WO2020216169A1 - 柔性电路板与印刷电路板的焊接方法、器件 - Google Patents

柔性电路板与印刷电路板的焊接方法、器件 Download PDF

Info

Publication number
WO2020216169A1
WO2020216169A1 PCT/CN2020/085560 CN2020085560W WO2020216169A1 WO 2020216169 A1 WO2020216169 A1 WO 2020216169A1 CN 2020085560 W CN2020085560 W CN 2020085560W WO 2020216169 A1 WO2020216169 A1 WO 2020216169A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
fpc
pad
suction nozzle
Prior art date
Application number
PCT/CN2020/085560
Other languages
English (en)
French (fr)
Inventor
杨俊杰
杨迎喜
汪志强
何丽荣
江帆
李文婧
邓凌超
刘鹏
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2020216169A1 publication Critical patent/WO2020216169A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • This application relates to the field of electronic technology, and in particular to a welding method and device for a flexible circuit board and a printed circuit board.
  • PCB printed circuit boards
  • FPC flexible printed circuit
  • the interconnection technology between soft and hard boards can include: board to board (BTB) solution, anisotropic conductive film (ACF) process, and hot-pressed soldering process (hotbar) .
  • BTB board to board
  • ACF anisotropic conductive film
  • hotbar hot-pressed soldering process
  • a BTB is welded to the FPC and PCB respectively, and the FPC and PCB are interconnected through mechanical buckling of the two BTBs.
  • BTB volume limitation in the BTB solution it is not conducive to the miniaturization of interconnection products between soft and hard boards.
  • the reliability of mechanical connection is poor. It is often necessary to add additional steel sheets to lock the two BTBs, which further increases the layout space.
  • ACF 300 includes conductive particles 301 and colloids 302.
  • the FPC pad 1011 and the PCB pad 201 are connected through the conductive particles 301, so as to realize the welding of the FPC 101 and the PCB 200.
  • hot pressing is required to achieve conduction between the two pads.
  • Devices cannot be placed on the corresponding back area of PCB 200 by hot pressing to reduce damage to the devices by hot pressing, and devices cannot be placed on the hot pressing area on FPC 101, thereby increasing the layout space of PCB 200 and FPC 101.
  • the width of the FPC pad 1011 and the PCB pad 201 are relatively large, which further increases the layout space.
  • the conductive flow capacity of the welding position is weaker than that of BTB or solder connection, and the maintenance is more difficult.
  • solder paste and flux are preset on the pads of the FPC and PCB respectively, and then the two pads are heated by the pulse hot pressing head to realize the conduction between the two pads, thereby realizing the connection between the FPC and the PCB. welding.
  • the pulse hot pressing head Similar to the ACF process, due to the need for hot pressing, devices cannot be placed in the corresponding back area of the PCB by hot pressing, and devices cannot be placed in the hot pressing area on the FPC, which increases the layout space of the PCB and FPC.
  • the present application discloses a welding method and device for a flexible circuit board and a printed circuit board, which can reduce the layout space occupied by interconnected products between the flexible and rigid boards.
  • an embodiment of the present application provides a soldering method, the method includes: bonding a reinforcing plate on a flexible circuit board by glue to obtain a surface mount device; and soldering the surface mount device using surface mount technology On the first circuit board, the flexible circuit board and the first circuit board are welded; the reinforcing plate and the glue are peeled from the surface mount device to obtain the flexible circuit board and The interconnection device of the first circuit board.
  • SMT can be used to realize the welding between the FPC and the PCB.
  • the soldering structure between the FPC and the PCB is solder paste, which saves the layout space occupied by the interconnection products between the flexible and rigid boards.
  • the use of the SMT soldering process does not require hot pressing, so that neither FPC nor PCB need to consider hot pressing for device prohibition, which saves the layout space occupied by interconnected products between soft and hard boards.
  • the process from taking SMD devices to solidification to form solder joints can be automatically completed by the equipment.
  • the processing efficiency can be improved, and the unit hour output can be increased in mass production.
  • the reinforcing plate may be made of glass fiber or stainless steel.
  • the viscosity of the first surface of the glue is greater than that of the second surface, the first surface is the surface contacting the reinforcing plate, and the second surface is the surface contacting the reinforcing plate.
  • the contact surface of the flexible circuit board is greater than that of the second surface, the first surface is the surface contacting the reinforcing plate, and the second surface is the surface contacting the reinforcing plate.
  • the glue can remain on the reinforcing plate when it is peeled off .
  • the residual glue on the FPC after peeling off the reinforcing plate and glue on the FPC is reduced, and the reinforcing plate and glue can be peeled from the FPC together, which improves the processing efficiency.
  • the viscosity of the first side is such that the peeling force required when the glue is peeled from the reinforcing plate by 180 degrees is greater than or equal to 4 N/cm.
  • the viscosity of the side (the second side) bonded to the FPC is such that the peeling force required when peeling 180 degrees from the FPC is less than or equal to 0.2 N/mm.
  • the viscosity of each of the first surface and the second surface is greater than or equal to a first threshold.
  • the adhesive of this viscosity is used to bond the reinforcing plate and the FPC. In the process of peeling the reinforcing plate and the adhesive, it can be easily peeled off from the FPC, which improves the processing efficiency.
  • the viscosity of the glue is expressed by the peeling force required to pull the glue to a deviation of 180 degrees, and the peeling force can be less than or equal to 0.1N/cm.
  • the reinforcing plate and the flexible circuit board are the same in shape and size; or the shape similarity between the reinforcing plate and the flexible circuit board is greater than or equal to the second Threshold, the size similarity between the reinforcement board and the flexible circuit board is greater than or equal to a third threshold.
  • the second threshold and the third threshold may take a value of 65% to 95%, for example, the second threshold is 75% and the third threshold is 80%.
  • the first circuit board includes a first pad; the flexible circuit board includes a second pad; and the surface mount device is soldered on the second pad using surface mount technology.
  • a circuit board including: printing tin paste on the first pad; bonding the surface mount device on the first circuit board so that the first pad passes through the tin paste and The second pad is attached; the solder paste is reflowed and cured to form a solder joint, so that the first solder pad and the second solder pad are connected through the solder joint.
  • the second pad may or may not include a through tin hole, which is not limited in the embodiment of the present application. If the second pad contains through-tin holes, the appearance inspection of the solder joints can be facilitated after the soldering between the soft and the rigid board, and the soldering strength can be improved.
  • the reinforcing plate can be adhered to the side of the FPC without pads.
  • solder paste soldering makes it easier to remove when the FPC and PCB need to be separated. Thereby reducing the difficulty of maintenance, it can be repaired manually, or the solder paste can be removed and re-soldered by SMT equipment.
  • the first circuit board is treated with an organic solder mask, and the solder paste contains flux. If the PCB has been treated with an organic solder mask, flux can be added to the solder paste.
  • the PCB surface after OSP treatment contains a layer of organic film, which can be removed by flux.
  • the above-mentioned soft-hard board welding method can be applied to the scene of OSP-processed PCB and FPC welding. However, since the solder is not added with the flux in the hot-press molten tin soldering process, it cannot be used for the OSP-treated PCB and FPC soldering. Therefore, compared with the hot-press molten tin welding process, the above-mentioned soft-hard board-to-board welding method can be applied in a wider range of scenarios.
  • solder paste Compared with the use of ACF soldering, since ACF contains colloid, the conduction ability of solder paste is higher than that of ACF.
  • the above-mentioned method of using solder paste for soldering between soft and hard boards can improve the signal flow capacity and the ability of high-speed signal transmission of interconnected products between the soft and hard boards.
  • the first circuit board may be a printed circuit board provided in an embodiment of the present application.
  • the first circuit board may also be a flexible circuit board.
  • the printed circuit board may also include FPC predictive glue strips.
  • the predictive adhesive strip can play a predictive role for SMD devices including FPC, that is, limit the position where the SMD device is placed, and improve the accuracy of the bonding position of the SMD device.
  • the surface assembly technology can be realized by SMT equipment.
  • SMT equipment can include PCB support frame, suction nozzle, vision system, material box and control system.
  • the control system controls the suction nozzle to suck SMD devices from the material box.
  • the control system attaches the SMD device to the corresponding position on the PCB according to the coordinate position.
  • the vision system can obtain the position of the suction nozzle to absorb the SMD device through the camera. Then feedback to the control system.
  • the control system adjusts the position of the suction nozzle to absorb the SMD device according to the feedback of the vision system, so that the SMD device is accurately attached to the corresponding position on the PCB, so that the FPC pad (second pad) and the corresponding PCB pad (second pad) A pad) is contacted by solder paste.
  • the surface assembly type device and PCB contacted by the solder paste can be put into the reflow oven.
  • the reflow oven uses infrared heat source, hot air or infrared hot air to solidify the solder paste to form solder joints to complete the soldering between the FPC pad (second pad) and the corresponding PCB pad (first pad).
  • an embodiment of the present application provides a soldering method, which includes: sucking a flexible circuit board through a suction nozzle of a surface assembly device to harden the flexible circuit board; on the suction nozzle, contacting the flexible circuit board
  • the surface of the flexible circuit board is the same or similar in shape and size; the suction nozzle is controlled to release the flexible circuit board, so that the flexible circuit board is attached to the first circuit board; the flexible circuit board is cured by reflow
  • the circuit board is soldered on the first circuit board.
  • the suction nozzle is the profiling suction nozzle in the embodiment of the present application. Since the profiling nozzle is the same or similar in shape and size to the FPC, the coplanarity of the FPC can be reduced after the FPC is adsorbed, and the FPC can be hardened by the profiling nozzle. This reduces the folding and deformation of the FPC when bonding the FPC and the PCB, and improves the accuracy of welding the FPC and the PCB.
  • the shape of the contact surface of the profiling nozzle with the FPC can be designed according to the shape of the FPC, so that after the profiling nozzle absorbs the FPC, the coplanarity of the FPC is less than 1 mm.
  • the shape of the contact surface of the contoured suction nozzle with the FPC is such that after the FPC is adsorbed, the coplanarity of the FPC is less than 0.2 mm or the coplanarity of the FPC is less than 0.1 mm.
  • the FPC can be hardened by the profiling nozzle when the FPC is adsorbed by the profiling nozzle.
  • the profiling nozzle automatically releases the FPC through the air hole. The steps of bonding the reinforcing plate are reduced, and the steps of peeling the reinforcing plate after welding are also reduced, thereby saving the process flow and improving the processing efficiency.
  • the shape similarity between the surface contacting the flexible circuit board and the flexible circuit board is greater than or equal to a fourth threshold, and the surface contacting the flexible circuit board is The size similarity between the flexible circuit boards is greater than or equal to the fifth threshold.
  • the fourth threshold is, for example, 60% to 95%, for example, a value of 80%.
  • the fifth threshold is, for example, 60% to 95%, and specifically is 85%.
  • the first circuit board includes a first pad; the flexible circuit board includes a second pad; and the control of the suction nozzle releases the flexible circuit board so that the Before the flexible circuit board is attached to the first circuit board, the method further includes: printing solder paste on the first pad; and controlling the suction nozzle to release the flexible circuit board so that the flexible circuit
  • the bonding of the board to the first circuit board includes bonding the surface mount device to the first circuit board so that the first pad is bonded to the second pad through the solder paste ; Reflow and solidify the solder paste to form solder joints, so that the first pad and the second pad are connected through the solder joints.
  • the first circuit board is a printed circuit board.
  • the first circuit board may also be a printed circuit board assembly
  • the flexible circuit board may also be a flexible circuit board assembly
  • embodiments of the present application provide a circuit board interconnection device, the circuit board interconnection device includes a flexible circuit board and a first circuit board; the flexible circuit board is soldered on the first circuit board; the circuit The board interconnection device is obtained by the welding method described in any one of the first aspect, the second aspect, the first aspect, or any one of the third aspects.
  • circuit board interconnection device described in the third aspect provided above adopts the welding method described in any one of the first, second, and first aspects, or any one of the third aspects. get. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding method, which will not be repeated here.
  • an embodiment of the present application provides a suction nozzle, which is used on a surface assembly device, and the surface assembly device is used for soldering a flexible circuit board on a first circuit board by using surface assembly technology; the suction nozzle The nozzle is used to suck the flexible circuit board to harden the flexible circuit board to obtain a surface mount device; the suction nozzle is also used to release the flexible circuit board so that the flexible circuit board and the first The circuit board is attached and reflowed and solidified and soldered on the first circuit board.
  • the profiling nozzle is the same or similar in shape and size to the FPC, after the FPC is adsorbed, the coplanarity of the FPC can be small, and the FPC can be realized by the profiling nozzle Hardening. This reduces the folding and deformation of the FPC when bonding the FPC and the PCB, and improves the accuracy of welding the FPC and the PCB.
  • the surface contacting the flexible circuit board is the same in shape and size as the flexible circuit board; or the surface contacting the flexible circuit board is the same as the The shape similarity between the flexible circuit boards is greater than or equal to the second threshold, and the size similarity between the surface contacting the flexible circuit board and the flexible circuit board is greater than or equal to the third threshold.
  • the FPC can be hardened by the profiling nozzle when the FPC is adsorbed by the profiling nozzle.
  • the profiling nozzle automatically releases the FPC through the air hole. The steps of bonding the reinforcing plate are reduced, and the steps of peeling the reinforcing plate after welding are also reduced, thereby saving the process flow and improving the processing efficiency.
  • the suction nozzle includes air holes, and the air holes are used for the suction nozzle to absorb or release the flexible circuit board.
  • the air between the FPC and the profiling nozzle is discharged through the air hole to realize the adsorption of the FPC.
  • the profiling suction nozzle is the same or similar in shape and size to the FPC, after the FPC is adsorbed, the coplanarity of the FPC can be small, that is, the FPC can be hardened by the profiling suction nozzle. This reduces the folding and deformation of the FPC when bonding the FPC and the PCB, and improves the accuracy of welding the FPC and the PCB.
  • FIG. 1 is a schematic diagram of an ACF process provided by the prior art
  • FIG. 2 is a schematic flowchart of a method for soldering a flexible circuit board and a printed circuit board according to an embodiment of the present application
  • FIG. 3 is a schematic diagram of a welding process between a flexible circuit board and a printed circuit board provided by an embodiment of the present application;
  • FIG. 4 is a schematic structural diagram of an SMT device provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the structure of an FPC and a profiling suction nozzle provided by an embodiment of the present application;
  • Fig. 6 is an example of a process flow for connecting AP, RF and FPC provided by an embodiment of the present application.
  • embodiments of the present application provide a welding method and device for a flexible circuit board and a printed circuit board.
  • the FPC is hardened, for example, a hard reinforcing plate is glued to the FPC. Then, using surface mount technology (SMT), the hardened FPC is attached to the PCB similar to surface mounted devices (SMD). After reflow curing, the soldering is completed. Finally, the reinforcing plate is peeled off from the FPC.
  • SMT surface mount technology
  • SMD surface mounted devices
  • FIG. 2 is a schematic flowchart of a method for soldering a flexible circuit board and a printed circuit board according to an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a welding process between a flexible circuit board and a printed circuit board provided by an embodiment of the present application. As shown in FIG. 2, the soldering method of the flexible circuit board and the printed circuit board includes steps S101 to S104.
  • S101 Adhere the FPC 101 and the reinforcing plate 103 through the glue 102 to harden to obtain the SMD device 100.
  • the SMD device 100 is attached to the PCB 200 using the SMT device.
  • S103 Complete the soldering of the SMD device 100 and the PCB 200 through reflow curing.
  • S104 Peel the reinforcing plate 103 and the glue 102 on the SMD device 100 from the FPC 101.
  • the embodiment of the present application does not limit the shape and size of the reinforcing plate 103.
  • the shape of the reinforcing plate 103 may be the same as the shape of the FPC 101.
  • the size of the reinforcing plate 103 may also be the same as the size of the FPC 101.
  • the shape of the FPC 101 is rectangular, the shape of the reinforcing plate 103 is also rectangular.
  • the length and width of the reinforcing plate 103 may be the same as the length and width of the FPC 101.
  • the reinforcing plate 103 and the FPC 101 may be similar in shape and size, for example, the similarity of the shape and size is greater than a set threshold (such as 65%-95%, for example, the shape similarity is 75%, and the size similarity is 75%). Is 80%).
  • a set threshold such as 65%-95%, for example, the shape similarity is 75%, and the size similarity is 75%). Is 80%).
  • the shape similarity of the reinforcing plate 103 and the FPC 101 is the second threshold, and the size similarity is the third threshold.
  • the reinforcing plate 103 may be made of glass fiber or stainless steel.
  • the thickness is, for example, 0.1 to 0.2 mm, and other thickness values are also possible.
  • FPC 101 may include FPC pads 1011.
  • the reinforcing plate 103 can be adhered to the side of the FPC 101 without pads.
  • the adhesive 102 can have the same viscosity on both sides.
  • the viscosity of the glue 102 is expressed by the peeling force required when the glue 102 is pulled to a deviation of 180 degrees.
  • the peeling force can be Less than or equal to 1.0N/cm.
  • the glue 102 of this viscosity is used to bond the reinforcing plate 103 and the FPC 101. During the process of peeling the reinforcing plate 103 and the glue 102, it can be easily peeled off from the FPC 101, which improves the processing efficiency.
  • the viscosity of the two sides of the glue 102 can be different.
  • the viscosity of the adhesive side of the glue 102 and the reinforcing plate 103 is such that the peeling force required when peeling 180 degrees from the reinforcing plate 103 is greater than or equal to 4 N/cm.
  • the viscosity of the side bonded to FPC 101 is such that the peeling force required when peeling 180 degrees from FPC 101 is less than or equal to 0.2 N/mm.
  • step S104 the glue 102 is peeled off in step S104
  • the time can remain on the reinforcing plate 103. Thereby, the residual glue on the FPC 101 after peeling off the reinforcing plate 103 and the glue 102 of the FPC 101 is reduced, and the reinforcing plate 103 and the glue 102 can be peeled from the FPC 101 together, which improves the processing efficiency.
  • the peeling force required to peel the glue 102 by 180 degrees may be greater than or equal to a first threshold, for example, 0.1 N/mm.
  • the PCB 200 may include a pad 201.
  • the FPC 101 may also include a pad 1011 correspondingly.
  • the solder paste can be printed on the PCB pad 201 in advance.
  • the solder paste may also contain flux.
  • the SMD device 100 is attached to the PCB 200 by using an SMT device, so that the FPC pad 1011 and the corresponding PCB pad 201 are in contact with each other through solder paste.
  • solder paste between the FPC pad 1011 and the corresponding PCB pad 201 is reflowed and solidified to form a solder joint, and the soldering of the SMD device 100 and the PCB 200 is completed.
  • FIG. 4 is a schematic structural diagram of an SMT device provided by an embodiment of the present application.
  • the SMT device may include a PCB support frame 400, a suction nozzle 500, a vision system 600, a magazine 700, and a control system 800.
  • the PCB 200 is placed on the PCB support frame 400, and multiple SMD devices 100 are placed in the material box 700.
  • the coordinate position where the SMD device 100 is attached to the PCB 200 is designed in advance, and the coordinate position is input to the control system 800.
  • the control system 800 controls the suction nozzle 500 to suck the SMD device 100 from the magazine 700.
  • the control system 800 attaches the SMD device 100 to the corresponding position on the PCB 200 according to the coordinate position.
  • the vision system 600 can obtain the position where the suction nozzle 500 absorbs the SMD device 100 through a camera. Then feedback to the control system 800.
  • the control system 800 adjusts the position of the suction nozzle 500 to absorb the SMD device 100 according to the feedback of the vision system 600, so that the SMD device 100 is accurately attached to the corresponding position on the PCB 200, so that the FPC pad 1011 and the corresponding PCB pad 201 Contact through solder paste.
  • the solder paste is reflowed and solidified to form solder joints to complete the soldering of the SMD type device 100 and the PCB 200.
  • the FPC 101 and PCB 200 contacted by the solder paste can be put into the reflow oven.
  • the reflow oven uses infrared heat source, hot air or infrared hot air to solidify the solder paste to form solder joints to complete the soldering between the FPC pad 1011 and the corresponding PCB pad 201.
  • SMT can be used to realize the welding between FPC 101 and PCB 200.
  • the soldering structure between FPC 101 and PCB 200 is solder paste, which saves the layout space occupied by interconnection products between soft and hard boards.
  • the use of SMT soldering process does not require hot pressing, so that neither FPC 101 nor PCB 200 need to consider hot pressing for device prohibition, which saves the layout space occupied by interconnected products between soft and hard boards.
  • the welding is completed by the SMT equipment, and the process from taking the SMD device 100 to solidifying and forming the solder joint can be automatically completed by the equipment. Compared with manual participation in the hot-pressing soldering process, it can improve processing efficiency and increase unit per hour (UPH) in mass production.
  • UHP unit per hour
  • solder paste soldering makes it easier to remove when FPC 101 and PCB 200 need to be separated. This reduces the difficulty of maintenance. It can be repaired manually, or the solder paste can be removed and re-soldered by SMT equipment.
  • OSP organic solderability preservatives
  • flux can be added to the solder paste in step S102.
  • the PCB surface after OSP treatment contains a layer of organic film, which can be removed by flux.
  • the above-mentioned soft-hard board welding method can be applied to the scene where the OSP processed PCB 200 is welded to the FPC.
  • the solder since the solder is not added with the flux in the hot-press molten tin soldering process, it cannot be used for the OSP-treated PCB and FPC soldering. Therefore, compared with the hot-press molten tin welding process, the above-mentioned soft-hard board-to-board welding method can be applied in a wider range of scenarios.
  • solder paste Compared with the use of ACF soldering, since ACF contains colloid, the conduction ability of solder paste is higher than that of ACF.
  • the above-mentioned method of using solder paste for soldering between soft and hard boards can improve the signal flow capacity and the ability of high-speed signal transmission of interconnected products between the soft and hard boards.
  • the FPC pad 1011 provided in the embodiment of the present application may or may not include a through-tin hole, which is not limited in the embodiment of the present application. If the FPC pad 1011 contains through-tin holes, the appearance inspection of the solder joints can be facilitated after the soldering between the soft and the rigid board, and the soldering strength can be improved.
  • the PCB 200 may also include an FPC predictive adhesive strip 202.
  • the predictive rubber strip 202 can play a predictive role for the SMD device 100 including the FPC 101, that is, limit the position where the SMD device 100 is placed, and improve the accuracy of the bonding position of the SMD device 100.
  • the first circuit board may be a printed circuit board provided in an embodiment of the present application.
  • the first circuit board may also be a flexible circuit board.
  • the PCB pad 201 is the first pad provided in the embodiment of the present application
  • the FPC pad 1011 is the second pad provided in the embodiment of the present application.
  • the first surface of the glue 102 is the surface contacting the reinforcing plate 103
  • the second surface is the surface contacting the flexible circuit board 101.
  • the FPC can be hardened by designing the shape of the suction nozzle in the SMT device. There is no need to glue the reinforcing plate 103 on the FPC 101 to realize the hardening of the FPC 101.
  • FIG. 5 is a schematic structural diagram of an FPC and a profiling suction nozzle provided by an embodiment of the present application.
  • FPC 101 includes FPC pad 1011.
  • the shape of the contact surface of the profiling nozzle 900 with the FPC 101 can be designed according to the shape of the FPC 101, so that the coplanarity of the FPC 101 is less than 1 mm.
  • the concept of coplanarity Take the plane formed by the three lowest positions on the FPC 101 after being adsorbed as the reference surface, and the maximum deviation of the remaining positions from the reference surface.
  • the shape of the contact surface of the contoured suction nozzle 900 with the FPC 101 is such that after the FPC 101 is adsorbed, the coplanarity of the FPC 101 is less than 0.2 mm or the coplanarity of the FPC 101 is less than 0.1 mm.
  • FIG. 5 is a bottom view of the contoured suction nozzle 900, and the plane shown in this figure is the surface in contact with the FPC 101.
  • the shape and size of the contact surface of the contoured suction nozzle 900 with the FPC 101 can be the same as the FPC 101.
  • the shape and size of the contact surface of the contoured suction nozzle 900 with the FPC 101 may be similar to the FPC 101.
  • the similarity of the shape between the surface contacting the FPC 101 and the FPC 101 is greater than or equal to the fourth threshold (the fourth threshold is, for example, 60%-95%, for example, a value of 80%).
  • the similarity of the size between the surface contacting the FPC 101 and the FPC 101 may also be greater than or equal to the fifth threshold (the fifth threshold, for example, 60%-95%, for example, a value of 85%).
  • the embodiment of the present application does not limit the calculation method of the above-mentioned shape similarity and size similarity.
  • the contoured suction nozzle 900 includes an air hole 901.
  • the air between the FPC 101 and the profiling suction nozzle 900 is discharged through the air hole 901, so that the FPC 101 can be adsorbed.
  • the profiling nozzle 900 is the same or similar in shape and size to the FPC 101, after the FPC 101 is adsorbed, the coplanarity of the FPC 101 can be small, that is, the FPC 101 can be hardened by the profiling nozzle 900. This reduces the folding and deformation of FPC 101 when bonding FPC 101 and PCB 200, and improves the accuracy of welding FPC 101 and PCB 200.
  • the profiling nozzle 900 can replace the nozzle 500 in the example shown in FIG. 4 to complete the process of attaching the FPC 101 to the PCB 200 by the SMT device.
  • the contoured suction nozzle 900 Through the shape design of the contact surface of the contoured suction nozzle 900 with the FPC 101, when the contoured suction nozzle 900 is used to adsorb the FPC 101, the FPC 101 is hardened by the contoured suction nozzle 900. After the FPC 101 is attached to the PCB 200 by using the profiling nozzle 900, the profiling nozzle 900 automatically releases the FPC 101 through the air hole 901. The steps of bonding the reinforcing plate are reduced, and the steps of peeling the reinforcing plate after welding are also reduced, thereby saving the process flow and improving the processing efficiency.
  • the embodiment of the present application does not limit the number and shape of the air holes 901 on the profiling suction nozzle 900.
  • the PCB 200 may also be a printed circuit board assembly (PCBA), and the FPC 101 may also be a flexible printed circuit board assembly (FPCA).
  • PCBA printed circuit board assembly
  • FPCA flexible printed circuit board assembly
  • FIG. 6 is an example of a process flow for connecting AP, RF and FPC provided by an embodiment of the present application.
  • the AP 210 and the RF 220 are all welded with the SMD device 100 through solder joints.
  • the solder joints are formed by reflowing and solidifying the solder paste. Specifically, the solder paste may be located on the pad.
  • the soldering pads are soldered by solidified solder paste, so that the AP 210 and RF 220 are soldered with the SMD device 100 through solder joints.
  • the SMD device 100 is formed by bonding the FPC 101 and the reinforcing plate 103 through glue 102.
  • step S104 the reinforcing plate 103 and the glue 102 on the SMD device 100 are peeled from the FPC 101 to obtain a panel of AP 210, RF 220 and FPC 101.
  • the soldering is completed by SMT equipment, which can realize the process from taking SMD device 100 to solidification to form solder joints by the equipment automatically, which is the same as the hot-pressing soldering process requiring manual participation. It can improve the processing efficiency and increase the output per hour in mass production.
  • the profiling suction nozzle can also be used to realize the hardening of FPC 101.
  • the profiling suction nozzle can also be used to realize the hardening of FPC 101.
  • the embodiment of this application takes the process flow of interconnection between soft and hard boards as an example for introduction, but the process flow provided in the embodiment of this application can also be used in other scenarios, such as interconnection between FPCs.
  • the embodiment does not limit this.
  • the FPC placed on the PCB support frame may be hardened by a reinforcing plate, or may be an unhardened FPC, which is not limited in the embodiment of the present application.
  • the interconnection products between the soft-hard boards provided in the embodiments of the present application can be used in electronic devices.
  • Electronic devices can be implemented as any of the following devices that include a camera: mobile phones, tablet computers (pad), portable game consoles, handheld computers (personal digital assistant, PDA), notebook computers, ultra mobile personal computers (UMPC) ), handheld computers, netbooks, vehicle-mounted media playback devices, wearable electronic devices, virtual reality (VR) terminal devices, augmented reality (augmented reality, AR) terminal devices and other digital display products.

Abstract

一种柔性电路板与印刷电路板的焊接方法、器件，该焊接方法包括：通过胶（102）在柔性电路板（101）上粘合补强板（103），得到表面组装类器件（100）；将所述表面组装类器件（100）利用表面组装技术焊接在第一电路板上，以将所述柔性电路板（101）与所述第一电路板焊接；将所述补强板（103）和所述胶（102）从所述表面组装类器件（100）上剥离，得到所述柔性电路板（101）与所述第一电路板的互联器件。该方法可以减小软-硬板板间互联产品所占据的布局空间。

Description

柔性电路板与印刷电路板的焊接方法、器件
本申请要求在2019年4月26日提交中国国家知识产权局、申请号为201910344312.7的中国专利申请的优先权，发明名称为“柔性电路板与印刷电路板的焊接方法、器件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及一种柔性电路板与印刷电路板的焊接方法、器件。
背景技术
当前，手机、平板等电子设备不断发展。这些电子设备中印制电路板(printed circuit board，PCB)和柔性电路板(flexible printed circuit，FPC)应用十分普遍。软-硬板板间互联(FPC on board，FOB)技术可实现将FPC和PCB焊接在一起。目前，软-硬板板间互联技术可包括：板对板连接器(board to board，BTB)方案、异向导电胶膜(anisotropic conductive film，ACF)工艺和热压熔锡焊接工艺(hotbar)。
BTB方案中，FPC和PCB上分别焊接一个BTB，通过这两个BTB机械扣合来实现FPC和PCB互联。然而BTB方案中由于BTB体积限制，不利于软-硬板板间互联产品的小型化。另外，机械扣合方式连接的可靠性差。往往需要额外增加钢片锁合这两个BTB，进一步增加了布局空间。
如图1所示，ACF 300包含导电粒子301和胶体302。FPC焊盘1011和PCB焊盘201通过导电粒子301导通，从而实现FPC 101和PCB 200的焊接。ACF工艺中，两焊盘之间需要热压实现导通。热压在PCB 200上对应的背面区域不能布设器件，以减少热压对器件的损坏，FPC 101上热压区域也不能布设器件，从而增大了PCB 200和FPC 101的布局空间。且FPC焊盘1011和PCB焊盘201宽度较大，进一步增大了布局空间。ACF工艺中，焊接位置的导电通流能力相比BTB或焊锡连接的偏弱，且维修难度高。
热压熔锡焊接工艺中，预先分别在FPC和PCB的焊盘上预置锡膏和助焊剂，再通过脉冲热压头加热来实现两焊盘之间导通，从而实现FPC和PCB板间焊接。与ACF工艺类似，由于需要热压，热压在PCB上对应的背面区域不能布设器件，FPC上热压区域也不能布设器件，增大了PCB和FPC的布局空间。
发明内容
本申请公开了一种柔性电路板与印刷电路板的焊接方法、器件，可减小软-硬板板间互联产品所占据的布局空间。
第一方面，本申请实施例提供一种焊接方法，所述方法包括：通过胶在柔性电路板上粘合补强板，得到表面组装类器件；将所述表面组装类器件利用表面组装技术焊接在第一电路板上，以将所述柔性电路板与所述第一电路板焊接；将所述补强板和所述胶从所述表面组装类器件上剥离，得到所述柔性电路板与所述第一电路板的互联器件。
上述的焊接方法，可利用SMT来实现FPC与PCB之间的焊接。FPC与PCB之间的焊接 结构为锡膏，从而节省了软-硬板板间互联产品所占据的布局空间。另外，利用SMT焊接过程无需热压，从而FPC与PCB均不需要考虑热压进行器件禁布，节省了软-硬板板间互联产品所占据的布局空间。
通过SMT设备完成焊接，可实现从取SMD类器件到固化形成焊点的过程由设备自动完成。与热压熔锡焊接工艺中需手动参与相比，可提高加工效率，在量产中提高单位小时产量。
可选的，补强板可以是玻纤材质或者不锈钢材质。
在一种可能的实现方式中，所述胶的第一面的粘度大于第二面的粘度，所述第一面为与所述补强板接触的面，所述第二面为与所述柔性电路板接触的面。
上述两面粘度不同的胶粘接补强板和FPC后，由于与FPC粘接的一面的粘度远小于与补强板粘接的一面的粘度，该胶在被剥离时可残留在补强板上。从而减少了剥离FPC上补强板和胶之后FPC上的残胶，且可实现将补强板和胶一起从FPC上剥离，提高加工效率。
可选的，第一面的粘度使得胶从补强板剥离180度时需要的剥离力大于或等于4N/cm。与FPC粘接的一面(第二面)的粘度使得从FPC剥离180度时需要的剥离力小于或等于0.2N/mm。
在一种可能的实现方式中，所述第一面和所述第二面中每一面的粘度均大于或等于第一阈值。使用该粘度的胶粘接补强板和FPC，在剥离补强板和胶的过程中，可便利地从FPC上剥离开，提高加工效率。胶的粘度通过将胶拉到偏离180度时需要的剥离力表示，该剥离力可以小于或等于0.1N/cm。
在一种可能的实现方式中，所述补强板和所述柔性电路板在形状、尺寸上相同；或者所述补强板与所述柔性电路板之间的形状相似度大于或等于第二阈值，所述补强板与所述柔性电路板之间的尺寸相似度大于或等于第三阈值。
示例性的，第二阈值和第三阈值可以取值65％～95％，具体如第二阈值为75％，第三阈值为80％。
在一种可能的实现方式中，所述第一电路板上包含第一焊盘；所述柔性电路板上包含第二焊盘；所述将所述表面组装类器件利用表面组装技术焊接在第一电路板上，包括：在所述第一焊盘上印刷锡膏；将所述表面组装类器件贴合在所述第一电路板上，使得所述第一焊盘通过所述锡膏与所述第二焊盘贴合；将所述锡膏回流固化形成焊点，使得所述第一焊盘和所述第二焊盘通过所述焊点导通。
可选的，第二焊盘可包含透锡孔，也可以不包含透锡孔，本申请实施例对此不作限定。如果第二焊盘上包含透锡孔，在软-硬板板间焊接完成后可便于焊点的外观检测，并提高焊接强度。
补强板可粘接在FPC上没有焊盘的一面。
由于FPC焊盘与对应的PCB焊盘之间通过锡膏焊接。与通过热压焊锡焊接相比，锡膏焊接使得需要拆分FPC和PCB时便于拆除。从而降低了维修难度，可通过手工维修，也可将锡膏清除后通过SMT设备重新焊接。
在一种可能的实现方式中，所述第一电路板经过有机保焊膜处理，所述锡膏中包含助焊剂。如果PCB进行了有机保焊膜处理，可在锡膏中加入助焊剂。OSP处理后的PCB表面包含一层有机膜，该有机膜可被助焊剂清除。上述的软-硬板板间焊接方法可应用于OSP处理的PCB与FPC焊接的场景。而热压熔锡焊接工艺中由于焊锡未加助焊剂，不能用于OSP处理的PCB与FPC焊接。因此，与热压熔锡焊接工艺相比，上述的软-硬板板间焊接方法可应 用在更广泛的场景中。
与使用ACF焊接相比，由于ACF中包含胶体，锡膏的导通能力高于ACF。上述使用锡膏进行软-硬板板间焊接的方法，可提高软-硬板板间互联产品的信号通流能力和传递高速信号的能力。
其中，第一电路板可以是本申请实施例提供的印刷电路板。第一电路板还可以是柔性电路板。
可选的，印刷电路板上还可以包含FPC预估定胶条。该预估定胶条可对包含FPC的SMD类器件起到预估定作用，即限定SMD类器件所放置的位置，提高SMD类器件贴合位置的准确性。
其中，表面组装技术可通过SMT设备实现。SMT设备可包括PCB支撑架、吸嘴、视觉系统、料盒和控制系统。
将PCB置于PCB支撑架上，将多个SMD类器件置于料盒中。预先设计SMD类器件贴合在PCB上的坐标位置，并将该坐标位置输入给控制系统。控制系统控制吸嘴从料盒中吸取SMD类器件。控制系统根据坐标位置将SMD类器件贴合在PCB上对应的位置。
其中，视觉系统可通过摄像头获取吸嘴吸附SMD类器件的位置。然后反馈给控制系统。控制系统根据视觉系统的反馈调整吸嘴吸附SMD类器件的位置，从而将SMD类器件精确贴合在PCB上对应的位置，使得FPC焊盘(第二焊盘)与对应的PCB焊盘(第一焊盘)通过锡膏接触。
其中，可将通过锡膏接触的表面组装类器件和PCB放入回流焊炉。回流焊炉通过红外热源、热风或者红外热风使得锡膏固化形成焊点，以完成FPC焊盘(第二焊盘)与对应的PCB焊盘(第一焊盘)之间的焊接。
第二方面，本申请实施例提供一种焊接方法，该方法包括：通过表面组装设备的吸嘴吸附柔性电路板，以硬化所述柔性电路板；所述吸嘴上，接触所述柔性电路板的面与所述柔性电路板在形状、尺寸上相同或相似；控制所述吸嘴释放所述柔性电路板，使得所述柔性电路板与第一电路板贴合；经过回流固化将所述柔性电路板焊接在所述第一电路板上。
该吸嘴即本申请实施例中的仿形吸嘴。由于仿形吸嘴与FPC形状、尺寸相同或相似，将FPC吸附起来之后可实现FPC的共面度较小，通过仿形吸嘴实现FPC的硬化。从而减少了在贴合FPC和PCB时，FPC折叠、变形，提高FPC与PCB焊接的准确性。
可根据FPC的形状设计仿形吸嘴上与FPC接触面的形状，使得仿形吸嘴吸附FPC之后，FPC的共面度小于1毫米。
可选的，仿形吸嘴上与FPC接触面的形状使得吸附FPC之后，FPC的共面度小于0.2毫米或者FPC的共面度小于0.1毫米。
通过仿形吸嘴上与FPC接触面的形状设计，实现在使用仿形吸嘴吸附FPC时，利用仿形吸嘴将FPC硬化。在利用仿形吸嘴将FPC贴合在PCB上之后仿形吸嘴通过气孔自动释放FPC。减少了粘接补强板的步骤，也减少了完成焊接后剥离补强板的步骤，从而节省工艺流程，提高加工效率。
在一种可能的实现方式中，所述接触所述柔性电路板的面与所述柔性电路板之间形状相似度大于或等于第四阈值，所述接触所述柔性电路板的面与所述柔性电路板之间尺寸相似度大于或等于第五阈值。
其中，第四阈值例如60％～95％，具体如取值80％。第五阈值例如60％～95％，具体如取 值85％。
在一种可能的实现方式中，所述第一电路板上包含第一焊盘；所述柔性电路板上包含第二焊盘；所述控制所述吸嘴释放所述柔性电路板，使得所述柔性电路板与第一电路板贴合之前，所述方法还包括：在所述第一焊盘上印刷锡膏；所述控制所述吸嘴释放所述柔性电路板，使得所述柔性电路板与第一电路板贴合，包括：将所述表面组装类器件贴合在所述第一电路板上，使得所述第一焊盘通过所述锡膏与所述第二焊盘贴合；将所述锡膏回流固化形成焊点，使得所述第一焊盘和所述第二焊盘通过所述焊点导通。
在一种可能的实现方式中，所述第一电路板为印刷电路板。
本申请实施例中，第一电路板还可以是印刷电路板组件，柔性电路板还可以是柔性电路板组件。
第三方面，本申请实施例提供一种电路板互联器件，所述电路板互联器件包含柔性电路板和第一电路板；所述柔性电路板焊接在所述第一电路板上；所述电路板互联器件通过第一方面、第二方面、第一方面的任意一种实现方式或者第三方面的任意一种实现方式所述的焊接方法得到。
可以理解地，上述提供的第三方面所述的电路板互联器件通过第一方面、第二方面、第一方面的任意一种实现方式或者第三方面的任意一种实现方式所述的焊接方法得到。因此，其所能达到的有益效果可参考对应方法中的有益效果，此处不再赘述。
第四方面，本申请实施例提供一种吸嘴，该吸嘴用在表面组装设备上，所述表面组装设备用于将柔性电路板利用表面组装技术焊接在第一电路板上；所述吸嘴，用于吸附所述柔性电路板以硬化所述柔性电路板，得到表面组装类器件；所述吸嘴，还用于释放所述柔性电路板，使得所述柔性电路板与所述第一电路板贴合并经过回流固化焊接在所述第一电路板上。
上述的吸嘴在用于软硬板互联方法时，由于仿形吸嘴与FPC形状、尺寸相同或相似，将FPC吸附起来之后可实现FPC的共面度较小，通过仿形吸嘴实现FPC的硬化。从而减少了在贴合FPC和PCB时，FPC折叠、变形，提高FPC与PCB焊接的准确性。
在一种可能的实现方式中，所述吸嘴上，接触所述柔性电路板的面与所述柔性电路板在形状、尺寸上相同；或者所述接触所述柔性电路板的面与所述柔性电路板之间形状相似度大于或等于第二阈值，所述接触所述柔性电路板的面与所述柔性电路板之间尺寸相似度大于或等于第三阈值。
通过仿形吸嘴上与FPC接触面的形状设计，实现在使用仿形吸嘴吸附FPC时，利用仿形吸嘴将FPC硬化。在利用仿形吸嘴将FPC贴合在PCB上之后仿形吸嘴通过气孔自动释放FPC。减少了粘接补强板的步骤，也减少了完成焊接后剥离补强板的步骤，从而节省工艺流程，提高加工效率。
在一种可能的实现方式中，所述吸嘴上包含气孔，所述气孔用于所述吸嘴吸附或释放所述柔性电路板。
通过气孔将FPC与仿形吸嘴之间的空气排出，实现将FPC吸附起来。且由于仿形吸嘴与FPC形状、尺寸相同或相似，将FPC吸附起来之后可实现FPC的共面度较小，即通过仿形吸嘴实现FPC的硬化。从而减少了在贴合FPC和PCB时，FPC折叠、变形，提高FPC与PCB焊接的准确性。
附图说明
下面对本申请实施例用到的附图进行介绍。
图1是现有技术提供的一种ACF工艺示意图；
图2是本申请实施例提供的一种柔性电路板与印刷电路板的焊接方法的流程示意图；
图3是本申请实施例提供的一种柔性电路板与印刷电路板的焊接流程的示意图；
图4是本申请实施例提供的一种SMT设备的结构示意图；
图5是本申请实施例提供的一种FPC和仿形吸嘴的结构示意图；
图6是本申请实施例提供的一种AP、RF与FPC连接的工艺流程示例。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。本申请实施例的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
为减小软-硬板板间互联产品所占据的布局空间，本申请实施例提供一种柔性电路板与印刷电路板的焊接方法和器件。
该焊接方法中，首先，将FPC硬化，例如在FPC上利用胶粘上硬质补强板。然后，利用表面组装技术(surface mount technology，SMT)将硬化的FPC类似于表面组装元件(surface mounted devices，SMD)贴合在PCB上。之后经过回流固化完成焊接。最后将补强板从FPC上剥离。
下面具体介绍本申请实施例提供的柔性电路板与印刷电路板的焊接方法。请一并参阅图2和图3，图2是本申请实施例提供的一种柔性电路板与印刷电路板的焊接方法的流程示意图。图3是本申请实施例提供的一种柔性电路板与印刷电路板的焊接流程的示意图。如图2所示，该柔性电路板与印刷电路板的焊接方法包括步骤S101～S104。
S101、将FPC 101和补强板103通过胶102粘接，以硬化得到SMD类器件100。
S102、将SMD类器件100利用SMT设备贴合在PCB 200上。
S103、通过回流固化完成SMD类器件100和PCB 200的焊接。
S104、将SMD类器件100上的补强板103和胶102从FPC 101上剥离。
其中，本申请实施例对补强板103的形状、尺寸不作限定。可选的，补强板103的形状可以是和FPC 101的形状相同。补强板103的尺寸也可以是和FPC 101的尺寸相同。例如，FPC 101的形状是长方形，则补强板103的形状也是长方形。补强板103的长、宽可以是和FPC 101的长、宽相同。
可选的，补强板103和FPC 101可以在形状、尺寸上相似，例如形状、尺寸相似度均大于设定阈值(如65％～95％，具体如形状相似度为75％，尺寸相似度为80％)。
其中，补强板103和FPC 101的形状相似度为第二阈值，尺寸相似度为第三阈值。
示例性的，补强板103可以是玻纤材质或者不锈钢材质。其厚度例如是0.1～0.2mm，还可以是其他厚度值。如图3中的(a)所示，FPC 101上可包含FPC焊盘1011。补强板103可粘接在FPC 101上没有焊盘的一面。
下面对步骤S101和S104中的胶102，进行说明。
该胶102两面粘度可以相同。为了粘接补强板103和FPC 101，并在步骤S104中方便剥离补强板103和胶102，胶102的粘度通过将胶102拉到偏离180度时需要的剥离力表示，该剥离力可以小于或等于1.0N/cm。使用该粘度的胶102粘接补强板103和FPC 101，在剥离补强板103和胶102的过程中，可便利地从FPC 101上剥离开，提高加工效率。
可选的，胶102两面的粘度可以不同。胶102与补强板103粘接的一面的粘度使得从补强板103剥离180度时需要的剥离力大于或等于4N/cm。与FPC 101粘接的一面的粘度使得从FPC 101剥离180度时需要的剥离力小于或等于0.2N/mm。上述两面粘度不同的胶102粘接补强板103和FPC 101后，由于与FPC 101粘接的一面的粘度远小于与补强板103粘接的一面的粘度，该胶102在执行步骤S104剥离时可残留在补强板103上。从而减少了剥离FPC 101上补强板103和胶102之后FPC 101上的残胶，且可实现将补强板103和胶102一起从FPC 101上剥离，提高加工效率。
可选的，为了保证胶102能够将补强板103和FPC 101粘合，将该胶102剥离180度时需要的剥离力可大于或等于第一阈值，第一阈值例如0.1N/mm。
可以理解的，上述对胶102的粘度的举例仅用于解释本申请实施例，不应构成限定。
关于步骤S102～S103中SMD类器件100和PCB 200的焊接过程进行说明。如图3中的(c)所示，PCB 200上可包含焊盘201。如图3中的(a)和(c)所示，FPC 101上也可对应包含焊盘1011。可预先在PCB焊盘201上印刷锡膏。锡膏中还可以包含助焊剂。如图3中的(c)和(d)所示，利用SMT设备将SMD类器件100贴合在PCB 200上，使得FPC焊盘1011与对应的PCB焊盘201通过锡膏接触。之后置于回流焊炉中使得FPC焊盘1011与对应的PCB焊盘201之间的锡膏回流固化形成焊点，则完成了SMD类器件100和PCB 200的焊接。
下面对利用SMT设备将SMD焊接到PCB的过程进行介绍。以下介绍本申请实施例涉及的SMT设备。请参阅图4，图4是本申请实施例提供的一种SMT设备的结构示意图。如图4所示，SMT设备可包括PCB支撑架400、吸嘴500、视觉系统600、料盒700和控制系统800。
将PCB 200置于PCB支撑架400上，将多个SMD类器件100置于料盒700中。预先设计SMD类器件100贴合在PCB 200上的坐标位置，并将该坐标位置输入给控制系统800。控制系统800控制吸嘴500从料盒700中吸取SMD类器件100。控制系统800根据坐标位置将SMD类器件100贴合在PCB 200上对应的位置。
其中，视觉系统600可通过摄像头获取吸嘴500吸附SMD类器件100的位置。然后反馈给控制系统800。控制系统800根据视觉系统600的反馈调整吸嘴500吸附SMD类器件100的位置，从而将SMD类器件100精确贴合在PCB 200上对应的位置，使得FPC焊盘1011与对应的PCB焊盘201通过锡膏接触。
将锡膏回流固化形成焊点，以完成SMD类器件100和PCB 200的焊接。具体的，可将通过锡膏接触的FPC 101和PCB 200放入回流焊炉。回流焊炉通过红外热源、热风或者红外热风使得锡膏固化形成焊点，以完成FPC焊盘1011与对应的PCB焊盘201之间的焊接。
上述的焊接方法，可利用SMT来实现FPC 101与PCB 200之间的焊接。FPC 101与PCB 200之间的焊接结构为锡膏，从而节省了软-硬板板间互联产品所占据的布局空间。另外，利用SMT焊接过程无需热压，从而FPC 101与PCB 200均不需要考虑热压进行器件禁布，节省了软-硬板板间互联产品所占据的布局空间。
通过SMT设备完成焊接，可实现从取SMD类器件100到固化形成焊点的过程由设备自动完成。与热压熔锡焊接工艺中需手动参与相比，可提高加工效率，在量产中提高单位小时产量(unit per hour，UPH)。
由于FPC焊盘1011与对应的PCB焊盘201之间通过锡膏焊接。与通过热压焊锡焊接相比，锡膏焊接使得需要拆分FPC 101和PCB 200时便于拆除。从而降低了维修难度，可通过 手工维修，也可将锡膏清除后通过SMT设备重新焊接。
如果PCB 200上进行了有机保焊膜(organic solderability preservatives，OSP)处理，可在步骤S102的锡膏中加入助焊剂。OSP处理后的PCB表面包含一层有机膜，该有机膜可被助焊剂清除。上述的软-硬板板间焊接方法可应用于OSP处理的PCB 200与FPC焊接的场景。而热压熔锡焊接工艺中由于焊锡未加助焊剂，不能用于OSP处理的PCB与FPC焊接。因此，与热压熔锡焊接工艺相比，上述的软-硬板板间焊接方法可应用在更广泛的场景中。
与使用ACF焊接相比，由于ACF中包含胶体，锡膏的导通能力高于ACF。上述使用锡膏进行软-硬板板间焊接的方法，可提高软-硬板板间互联产品的信号通流能力和传递高速信号的能力。
可选的，本申请实施例提供的FPC焊盘1011可包含透锡孔，也可以不包含透锡孔，本申请实施例对此不作限定。如果FPC焊盘1011上包含透锡孔，在软-硬板板间焊接完成后可便于焊点的外观检测，并提高焊接强度。
可选的，如图3中的(c)所示，PCB 200上还可以包含FPC预估定胶条202。该预估定胶条202可对包含FPC 101的SMD类器件100起到预估定作用，即限定SMD类器件100所放置的位置，提高SMD类器件100贴合位置的准确性。
其中，第一电路板可以是本申请实施例提供的印刷电路板。第一电路板还可以是柔性电路板。PCB焊盘201即本申请实施例提供的第一焊盘，FPC焊盘1011即本申请实施例提供的第二焊盘。胶102的第一面为与补强板103接触的面，第二面为与柔性电路板101接触的面。
在本申请的另一些实施例中，可通过设计SMT设备中吸嘴的形状来利用吸嘴实现FPC的硬化。则无需在FPC 101上粘连补强板103，即可实现FPC 101的硬化。具体的，请参阅图5，图5是本申请实施例提供的一种FPC和仿形吸嘴的结构示意图。如图5中的(a)所示，FPC 101上包含FPC焊盘1011。如图5中的(b)所示，可根据FPC 101的形状设计仿形吸嘴900上与FPC 101接触面的形状，使得仿形吸嘴900吸附FPC 101之后，FPC 101的共面度小于1毫米。
其中，共面度的概念：以被吸附后FPC 101上三个最低位置形成的平面为基准面，其余位置与该基准面的最大偏差。
可选的，仿形吸嘴900上与FPC 101接触面的形状使得吸附FPC 101之后，FPC 101的共面度小于0.2毫米或者FPC 101的共面度小于0.1毫米。
示例性的，图5中的(b)是仿形吸嘴900的仰视图，该图所显示平面是与FPC 101接触的面。如图5中的(b)所示，仿形吸嘴900上与FPC 101接触面的形状、尺寸可以和FPC 101相同。或者仿形吸嘴900上与FPC 101接触面的形状、尺寸可以和FPC 101相似。例如，仿形吸嘴900上，接触FPC 101的面和FPC 101之间形状的相似度大于或等于第四阈值(第四阈值例如60％～95％，具体如取值80％)。接触FPC 101的面和FPC 101之间尺寸的相似度也可以大于或等于第五阈值(第五阈值例如60％～95％，具体如取值85％)。
本申请实施例对上述形状相似度和尺寸相似度的计算方法不作限定。
在一些可能的实现方式中，如图5中的(b)和(c)所示，仿形吸嘴900上包含气孔901。通过气孔901将FPC 101与仿形吸嘴900之间的空气排出，实现将FPC 101吸附起来。且由于仿形吸嘴900与FPC 101形状、尺寸相同或相似，将FPC 101吸附起来之后可实现FPC 101的共面度较小，即通过仿形吸嘴900实现FPC 101的硬化。从而减少了在贴合FPC 101和PCB  200时，FPC 101折叠、变形，提高FPC 101与PCB 200焊接的准确性。
该仿形吸嘴900可替代图4所示示例中的吸嘴500完成SMT设备将FPC 101贴合在PCB200的过程。
通过仿形吸嘴900上与FPC 101接触面的形状设计，实现在使用仿形吸嘴900吸附FPC 101时，利用仿形吸嘴900将FPC 101硬化。在利用仿形吸嘴900将FPC 101贴合在PCB 200上之后仿形吸嘴900通过气孔901自动释放FPC 101。减少了粘接补强板的步骤，也减少了完成焊接后剥离补强板的步骤，从而节省工艺流程，提高加工效率。
本申请实施例对仿形吸嘴900上的气孔901的数量和形状不作限定。
关于FPC 101贴合在PCB 200上，经过回流固化完成焊接的过程，可参考图2所描述示例中步骤S102～S103中SMD类器件100焊接在PCB 200上的描述，这里不再赘述。
本申请实施例中，PCB 200还可以是印刷电路板组件(printed circuit board assembly，PCBA)，FPC 101也可以是柔性电路板组件(flexible printed circuit assembly，FPCA)。
下面介绍一种使用图2所描述的焊接方法来实现FPC与PCB连接的示例。电子设备中的应用处理器(application processor，AP)、射频模块(radio frequency，RF)可与FPC连接。请参阅图6，图6是本申请实施例提供的一种AP、RF与FPC连接的工艺流程示例。
如图6中的(a)所示，经过步骤S101～S103，AP 210、RF 220均与SMD类器件100通过焊点焊接。焊点由回流固化使得锡膏固化形成。具体的，锡膏可位于焊盘上。焊盘之间通过固化的锡膏焊接，以实现AP 210、RF 220均与SMD类器件100通过焊点焊接，具体参考图3中的(c)所示示例的描述。SMD类器件100是FPC 101和补强板103通过胶102粘接而来的。
如图6中的(b)所示，经过步骤S104，实现将SMD类器件100上的补强板103和胶102从FPC 101上剥离，得到AP 210、RF 220与FPC101的拼板。
如图6中的(c)所示，由于FPC101是柔性的，可在FPC101位置将AP 210、RF 220与FPC101的拼板进行折叠，并通过螺钉1000固定AP 210和RF220，可形成稳固的叠层架构。
上述AP、RF与FPC连接的工艺流程中，通过SMT设备完成焊接，可实现从取SMD类器件100到固化形成焊点的过程由设备自动完成，与热压熔锡焊接工艺中需手动参与相比，可提高加工效率，在量产中提高单位小时产量。
其中，图6所示的AP、RF与FPC连接的工艺流程示例中，还可以利用仿形吸嘴来实现FPC 101的硬化，具体可参加图5所描述示例。
可以理解的，本申请实施例以软-硬板板间互联工艺流程为例进行介绍，但是本申请实施例所提供的工艺流程还可以用于其他场景，例如FPC之间的互联等，本申请实施例对此不作限定。
对于FPC之间的互联，其中放在PCB支撑架上的FPC可以是通过补强板硬化的，也可以是未硬化过的FPC，本申请实施例对此不作限定。
本申请实施例提供的软-硬板板间互联产品可用于电子设备。电子设备可以实现为以下任意一种包含摄像头的设备：手机、平板电脑(pad)、便携式游戏机、掌上电脑(personal digital assistant，PDA)、笔记本电脑、超级移动个人计算机(ultra mobile personal computer，UMPC)、手持计算机、上网本、车载媒体播放设备、可穿戴电子设备、虚拟现实(virtual reality，VR) 终端设备、增强现实(augmented reality，AR)终端设备等数显产品。
以上所述，仅为本申请实施例的具体实施方式，但本申请实施例的保护范围并不局限于此，任何在本申请实施例揭露的技术范围内的变化或替换，都应涵盖在本申请实施例的保护范围之内。因此，本申请实施例的保护范围应以所述权利要求的保护范围为准。

Claims (15)

  1. 一种焊接方法，其特征在于，所述方法包括：
    通过胶在柔性电路板上粘合补强板，得到表面组装类器件；
    将所述表面组装类器件利用表面组装技术焊接在第一电路板上，以将所述柔性电路板与所述第一电路板焊接；
    将所述补强板和所述胶从所述表面组装类器件上剥离，得到所述柔性电路板与所述第一电路板的互联器件。
  2. 根据权利要求1所述的方法，其特征在于，所述胶的第一面的粘度大于第二面的粘度，所述第一面为与所述补强板接触的面，所述第二面为与所述柔性电路板接触的面。
  3. 根据权利要求1或2所述的方法，其特征在于，所述第一面和所述第二面中每一面的粘度均大于或等于第一阈值。
  4. 根据权利要求1至3任一项所述的方法，其特征在于，所述补强板和所述柔性电路板在形状、尺寸上相同；或者所述补强板与所述柔性电路板之间的形状相似度大于或等于第二阈值，所述补强板与所述柔性电路板之间的尺寸相似度大于或等于第三阈值。
  5. 根据权利要求1至4任一项所述的方法，其特征在于，所述第一电路板上包含第一焊盘；所述柔性电路板上包含第二焊盘；
    所述将所述表面组装类器件利用表面组装技术焊接在第一电路板上，包括：
    在所述第一焊盘上印刷锡膏；
    将所述表面组装类器件贴合在所述第一电路板上，使得所述第一焊盘通过所述锡膏与所述第二焊盘贴合；
    将所述锡膏回流固化形成焊点，使得所述第一焊盘和所述第二焊盘通过所述焊点导通。
  6. 根据权利要求5所述的方法，其特征在于，所述第一电路板经过有机保焊膜处理，所述锡膏中包含助焊剂。
  7. 根据权利要求1至6任一项所述的方法，其特征在于，所述第一电路板为印刷电路板。
  8. 一种焊接方法，其特征在于，所述方法包括：
    通过表面组装设备的吸嘴吸附柔性电路板，以硬化所述柔性电路板；所述吸嘴上，接触所述柔性电路板的面与所述柔性电路板在形状、尺寸上相同或相似；
    控制所述吸嘴释放所述柔性电路板，使得所述柔性电路板与第一电路板贴合；
    经过回流固化将所述柔性电路板焊接在所述第一电路板上。
  9. 根据权利要求8所述的方法，其特征在于，所述接触所述柔性电路板的面与所述柔性电路板之间形状相似度大于或等于第四阈值，所述接触所述柔性电路板的面与所述柔性电路 板之间尺寸相似度大于或等于第五阈值。
  10. 根据权利要求8或9所述的方法，其特征在于，所述第一电路板上包含第一焊盘；所述柔性电路板上包含第二焊盘；
    所述控制所述吸嘴释放所述柔性电路板，使得所述柔性电路板与第一电路板贴合之前，所述方法还包括：
    在所述第一焊盘上印刷锡膏；
    所述控制所述吸嘴释放所述柔性电路板，使得所述柔性电路板与第一电路板贴合，包括：
    将所述表面组装类器件贴合在所述第一电路板上，使得所述第一焊盘通过所述锡膏与所述第二焊盘贴合；
    将所述锡膏回流固化形成焊点，使得所述第一焊盘和所述第二焊盘通过所述焊点导通。
  11. 根据权利要求8至10任一项所述的方法，其特征在于，所述第一电路板为印刷电路板。
  12. 一种电路板互联器件，其特征在于，所述电路板互联器件包含柔性电路板和第一电路板；所述柔性电路板焊接在所述第一电路板上；所述电路板互联器件通过如权利要求1至11任一项所述的焊接方法得到。
  13. 一种吸嘴，其特征在于，所述吸嘴用在表面组装设备上，所述表面组装设备用于将柔性电路板利用表面组装技术焊接在第一电路板上；
    所述吸嘴，用于吸附所述柔性电路板以硬化所述柔性电路板，得到表面组装类器件；
    所述吸嘴，还用于释放所述柔性电路板，使得所述柔性电路板与所述第一电路板贴合并经过回流固化焊接在所述第一电路板上。
  14. 根据权利要求13所述的吸嘴，其特征在于，所述吸嘴上，接触所述柔性电路板的面与所述柔性电路板在形状、尺寸上相同；或者
    所述接触所述柔性电路板的面与所述柔性电路板之间形状相似度大于或等于第二阈值，所述接触所述柔性电路板的面与所述柔性电路板之间尺寸相似度大于或等于第三阈值。
  15. 根据权利要求13或14所述的吸嘴，其特征在于，所述吸嘴上包含气孔，所述气孔用于所述吸嘴吸附或释放所述柔性电路板。
PCT/CN2020/085560 2019-04-26 2020-04-20 柔性电路板与印刷电路板的焊接方法、器件 WO2020216169A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910344312.7 2019-04-26
CN201910344312.7A CN111867274A (zh) 2019-04-26 2019-04-26 柔性电路板与印刷电路板的焊接方法、器件

Publications (1)

Publication Number Publication Date
WO2020216169A1 true WO2020216169A1 (zh) 2020-10-29

Family

ID=72940743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/085560 WO2020216169A1 (zh) 2019-04-26 2020-04-20 柔性电路板与印刷电路板的焊接方法、器件

Country Status (2)

Country Link
CN (1) CN111867274A (zh)
WO (1) WO2020216169A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114501791A (zh) * 2020-11-12 2022-05-13 荣耀终端有限公司 电路板组件及电子设备
CN113745202A (zh) * 2021-06-04 2021-12-03 荣耀终端有限公司 封装模组及其制作方法、电子设备
CN115023037B (zh) * 2021-09-18 2023-04-11 荣耀终端有限公司 电路板组件以及电子设备
CN114630490B (zh) * 2022-03-31 2023-08-04 苏州浪潮智能科技有限公司 一种柔性电路板及焊盘连接系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101384136A (zh) * 2008-10-17 2009-03-11 林克治 软性线路板表面贴装工艺及其使用的磁性治具和钢网
CN101702870A (zh) * 2009-11-16 2010-05-05 深圳华为通信技术有限公司 一种柔性板和刚性板的互连方法和系统
US20160066436A1 (en) * 2014-09-01 2016-03-03 Quanta Computer Inc. Method for fabricating circuit board structure
CN105578763A (zh) * 2016-03-09 2016-05-11 深圳市信维通信股份有限公司 一种防止接触弹脚歪斜的fpc及其制造方法
CN109041444A (zh) * 2017-06-12 2018-12-18 宁波舜宇光电信息有限公司 线路板加工方法
CN208353738U (zh) * 2018-06-15 2019-01-08 无锡市德科立光电子技术有限公司 用于fpc贴装pcb板的工装

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6721187B2 (en) * 2001-03-16 2004-04-13 International Business Machines Corporation Multi-layered high density connections
CN107454756B (zh) * 2017-07-12 2019-11-15 维沃移动通信有限公司 一种fpc器件贴片方法、fpc组件及终端

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101384136A (zh) * 2008-10-17 2009-03-11 林克治 软性线路板表面贴装工艺及其使用的磁性治具和钢网
CN101702870A (zh) * 2009-11-16 2010-05-05 深圳华为通信技术有限公司 一种柔性板和刚性板的互连方法和系统
US20160066436A1 (en) * 2014-09-01 2016-03-03 Quanta Computer Inc. Method for fabricating circuit board structure
CN105578763A (zh) * 2016-03-09 2016-05-11 深圳市信维通信股份有限公司 一种防止接触弹脚歪斜的fpc及其制造方法
CN109041444A (zh) * 2017-06-12 2018-12-18 宁波舜宇光电信息有限公司 线路板加工方法
CN208353738U (zh) * 2018-06-15 2019-01-08 无锡市德科立光电子技术有限公司 用于fpc贴装pcb板的工装

Also Published As

Publication number Publication date
CN111867274A (zh) 2020-10-30

Similar Documents

Publication Publication Date Title
WO2020216169A1 (zh) 柔性电路板与印刷电路板的焊接方法、器件
JPWO2014024338A1 (ja) 部品実装基板の製造方法及び製造システム
WO2023279449A1 (zh) 显示模组及其制备方法、移动终端
CN203311370U (zh) 用于连接触摸屏与fpc的连接装置、触摸屏模组及电子设备
CN107111170B (zh) 柔性显示模组的绑定方法
WO2013146572A1 (ja) 接続体の製造方法、接続方法
JP2012059814A (ja) 電子部品装置およびその製造方法
WO2019205430A1 (zh) 面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法
CN101303443A (zh) 相机模组及其组装方法
JP2006202806A (ja) 圧着装置および圧着方法
WO2021036160A1 (zh) 覆晶薄膜及显示装置
JP2018056279A (ja) 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム
CN103079342B (zh) 一种柔性电路板及电路连接设备
CN114527589A (zh) 绑定装置及显示面板的制作方法
KR100711585B1 (ko) 초음파를 이용하여 연성 프린트 기판과 경성 프린트 기판을상온에서 직접 접합하기 위한 방법
CN100454669C (zh) 电性连接装置、包含该电性连接装置的电子装置及电子产品
WO2023124804A1 (zh) 一种电路板组件及电子设备
CN109429438B (zh) 薄膜显示器与软性电路板的压合方法及其压合装置
CN102364995A (zh) Fpc的金手指
JP5344018B2 (ja) 配線板接続体および配線板モジュール
US20070285905A1 (en) Electronic device, display apparatus, flexible circuit board and fabrication method thereof
TWI607884B (zh) Pressing method of thin film display and flexible circuit board and pressing device thereof
JP2010050308A (ja) 電子部品の接着方法、回路基板、及び電子機器
CN206402519U (zh) 一种适用于多层拼板的fpc线路板结构
JP2006210504A (ja) 電子デバイスの接続方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20794067

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20794067

Country of ref document: EP

Kind code of ref document: A1