WO2023124804A1 - 一种电路板组件及电子设备 - Google Patents

一种电路板组件及电子设备 Download PDF

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Publication number
WO2023124804A1
WO2023124804A1 PCT/CN2022/136576 CN2022136576W WO2023124804A1 WO 2023124804 A1 WO2023124804 A1 WO 2023124804A1 CN 2022136576 W CN2022136576 W CN 2022136576W WO 2023124804 A1 WO2023124804 A1 WO 2023124804A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
pad
pads
reinforcing plate
hole
Prior art date
Application number
PCT/CN2022/136576
Other languages
English (en)
French (fr)
Inventor
张瞳
江帆
唐河雨佳
周海生
魏丹
李科林
李激光
王昊
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023124804A1 publication Critical patent/WO2023124804A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a circuit board assembly and electronic equipment.
  • PCB printed circuit board
  • FPC flexible printed circuit
  • the FPC on board (FOB) technology can realize the electrical connection between the two by soldering the corresponding pads of the FPC and PCB together.
  • FPC on board (FOB) technology can realize the electrical connection between the two by soldering the corresponding pads of the FPC and PCB together.
  • commonly used interconnection technologies between soft and hard boards may include: board-to-board (board to board, BTB) connector scheme, anisotropic conductive film (anisotropic conductive film, ACF) process and hot-press melting soldering process (hotbar ).
  • BTB board-to-board
  • anisotropic conductive film anisotropic conductive film
  • hotbar hot-press melting soldering
  • the present application provides a circuit board assembly and electronic equipment, so as to improve the reliability of the connection between the circuit boards in the circuit board assembly.
  • the present application provides a circuit board assembly, which includes a first circuit board and a second circuit board.
  • the first circuit board is a flexible circuit board.
  • a reinforcement board and a first welding pad are arranged on the first surface of the first circuit board.
  • the reinforcement board is provided with a first through hole, at least one first welding pad is located in the first through hole, and the hardness of the reinforcement board is greater than that of the first circuit board.
  • a second pad is provided on the second circuit board, and at least one first pad is soldered to the second pad, so as to realize the electrical connection between the first circuit board and the second circuit board.
  • the circuit board assembly By adopting the circuit board assembly, by arranging a reinforcing plate with relatively high hardness in the area of the first circuit board corresponding to the first welding pad, the structural strength and flatness of the area of the first circuit board provided with the reinforcing plate can be improved . Therefore, it is beneficial to improve the reliability of welding between the first pad and the second pad, so as to improve the reliability of the connection between the first circuit board and the second circuit board.
  • the structural strength and flatness of the first circuit board are improved by arranging a stiffening plate with higher hardness on the first circuit board, so that the first circuit board and other components can pass through the same road The process is welded to the second circuit board, which is beneficial to reduce the processing process of the circuit board assembly, so as to improve the processing efficiency and reduce the processing cost.
  • the distance between the first circuit board and other components can be kept small, which is beneficial to realize the miniaturization design of the circuit board assembly.
  • the material of the reinforcing plate is not limited, and it can be exemplified by glass fiber, polyimide, or stainless steel. In this way, the structural strength and flatness of the area of the first circuit board where the reinforcing plate is provided can be effectively improved.
  • the surface of the first circuit board may include a first surface and a second surface opposite to each other.
  • at least two first pads may be provided on the first surface, and at least two first pads may also be provided on the second surface.
  • the at least two first pads on the first surface are arranged in one-to-one correspondence with the at least two first pads on the second surface, and the correspondingly arranged first pads on the first surface and first pads on the second surface are connected through the second through hole.
  • the first surface may be the surface of the first circuit board facing the second circuit board, so that during the soldering process of the first pad and the second pad on the first surface, the The solder between the two overflows from the first surface to the first pad on the second surface through the second through hole, so that the amount of solder overflowing to other surrounding pads can be reduced to reduce the risk of short circuit between pads .
  • first pads on the first surface can be located in the first through hole of the reinforcing plate, so as to facilitate the welding between the first pads and the corresponding second pads .
  • the reinforcing plate may be provided with at least two first through holes, and each first pad may be located in a first through hole in a one-to-one correspondence, so that the first pad and the second pad During the soldering process, the first through hole can block the overflow of the solder, so as to effectively avoid the short circuit between the pads.
  • the reinforcing plate can be provided with at least one first through hole, at this time, at least two first pads can be located in one first through hole, that is, at least two first through holes can be accommodated in each first through hole.
  • the preparation process of the reinforcement board can be simplified by adopting this solution, and the structural strength of the reinforcement board can be improved.
  • the reinforcement board can be made to abut against the second circuit board, which can further improve the first pass through of the reinforcement board. Barrier effect of the hole on the solder.
  • the reinforcing plate can also support the first circuit board, thereby improving the structural strength of the first circuit board.
  • the first surface may be a surface of the first circuit board facing away from the second circuit board.
  • at least two first pads on the first surface may be located in the first through hole of the stiffener.
  • the first through hole can also block the overflow of solder, so as to reduce the risk of short circuit between pads.
  • the first pad located in the first through hole can be soldered to the second pad through the solder passing through the second through hole.
  • the circuit board assembly may further include a spacer, and the spacer may be located between the first circuit board and the second circuit board. And the pads can be respectively abutted against the first circuit board and the second circuit board, thereby avoiding the short circuit of the adjacent pads caused by the overflow of solder between the correspondingly soldered first pads and the second pads .
  • the first surface When the first surface is set away from the second circuit board, the first surface can be provided with at least two first pads, and the number of first through holes of the reinforcing plate can also be set at least two, so that each first pad
  • the pads can be located in a first through hole in a one-to-one correspondence, so as to effectively avoid short circuits between the pads.
  • the reinforcing plate can be provided with at least one first through hole, at this time, at least two first pads can be located in one first through hole, that is, at least two first through holes can be accommodated in each first through hole.
  • the preparation process of the reinforcement board can be simplified by adopting this solution, and the structural strength of the reinforcement board can be improved.
  • the height of the reinforcing plate above the surface of the first circuit board can be greater than or equal to the first height, and the first height is that the first soldering pad disposed on the same surface as the first circuit board is higher than the first circuit board.
  • the first circuit board may include a first surface and a second surface opposite to each other, and the first surface is the first surface of the first circuit board. The surface facing the second circuit arrangement.
  • the first pad is provided on the first surface, and the first pad is not provided on the second surface.
  • the reinforcing plate can be arranged on the first surface, and at least one first solder pad on the first surface can be located in the first through hole of the reinforcing plate, so as to realize the connection between the first solder pad and the corresponding second solder pad. Welding between.
  • each first soldering pad may be located in a first through hole in a one-to-one correspondence.
  • the reinforcing plate can be provided with at least one first through hole, at this time, at least two first pads can be located in one first through hole, that is, at least two first through holes can be accommodated in each first through hole.
  • the preparation process of the reinforcement board can be simplified by adopting this solution, and the structural strength of the reinforcement board can be improved.
  • the reinforcement board can abut against the second circuit board, thereby further improving the barrier effect of the first through hole of the reinforcement board on solder.
  • the reinforcing plate can also support the first circuit board, thereby improving the structural strength of the first circuit board.
  • the present application also provides a circuit board assembly, which includes a first circuit board, a second circuit board and a spacer.
  • the first circuit board is a flexible circuit board
  • the first surface of the first circuit board is provided with a first pad
  • the second surface of the first circuit board is provided with a reinforcing plate
  • the first surface and the second The surfaces are opposite to each other, and the hardness of the reinforcement board is greater than that of the first circuit board.
  • the first pad is provided on the first surface of the first circuit board, and the first pad is not provided on the second surface.
  • the reinforcing plate can be a continuous plate structure, which can effectively improve the structural strength and flatness of the area of the first circuit board where the reinforcing plate is disposed. Since the reinforcement plate is arranged on the first circuit board in the area corresponding to the pad, the circuit board assembly can help improve the reliability of welding between the first pad and the second pad, so as to improve the connection between the first circuit board and the second pad. Second, the reliability of the circuit board connection.
  • the spacer can be located between the first circuit board and the second circuit board, and the spacer can be respectively abutted against the first circuit board and the second circuit board, thereby avoiding the corresponding soldering of the first pad and the second pad.
  • the overflow of solder between the pads results in a short circuit of adjacent pads.
  • the gasket can be arranged on the first circuit board or on the second circuit board.
  • the spacer is disposed on the second circuit board, and the spacer and the second welding pad are disposed on the same surface of the second circuit board.
  • the height of the spacer above the surface of the second circuit board is greater than the height of the second welding pad above the surface of the second circuit board, so that the spacer can abut against the first surface of the first circuit board.
  • the distance between the correspondingly welded first pad and the second pad can be increased, so that during the soldering process of the first circuit board and the second circuit board, The amount of overflow of the solder between the first pad and the second pad to the direction of other pads is reduced, thereby effectively avoiding short circuits between adjacent pads.
  • the spacer When the spacer is specifically arranged, it may be but not limited to a ring structure, and at least one second pad in the second welding area of the second circuit board may be disposed in the closed area formed by the spacer.
  • the spacer can be multi-segment, and the multi-segment spacer is arranged at the gap between adjacent second pads, or at each corner of the second welding area. It is sufficient as long as the spacer can serve the purpose of increasing the distance between the correspondingly welded first pad and the second pad.
  • the spacer may also be disposed on the first circuit board. Since the first surface of the first circuit board is opposite to the second circuit board, the gasket can be arranged on the first surface of the first circuit board. In addition, the height of the spacer above the first surface is greater than the height of the first pad above the first surface, and the spacer abuts against the second circuit board.
  • the material of the reinforcing plate is not limited, and it can be exemplified by glass fiber, polyimide or stainless steel, etc., which can effectively improve the strength of the first circuit board. Structural strength and flatness of areas where stiffeners are provided.
  • the present application also provides a welding method for the circuit board assembly provided in the first aspect and/or the second aspect, the welding method may include:
  • the reinforcing plate can improve the structural strength and flatness of the first welding area of the first circuit board. With some improvement, it can press the corresponding first pad to the second pad, thereby improving the reliability of welding of the two pads.
  • the first circuit board can be used as a component and welded to the second circuit board through the same process as other components, which is beneficial to reduce the processing process of circuit board components and improve processing efficiency , thereby reducing processing costs.
  • the distance between the first circuit board and other components can be kept small, which is beneficial to realize the miniaturization design of the circuit board assembly.
  • the aforementioned soldering of the correspondingly arranged first pads and second pads may specifically include: soldering the correspondingly arranged first pads and second pads by reflow soldering .
  • soldering the correspondingly arranged first pads and second pads by reflow soldering .
  • the soldering method may further include: placing solder on the second pad of the second circuit board.
  • the solder can be, but not limited to, solder paste.
  • the placement of the solder can be realized by, but not limited to, screen printing or tin spraying technology.
  • the present application provides an electronic device, which includes the circuit board assembly of the first aspect.
  • the electronic equipment provided by the present application since the volume of the circuit board assembly can be small, the space occupied by the circuit board assembly in the electronic equipment is small. In this way, it is beneficial to realize the miniaturization design of the electronic equipment. In addition, space can be reserved for setting other functional modules in the electronic device, so as to facilitate the realization of the diversification of functions of the electronic device.
  • Figure 1a is a schematic structural diagram of a circuit board assembly connected by a BTB connector provided by an embodiment of the present application;
  • Figure 1b is a schematic structural diagram of a circuit board assembly connected by an ACF process provided by an embodiment of the present application
  • Figure 1c is a schematic structural diagram of a circuit board assembly connected by a hot-press soldering process provided by an embodiment of the present application;
  • FIG. 2 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 3a is a schematic structural diagram of the first surface of the first circuit board provided by an embodiment of the present application.
  • Fig. 3b is a schematic structural diagram of the second surface of the first circuit board provided by an embodiment of the present application.
  • Fig. 4 is the sectional view of A-A place in Fig. 3 b;
  • Fig. 5 is the B direction view of the partial structure of the first circuit board shown in Fig. 4;
  • FIG. 6 is a schematic structural diagram of a second circuit board provided by an embodiment of the present application.
  • Fig. 7a to Fig. 7c are the welding process flow charts of the first circuit board and the second circuit board provided by an embodiment of the present application;
  • FIG. 8 is a cross-sectional view of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a circuit board assembly provided by another embodiment of the present application.
  • Figure 10 is a cross-sectional view at the C-C place in Figure 9;
  • FIG. 11 is a schematic structural diagram of a circuit board assembly provided by another embodiment of the present application.
  • FIG. 12 is a schematic structural view of a first circuit board of the circuit board assembly shown in FIG. 11;
  • Figure 13 is a sectional view at the D-D place in Figure 12;
  • Figure 14 is a cross-sectional view at the E-E place in Figure 11;
  • FIG. 15 is a schematic structural diagram of a circuit board assembly provided by another embodiment of the present application.
  • FIG. 16 is a schematic structural diagram of a first circuit board of the circuit board assembly shown in FIG. 15;
  • Fig. 17 is a sectional view at the F-F place in Fig. 16;
  • Figure 18 is a cross-sectional view at G-G in Figure 15;
  • FIG. 19 is a schematic structural diagram of a second circuit board provided by another embodiment of the present application.
  • Figure 20 is a sectional view at the H-H place in Figure 19;
  • Fig. 21 is a cross-sectional view of a partial structure of a circuit board assembly provided by another embodiment of the present application.
  • 1101-printed circuit board 11011-first pad; 1102-flexible circuit board; 11021-second pad;
  • the circuit board assembly can be applied to various electronic devices, for example, but not limited to, it can be applied to mobile phones, tablet computers (pad), portable game consoles, palmtop computers (personal digital assistant, PDA), notebook computers, super mobile Digital display products such as personal computer (ultramobile personal computer, UMPC), handheld computer, netbook, vehicle-mounted media player, wearable electronic device, virtual reality (virtual reality, VR) terminal equipment, augmented reality (augmented reality, AR) terminal equipment, etc.
  • VR virtual reality
  • AR augmented reality
  • the circuit board assembly may generally include at least two circuit boards, and the at least two circuit boards may be electrically connected in a direct or indirect manner, so that the function of a single circuit board is expanded.
  • the at least two circuit boards can be printed circuit boards or flexible circuit boards.
  • at least one circuit board in the circuit board assembly can be a printed circuit board, and at least one circuit board The board is a flexible circuit board.
  • the printed circuit board 1101 is provided with a first BTB connector 1103 which can be electrically connected to a pad (not shown in FIG. 1 a ) on the printed circuit board 1101 .
  • the flexible circuit board 1102 is provided with a second BTB connector 1104 that can be electrically connected to pads (not shown in FIG. 1 a ) on the flexible circuit board 1102 .
  • the first BTB connector 1103 and the second BTB connector 1104 can be mechanically snapped together to electrically connect the two BTB connectors, thereby realizing the electrical connection between the printed circuit board 1101 and the flexible circuit board 1102 .
  • the size of the BTB connector is generally large, it is limited by the size of the BTB connector, which is not conducive to realizing the miniaturization design of the circuit board assembly.
  • FIG. 1 b shows a schematic diagram of the connection between the printed circuit board 1101 and the flexible circuit board 1102 using the ACF process.
  • an anisotropic conductive adhesive film 1105 can be provided between the first pad 11011 of the printed circuit board 1101 and the second pad 11021 of the flexible circuit board 1102, and then the anisotropic conductive adhesive film can be formed by hot pressing.
  • the film 1105 is electrically connected to the two circuit boards respectively, so as to realize the conduction between the two circuit boards.
  • FIG. 1c shows a schematic diagram of soldering between the printed circuit board 1101 and the flexible circuit board 1102 using a hot-press soldering soldering process.
  • the solder 1106 can be arranged between the first pad 11011 of the printed circuit board 1101 and the second pad 11021 of the flexible circuit board 1102, and then the solder 1106 is heated by a pulse thermal head 1107 to achieve corresponding conduction between the pads.
  • the circuit board assembly provided by the present application aims to solve the above-mentioned problems, so that while realizing the miniaturization design of the circuit board assembly, the connection between the circuit boards of the circuit board assembly can also be processed by an existing separate station to be optimized Other components are processed through the same process, so as to achieve the purpose of simplifying the processing process, improving processing efficiency and reducing processing costs.
  • the application will be further described in detail below in conjunction with the accompanying drawings.
  • FIG. 2 is a schematic structural diagram of a circuit board assembly provided in a possible embodiment of the present application.
  • the circuit board assembly provided by the present application may include at least two circuit boards, and may include a first circuit board 1 and a second circuit board 2 in an exemplary embodiment.
  • the first circuit board 1 is a flexible circuit board, and the first circuit board 1 and the second circuit board 2 are electrically connected.
  • the first circuit board 1 may include two surfaces disposed opposite to each other.
  • FIG. 3 a shows a schematic structural view of the surface 1 a of the first circuit board 1 .
  • the surface 1a can be the surface of the first circuit board 1 facing the second circuit board 2 as shown in FIG. This surface 1a can therefore be referred to as the welding surface.
  • the first circuit board 1 has a first soldering area 101 , and the first soldering area 101 is an area of the first circuit board 1 for soldering with the second circuit board 2 . It can be understood that the dotted frame in FIG. 1a is only an exemplary representation of the arrangement of the first soldering area 101.
  • the first soldering area 101 may be, but not limited to, located at the end of the first circuit board 1, so that In order to realize the welding of the first circuit board 1 and the second circuit board 2.
  • the first circuit board 1 may be provided with only one first welding area 101 , or may be provided with multiple first welding areas 101 , which can be set according to the specific connection conditions of the first circuit board 1 .
  • At least two first pads 102 a are provided on the surface 1 a of the first circuit board 1 , and the at least two first pads 102 a are located in the first welding area 101 .
  • the specific arrangement form of the at least two first pads 102a is not limited, and it can be exemplarily a ball grid array package (ball grid array package, BGA) pad, of course, it can also be any other Form to set the pad.
  • FIG. 3 b shows a schematic structural view of the surface 1 b of the first circuit board 1 .
  • the surface 1b of the first circuit board 1 may also be provided with at least two first pads 102b, and the at least two first pads 102b on the surface 1b are also located in the first soldering area 101 .
  • the at least two first pads 102b on the surface 1b and the at least two first pads 102a on the surface 1a can be set in one-to-one correspondence, that is, each first pad 102b is set corresponding to one first pad 102a .
  • the first circuit board 1 may also be provided with a reinforcing plate 103 , and the reinforcing plate 103 may be provided on the first soldering area 101 of the first circuit board 1 .
  • the hardness of the material of the reinforcing plate 103 is greater than that of the material of the first circuit board 1 , so that the structural strength of the first soldering area 101 of the first circuit board 1 can be improved by setting the reinforcing plate 103 .
  • the material of the reinforcing plate 103 is not specifically limited, and it can be exemplified by glass fiber, polyimide, or stainless steel.
  • FIG. 4 shows a cross-sectional view at A-A in FIG. 3b.
  • the surface 1 a can be used as the second surface of the first circuit board 1
  • the surface 1 b can be used as the first surface of the first circuit board.
  • the reinforcing plate 103 can be disposed on the surface 1 b of the first circuit board 1 , and each first pad 102 b also disposed on the surface 1 b of the first circuit board 1 can fall within the outline of the reinforcing plate 103 .
  • the reinforcing board 103 may be provided with a first through hole 1031 , and the first pad 102 b disposed on the surface 1 b may be located in the first through hole 1031 .
  • FIG. 5 is a B-direction view of the partial structure of the first circuit board 1 shown in FIG. 4 .
  • the reinforcing plate 103 may be provided with at least two first through holes 1031 , so that each first pad 102 b is located in one of the first through holes 1031 correspondingly.
  • At least one first through hole 1031 may be provided on the reinforcing plate 103, so that each first pad 102b can be located in one first through hole 1031, and at this time, each first pad 102b At least one first pad 102b may be disposed in a through hole 1031 , for example, two first pads 102b may be disposed in each first through hole 1031 .
  • first through hole 1031 of the reinforcing plate 103 is not limited to the circular hole or the oval hole shown in FIG. 3 b , and the shape of the first through hole 1031 is not specifically limited in this application.
  • present application does not limit the cross-sectional area of the first through hole 1031 , as long as the first pad 102 b can be accommodated in the corresponding first through hole 1031 .
  • the first pad 102a on the surface 1a of the first circuit board 1 and the first pad 102b on the surface 1b that are arranged correspondingly can pass through The second through hole 1021 passing through the first circuit board 1 is connected.
  • FIG. 6 is a schematic structural diagram of a second circuit board 2 in a possible embodiment of the present application.
  • the second circuit board 2 may have a second soldering area 201 for soldering with the first circuit board 1 shown in FIG. 3 a or FIG. 3 b.
  • the second circuit board 2 is provided with a second welding pad 202, which can be arranged on the surface of the second circuit board 2 for welding with the first circuit board 1, and the second welding pad 202 is located at Inside the second welding area 201 .
  • first pads 102a there may be at least two second pads 202, and the correspondingly arranged second pads 202 are welded to the first pads 102a, so that the first circuit board 1 and the second circuit board 2 are welded through the soldered first pad 202a.
  • the first pad 102a is electrically connected to the second pad 202 .
  • the number of the second pads 202 on the second circuit board 2 may be the same as the number of the first pads 102a on the surface 1a of the first circuit board 1, At this time, the first welding pad 102 a and the second welding pad 202 can be soldered in one-to-one correspondence. In some other possible embodiments, the number of the second pads 202 on the second circuit board 2 may be different from the number of the first pads 102a on the surface 1a of the first circuit board 1, and at this time, at least One first pad 102 a is soldered to the corresponding second pad 202 to realize the electrical connection between the first circuit board 1 and the second circuit board 2 .
  • the welding of the first pad 102 a and the second pad 202 can be achieved by adding solder 3 between the two pads.
  • FIG. 7a to FIG. 7c illustrate a process flow of welding the first circuit board 1 and the second circuit board 2 in a possible embodiment of the present application.
  • solder 3 can be placed on the second pad 202 of the second circuit board 2, and the solder 3 can be, but not limited to, tin paste.
  • the placement of the solder 3 can be realized by, but not limited to, screen printing or tin spraying technology.
  • the first circuit board 1 can be sucked by the suction device and moved to the side of the second circuit board 2 for soldering with the first circuit board 1 .
  • the first pads 102 a on the surface 1 a of the first circuit board 1 can be provided in one-to-one correspondence with the second pads 202 of the second circuit board 2 .
  • the first circuit board 1 is placed on the second circuit board 2 , and each first pad 102 a is in contact with the solder 3 of the corresponding second pad 202 .
  • the solder 3 between the first circuit board 1 and the second circuit board 2 can be heated and melted by means of reflow soldering (reflow), so as to realize the first pad 102a and the second solder pad 102a arranged correspondingly. Welding of disc 202.
  • the first circuit board 1 and the second circuit board 2 since the first welding area 101 of the first circuit board 1, for example shown in FIG. , which can effectively strengthen the structural strength of the first soldering area 101 of the first circuit board 1, so that the first circuit board 1 can be used as a surface mount component and passed surface mount technology (surface mount technology, SMT) Soldered on the second circuit board 2. Therefore, the first circuit board 1 and other surface mount components can be soldered to the second circuit board 2 through the same process, which is beneficial to reduce the processing process of circuit board components, improve processing efficiency, and reduce processing costs.
  • SMT surface mount technology
  • the distance between the first circuit board 1 and other components can be made as small as possible, thereby facilitating the realization of the first circuit board 1 and other components. Miniaturized design of the circuit board assembly of the board 1 and the second circuit board 2 .
  • the first soldering pad 102a located on the surface 1a of the first circuit board 1 and the first soldering pad 102b located on the surface 1b of the first circuit board 1 may both fall on the complementary within the contour range of the reinforcing plate 103, so that when the first circuit board 1 and the second circuit board 2 are soldered, the first soldering pad 102a arranged on the surface 1a of the first circuit board 1 can play the role of the reinforcing plate 103. In this way, it can be better pressed against the second circuit board 2 , which is beneficial to improve the reliability of welding between the first circuit board 1 and the second circuit board 2 .
  • FIG. 8 is a cross-sectional view of the circuit board assembly obtained through the soldering process shown in FIGS. 7 a to 7 c. Since in this embodiment of the present application, the first pad 102a of the surface 1a of the first circuit board 1 and the first pad 102b of the surface 1b can be connected through the second through hole 1021, then the first circuit board 1 In the process of soldering with the second circuit board 2, the solder 3 between the first pad 102a and the second pad 202 can overflow from the first pad 102a to the first pad through the second through hole 1021 after melting 102b, which can effectively avoid each first pad 102a located on the surface 1a of the first circuit board 1 and/or each first pad 102b located on the surface 1b of the first circuit board 1, and the second circuit board 2 A short circuit between the second bonding pads 202 . And the first pad 102 b can be soldered to the second pad 202 through the solder 3 passing through the second through hole 1021 .
  • the reinforcement board 103 is disposed on the surface 1b of the first circuit board 1, and the reinforcement board 103 is provided with the first through hole 1031, and the first pad 102b is located in the first through hole 1b. Inside the hole 1031. In this way, it is convenient to check the situation that the solder 3 overflows to the first pad 102b through the first through hole 1031, so that the first pad 102a and the second pad that are correspondingly arranged can be checked according to the overflow situation. 202 to judge the welding effect, which is conducive to improving the product yield of the circuit board assembly.
  • the height of the reinforcing plate 103 above the surface 1b of the first circuit board 1 can also be greater than or equal to the first height, which is the same as that of the reinforcing plate.
  • 103 is arranged on the same surface (i.e. the surface 1b) the first pad 102b is higher than the height of the surface, which can make the hole wall of the first through hole 1031 of the reinforcing board 103 play a role in the solder 3 overflowing to the surface 1b. barrier, thereby reducing the risk of a short circuit between adjacent first pads 102b on the surface 1b.
  • FIG. 9 is a schematic structural diagram of a circuit board assembly provided in another possible embodiment of the present application.
  • the arrangement of the circuit board assembly is slightly different from the above-mentioned embodiments, mainly in the arrangement position of the reinforcing plate 103 on the first circuit board 1 .
  • FIG. 10 which is a cross-sectional view at C-C in FIG. 9 .
  • the reinforcement board 103 is disposed on the surface 1a of the first circuit board 1, and the reinforcement board 103 is provided with a first through hole 1031, then the first pad on the surface 1a 102a can be located in the first through hole 1031 .
  • the surface 1 a is disposed facing the second circuit board, the surface 1 a can be used as the first surface of the first circuit board 1 , and the surface 1 b can be used as the second surface of the first circuit board 1 .
  • the height of the reinforcing plate 103 above the surface 1a may be greater than or equal to the first height, which is the height above the surface of the first pad 102a disposed on the same surface as the reinforcing plate 103 (ie, the surface 1a), Moreover, the reinforcement board 103 can abut against the second circuit board 2 , so that the reinforcement board 103 can support the first circuit board 1 , which is beneficial to improve the structural strength and flatness of the first circuit board 1 .
  • the first pad 102a on the surface 1a of the first circuit board 1 and the first pad 102b on the surface 1b may also be connected through the second through hole.
  • the soldering process flow can refer to the above-mentioned embodiments, which will not be repeated here. It should be noted that, in the process of welding the first circuit board 1 and the second circuit board 2, the first circuit board 1 and other surface mount components can still be welded to the second circuit board 2 through the same process. It is beneficial to reduce the processing process of the circuit board assembly, improve the processing efficiency, reduce the processing cost, and realize the miniaturization design of the circuit board assembly.
  • the solder 3 between the correspondingly arranged first pad 102a and the second pad 202 will also overflow to the surface 1b of the first circuit board 1 after melting, so that the solder 3 can pass through Check the overflow to the first pad 102b, and judge the welding effect of the first pad 102 and the second pad 202 according to the overflow situation, which is conducive to improving the reliability of the circuit board assembly. Product yield.
  • the first soldering pad 102a located on the surface 1a of the first circuit board 1 and the first soldering pad 102b located on the surface 1b of the first circuit board 1 may both fall on the complementary within the contour range of the reinforcing plate 103, so that when the first circuit board 1 and the second circuit board 2 are welded, the first pad 102a used for welding with the second circuit board 2 is under the action of the reinforcing plate 103 , can be better pressed on the second circuit board 2 , which is conducive to improving the reliability of welding between the first circuit board 1 and the second circuit board 2 .
  • the wall of the first through hole 1031 of the reinforcing plate 103 can block the overflow of the solder 3 on the surface 1a, thereby reducing the adjacent The risk of short circuit between the first pads 102a.
  • the distance between the corresponding first pad 102a and the second pad 202 can be increased, which can reduce the direction of the solder 3 to other pads. The amount of overflow can effectively avoid the short circuit between adjacent pads.
  • FIG. 11 is a schematic structural diagram of a circuit board assembly provided in another possible embodiment of the present application.
  • one surface of the first circuit board 1 is not provided with the first pad.
  • FIG. 12 is a schematic structural diagram of the first circuit board 1 of the circuit board assembly shown in FIG. 11 .
  • FIG. 12 shows the structure of the surface 1 b of the first circuit board 1 .
  • FIG. 13 is a cross-sectional view at D-D in FIG. 12 .
  • the surface 1 a can be used as the first surface of the first circuit board 1
  • the surface 1 b can be used as the second surface of the first circuit board 1 .
  • the surface 1a of the first circuit board 1 is provided with at least two first pads 102a, and the at least two first pads 102a are located in the first soldering area 101 of the first circuit board 1 (not shown in FIG. 12).
  • the reinforcement board 103 can also be arranged on the surface 1a, and the reinforcement board 103 is provided with a first through hole 1031, and the first pad 102a can be exposed from the first through hole 1031, so as to realize the connection between the first pad 102a and the first pad 102a. Welding of the second pad 202 .
  • FIG. 14 is a cross-sectional view at E-E in FIG. 11 .
  • the surface 1 a is arranged facing the second circuit board 2 .
  • the welding process flow can refer to the above embodiment, and will not be repeated here.
  • the arrangement of the reinforcing plate 103 can effectively improve the structural strength and flatness of the first circuit board 1, the reinforcing plate 103 can press the first pad 102a to the first circuit board 1.
  • the second pad 202 is beneficial to improve the reliability of the connection between the first circuit board 1 and the second circuit board 2 .
  • the first circuit board 1 and other surface mount components can still be soldered to the second circuit board through the same process. 2. It is beneficial to reduce the processing process of the circuit board assembly, improve the processing efficiency, reduce the processing cost, and realize the miniaturization design of the circuit board assembly.
  • the height of the reinforcing plate 103 above the surface 1a may also be greater than the height of the first pad 102a, and the reinforcing plate 103 may abut against the second circuit board 2, so that the reinforcing plate 103 can support the first circuit board 1 .
  • the reinforcing plate 103 is arranged on the surface 1a, the wall of the first through hole 1031 of the reinforcing plate 103 can block the overflow of the solder 3 on the surface 1a, thereby reducing the adjacent The risk of short circuit between the first pads 102a.
  • the distance between the corresponding first pad 102a and the second pad 202 can be increased, which can reduce the direction of the solder 3 to other pads.
  • the amount of overflow can effectively avoid the short circuit between adjacent pads.
  • FIG. 15 is a schematic structural diagram of a circuit board assembly provided in another possible embodiment of the present application.
  • the structure of the first circuit board 1 is slightly different from the above-mentioned embodiments.
  • FIG. 16 is the first circuit board assembly shown in FIG. Schematic diagram of the structure of the circuit board 1.
  • FIG. 16 shows the structure of the surface 1 b of the first circuit board 1 .
  • the reinforcing plate 103 is disposed on the surface 1 b of the first circuit board 1 .
  • FIG. 17 is a cross-sectional view along line F-F in FIG. 16 .
  • the surface 1 a can be used as the first surface of the first circuit board 1
  • the surface 1 b can be used as the second surface of the first circuit board 1 .
  • the surface 1a of the first circuit board 1 is provided with at least two first pads 102a, and the at least two first pads 102a are located in the first soldering area 101 of the first circuit board 1 (not shown in FIG. 16).
  • the surface 1b of the first circuit board 1 is not provided with the first pad 102b as shown in FIG.
  • the shown first through hole 1031 can be a continuous and flat plate structure, which is beneficial to improve the structural strength and flatness of the first circuit board 1 where the reinforcing plate 103 is disposed.
  • FIG. 18 is a cross-sectional view at G-G in FIG. 15 .
  • the welding process flow can refer to the above embodiment, and will not be repeated here.
  • the setting of the reinforcing plate 103 can effectively improve the structural strength and flatness of the first circuit board 1, then in the process of welding the first circuit board 1 and the second circuit board 2 Among them, the reinforcing plate 103 can press the first pad 102 a to the second pad 202 , thereby improving the reliability of the connection between the first circuit board 1 and the second circuit board 2 .
  • the first circuit board 1 and other surface mount components can still be soldered to the second circuit board 2 through the same process, which is beneficial to reduce the processing process of circuit board components and improve processing efficiency , Reduce processing costs, and realize the miniaturization design of circuit board components.
  • FIG. 19 is a schematic structural diagram of a second circuit board 2 in a possible embodiment of the present application.
  • the second circuit board 2 can also be provided with the second pad 202
  • a spacer 4 is provided, and the spacer 4 and the second pad 202 are disposed on the same surface of the second circuit board 2 .
  • FIG. 20 is a cross-sectional view at H-H in FIG. 19 .
  • the height of the gasket 4 above the surface of the second circuit board 2 is greater than the height of the second pad 202 above the surface of the second circuit board 2 .
  • the spacer 4 may be a ring structure, for example as shown in FIG. 19 , at least one second pad 202 in the second welding area 201 may be disposed in the closed area formed by the spacer 4 .
  • the gasket 4 can also be divided into multiple sections, and the multi-section gasket 4 can be distributed in any position of the second welding area 201, for example, it can be distributed in the second welding area
  • the respective corners of the pads 201 may be disposed at gaps between adjacent second pads 202 .
  • FIG. 21 shows a cross-sectional view of the partial structure of the circuit board assembly of this embodiment.
  • the structure of the first circuit board 1 can be set with reference to the embodiment shown in FIG. the second surface of the plate 1.
  • the surface 1a is provided with at least two first pads 102a
  • the reinforcing plate 103 can be arranged on the surface 1b of the first circuit board 1, and the reinforcing plate 103 can be a continuous and flat plate structure, which is beneficial to improve the The structural strength and flatness of the area of the circuit board 1 provided with the reinforcing plate 103 .
  • the gasket 4 can abut against the surface 1 a of the first circuit board 1 .
  • the space between the correspondingly welded first pad 102a and the second pad 202 can be increased by adjusting the height of the gasket 4 above the surface of the second circuit board 2, so that the first circuit board can In the process of welding the board 1 and the second circuit board 2, the amount of overflow of the solder 3 between the first pad 102a and the second pad 202 to the direction of other pads can be reduced, thereby effectively avoiding adjacent short circuit between pads.
  • the spacer 4 can also be provided on the surface 1a of the first circuit board 1, for example, it can be provided on the first circuit board as shown in Figure 4 or Figure 17
  • the surface 1 a of the board 1 is provided with the gasket 4 , and the specific arrangement method can refer to the introduction of the gasket 4 disposed on the second circuit board 2 in the above-mentioned embodiment, and details are not repeated here.
  • the height of the gasket 4 above the surface 1a can be greater than the height of the first pad 102a, as long as the gasket 4 can be abutted against the second circuit board 2, so that the first circuit board 1 and the second circuit board 2 It is enough to play the role of support and short-circuit prevention between them.
  • the first circuit board 1 and the The scheme of the spacing between the second circuit boards 2 can be increased while the heights of the first pad 102 a of the first circuit board 1 and the height of the solder 3 remain unchanged. In this way, during the soldering process of the corresponding first pad 102a and the second pad 202, the amount of overflow to the surroundings can be reduced by making the molten solder 3 flow along the sidewall of the second pad 202. , thereby reducing the risk of short circuits between pads.
  • each second welding pad 202 in the second welding area 201 of the second circuit board 2 can be increased, or by increasing part of the second welding pad 202 height, for example, increasing the height of the second pads 202 located at each corner.
  • connection between the circuit boards in the circuit board assembly is described by taking the connection between the first circuit board 1 and the second circuit board 2 as an example. It can be understood that when the circuit board assembly includes more than two circuit boards, the connection between any flexible circuit board and the printed circuit board, and between the flexible circuit board and the flexible circuit board in the two or more circuit boards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

本申请提供一种电路板组件及电子设备，该电路板组件包括第一电路板和第二电路板。其中，第一电路板为柔性电路板，该第一电路板的第一表面设置有补强板和一个或多个第一焊盘。补强板设置有第一通孔，至少一个第一焊盘位于第一通孔内，且补强板的硬度大于第一电路板的硬度。另外，第二电路板上设置有第二焊盘，至少一个第一焊盘与第二焊盘焊接，从而实现第一电路板和第二电路板之间的电连接。采用本申请提供的电路板组件，通过在第一电路板上设置硬度较大的补强板，可有利于提高第一电路板的设置有补强板的区域的结构强度及平整度，这样可有利于提高第一焊盘和第二焊盘焊接的可靠性，以提高第一电路板和第二电路板之间连接的可靠性。

Description

一种电路板组件及电子设备
相关申请的交叉引用
本申请要求在2021年12月30日提交中国专利局、申请号为202111645822.1、申请名称为“一种电路板组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电路板组件及电子设备。
背景技术
目前，手机、平板或可穿戴产品等电子设备正处于快速发展的阶段。印制电路板(printedcircuit board，PCB)和柔性电路板(flexible printed circuit，FPC)在这些电子设备中的应用十分普遍。
在一些应用场景下，为了实现电子设备的功能，需要将PCB与FPC进行电连接。软-硬板板间互联(FPC on board，FOB)技术可通过将FPC和PCB的相对应的焊盘焊接在一起，来实现二者之间的电连接。目前，常用的软-硬板板间互联技术可包括：板对板(board to board，BTB)连接器方案、异向导电胶膜(anisotropicconductive film，ACF)工艺和热压熔锡焊接工艺(hotbar)。但是，目前使用的这些软-硬板板间互联技术普遍存在布局空间大、连接可靠性较差等问题。
基于此，提供一种有利于提高板间连接可靠性的板间互联方案已成为本领域技术人员亟待解决的难题。
发明内容
本申请提供一种电路板组件及电子设备，以有利于提高电路板组件中的电路板之间连接的可靠性。
第一方面，本申请提供了一种电路板组件，该电路板组件包括第一电路板和第二电路板。其中，第一电路板为柔性电路板。在第一电路板的第一表面上设置有补强板和第一焊盘。补强板设置有第一通孔，至少一个第一焊盘位于第一通孔内，且补强板的硬度大于第一电路板的硬度。另外，第二电路板上设置有第二焊盘，至少一个第一焊盘和第二焊盘焊接，从而实现第一电路板和第二电路板之间的电连接。采用该电路板组件，通过在第一电路板的与第一焊盘对应的区域设置硬度较大的补强板，可提高第一电路板的设置有补强板的区域的结构强度及平整度。从而有利于提高第一焊盘与第二焊盘焊接的可靠性，以提高第一电路板与第二电路板连接的可靠性。
又由于补强板的硬度大于第一电路板的硬度，这样，在将第一电路板焊接于第二电路板时，可使补强板将第一焊盘压向对应的第二焊盘，以有利于提高第一焊盘和第二焊盘之间焊接的可靠性。另外，在本申请中，通过在第一电路板上设置硬度较大的补强板，来提高第一电路板的结构强度和平整度，这样可使第一电路板与其它元器件通过同一道工序焊 接于第二电路板，其有利于减少电路板组件的加工工艺流程，以提高加工效率，从而降低加工成本。并且，在第一电路板与其它元器件的功能实现互不影响的情况下，可使第一电路板与其它元器件之间的间距较小，其有利于实现电路板组件的小型化设计。
在本申请中，不对补强板的材质进行限定，其示例性的可为玻璃纤维、聚酰亚胺或不锈钢等。这样可有效的提高第一电路板的设置有补强板的区域的结构强度和平整度。
在具体设置第一电路板时，该第一电路板的表面可以包括相背设置的第一表面和第二表面。其中，在第一表面上可设置有至少两个第一焊盘，第二表面也设置有至少两个第一焊盘。第一表面的至少两个第一焊盘与第二表面的至少两个第一焊盘一一对应设置，且相对应设置的第一表面的第一焊盘和第二表面的第一焊盘之间通过第二通孔相连接。
在本申请一个可能的实现方式中，第一表面可为第一电路板的面向第二电路板的表面，这样可使第一表面的第一焊盘与第二焊盘焊接的过程中，使二者之间的焊料由第一表面通过第二通孔溢流至第二表面的第一焊盘，从而可减少焊料向周围其它焊盘方向溢流的量，以降低焊盘间短路的风险。
另外，值得一提的是，第一表面上的至少两个第一焊盘可位于补强板的第一通孔内，以便于实现第一焊盘与对应的第二焊盘之间的焊接。需要说明的是，补强板可设置有至少两个第一通孔，并且每个第一焊盘可一一对应的位于一个第一通孔内，以在第一焊盘与第二焊盘焊接的过程中，使第一通孔能够对焊料的溢流起到阻隔的作用，以有效的避免焊盘间的短路。或者，可以使补强板设置有至少一个第一通孔，此时可使至少两个第一焊盘位于一个第一通孔内，即每个第一通孔内可容置有至少两个第一焊盘，采用该方案可以简化补强板的制备工艺，并可提高补强板的结构强度。
又由于第一电路板的第一表面面向第二电路板设置，在一个可能的实现方式中，可以使该补强板与第二电路板相抵接，这样可进一步提高补强板的第一通孔对焊料的阻隔作用。并且补强板还可以对第一电路板起到支撑作用，从而可提高第一电路板的结构强度。
在本申请另一个可能的实现方式中，第一表面可为第一电路板的背向第二电路板的表面。在该实现方式中，第一表面上的至少两个第一焊盘可位于补强板的第一通孔内。这样，可在第一电路板和第二电路板焊接的过程中，通过第一通孔对焊料由第一表面溢流到第二表面的情况进行检查，从而对第一表面的第一焊盘与第二焊盘的焊接可靠性进行判断，其有利于提高电路板组件的产品良率。另外，在该实现方式中，第一通孔也可对焊料的溢流起到阻隔作用，以降低焊盘间短路的风险。
需要说明的是，在该实现方式中，位于第一通孔内的第一焊盘可通过穿过第二通孔的焊料来实现与第二焊盘的焊接。
另外，在该实现方式中，电路板组件还可以包括垫片，该垫片可位于第一电路板和第二电路板之间。并且该垫片可分别与第一电路板和第二电路板相抵接，从而可避免相对应焊接的第一焊盘和第二焊盘之间的焊料的溢流导致相邻的焊盘的短路。
当第一表面背向第二电路板设置时，第一表面可设置有至少两个第一焊盘，补强板的第一通孔也可设置为至少两个，以使每个第一焊盘可一一对应的位于一个第一通孔内，以有效的避免焊盘间的短路。或者，可以使补强板设置有至少一个第一通孔，此时可使至少两个第一焊盘位于一个第一通孔内，即每个第一通孔内可容置有至少两个第一焊盘，采用该方案可以简化补强板的制备工艺，并可提高补强板的结构强度。
另外，可以使补强板高出第一电路板的表面的高度，大于或等于第一高度，该第一高 度为与第一电路板设置于同一表面的第一焊盘高出第一电路板的第一表面的高度。从而可提高补强板的第一通孔对焊料的阻隔作用，以降低焊盘间短路的风险。
第一电路板除了可以采用上述的设置方式外，在本申请一个可能的实现方式中，第一电路板可以包括相背设置的第一表面和第二表面，第一表面为第一电路板的面向第二电路设置的表面。在该实现方式中，第一表面设置有第一焊盘，而在第二表面未设置第一焊盘。另外，补强板可设置于第一表面，则第一表面的至少一个第一焊盘可位于补强板的第一通孔内，以便于实现第一焊盘与对应的第二焊盘之间的焊接。需要说明的是，第一表面的第一焊盘可为至少两个，补强板可设置有至少两个第一通孔，这样每个第一焊盘可一一对应的位于一个第一通孔内，以在第一焊盘与第二焊接的过程中，使第一通孔能够对焊料的溢流起到阻隔的作用。或者，可以使补强板设置有至少一个第一通孔，此时可使至少两个第一焊盘位于一个第一通孔内，即每个第一通孔内可容置有至少两个第一焊盘，采用该方案可以简化补强板的制备工艺，并可提高补强板的结构强度。
由于第一电路板的第一表面面向第二电路板设置，这样，可以使该补强板与第二电路板相抵接，从而可进一步提高补强板的第一通孔对焊料的阻隔作用。并且补强板还可以对第一电路板起到支撑作用，从而可提高第一电路板的结构强度。
第二方面，本申请还提供了一种电路板组件，该电路板组件包括第一电路板、第二电路板和垫片。其中，第一电路板为柔性电路板，该第一电路板的第一表面设置有第一焊盘，所述第一电路板的第二表面上设置有补强板，第一表面和第二表面相背设置，补强板的硬度大于第一电路板的硬度。另外，第一电路板的第一表面设置有第一焊盘，而在第二表面未设置第一焊盘。这样，补强板可为一连续的板状结构，其可有效的提高第一电路板的设置有补强板的区域的结构强度以及平整度。由于补强板设置在第一电路板上与焊盘对应的区域，采用该电路板组件，可有利于提高第一焊盘和第二焊盘焊接的可靠性，以提高第一电路板与第二电路板连接的可靠性。
另外，垫片可位于第一电路板和第二电路板之间，该垫片可分别与第一电路板和第二电路板相抵接，从而可避免相对应焊接的第一焊盘和第二焊盘之间的焊料的溢流导致相邻的焊盘的短路。
在本申请中，垫片既可以设置于第一电路板，也可以设置于第二电路板。示例性的，在本申请一个可能的实现方式中，垫片设置于第二电路板，该垫片与第二焊盘设置于第二电路板的同一表面。并且垫片高出第二电路板的表面的高度，大于第二焊盘高出第二电路板的表面的高度，以使垫片可与第一电路板的第一表面相抵接。这样，可通过对垫片的高度进行调整，来增加相对应焊接的第一焊盘和第二焊盘之间的间距，从而可在第一电路板和第二电路板进行焊接的过程中，减少第一焊盘和第二焊盘之间的焊料向其它焊盘的方向溢流的量，从而可有效的避免相邻的焊盘之间的短路。
在具体设置垫片时，其可以但不限于为一环形结构，第二电路板的第二焊接区域内的至少一个第二焊盘可设置于垫片围绕形成的闭合区域内。或者，垫片可为多段，该多段垫片设置于相邻的第二焊盘之间的间隙处，或设置于第二焊接区域的各个角部。只要能够使垫片能够起到增加相对应焊接的第一焊盘和第二焊盘之间的间距的目的即可。
由上述对垫片的介绍可以知道，垫片的设置可增加第一电路板和第二电路板之间的间距，从而起到降低焊盘间短路的风险。基于此，垫片除了可以设置在第二电路板外，在本申请另一个可能的实现方式中，垫片还可以设置于第一电路板。由于第一电路板的第一表 面与第二电路板相对设置，因此，垫片可以设置于第一电路板的第一表面。另外，垫片高出第一表面的高度大于第一焊盘高出第一表面的高度，并且垫片与第二电路板相抵接。此时也可通过对垫片的高度进行调整，来增加相对应焊接的第一焊盘和第二焊盘之间的间距，从而可在第一电路板和第二电路板进行焊接的过程中，减少第一焊盘和第二焊盘之间的焊料向其它焊盘的方向溢流的量，从而可有效的避免相邻的焊盘之间的短路。
值得一提的是，在本申请该实现方案中，不对补强板的材质进行限定，其示例性的可为玻璃纤维、聚酰亚胺或不锈钢等，这样可有效的提高第一电路板的设置有补强板的区域的结构强度和平整度。
第三方面，本申请还提供了一种用于第一方面和/或第二方面提供的电路板组件的焊接方法，该焊接方法可以包括：
将第一电路板移至第二电路板，并使第一焊盘与第二焊盘相对应设置；
将相对应设置的第一焊盘和第二焊盘焊接。
采用该焊接方法将第一电路板与第二电路板进行焊接时，由于第一电路板设置有补强板，该补强板可使第一电路板的第一焊接区域的结构强度以及平整度有所提升，其可将相对应设置第一焊盘压向第二焊盘，从而提高两个焊盘焊接的可靠性。另外，在本申请中，可将第一电路板作为一个元器件，并与其它元器件通过同一道工序焊接于第二电路板，其有利于减少电路板组件的加工工艺流程，以提高加工效率，从而降低加工成本。并且在第一电路板与其它元器件的功能实现互不影响的情况下，可使第一电路板与其它元器件之间的间距较小，其有利于实现电路板组件的小型化设计。
在本申请一个可能的实现方式中，上述的将相对应设置的第一焊盘和第二焊盘焊接，具体可包括：采用回流焊将相对应设置的第一焊盘和第二焊盘焊接。这样，可在将相对应设置的第一焊盘与第二焊盘进行焊接的过程中，避免对第一电路板和第二电路板上的元器件造成损坏，并可便于将第一电路板与其它元器件通过同一道工序焊接于第二电路板，以提高加工效率，降低加工成本。
在本申请一个可能的实现方式中，在将第一电路板移至第二电路板之前，该焊接方法还可以包括：在第二电路板的第二焊盘上放置焊料。该焊料可以但不限于为锡膏。另外，焊料的放置可以但不限于采用丝网印刷或者喷锡技术等来实现。
第四方面，本申请提供了一种电子设备，该电子设备包括第一方面的电路板组件。在本申请提供的电子设备中，由于电路板组件的体积可较小，故其在电子设备中所占用的空间较小。这样，可以有利于实现电子设备的小型化设计。另外，还可以为电子设备中其它功能模块的设置预留出空间，以利于实现电子设备功能的多样化。
附图说明
图1a为本申请一实施例提供的采用BTB连接器连接的电路板组件的结构示意图；
图1b为本申请一实施例提供的采用ACF工艺连接的电路板组件的结构示意图；
图1c为本申请一实施例提供的采用热压熔锡焊接工艺连接的电路板组件的结构示意图；
图2为本申请一实施例提供的电路板组件的结构示意图；
图3a为本申请一实施例提供的第一电路板的第一表面的结构示意图；
图3b为本申请一实施例提供的第一电路板的第二表面的结构示意图；
图4为图3b中的A-A处的剖视图；
图5为图4中所示的第一电路板的局部结构的B向视图；
图6为本申请一实施例提供的第二电路板的结构示意图；
图7a至图7c为本申请一实施例提供的第一电路板和第二电路板的焊接工艺流程图；
图8为本申请一实施例提供的电路板组件的剖视图；
图9为本申请另一实施例提供的电路板组件的结构示意图；
图10为图9中的C-C处的剖视图；
图11为本申请另一实施例提供的电路板组件的结构示意图；
图12为图11中所示电路板组件的第一电路板的结构示意图；
图13为图12中的D-D处的剖视图；
图14为图11中的E-E处的剖视图；
图15为本申请另一实施例提供的电路板组件的结构示意图；
图16为图15中所示电路板组件的第一电路板的结构示意图；
图17为图16中的F-F处的剖视图；
图18为图15中的G-G处的剖视图；
图19为本申请另一实施例提供的第二电路板的结构示意图；
图20为图19中的H-H处的剖视图；
图21为本申请另一实施例提供的电路板组件的局部结构的剖视图。
附图标记：
1101-印制电路板；11011-第一焊盘；1102-柔性电路板；11021-第二焊盘；
1103-第一BTB连接器；1104-第二BTB连接器；1105-异向导电胶膜；1106-焊料；
1107-脉冲热压头；
1-第一电路板；1a-第一表面；1b-第二表面；101-第一焊接区域；102a，102b-第一焊盘；
1021-第二通孔；103-补强板；1031-第一通孔；2-第二电路板；201-第二焊接区域；
202-第二焊盘；3-焊料；4-垫片。
具体实施方式
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“具体的实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
为了方便理解本申请实施例提供的电路板组件，下面首先介绍一下其应用场景。该电路板组件可以应用于各类电子设备中，示例性的，可以但不限于应用于手机、平板电脑(pad)、便携式游戏机、掌上电脑(personal digital assistant，PDA)、笔记本电脑、超级移动个人计算机(ultramobilepersonal computer，UMPC)、手持计算机、上网本、车载媒体播放设备、可穿戴电子设备、虚拟现实(virtual reality，VR)终端设备、增强现实(augmented reality，AR) 终端设备等数字显示产品。
电路板组件通常可以包括至少两个电路板，该至少两个电路板之间可以通过直接或者间接的方式进行电连接，从而使单个电路板的功能得到扩展。另外，该至少两个电路板既可以为印制电路板，也可以为柔性电路板。而为了使电路板组件在能够实现其功能的同时，还可以便于实现电路板组件在电子设备中的安装，通常可以使电路板组件中的至少一个电路板为印制电路板，且至少一个电路板为柔性电路板。
由于无论是印制电路板还是柔性电路板，在其表面均可设置有多个焊盘，该焊盘可通过设置于电路板内部的走线来实现其与电路板上的元器件的电连接。基于此，印制电路板和柔性电路板之间的电连接可通过对应的焊盘的焊接来实现。目前，电路板之间的互联可以采用BTB连接器、ACF工艺和热压熔锡焊接工艺等来实现。其中，在采用BTB连接器进行电路板互联时，可参照图1a，图1a中以一个印制电路板1101和一个柔性电路板1102之间的连接为例，对于电路板之间采用BTB连接器进行连接的方案进行了示意。在该方案中，印制电路板1101设置有第一BTB连接器1103，该第一BTB连接器1103可与印制电路板1101上的焊盘(图1a中未示出)电连接。另外，柔性电路板1102设置有第二BTB连接器1104，该第二BTB连接器1104可与柔性电路板1102上的焊盘(图1a中未示出)电连接。这样，可通过将第一BTB连接器1103与第二BTB连接器1104进行机械扣合，来使两个BTB连接器电连接，从而实现印制电路板1101和柔性电路板1102之间的电连接。但是，由于BTB连接器的尺寸通常较大，则受BTB连接器的尺寸的限制，不利于实现电路板组件的小型化设计。
而在ACF工艺中，可参照图1b，图1b展示了印制电路板1101和柔性电路板1102之间采用ACF工艺进行连接的示意图。在该方案中，可在印制电路板1101的第一焊盘11011和柔性电路板1102的第二焊盘11021之间设置异向导电胶膜1105，然后采用热压的方式使异向导电胶膜1105分别与两电路板电连接，从而实现两电路板之间的导通。这就导致在二者的热压区域以及热压区域在二者上的投影区域内不能设置元器件，从而使印制电路板1101与柔性电路板1102连接区域的布局空间较大，其也不利于实现电路板组件的小型化设计。另外，采用ACF工艺对印制电路板1101与柔性电路板1102进行连接时，其连接的可靠性较差，且维修难度大。
另外，参照图1c，图1c展示了印制电路板1101和柔性电路板1102之间采用热压熔锡焊接工艺实现焊接的示意图。在该方案中，可在印制电路板1101的第一焊盘11011和柔性电路板1102的第二焊盘11021之间设置焊料1106，然后通过脉冲热压头1107对焊料1106进行加热来实现对应的焊盘之间的导通。采用该方案，会使得在两个电路板的加热区域以及加热区域在二者上的投影区域内不能设置元器件，因此，其也会导致印制电路板1101和柔性电路板1102连接区域的布局空间较大，从而不利于实现电路板组件的小型化设计。
本申请提供的电路板组件旨在解决上述问题，以在实现电路板组件的小型化设计的同时，还可以将电路板组件的电路板之间的连接由现有的单独工站加工优化为与其它元器件通过同一道工序加工，从而达到简化加工流程、提升加工效率以及降低加工成本的目的。为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
首先，参照图2，图2为本申请一个可能的实施例提供的电路板组件的结构示意图。本申请提供的电路板组件可以包括至少两个电路板，示例性的可以包括第一电路板1和第 二电路板2。其中，第一电路板1为柔性电路板，且第一电路板1和第二电路板2电连接。
在具体设置第一电路板1时，第一电路板1可包括两个相背设置的两个表面。可参照图3a，图3a展示了第一电路板1的表面1a的结构示意图。该表面1a可为第一电路板1的朝向如图2所示的第二电路板2的表面，即该表面1a为第一电路板1的用于与第二电路板2进行焊接的表面，因此可将该表面1a称为焊接面。另外，在本申请中，第一电路板1具有第一焊接区域101，该第一焊接区域101为第一电路板1的用于与第二电路板2进行焊接的区域。可以理解的是，图1a中的虚线框只是对第一焊接区域101的设置方式的一种示例性的表示，该第一焊接区域101可以但不限于位于第一电路板1的端部，以便于实现对第一电路板1和第二电路板2的焊接。另外，第一电路板1可以只设置有一个第一焊接区域101，也可以设置有多个第一焊接区域101，其可根据第一电路板1的具体连接情况进行设置。
可继续参照图3a，第一电路板1的表面1a设置有至少两个第一焊盘102a，该至少两个第一焊盘102a位于第一焊接区域101。在本申请中，不对该至少两个第一焊盘102a的具体设置形式进行限定，其示例性的可以为球珊阵列封装(ball grid array package，BGA)焊盘，当然也可以为采用其它任意形式进行设置的焊盘。
另外，参照图3b，图3b展示的是第一电路板1的表面1b的结构示意图。在本申请该实施例中，第一电路板1的表面1b也可以设置有至少两个第一焊盘102b，该表面1b上的至少两个第一焊盘102b也位于第一焊接区域101内。另外，表面1b的至少两个第一焊盘102b与表面1a的至少两个第一焊盘102a可一一对应设置，也就是说，每个第一焊盘102b对应一个第一焊盘102a设置。
可继续参照图3b，第一电路板1还可以设置有补强板103，该补强板103可设置于第一电路板1的第一焊接区域101。其中，补强板103的材质的硬度大于第一电路板1的材质的硬度，从而可通过补强板103的设置来提高第一电路板1的第一焊接区域101的结构强度。在本申请中，不对补强板103的材质进行具体限定，其示例性的可以为玻璃纤维、聚酰亚胺或不锈钢等。
参照图4，图4展示了图3b中的A-A处的剖视图。在本申请该实施例中，表面1a可作为第一电路板1的第二表面，表面1b可作为第一电路板的第一表面。补强板103可设置于第一电路板1的表面1b，而同样设置于第一电路板1的表面1b的各个第一焊盘102b可落在补强板103的轮廓范围之内。另外，补强板103可设置有第一通孔1031，设置于表面1b的第一焊盘102b可位于第一通孔1031内。值得一提的是，例如在图5所示的实施例中，图5为图4中所示的第一电路板1的局部结构的B向视图。补强板103可设置有至少两个第一通孔1031，这样可使每个第一焊盘102b一一对应的位于一个第一通孔1031内。而在另外一些可能的实施例中，也可以使补强板103设置有至少一个第一通孔1031，这样每个第一焊盘102b可位于一个第一通孔1031内，此时每个第一通孔1031内可设置有至少一个第一焊盘102b，例如每个第一通孔1031内可设置有两个第一焊盘102b。
需要说明的是，补强板103的第一通孔1031不限于图3b中所示的圆形孔或椭圆形孔，在本申请中不对该第一通孔1031的形状进行具体限定。另外，本申请也不对第一通孔1031的截面积进行限定，只要使第一焊盘102b能够容置于对应的第一通孔1031即可。
可继续参照图4和图5，在本申请该实施例中，相对应设置的位于第一电路板1的表面1a的第一焊盘102a与位于表面1b的第一焊盘102b之间可通过贯穿第一电路板1的第 二通孔1021相连接。
参照图6，图6为本申请一个可能的实施例的第二电路板2的结构示意图。该第二电路板2可具有用于与上述图3a或图3b中所示的第一电路板1进行焊接的第二焊接区域201。另外，第二电路板2设置有第二焊盘202，该第二焊盘202可设置于第二电路板2的用于与第一电路板1进行焊接的表面，且第二焊盘202位于第二焊接区域201内。另外，第二焊盘202可以为至少两个，且相对应设置的第二焊盘202与第一焊盘102a进行焊接，从而使第一电路板1与第二电路板2通过相焊接的第一焊盘102a和第二焊盘202实现电连接。
需要说明的是，在本申请一些可能的实施例中，第二电路板2上的第二焊盘202的数量，可与第一电路板1的表面1a的第一焊盘102a的数量相同，此时可使第一焊盘102a与第二焊盘202一一对应焊接。而在另外一些可能的实施例中，第二电路板2上的第二焊盘202的数量，可与第一电路板1的表面1a的第一焊盘102a的数量不同，此时可使至少一个第一焊盘102a与相对应的第二焊盘202进行焊接，来实现第一电路板1与第二电路板2的电连接即可。
可以理解的是，第一焊盘102a与第二焊盘202的焊接可通过在两个焊盘之间添加焊料3来实现。具体实施时，可参照图7a至图7c，图7a至图7c展示了本申请一个可能的实施例将第一电路板1和第二电路板2进行焊接的工艺流程。
首先，可参照图7a，在将第一电路板1移至第二电路板2之前，可在第二电路板2的第二焊盘202上放置焊料3，该焊料3可以但不限于为锡膏。另外，焊料3的放置可以但不限于采用丝网印刷或者喷锡技术等来实现。
然后，参照图7b，可通过吸附设备将第一电路板1吸附，并将其移至第二电路板2的用于与第一电路板1进行焊接的一侧。此时，位于第一电路板1的表面1a的第一焊盘102a可与第二电路板2的第二焊盘202一一对应的设置。
最后，可参照图7c，将第一电路板1放置于第二电路板2，且每个第一焊盘102a与相对应的第二焊盘202的焊料3相接触。此时，可通过回流焊(reflow)等方式对第一电路板1和第二电路板2之间的焊料3进行加热并使其熔融，从而实现对应设置的第一焊盘102a和第二焊盘202的焊接。
由上述对第一电路板1和第二电路板2的焊接工艺流程的介绍可以理解，由于第一电路板1的例如图3a或图3b所示的第一焊接区域101设置有补强板103，其可以使第一电路板1的第一焊接区域101的结构强度得到有效的加强，从而可将第一电路板1当做表面贴装元器件并通过表面贴装技术(surface mount technology，SMT)焊接于第二电路板2。因此，第一电路板1可与其它表面贴装元器件通过同一道工序焊接于第二电路板2，其有利于减少电路板组件的加工工艺流程，以提高加工效率，从而降低加工成本。另外，可在第一电路板1及其它元器件的功能实现互不影响的基础上，使第一电路板1与其它元器件之间的间距尽可能的小，从而有利于实现包括第一电路板1和第二电路板2的电路板组件的小型化设计。
需要说明的是，在本申请该实施例中，位于第一电路板1的表面1a的第一焊盘102a，以及位于第一电路板1的表面1b的第一焊盘102b可均落在补强板103的轮廓范围内，从而可在第一电路板1与第二电路板2进行焊接时，使设置于第一电路板1的表面1a的第一焊盘102a在补强板103的作用下，能够更好的压于第二电路板2，从而有利于提高第一电路板1与第二电路板2之间焊接的可靠性。
可参照图8，图8为通过上述图7a至图7c所示的焊接工艺获得的电路板组件的剖视图。由于在本申请该实施例中，第一电路板1的表面1a的第一焊盘102a和表面1b的第一焊盘102b可通过第二通孔1021相连接，则在将第一电路板1与第二电路板2进行焊接的过程中，位于第一焊盘102a与第二焊盘202之间的焊料3熔融后可由第一焊盘102a经第二通孔1021溢流至第一焊盘102b，这样可有效的避免位于第一电路板1的表面1a的各第一焊盘102a和/或位于第一电路板1的表面1b的各第一焊盘102b，以及第二电路板2的各第二焊盘202之间的短路。并且可使第一焊盘102b通过该穿过第二通孔1021的焊料3与第二焊盘202焊接。
另外，由于在本申请该实施例中，补强板103设置于第一电路板1的表面1b，且补强板103设置有第一通孔1031，而第一焊盘102b位于该第一通孔1031内。这样，可便于通过该第一通孔1031对于焊料3溢流至第一焊盘102b上的情况进行检查，从而可根据该溢流情况对于相对应设置的第一焊盘102a与第二焊盘202的焊接效果进行判断，其有利于提高电路板组件的产品良率。可继续参照图8，在本申请该实施例中，还可以使补强板103高出第一电路板1的表面1b的高度，大于或等于第一高度，该第一高度为与补强板103设置于同一表面(即表面1b)的第一焊盘102b高出该表面的高度，其可使补强板103的第一通孔1031的孔壁对于溢流至表面1b的焊料3起到阻隔的作用，从而减小位于表面1b的相邻的第一焊盘102b之间的短路的风险。
值得一提的是，在如图8所示的电路板组件的基础上，在本申请一些可能的实施例中，电路板组件还可以包括垫片，该垫片可分别与第一电路板1和第二电路板2相抵接。这样，可通过对垫片的高度进行调整，来增加相对应焊接的第一焊盘102a和第二焊盘202之间的间距，从而可在第一电路板1和第二电路板2进行焊接的过程中，减少第一焊盘102a和第二焊盘202之间的焊料3向其它焊盘的方向溢流的量，从而可有效的避免相邻的焊盘之间的短路。
参照图9，图9为本申请另一个可能的实施例提供的电路板组件的结构示意图。在该实施例中，电路板组件的设置方式与上述实施例稍有不同，主要在于补强板103在第一电路板1上的设置位置。具体的，可参照图10，图10为图9中C-C处的剖视图。
可继续参照图10，在本申请该实施例中，补强板103设置于第一电路板1的表面1a，且补强板103设置有第一通孔1031，则表面1a的第一焊盘102a可位于该第一通孔1031内。另外，在该实施例中，表面1a面向第二电路板设置，该表面1a可作为第一电路板1的第一表面，而表面1b可作为第一电路板1的第二表面。补强板103高出表面1a的高度可大于或等于第一高度，该第一高度为与补强板103设置于同一表面(即表面1a)的第一焊盘102a高出该表面的高度，且补强板103可与第二电路板2相抵接，从而使补强板103可以对第一电路板1起到支撑的作用，其有利于提高第一电路板1的结构强度和平整度。
在图10所示的电路板组件中，第一电路板1的表面1a的第一焊盘102a和表面1b的第一焊盘102b也可通过第二通孔相连接。则采用该电路板组件的设计方案，在将第一电路板1和第二电路板2进行焊接时，其焊接工艺流程可参照上述实施例，在此不进行赘述。需要说明的是，在第一电路板1和第二电路板2焊接的过程中，仍可将第一电路板1与其它表面贴装元器件通过同一道工序焊接于第二电路板2，其有利于减少电路板组件的加工工艺流程、提高加工效率、降低加工成本，并实现电路板组件的小型化设计。
另外，在该实施例中，相对应设置的第一焊盘102a和第二焊盘202之间的焊料3熔融 后也会向第一电路板1的表面1b溢流，从而可通过对焊料3溢流至第一焊盘102b上的情况进行检查，并根据该溢流情况对于相对应设置的第一焊盘102与第二焊盘202的焊接效果进行判断，其有利于提高电路板组件的产品良率。
需要说明的是，在本申请该实施例中，位于第一电路板1的表面1a的第一焊盘102a，以及位于第一电路板1的表面1b的第一焊盘102b可均落在补强板103的轮廓范围内，从而可在第一电路板1与第二电路板2进行焊接时，使用于与第二电路板2进行焊接的第一焊盘102a在补强板103的作用下，能够更好的压于第二电路板2，从而有利于提高第一电路板1与第二电路板2之间焊接的可靠性。
又由于补强板103设置于表面1a，则补强板103的第一通孔1031的孔壁可对于表面1a的焊料3的溢流起到阻隔的作用，从而减小位于表面1a的相邻的第一焊盘102a之间的短路的风险。另外，通过对补强板103的高出表面1a的高度进行调整，可增加相对应的第一焊盘102a和第二焊盘202之间的间距，其可减少焊料3向其它焊盘的方向溢流的量，从而可有效的避免相邻的焊盘之间的短路。
参照图11，图11为本申请另一个可能的实施例提供的电路板组件的结构示意图。在该实施例中，第一电路板1的一个表面未设置有第一焊盘。在具体设置第一电路板1时，可参照图12，图12为图11中所示电路板组件的第一电路板1的结构示意图。图12展示了第一电路板1的表面1b的结构。
另外，参照图13，图13为图12中D-D处的剖视图。在该实施例中，表面1a可作为第一电路板1的第一表面，表面1b可作为第一电路板1的第二表面。第一电路板1的表面1a设置有至少两个第一焊盘102a，该至少两个第一焊盘102a位于第一电路板1的第一焊接区域101(图13未示出，可参照图12)。另外，补强板103也可设置于表面1a，且补强板103设置有第一通孔1031，第一焊盘102a可从第一通孔1031露出，以便于实现第一焊盘102a与第二焊盘202的焊接。
参照图14，图14为图11中E-E处的剖视图。在该实施例中，表面1a面向第二电路板2设置。采用本申请该实施例提供的电路板组件的设计方案，在将第一电路板1和第二电路板2进行焊接时，其焊接工艺流程可参照上述实施例，在此不进行赘述。需要说明的是，由于在该实施例中，补强板103的设置可有效的提高第一电路板1的结构强度以及平整度，则可使补强板103将第一焊盘102a压向第二焊盘202，从而有利于提高第一电路板1与第二电路板2之间连接的可靠性。另外，在该焊接过程中，在第一电路板1和第二电路板2焊接的过程中，仍可将第一电路板1与其它表面贴装元器件通过同一道工序焊接于第二电路板2，其有利于减少电路板组件的加工工艺流程、提高加工效率、降低加工成本，并实现电路板组件的小型化设计。
另外，在该实施例中，也可以使补强板103高出表面1a的高度大于第一焊盘102a的高度，且补强板103可与第二电路板2相抵接，从而使补强板103可以对第一电路板1起到支撑的作用。又由于补强板103设置于表面1a，则补强板103的第一通孔1031的孔壁可对于表面1a的焊料3的溢流起到阻隔的作用，从而减小位于表面1a的相邻的第一焊盘102a之间的短路的风险。另外，通过对补强板103的高出表面1a的高度进行调整，可增加相对应的第一焊盘102a和第二焊盘202之间的间距，其可减少焊料3向其它焊盘的方向溢流的量，从而可有效的避免相邻的焊盘之间的短路。
参照图15，图15为本申请另一个可能的实施例提供的电路板组件的结构示意图。在 该实施例中，第一电路板1的结构与上述实施例略有不同，在具体设置第一电路板1时，可参照图16，图16为图15中所示电路板组件的第一电路板1的结构示意图。图16展示了第一电路板1的表面1b的结构，在该实施例中，补强板103设置于第一电路板1的表面1b。
参照图17，图17为图16中的F-F处的剖视图。在该实施例中，表面1a可作为第一电路板1的第一表面，表面1b可作为第一电路板1的第二表面。第一电路板1的表面1a设置有至少两个第一焊盘102a，该至少两个第一焊盘102a位于第一电路板1的第一焊接区域101(图17未示出，可参照图16)。另外，第一电路板1的表面1b未设置如图10所示的第一焊盘102b，补强板103可设置于第一电路板1的表面1b，且补强板103未设置如图10所示的第一通孔1031，其可为一连续且平整的板状结构，从而有利于提高第一电路板1设置有补强板103处的结构强度以及平整度。
参照图18，图18为图15中G-G处的剖视图。采用本申请该实施例提供的电路板组件的设计方案，在将第一电路板1和第二电路板2进行焊接时，其焊接工艺流程可参照上述实施例，在此不进行赘述。需要说明的是，由于在该实施例中，补强板103的设置可有效的提高第一电路板1的结构强度以及平整度，则在第一电路板1和第二电路板2焊接的过程中，可使补强板103将第一焊盘102a压向第二焊盘202，从而有利于提高第一电路板1与第二电路板2之间连接的可靠性。另外，在该焊接过程中，仍可将第一电路板1与其它表面贴装元器件通过同一道工序焊接于第二电路板2，其有利于减少电路板组件的加工工艺流程、提高加工效率、降低加工成本，并实现电路板组件的小型化设计。
由上述各实施例对于本申请提供的电路板组件的介绍可以知道，在第一电路板1和第二电路板2进行焊接的过程中，可能存在焊料3溢流造成相邻的焊盘短路的问题。为了解决这一问题，除了可以采用本申请上述一些实施例提供的方案外，还可以使电路板组件采用其它可能的设置方式。示例性的，参照图19，图19为本申请一个可能的实施例的第二电路板2的结构示意图。图19展示了第二电路板2的用于与第一电路板1进行焊接的一侧表面的结构，在该实施例中，第二电路板2除了设置有第二焊盘202外，还可以设置有垫片4，该垫片4与第二焊盘202设置于第二电路板2的同一表面。
参照图20，图20为图19中的H-H处的剖面图。垫片4高出第二电路板2的表面的高度大于第二焊盘202高出第二电路板2的表面的高度。该垫片4可以为一环形结构，例如图19所示，第二焊接区域201内的至少一个第二焊盘202可设置于该垫片4围绕形成的闭合区域内。在本申请另外一些可能的实施例中，垫片4还可以分为多段进行设置，该多段垫片4可分布于第二焊接区域201的任意位置，示例性的，可分布于第二焊接区域201的各个角部，或者可设置于相邻的第二焊盘202之间的间隙处。
参照图21，图21展示了该实施例的电路板组件的局部结构的剖视图。在该实施例中，第一电路板1的结构可参照上述如图17所示的实施例进行设置，其中，表面1a可作为第一电路板1的第一表面，表面1b可作为第一电路板1的第二表面。表面1a设置有至少两个第一焊盘102a，补强板103可设置于第一电路板1的表面1b，且补强板103可为一连续且平整的板状结构，从而有利于提高第一电路板1设置有补强板103的区域的结构强度以及平整度。
另外，由图21可以看出，垫片4可与第一电路板1的表面1a相抵接。这样，可通过对垫片4高出第二电路板2的表面的高度进行调整，来增加相对应焊接的第一焊盘102a 和第二焊盘202之间的间距，从而可在第一电路板1和第二电路板2进行焊接的过程中，减少第一焊盘102a和第二焊盘202之间的焊料3向其它焊盘的方向溢流的量，从而可有效的避免相邻的焊盘之间的短路。
可以理解的是，垫片4除了可设置于第二电路板2外，也可以设置于第一电路板1的表面1a，示例性的，可在如图4或者图17所示的第一电路板1的表面1a设置垫片4，其具体设置方式可参照上述实施例对于垫片4设置于第二电路板2的介绍，在此不进行赘述。例如可使垫片4高出表面1a的高度大于第一焊盘102a的高度，只要可使垫片4能够与第二电路板2相抵接，从而在第一电路板1和第二电路板2之间起到支撑以及防短路的作用即可。
为了减少相对应的第一焊盘102a和第二焊盘202之间的焊料3向其它焊盘的溢流，在本申请另外一些可能的实施例中，还可以通过增加第一电路板1和第二电路板2之间的间距的方案。具体实施时，可在第一电路板1的第一焊盘102a以及焊料3的高度的不变的情况下，增加第二电路板2的第二焊盘202的高度。这样，在相对应的第一焊盘102a和第二焊盘202焊接的过程中，可通过使熔融的焊料3沿第二焊盘202的侧壁的流动，来减少其向四周溢流的量，从而可降低焊盘之间短路的风险。值得一提的是，采用该实施例提供的方案，可使第二电路板2的第二焊接区域201内的各个第二焊盘202的高度均增加，也可以通过增加部分第二焊盘202的高度来实现，例如增加位于各个角部的第二焊盘202的高度。
在本申请上述各实施例中，为了便于说明，均以第一电路板1与第二电路板2的连接为例对电路板组件中的各个电路板之间的连接方式进行的描述。可以理解的是，当电路板组件包括两个以上电路板时，该两个以上电路板中的任意柔性电路板与印制电路板之间，以及柔性电路板与柔性电路板之间的连接均可参照上述任一实施例进行设置，在此不进行赘述，但其均应理解为落在本申请的保护范围之内。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (19)

  1. 一种电路板组件，其特征在于，包括第一电路板和第二电路板，其中：
    所述第一电路板为柔性电路板，所述第一电路板的第一表面设置有补强板和第一焊盘，所述补强板设置有第一通孔，至少一个所述第一焊盘位于所述第一通孔内，所述补强板的硬度大于所述第一电路板的硬度；
    所述第二电路板上设置有第二焊盘，至少一个所述第一焊盘与所述第二焊盘焊接。
  2. 如权利要求1所述的电路板组件，其特征在于，所述第一电路板的与所述第一表面相背设置的第二表面设置有至少两个所述第一焊盘，所述第一表面设置有至少两个所述第一焊盘；
    所述第一表面的至少两个所述第一焊盘，与所述第二表面的至少两个所述第一焊盘一一对应设置；且相对应设置的所述第一表面的所述第一焊盘和所述第二表面的所述第一焊盘之间通过第二通孔相连接。
  3. 如权利要求2所述的电路板组件，其特征在于，所述第一表面为所述第一电路板的背向所述第二电路板的表面。
  4. 如权利要求3所述的电路板组件，其特征在于，所述第一通孔内的所述第一焊盘通过穿过所述第二通孔的焊料与所述第二焊盘焊接。
  5. 如权利要求3或4所述的电路板组件，其特征在于，所述电路板组件还包括垫片，所述垫片位于所述第一电路板和所述第二电路板之间，且所述垫片与所述第一电路板和所述第二电路相抵接。
  6. 如权利要求2所述的电路板组件，其特征在于，所述第一表面为所述第一电路板的面向所述第二电路板的表面。
  7. 如权利要求6所述的电路板组件，其特征在于，所述补强板与所述第二电路板抵接。
  8. 如权利要求1～7任一项所述的电路板组件，其特征在于，所述第一表面设置有至少两个所述第一焊盘；所述补强板设置有至少两个所述第一通孔，每个所述第一焊盘一一对应的位于一个所述第一通孔内；
    或，所述补强板设置有至少一个所述第一通孔，至少两个所述第一焊盘位于一个所述第一通孔内。
  9. 如权利要求1～8任一项所述的电路板组件，其特征在于，所述补强板高出于所述第一电路板的第一表面的高度，大于或等于第一高度，所述第一高度为与所述补强板设置于同一表面的所述第一焊盘高出于所述第一电路板的所述第一表面的高度。
  10. 如权利要求1所述的电路板组件，其特征在于，所述第一表面为第一电路板的面向所述第二电路板的表面。
  11. 如权利要求1～10任一项所述的电路板组件，其特征在于，所述补强板的材质为玻璃纤维、聚酰亚胺或不锈钢。
  12. 一种电路板组件，其特征在于，包括第一电路板、第二电路板和垫片，其中：
    所述第一电路板为柔性电路板，所述第一电路板的第一表面上设置有第一焊盘，所述第一电路板的第二表面上设置有补强板，所述第一表面和所述第二表面相背设置，所述补强板的硬度大于所述第一电路板的硬度；
    所述第二电路板上设置有第二焊盘，相对应设置的所述第一焊盘与所述第二焊盘焊接；
    所述垫片位于所述第一电路板和所述第二电路板之间，且所述垫片与所述第一电路板和所述第二电路相抵接。
  13. 如权利要求12所述的电路板组件，其特征在于，所述垫片设置于所述第二电路板，且所述第二焊盘与所述垫片设置于所述第二电路板的同一表面；所述垫片高出于所述第二电路板的表面的高度，大于所述第二焊盘高出于所述第二电路板的表面的高度。
  14. 如权利要求13所述的电路板组件，其特征在于，所述垫片为环形结构，所述第二电路板的所述第二焊接区域内的至少一个所述第二焊盘设置于所述垫片围绕形成的闭合区域内；或，所述垫片为多段，多段所述垫片设置于相邻的所述第二焊盘之间的间隙处或所述第二焊接区域的各个角部。
  15. 如权利要求12所述的电路板组件，其特征在于，所述垫片设置于所述第一电路板的所述第一表面，所述垫片高出于所述第一表面的高度，大于所述第一焊盘高出于所述第一表面的高度。
  16. 一种应用于如权利要求1～15任一项所述的电路板组件的焊接方法，其特征在于，所述焊接方法包括：
    将所述第一电路板移至所述第二电路板，并使所述第一焊盘与所述第二焊盘相对应设置；
    将相对应设置的所述第一焊盘和所述第二焊盘焊接。
  17. 如权利要求16所述的焊接方法，其特征在于，所述将相对应设置的所述第一焊盘和所述第二焊盘焊接，包括：
    采用回流焊将相对应设置的所述第一焊盘和所述第二焊盘焊接。
  18. 如权利要求16或17所述的焊接方法，其特征在于，所述将所述第一电路板移至所述第二电路板之前，所述方法还包括：
    在所述第二电路板的所述第二焊盘上放置焊料。
  19. 一种电子设备，其特征在于，包括如权利要求1～15任一项所述的电路板组件。
PCT/CN2022/136576 2021-12-30 2022-12-05 一种电路板组件及电子设备 WO2023124804A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190653A (ja) * 2000-12-20 2002-07-05 Olympus Optical Co Ltd 電気回路基板とその接続方法
JP2006295078A (ja) * 2005-04-14 2006-10-26 Toyota Industries Corp 主基板とフレキシブルプリント基板との接続構造及びその接続方法
CN107920417A (zh) * 2017-12-18 2018-04-17 广州兴森快捷电路科技有限公司 线路板及其制造方法
CN212677468U (zh) * 2017-12-28 2021-03-09 株式会社村田制作所 基板接合构造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190653A (ja) * 2000-12-20 2002-07-05 Olympus Optical Co Ltd 電気回路基板とその接続方法
JP2006295078A (ja) * 2005-04-14 2006-10-26 Toyota Industries Corp 主基板とフレキシブルプリント基板との接続構造及びその接続方法
CN107920417A (zh) * 2017-12-18 2018-04-17 广州兴森快捷电路科技有限公司 线路板及其制造方法
CN212677468U (zh) * 2017-12-28 2021-03-09 株式会社村田制作所 基板接合构造

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