3 particles having a perovskite structure (Pe structure). It was confirmed that
- Examples 1 to 12 were shown to contain tantalum, molybdenum, potassium, and sodium in the oxide equivalent amounts shown in Table 2 determined by XRF analysis.
- the particles of Examples 1 to 12 had large primary particle sizes and large crystallite sizes. This is because most of the raw material compounds MoO 3 , Na 2 Co 3 , and K 2 CO 3 (including their products and decomposition products) used in the production method of each example functioned as a fluxing agent. This is thought to be due to the fact that the crystal growth of the particles was able to progress well.
- each particle of Examples 1 to 12 had a BET specific surface area shown in Table 2.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Abstract
L'invention concerne des particules de sel d'acide tantalitique comprenant une structure cristalline d'un sel d'acide tantalitique représenté par KxNa(1-x)TaO3 (où 0 ≤ x ≤ 1), la structure cristalline ayant une taille de cristallite moyenne supérieure ou égale à 80 nm, la taille de cristallite moyenne étant déterminée à partir d'un pic à 2θ = 23,0 ± 1,0° du sel d'acide tantalitique obtenu par diffractométrie de rayons X.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022-070230 | 2022-04-21 | ||
JP2022070230 | 2022-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023204235A1 true WO2023204235A1 (fr) | 2023-10-26 |
Family
ID=88419892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2023/015559 WO2023204235A1 (fr) | 2022-04-21 | 2023-04-19 | Particules de sel d'acide tantalitique, méthode de production de particules de sel d'acide tantalitique, composition de résine et objet moulé |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW202342632A (fr) |
WO (1) | WO2023204235A1 (fr) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0812333A (ja) * | 1994-06-29 | 1996-01-16 | Hc Starck Gmbh & Co Kg | 水和タンタルおよび/またはニオブ酸化物の製造および得られるタンタル酸塩およびニオブ酸塩 |
JP2007076926A (ja) * | 2005-09-09 | 2007-03-29 | National Institute Of Advanced Industrial & Technology | タンタル酸カリウム微結晶及び薄膜の製造方法 |
WO2010005101A1 (fr) * | 2008-07-11 | 2010-01-14 | 独立行政法人物質・材料研究機構 | Nanofeuille luminescente, dispositif fluorescent, cellule solaire et écran couleur utilisant celle-ci, et revêtement de nanofeuille |
JP2016524534A (ja) * | 2013-06-17 | 2016-08-18 | ヒンドゥスタン・ペトロリアム・コーポレーション・リミテッド | 二酸化炭素の光触媒還元のための共触媒組成物を有するnatao3:la2o3触媒 |
JP2018030115A (ja) * | 2016-08-26 | 2018-03-01 | 国立大学法人信州大学 | ストロンチウム吸着材及びその製造方法 |
JP2019130454A (ja) * | 2018-01-30 | 2019-08-08 | 国立大学法人信州大学 | ストロンチウム吸着材及びその製造方法 |
JP2020092228A (ja) * | 2018-12-07 | 2020-06-11 | 住友化学株式会社 | 圧電積層体、圧電素子および圧電積層体の製造方法 |
WO2021187412A1 (fr) * | 2020-03-19 | 2021-09-23 | 株式会社ニコン | Méthode de production de particules de tantalate de potassium, méthode de production de film, particules de tantalate de potassium, film, film antireflet, élément optique et appareil optique |
-
2023
- 2023-04-18 TW TW112114456A patent/TW202342632A/zh unknown
- 2023-04-19 WO PCT/JP2023/015559 patent/WO2023204235A1/fr unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0812333A (ja) * | 1994-06-29 | 1996-01-16 | Hc Starck Gmbh & Co Kg | 水和タンタルおよび/またはニオブ酸化物の製造および得られるタンタル酸塩およびニオブ酸塩 |
JP2007076926A (ja) * | 2005-09-09 | 2007-03-29 | National Institute Of Advanced Industrial & Technology | タンタル酸カリウム微結晶及び薄膜の製造方法 |
WO2010005101A1 (fr) * | 2008-07-11 | 2010-01-14 | 独立行政法人物質・材料研究機構 | Nanofeuille luminescente, dispositif fluorescent, cellule solaire et écran couleur utilisant celle-ci, et revêtement de nanofeuille |
JP2016524534A (ja) * | 2013-06-17 | 2016-08-18 | ヒンドゥスタン・ペトロリアム・コーポレーション・リミテッド | 二酸化炭素の光触媒還元のための共触媒組成物を有するnatao3:la2o3触媒 |
JP2018030115A (ja) * | 2016-08-26 | 2018-03-01 | 国立大学法人信州大学 | ストロンチウム吸着材及びその製造方法 |
JP2019130454A (ja) * | 2018-01-30 | 2019-08-08 | 国立大学法人信州大学 | ストロンチウム吸着材及びその製造方法 |
JP2020092228A (ja) * | 2018-12-07 | 2020-06-11 | 住友化学株式会社 | 圧電積層体、圧電素子および圧電積層体の製造方法 |
WO2021187412A1 (fr) * | 2020-03-19 | 2021-09-23 | 株式会社ニコン | Méthode de production de particules de tantalate de potassium, méthode de production de film, particules de tantalate de potassium, film, film antireflet, élément optique et appareil optique |
Also Published As
Publication number | Publication date |
---|---|
TW202342632A (zh) | 2023-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018112810A1 (fr) | MÉTHODE DE PRODUCTION DE PARTICULES D'α-ALUMINE ET MÉTHODE DE PRODUCTION D'UNE COMPOSITION DE RÉSINE | |
JP5995130B1 (ja) | スピネル粒子およびその製造方法、並びに前記スピネル粒子を含む組成物および成形物 | |
CN109415220B (zh) | 尖晶石颗粒及其制造方法、及包含前述尖晶石颗粒的组合物和成形物 | |
JPWO2017104853A1 (ja) | 複合タングステン酸化物超微粒子およびその分散液 | |
TWI755366B (zh) | 負熱膨脹材及含有其的複合材料與糊料 | |
JP6965562B2 (ja) | スピネル粒子の製造方法、スピネル粒子、並びに前記スピネル粒子を含む樹脂組成物および成形物 | |
JP6468457B2 (ja) | 酸化チタン粒子およびその製造方法 | |
WO2020145343A1 (fr) | Particules de spinelle en forme de plaque et leur méthode de production | |
WO2018207679A1 (fr) | Particules d'oxyde composite de type spinelle et leur méthode de production, composition de résine contenant des particules d'oxyde composite de type spinelle, et article moulé | |
JP7459801B2 (ja) | 板状アルミナ粒子、板状アルミナ粒子の製造方法、及び樹脂組成物 | |
WO2023204235A1 (fr) | Particules de sel d'acide tantalitique, méthode de production de particules de sel d'acide tantalitique, composition de résine et objet moulé | |
WO2023204242A1 (fr) | Particules de niobate, méthode de production de particules de niobate, composition de résine et corps moulé | |
CN114555719A (zh) | 复合颗粒和复合颗粒的制造方法 | |
WO2023234160A1 (fr) | Spinelle d'oxyde de chrome et de cuivre, composition de résine de celui-ci, article moulé en résine et méthode de production de spinelle d'oxyde de chrome et de cuivre | |
JP7392869B2 (ja) | 酸化亜鉛粒子、酸化亜鉛粒子の製造方法及び樹脂組成物 | |
US20230082688A1 (en) | Alumina particles, resin composition, molded body, and method for producing alumina particles | |
WO2020145342A1 (fr) | Particules de spinelle, leur procédé de production, composition de résine, article moulé, composition, feuille crue, article cuit et substrat vitrocéramique | |
JP7458576B2 (ja) | 酸化タンタル粒子、及び酸化タンタル粒子の製造方法 | |
JP6836730B2 (ja) | スピネル粒子の製造方法、樹脂組成物の製造方法および成形物の製造方法 | |
JP7468790B2 (ja) | 複合粒子及び該複合粒子の製造方法 | |
JPWO2020145341A1 (ja) | 樹脂組成物、成形物、組成物、グリーンシート、焼成物及びガラスセラミックス基板 | |
JP2024072854A (ja) | 複合粒子の製造方法 | |
TW202229174A (zh) | 氧化鋯粒子及氧化鋯粒子的製造方法 | |
TW202222699A (zh) | 氧化鈮粒子及氧化鈮粒子的製造方法 | |
JP2022171034A (ja) | 複合粒子及び該複合粒子の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 23791883 Country of ref document: EP Kind code of ref document: A1 |