WO2019205430A1 - 面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法 - Google Patents

面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法 Download PDF

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Publication number
WO2019205430A1
WO2019205430A1 PCT/CN2018/105337 CN2018105337W WO2019205430A1 WO 2019205430 A1 WO2019205430 A1 WO 2019205430A1 CN 2018105337 W CN2018105337 W CN 2018105337W WO 2019205430 A1 WO2019205430 A1 WO 2019205430A1
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Prior art keywords
flexible film
flip
chip flexible
panel
chip
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PCT/CN2018/105337
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English (en)
French (fr)
Inventor
邢振周
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武汉华星光电技术有限公司
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Priority to US16/097,620 priority Critical patent/US11006518B2/en
Publication of WO2019205430A1 publication Critical patent/WO2019205430A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a panel driving architecture, a flip chip flexible film for driving a panel, and a flip chip flexible film reinforcing method.
  • Liquid crystal display has many advantages such as thin body, power saving, no radiation, etc., and is widely used, such as: LCD TV, smart phone, digital camera, tablet computer, computer screen, or laptop computer. Screens, etc., dominate the field of flat panel display.
  • the flip-chip flexible film structure is similar to a flexible printed circuit (FPC), which is a base film of polyimide (PI) plus a layer of copper.
  • FPC flexible printed circuit
  • the difference between the two is that The colloidal material at the joint, plus both, must be covered with an additional coverlay (Coverlay), so the structure of the two is at least two layers of glue, so the flexibility of the FPC is far worse than the overlay.
  • Crystal flexible film is a base film of polyimide (PI) plus a layer of copper.
  • FIG. 1 is a schematic view showing a driving structure of a conventional medium and small size liquid crystal panel flip chip flexible film.
  • the flip-chip flexible film 1 is connected to the liquid crystal panel 2, the other end is connected to the FPC 3, and the control signal on the FPC 3 is transmitted to the liquid crystal panel 2 through the flip-chip flexible film circuit;
  • the flip-chip flexible film 1 is provided with a driving chip (Driver) IC) 4;
  • FPC 3 is provided with electronic components 5 such as resistors, capacitors, etc., and a connector 6.
  • the flip-chip flexible film driving structure also has the disadvantage that the flip-chip flexible film 1 is connected with the FPC 3, and the process of the flip-chip flexible film 1 and the FPC 3 is required in the process, and two bonding processes (Bonding) are required.
  • the risk of defective products will increase; two processes and two bonding processes will inevitably reduce production efficiency, and with the increase in non-performing rates, the cost will increase significantly.
  • Another object of the present invention is to provide a flip-chip flexible film reinforcing method for reinforcing a flip-chip flexible film to improve the existing medium and small-sized panel flip-chip flexible film driving structure.
  • the present invention provides a panel driving architecture, comprising: a flip chip flexible film, a panel and a main circuit board; the flip chip flexible film is connected to the panel at one end, and the other end is connected to the main circuit board through a connector;
  • the flip chip flexible film is provided with a reinforcing structure to increase the load carrying capacity.
  • the reinforcing structure is disposed in a region to be reinforced of the flip-chip flexible film to thicken the region to be reinforced or form a multi-layer structure in the region to be reinforced.
  • the panel may be a liquid crystal panel or an OLED panel.
  • the reinforcing structure is a reinforcing structure formed by folding the carrier tape to be fixed to the region to be strengthened, or a reinforcing structure formed by the reinforcing material being attached to the region to be strengthened.
  • the area to be reinforced is corresponding to the driving chip carried on the upper surface of the flip-chip flexible film, under the electronic component and/or the connector, and the size of the area to be reinforced is equal to or greater than the corresponding The size of the drive chip, electronic components and / or connectors.
  • the present invention also provides a flip chip flexible film for driving a panel, comprising:
  • the first end is used to connect the panel
  • a reinforcing structure for increasing the load carrying capacity of the flip chip flexible film is
  • the reinforcing structure is disposed in a region to be reinforced of the flip-chip flexible film to thicken the region to be reinforced or form a multi-layer structure in the region to be reinforced.
  • the reinforcing structure is a reinforcing structure formed by folding the carrier tape to be fixed to the region to be strengthened, or a reinforcing structure formed by the reinforcing material being attached to the region to be strengthened.
  • the area to be reinforced is corresponding to the driving chip carried on the upper surface of the flip-chip flexible film, under the electronic component and/or the connector, and the size of the area to be reinforced is equal to or greater than the corresponding The size of the drive chip, electronic components and / or connectors.
  • the invention also provides a method for reinforcing a flip chip flexible film, comprising:
  • the flip-chip flexible film substrate is moved from the left roller to the right roller. After the crimping region reaches the designated position, the crimping region is coated on both sides of the crimping region;
  • the left roller moves to the right side, and the pressure between the right roller and the right roller bends the crimping region to form a reinforcing material
  • the flip-chip flexible film substrate continues to move to the right, and is pressed by the upper and lower two rollers on the right side, so that the reinforcing material and the flip-chip flexible film are to be reinforced, and the left roller is reset;
  • the fused area of the flip chip flexible film is pressed.
  • the panel driving architecture of the present invention, the flip chip flexible film for driving the panel, and the flip chip flexible film reinforcing method can improve the existing medium and small size panel flip chip flexible film driving structure; reduce the FPC process, and combine the FPC
  • the process of flip-chip flexible film is beneficial to improve production efficiency and yield while reducing cost; combining the flip-chip flexible film with FPC, the reinforcing thickness and reinforcing area of the reinforcing film of the flip-chip flexible film can be adjusted in the process, Can adapt to the needs of a variety of products.
  • FIG. 1 is a schematic view showing a driving structure of a conventional medium and small size panel flip chip flexible film
  • FIG. 2 is a schematic diagram of a preferred embodiment of a panel driving architecture of the present invention.
  • FIG. 3 is a schematic structural view of a flip chip flexible film substrate
  • FIG. 4 is a schematic flow chart of a preferred embodiment of a method for reinforcing a flip-chip flexible film according to the present invention
  • FIG. 5 is a schematic flow chart of still another preferred embodiment of a method for reinforcing a flip-chip flexible film according to the present invention.
  • FIG. 2 is a schematic diagram of a panel drive architecture according to a preferred embodiment of the present invention.
  • the present invention provides a novel panel drive architecture, which mainly includes: a flip chip flexible film 10, a panel 11 and a main circuit board (not shown);
  • the crystalline flexible film 10 is connected to the panel 11 at one end, and the other end is connected to the main circuit board through the connector 14.
  • the control signal is transmitted to the panel 11 through the flip-chip flexible film circuit; the flip-chip flexible film 10 is provided with a reinforcing structure to increase the carrying capacity.
  • the flip chip flexible film 10 is provided with a driving chip 12, an electronic component 13 such as a resistor, a capacitor, etc., and a connector 14.
  • the reinforcing structure is disposed on the region to be reinforced of the flip-chip flexible film 10 to thicken the region to be reinforced or form a multi-layer structure in the region to be reinforced; the position and the area of the region to be reinforced may be supported by the flip-chip flexible film.
  • the upper surface of the driving chip 12, the electronic component 13, or the connector 14 is determined; the area to be reinforced may be located under the driving chip 12, the electronic component 13, and/or the connector 14, or the area to be reinforced may be located a continuous region between one end and the other end of the flip-chip flexible film 10; the size of the region to be reinforced may be equal to or larger than the corresponding area of the driving chip 12, the electronic component 13 and/or the connector 14
  • the area to be reinforced is preferably located below the electronic component 13, and the size of the area to be reinforced may be equal to or larger than the size of the electronic component 13 on the upper surface of the flip chip flexible film 10.
  • the invention combines the FPC with the flip-chip flexible film, transfers the function of the FPC carrying component to the flip-chip flexible film, and replaces the FPC process with the flip-chip flexible film. Due to the insufficient carrying capacity of the flip chip flexible film, it is necessary to add a reinforcing portion on the flip chip flexible film to increase its ability to carry components.
  • the reinforcing structure may be a reinforcing structure formed by folding the carrier tape to the region to be reinforced, or a reinforcing structure formed by the reinforcing material being attached to the region to be reinforced.
  • an embodiment of the present invention further provides a flip-chip flexible film for driving a panel, which can be applied to the panel driving structure of the present invention, and mainly includes: a first end for connecting the panel; and a second end, For connecting to the main circuit board through the connector, the control signal is transmitted to the panel through the flip-chip flexible thin film circuit; a reinforcing structure (not shown) is used to increase the carrying capacity of the flip-chip flexible film.
  • the reinforcing structure may be a reinforcing structure formed by laminating the carrier tape after lamination, or a reinforcing structure formed by laminating the reinforcing material after lamination.
  • the flip chip flexible film can also be provided with a driver chip, an electronic component, and a connector.
  • the flip-chip flexible film of the invention combines FPC with a flip chip flexible film, transfers the function of the FPC carrier component to the flip chip flexible film, and replaces the FPC process with the flip chip flexible film.
  • the invention provides a reinforcing method for increasing the carrying capacity of the flip-chip flexible film.
  • the invention provides a direct reinforcement method for reinforcing the bearing capacity of the flip chip flexible film and a method for reinforcing the carrier portion of the flip chip flexible film.
  • the flip-chip flexible film substrate mainly comprises a flip-chip flexible film and a carrier tape, and the edge of the crystal-coated flexible film substrate is provided with a positioning hole, wherein the carrier tape portion can be set as a crimping zone.
  • the flip-chip flexible film carrier portion is used to reinforce the flip-chip flexible film in such a manner that the flip-chip flexible film carrier portion is crimped instead of the reinforcing material, and is fixed to the flip-chip flexible film to be reinforced region.
  • the crimping part and the crimping thickness can be adjusted to meet various product requirements; when crimping and reinforcing, it is necessary to pay attention to the position of the positioning hole, and the positioning hole after pressing One-to-one correspondence.
  • the preferred embodiment uses a flip-chip flexible film carrier portion to reinforce a flip-chip flexible film.
  • the device may include: A set of rollers are arranged on the left and right sides, and the two sets of rollers can move relative to each other; each set of rollers includes two rollers arranged above and below, and the distance between the two rollers is adjustable; the folding device; the pressing device.
  • Preparation stage after the crimping area reaches the designated position, the pressed area is coated on both sides of the crimping area;
  • Pre-crimping stage using the folding equipment, impacting the crimping area, positioning the bending part, the bending area is initially bent, and the left side wheel is moved to the right;
  • the left roller moves to the right side, and the pressure between the right side roller and the right side of the roller bends the pressing area to form a reinforcing material;
  • Forming stage the flip-chip flexible film substrate continues to move to the right, and is pressed by the upper and lower two rollers on the right side, so that the reinforcing material and the flip-chip flexible film are to be reinforced, and the left roller is reset;
  • Press-bonding stage The reinforced area of the flip-chip flexible film is pressed by a pressing device.
  • FIG. 5 is a schematic flow chart of another preferred embodiment of a method for reinforcing a flip-chip flexible film according to the present invention.
  • the preferred embodiment uses a direct reinforcing method to reinforce the flip-chip flexible film by attaching a reinforcing material to the loaded region.
  • the equipment used may include: one set of rollers on each of the left and right sides; each set of rollers includes two rollers arranged one above the other, the distance between the two rollers is adjustable; the pressing device.
  • Preparation stage after the nip area of the flip-chip flexible film substrate reaches the designated position, the nip area is coated with the glue;
  • Fitting stage attaching the reinforcing material to the specified position for bonding
  • Forming stage the bonding area moves to the right side of the roller, and after the right side roller, the reinforcing material and the flip-chip flexible film are to be reinforced;
  • Press-bonding stage press-fitting the area of the flip-chip flexible film to be reinforced by a pressing device
  • the panel driving architecture of the present invention, the flip chip flexible film for driving the panel, and the flip chip flexible film reinforcing method can improve the existing medium and small size panel flip chip flexible film driving structure; reduce the FPC process, and combine the FPC
  • the process of flip-chip flexible film is beneficial to improve production efficiency and yield while reducing cost; combining the flip-chip flexible film with FPC, the reinforcing thickness and reinforcing area of the reinforcing film of the flip-chip flexible film can be adjusted in the process, Can adapt to the needs of a variety of products.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

一种面板驱动架构、用于驱动面板（11）的覆晶柔性薄膜（10）及覆晶柔性薄膜（10）补强方法。面板驱动架构包括：覆晶柔性薄膜（10），面板（11）以及主电路板；覆晶柔性薄膜（10）一端连接面板（11），另一端通过连接器（14）与主电路板连接，控制信号通过覆晶柔性薄膜（10）电路传递给面板（11）；覆晶柔性薄膜（10）设有补强结构以增加承载能力。能够改善现有中小尺寸面板覆晶柔性薄膜驱动架构；减少FPC制程、将FPC结合于覆晶柔性薄膜（10）的制程，有利于提高生产效率及良率，同时降低成本；将覆晶柔性薄膜（10）与FPC结合，在制程上覆晶柔性薄膜（10）补强区域的补强厚度与补强面积可调节，可以适应多种产品的需求。

Description

面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法 技术领域
本发明涉及显示技术领域，尤其涉及一种面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法。
背景技术
液晶显示面板(Liquid Crystal Display，LCD)具有机身薄、省电、无辐射等众多优点，得到了广泛地应用，如：液晶电视、智能手机、数字相机、平板电脑、计算机屏幕、或笔记本电脑屏幕等，在平板显示领域中占主导地位。
随着现代显示科技的发展，面板窄边框化及面板形状多样化日益成为趋势，于是覆晶柔性薄膜(COF，Chip on flexible printed circuit)驱动架构应用而生。覆晶柔性薄膜结构类似于单层板的柔性电路板(FPC，Flexible Printed Circuit)，为一层底膜(Base film)的聚亚酰胺(PI)再加上一层铜，两者的差异在于接合处的胶质材料，再加上两者皆须再上一层绝缘的覆盖膜(Coverlay)，故两者的结构至少就差了两层的胶，因此FPC的挠折性远差于覆晶柔性薄膜。
图1为现有中小尺寸液晶面板覆晶柔性薄膜驱动架构示意图。通常覆晶柔性薄膜1一端与液晶面板2连接，另一端与FPC 3连接，FPC 3上的控制信号通过覆晶柔性薄膜电路传递给液晶面板2；覆晶柔性薄膜1上设有驱动芯片(Driver IC)4；FPC 3上设有电子元器件5如电阻、电容等，以及连接器6。但是覆晶柔性薄膜驱动架构也存在缺点，即覆晶柔性薄膜1与FPC 3相连接，在制程上需要覆晶柔性薄膜1与FPC 3两个制程，且需两道贴合工艺(Bonding)，从而不良品的风险就会提高；两个制程及两道贴合工艺，势必会降低生产效率，再加上不良率增高，成本方面就会大幅提升。
发明内容
因此，本发明的目的在于提供一种面板驱动架构以及用于驱动面板的覆晶柔性薄膜，改善现有中小尺寸面板覆晶柔性薄膜驱动架构。
本发明的另一目的在于提供一种覆晶柔性薄膜补强方法，补强覆晶柔性薄膜以改善现有中小尺寸面板覆晶柔性薄膜驱动架构。
为实现上述目的，本发明提供了一种面板驱动架构，包括：覆晶柔性薄膜，面板以及主电路板；所述覆晶柔性薄膜一端连接面板，另一端通过连接器与主电路板连接；所述覆晶柔性薄膜设有补强结构以增加承载能力。
其中，所述补强结构设置于覆晶柔性薄膜的待补强区域以加厚待补强区域或者在待补强区域形成多层结构。
其中，所述面板可以为液晶面板或OLED面板。
其中，所述补强结构为由载带折叠后固定至待补强区域形成的补强结构，或者为由补强材料贴付至待补强区域形成的补强结构。
其中，所述待补强区域对应设于所述覆晶柔性薄膜上表面所承载的驱动芯片，电子元器件和/或连接器的下方，待补强区域的大小等于或者大于所对应的所述驱动芯片，电子元器件和/或连接器的面积大小。
本发明还提供了一种用于驱动面板的覆晶柔性薄膜，包括：
第一端，用于连接面板；
第二端，用于通过连接器与主电路板连接；以及
补强结构，用于增加所述覆晶柔性薄膜承载能力。
其中，所述补强结构设置于覆晶柔性薄膜的待补强区域以加厚待补强区域或者在待补强区域形成多层结构。
其中，所述补强结构为由载带折叠后固定至待补强区域形成的补强结构，或者为由补强材料贴付至待补强区域形成的补强结构。
其中，所述待补强区域对应设于所述覆晶柔性薄膜上表面所承载的驱动芯片，电子元器件和/或连接器的下方，待补强区域的大小等于或者大于所对应的所述驱动芯片，电子元器件和/或连接器的面积大小。
本发明还提供了一种覆晶柔性薄膜补强方法，包括：
覆晶柔性薄膜基材自左侧滚轮向右侧滚轮移动，当压折区域到达指定位置后，在压折区域两边对压折区域进行胶材涂布；
冲击压折区域，对弯折部分进行定位，使压折区域初步弯折，同时左侧滚轮向右移动；
左侧滚轮移动到右侧，与右侧滚轮之间的压力使压折区域弯折，构成补强材料；
覆晶柔性薄膜基材继续向右移动，经过右侧上下两个滚轮的压合，使补强材料与覆晶柔性薄膜待补强区域贴合，同时左侧滚轮复位；
对覆晶柔性薄膜补强区域进行压合。
其中，通过调节压折区域面积以及压折次数以实现不同的补强区域面积。
综上，本发明的面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法，能够改善现有中小尺寸面板覆晶柔性薄膜驱动架构；减少FPC制程、将FPC结合于覆晶柔性薄膜的制程，有利于提高生产效率及良率，同时降低成本；将覆晶柔性薄膜与FPC结合，在制程上覆晶柔性薄膜补强区域的补强厚度与补强面积可调节，可以适应多种产品的需求。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为现有中小尺寸面板覆晶柔性薄膜驱动架构示意图；
图2为本发明面板驱动架构一较佳实施例的示意图；
图3为覆晶柔性薄膜基材结构示意图；
图4为本发明覆晶柔性薄膜补强方法一较佳实施例的流程示意图；
图5为本发明覆晶柔性薄膜补强方法又一较佳实施例的流程示意图。
具体实施方式
图2为本发明面板驱动架构一较佳实施例的示意图，本发明提出一种新型面板驱动架构，主要包括：覆晶柔性薄膜10，面板11以及主电路板(图未示)；所述覆晶柔性薄膜10一端连接面板11，另一端通过连接器14与主电路板连接，控制信号通过覆晶柔性薄膜电路传递给面板11；所述覆晶柔性薄膜10设有补强结构以增加承载能力。所述覆晶柔性薄膜10设有驱动芯片12，电子元器件13如电阻、电容等，以及连接器14。
补强结构设置于覆晶柔性薄膜10的待补强区域以加厚待补强区域或者在待补强区域形成多层结构；待补强区域的位置和面积大小可以根据承载于覆晶柔性薄膜10上表面的驱动芯片12，电子元器件13，或者连接器14确定；待补强区域可以位于驱动芯片12，电子元器件13，和/或连接器14下方，或者待补强区域可以为位于覆晶柔性薄膜10一端及另一端之间下方的连续区域；待补强区域的大小可以等于或者大于所对应的所述驱动芯片12，电子元器件13和/或连接器14所占面积的大小；待补强区域优选位于电子元器件13的下方，待补强区域的大小可以等于或者大于覆晶柔性薄膜 10上表面的电子元器件13的大小。
本发明将FPC与覆晶柔性薄膜结合，将FPC承载元器件的功能转移到覆晶柔性薄膜上，以覆晶柔性薄膜取代FPC工艺。因覆晶柔性薄膜的承载能力不够，需要在覆晶柔性薄膜上增加补强部分，以增加其承载元器件的能力。补强结构可以为由载带折叠后固定至待补强区域形成的补强结构，或者为由补强材料贴付至待补强区域形成的补强结构。具体补强结构及补强方法可以参考本发明下面提供的覆晶柔性薄膜补强方法的实施例。
参考图2，本发明一实施例还提供了一种用于驱动面板的覆晶柔性薄膜，可应用于本发明的面板驱动架构，主要包括：第一端，用于连接面板；第二端，用于通过连接器与主电路板连接，控制信号通过覆晶柔性薄膜电路传递给面板；补强结构(图未示)，用于增加所述覆晶柔性薄膜的承载能力。补强结构可以为由载带贴合后压合形成的补强结构，或者为由补强材料贴合后压合形成的补强结构。覆晶柔性薄膜还可以设有驱动芯片，电子元器件，以及连接器。本发明的覆晶柔性薄膜将FPC与覆晶柔性薄膜结合，将FPC承载元器件的功能转移到覆晶柔性薄膜上，以覆晶柔性薄膜取代FPC工艺。
因覆晶柔性薄膜的承载能力不够，需要在覆晶柔性薄膜上增加补强部分，以增加其承载元器件的能力，本发明也相应提供了增加覆晶柔性薄膜承载能力的补强方法，本发明对覆晶柔性薄膜承载能力补强提供了直接补强方式和利用覆晶柔性薄膜载带部分补强的方式。
参见图3，其为覆晶柔性薄膜基材结构示意图。覆晶柔性薄膜基材主要包括覆晶柔性薄膜及载带，覆晶柔性薄膜基材边缘设有定位孔，其中载带部分可以设定为压折区。本发明一较佳实施例中利用覆晶柔性薄膜载带部分补强覆晶柔性薄膜的方式为将覆晶柔性薄膜载带部分压折代替补强材料，固定至覆晶柔性薄膜待补强区域，增强覆晶柔性薄膜的承载能力，且压折部分与压折厚度均可调节，以适应各种产品需求；压折补强时需注意定位孔的位置贴合，压折后的定位孔要一一对应。
参见图4，其为本发明覆晶柔性薄膜补强方法一较佳实施例的流程示意图，此较佳实施例利用覆晶柔性薄膜载带部分补强覆晶柔性薄膜，所采用设备可以包括：左右两侧各设一组滚轮，两组滚轮可相对移动；每组滚轮包括上下対置的两个滚轮，两个滚轮之间距离可调；压折设备；压合设备。
制程如下：
准备阶段：当压折区域到达指定位置后，在压折区域两边对压折区域进行胶材涂布；
预压折阶段：利用压折设备，冲击压折区域，对弯折部分进行定位，使压折区域初步弯折，同时左侧滚轮向右移动；
压折阶段：左侧滚轮移动到右侧，与右侧滚轮之间的压力使压折区域弯折，构成补强材料；
成型阶段：覆晶柔性薄膜基材继续向右移动，经过右侧上下两个滚轮的压合，使补强材料与覆晶柔性薄膜待补强区域贴合，同时左侧滚轮复位；
压合阶段：经过压合设备对覆晶柔性薄膜补强区域进行压合。
当要求不同的补强区域面积时，只需要对压折区域面积以及压折次数进行调节即可。
图5为本发明覆晶柔性薄膜补强方法又一较佳实施例的流程示意图，此较佳实施例采用直接补强方式补强覆晶柔性薄膜，通过对带载区贴合补强材料而实现；所采用设备可以包括：左右两侧各设一组滚轮；每组滚轮包括上下対置的两个滚轮，两个滚轮之间距离可调；压合设备。
制程如下：
准备阶段：当覆晶柔性薄膜基材的压合区域到达指定位置后，对压合区域进行胶材涂布；
贴合阶段：将补强材料贴在指定位置进行贴合；
成型阶段：贴合区域移动到右侧滚轮之间，经过右侧滚轮后补强材料与覆晶柔性薄膜待补强区域贴合；
压合阶段：经过压合设备对覆晶柔性薄膜待补强区域进行压合；
当要求不同的补强区域面积时，只需要对补强区域面积以及补强材料进行调节即可。
综上，本发明的面板驱动架构、用于驱动面板的覆晶柔性薄膜及覆晶柔性薄膜补强方法，能够改善现有中小尺寸面板覆晶柔性薄膜驱动架构；减少FPC制程、将FPC结合于覆晶柔性薄膜的制程，有利于提高生产效率及良率，同时降低成本；将覆晶柔性薄膜与FPC结合，在制程上覆晶柔性薄膜补强区域的补强厚度与补强面积可调节，可以适应多种产品的需求。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (9)

  1. 一种面板驱动架构，包括：覆晶柔性薄膜，面板以及主电路板；所述覆晶柔性薄膜一端连接面板，另一端通过连接器与主电路板连接；所述覆晶柔性薄膜设有补强结构以增加承载能力。
  2. 如权利要求1所述的面板驱动架构，其中，所述补强结构设置于覆晶柔性薄膜的待补强区域以加厚待补强区域或者在待补强区域形成多层结构。
  3. 如权利要求2所述的面板驱动架构，其中，所述补强结构为由载带折叠后固定至待补强区域形成的补强结构，或者为由补强材料贴付至待补强区域形成的补强结构。
  4. 如权利要求2所述的面板驱动架构，其中，所述待补强区域对应设于所述覆晶柔性薄膜上表面所承载的驱动芯片，电子元器件和/或连接器的下方，待补强区域的大小等于或者大于所对应的所述驱动芯片，电子元器件和/或连接器的面积大小。
  5. 一种用于驱动面板的覆晶柔性薄膜，包括：
    第一端，用于连接面板；
    第二端，用于通过连接器与主电路板连接；以及
    补强结构，用于增加所述覆晶柔性薄膜承载能力。
  6. 如权利要求5所述的用于驱动面板的覆晶柔性薄膜，其中，所述补强结构设置于覆晶柔性薄膜的待补强区域以加厚待补强区域或者在待补强区域形成多层结构。
  7. 如权利要求6所述的用于驱动面板的覆晶柔性薄膜，其中，所述补强结构为由载带折叠后固定至待补强区域形成的补强结构，或者为由补强材料贴付至待补强区域形成的补强结构。
  8. 如权利要求6所述的用于驱动面板的覆晶柔性薄膜，其中，所述待补强区域对应设于所述覆晶柔性薄膜上表面所承载的驱动芯片，电子元器件和/或连接器的下方，待补强区域的大小等于或者大于所对应的所述驱动芯片，电子元器件和/或连接器的面积大小。
  9. 一种覆晶柔性薄膜补强方法，包括：
    覆晶柔性薄膜基材自左侧滚轮向右侧滚轮移动，当压折区域到达指定位置后，在压折区域两边对压折区域进行胶材涂布；
    冲击压折区域，对弯折部分进行定位，使压折区域初步弯折，同时左 侧滚轮向右移动；
    左侧滚轮移动到右侧，与右侧滚轮之间的压力使压折区域弯折，构成补强材料；
    覆晶柔性薄膜基材继续向右移动，经过右侧上下两个滚轮的压合，使补强材料与覆晶柔性薄膜待补强区域贴合，同时左侧滚轮复位；
    对覆晶柔性薄膜补强区域进行压合。
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Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
CN112311987A (zh) * 2020-10-27 2021-02-02 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150173171A1 (en) * 2013-12-17 2015-06-18 Samsung Display Co., Ltd. Display device
CN105163484A (zh) * 2015-09-18 2015-12-16 刘炜 一种具有补强结构的柔性线路板及其加工工艺
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN106898264A (zh) * 2017-03-06 2017-06-27 武汉华星光电技术有限公司 一种可折叠面板及其制作方法
CN107507513A (zh) * 2017-08-25 2017-12-22 武汉华星光电技术有限公司 一种显示面板和显示器
CN107644593A (zh) * 2017-09-06 2018-01-30 武汉华星光电半导体显示技术有限公司 一种柔性oled显示面板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100381046B1 (ko) * 2000-03-31 2003-04-18 엘지.필립스 엘시디 주식회사 더미부를 가지는 테이프 캐리어 패키지와 이를 이용한 액정표시장치
FR2985328B1 (fr) * 2011-12-29 2013-12-20 Saint Gobain Vitrage multiple a diffusion variable par cristaux liquides
US9419065B2 (en) * 2012-08-07 2016-08-16 Apple Inc. Flexible displays
CN102890348B (zh) * 2012-10-18 2016-03-30 深圳市华星光电技术有限公司 一种cof基带及其制造方法、液晶显示模组
CN107526222A (zh) * 2017-09-11 2017-12-29 深圳市华星光电技术有限公司 阵列基板及其制作方法、显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150173171A1 (en) * 2013-12-17 2015-06-18 Samsung Display Co., Ltd. Display device
CN105163484A (zh) * 2015-09-18 2015-12-16 刘炜 一种具有补强结构的柔性线路板及其加工工艺
CN106898264A (zh) * 2017-03-06 2017-06-27 武汉华星光电技术有限公司 一种可折叠面板及其制作方法
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN107507513A (zh) * 2017-08-25 2017-12-22 武汉华星光电技术有限公司 一种显示面板和显示器
CN107644593A (zh) * 2017-09-06 2018-01-30 武汉华星光电半导体显示技术有限公司 一种柔性oled显示面板

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