WO2021082041A1 - 双面显示屏及显示装置 - Google Patents

双面显示屏及显示装置 Download PDF

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Publication number
WO2021082041A1
WO2021082041A1 PCT/CN2019/116384 CN2019116384W WO2021082041A1 WO 2021082041 A1 WO2021082041 A1 WO 2021082041A1 CN 2019116384 W CN2019116384 W CN 2019116384W WO 2021082041 A1 WO2021082041 A1 WO 2021082041A1
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WO
WIPO (PCT)
Prior art keywords
thin film
film transistor
transistor substrate
substrate
double
Prior art date
Application number
PCT/CN2019/116384
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English (en)
French (fr)
Inventor
张彦学
俞刚
Original Assignee
惠州市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 惠州市华星光电技术有限公司 filed Critical 惠州市华星光电技术有限公司
Priority to US16/618,407 priority Critical patent/US11355521B2/en
Publication of WO2021082041A1 publication Critical patent/WO2021082041A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits

Definitions

  • the present invention relates to the field of display technology, in particular to a double-sided display screen and a display device.
  • the double-sided display device inside the mobile phone can display the main function window of the mobile phone on one side and the time on the other side; for example, in public
  • double-sided displays are used to allow people on both sides of the display to see the various contents displayed.
  • the present invention provides a double-sided display screen and a display device, which can solve the technical problem that the number of bindings and the complexity of the circuit board increase due to the preparation of two display screens in the prior art, thereby affecting the display.
  • the present invention provides a double-sided display screen, which includes:
  • the first display module includes a first thin film transistor substrate
  • the second display module includes a second thin film transistor substrate, and the second display module is disposed opposite to the first display module, wherein the first thin film transistor substrate and the second thin film transistor The substrate is attached to each other;
  • the conductive layer is arranged on one side of the double-sided display screen, and the conductive layer is arranged on a side surface of at least one of the first thin film transistor substrate and the second thin film transistor substrate, And connected with the side surface;
  • the drive module is arranged on the side of the double-sided display screen where the conduction layer is provided, and is connected to the first thin film transistor substrate and the second thin film transistor substrate through the conduction layer At least one electrical connection.
  • the first display module includes a first color filter substrate disposed opposite to the first thin film transistor substrate
  • the second display module includes a first color film substrate opposite to the second thin film transistor substrate.
  • a second color filter substrate disposed opposite to the transistor substrate, wherein the first color filter substrate and the second color filter substrate are disposed opposite to the second thin film transistor substrate via the first thin film transistor substrate .
  • the conduction layer is disposed on the same side surface of the first thin film transistor substrate and the second thin film transistor substrate, and is connected to the side surface, wherein The first thin film transistor substrate and the second thin film transistor substrate are flush with the side where the conductive layer is provided.
  • the conduction layer is disposed on one side surface of the first thin film transistor substrate and is connected to the side surface, and the first thin film transistor substrate passes through the The conduction layer is connected with the driving module, and the second thin film transistor substrate is connected with the driving module.
  • the first thin film transistor substrate and the second thin film transistor substrate are not flush on the side where the conduction layer is provided, and the first thin film transistor substrate The side surface is retracted inwardly from the side surface of the second thin film transistor substrate to accommodate the thickness of the conductive layer.
  • the conduction layer is disposed on one side surface of the second thin film transistor substrate and is connected to the side surface, and the second thin film transistor substrate passes through the The conduction layer is connected with the driving module, and the first thin film transistor substrate is connected with the driving module.
  • the first thin film transistor substrate and the second thin film transistor substrate are not flush on the side where the conduction layer is provided, and the second thin film transistor substrate The side surface is retracted inwardly from the side surface of the first thin film transistor substrate to accommodate the thickness of the conductive layer.
  • the driving module includes a circuit board and a flip chip film, and one side of the flip chip film is connected to the first display module and the second display module , The other side is connected with the circuit board.
  • the material of the conductive layer includes conductive metal or conductive glue.
  • a display device includes a double-sided display screen, and the double-sided display screen includes:
  • the first display module includes a first thin film transistor substrate
  • the second display module includes a second thin film transistor substrate, and the second display module is disposed opposite to the first display module, wherein the first thin film transistor substrate and the second thin film transistor The substrate is attached to each other;
  • the conductive layer is arranged on one side of the double-sided display screen, and the conductive layer is arranged on a side surface of at least one of the first thin film transistor substrate and the second thin film transistor substrate, And connected with the side surface;
  • the drive module is arranged on the side of the double-sided display screen where the conduction layer is provided, and is connected to the first thin film transistor substrate and the second thin film transistor substrate through the conduction layer At least one electrical connection.
  • the first display module includes a first color filter substrate disposed opposite to the first thin film transistor substrate
  • the second display module includes a first color film substrate opposite to the second thin film transistor substrate.
  • a second color filter substrate disposed opposite to the transistor substrate, wherein the first color filter substrate and the second color filter substrate are disposed opposite to the second thin film transistor substrate via the first thin film transistor substrate .
  • the conduction layer is disposed on the same side surface of the first thin film transistor substrate and the second thin film transistor substrate, and is connected to the side surface, wherein The first thin film transistor substrate and the second thin film transistor substrate are flush with the side where the conductive layer is provided.
  • the conduction layer is disposed on one side surface of the first thin film transistor substrate and is connected to the side surface, and the first thin film transistor substrate passes through the The conduction layer is connected with the driving module, and the second thin film transistor substrate is connected with the driving module.
  • the first thin film transistor substrate and the second thin film transistor substrate are not flush on the side where the conduction layer is provided, and the first thin film transistor substrate The side surface is retracted inwardly from the side surface of the second thin film transistor substrate to accommodate the thickness of the conductive layer.
  • the conduction layer is disposed on one side surface of the second thin film transistor substrate and is connected to the side surface, and the second thin film transistor substrate passes through the The conduction layer is connected with the driving module, and the first thin film transistor substrate is connected with the driving module.
  • the first thin film transistor substrate and the second thin film transistor substrate are not flush on the side where the conduction layer is provided, and the second thin film transistor substrate The side surface is retracted inwardly from the side surface of the first thin film transistor substrate to accommodate the thickness of the conductive layer.
  • the driving module includes a circuit board and a flip chip film, and one side of the flip chip film is connected to the first display module and the second display module , The other side is connected with the circuit board.
  • the material of the conductive layer includes conductive metal or conductive glue.
  • the present invention connects two thin film transistor substrates to the same driving module by providing a conductive layer on the side of the double-sided display screen, so that the two display modules share the same
  • a driving module reduces the number of binding times of the double-sided display screen in the manufacturing process and the complexity of the circuit board, reduces the structural complexity of the display device, makes the display device lighter and thinner, and saves the manufacturing cost.
  • FIG. 1 is a schematic structural diagram of a double-sided display screen provided by an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of another double-sided display screen provided by an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of another double-sided display screen provided by an embodiment of the present invention.
  • the present invention is aimed at the existing double-sided display screen and display device. Since two panels need to be manufactured, two independent driving modules need to be manufactured to drive the two panels separately, which makes the structure complicated and increases the manufacturing cost. Problem, this embodiment can solve the defect.
  • the embodiment of the present invention provides a double-sided display screen, the double-sided display screen includes:
  • the first display module includes a first thin film transistor substrate
  • the second display module includes a second thin film transistor substrate, and the second display module is disposed opposite to the first display module, wherein the first thin film transistor substrate and the second thin film transistor The substrate is attached to each other;
  • the conductive layer is arranged on one side of the double-sided display screen, and the conductive layer is arranged on a side surface of at least one of the first thin film transistor substrate and the second thin film transistor substrate, And connected with the side surface;
  • the drive module is arranged on the side of the double-sided display screen where the conduction layer is provided, and is connected to the first thin film transistor substrate and the second thin film transistor substrate through the conduction layer At least one electrical connection.
  • the double-sided display screen 10 includes a first display module 101 and a second display module 102 that are arranged oppositely.
  • the first display module 101 includes a first display module 101 and a second display module 102.
  • the thin film transistor substrate 1011 and the second display module 102 include a second thin film transistor substrate 1021 bonded to the first thin film transistor substrate 1011.
  • the double-sided display screen 10 further includes a conductive layer 103, and the conductive layer 103 is disposed on one side of the double-sided display screen 10, wherein the conductive layer 103 is disposed on the first thin film electrical A side surface of at least one of the crystal substrate 1011, the second thin film transistor substrate 1021, and is connected to the side surface.
  • the conductive layer 103 is provided on the first In the case of the side surface of the thin film transistor substrate 1011 on the same side of the second thin film transistor substrate 1021, see the subsequent embodiments for other cases.
  • the double-sided display screen 10 further includes a drive module 104, and the drive module 104 is arranged on the side of the double-sided display screen 10 where the conduction layer 103 is provided, and passes through the conduction layer 103.
  • the layer 103 is electrically connected to at least one of the first thin film transistor substrate 1011 and the second thin film transistor substrate 1021.
  • the existing double-sided display screens often use two independent panels as the control screen and display screen for local dimming (local dimming).
  • the panels need to be bound twice and at the same time.
  • An independent circuit board drives the panel, which leads to an increase in the cost of the display system and a more complex structure.
  • the display panel provided by the embodiment of the present invention provides a conductive layer on the side of the double-sided display screen, which can connect two The thin film transistor substrates of the display module are all connected to the same drive module, so that the two display modules share one drive module, which reduces the number of bindings during the manufacturing process of the double-sided display and the complexity of the circuit board , The structure complexity of the display device is reduced, and the manufacturing cost is saved.
  • the remaining manufacturing process of the double-sided display screen 10 can be manufactured with reference to conventional manufacturing processes.
  • the double-sided display screen 10 includes a first display module 101, a second display module 102, a conductive layer 103 and a driving module 104 arranged opposite to each other.
  • the first display module 101 includes a first thin film transistor substrate 1011 and a first color filter substrate 1012 that are disposed oppositely
  • the second display module 102 includes a second thin film transistor substrate 1021 and a first color film transistor substrate 1021 that are disposed oppositely.
  • Two color filter substrates 1022 wherein the first thin film transistor substrate 1011 and the second thin film transistor substrate 1021 are attached to each other, and the first color filter substrate 1012 is separated from the second color filter substrate 1022
  • the first thin film transistor substrate 1011 and the second thin film transistor substrate 1021 are arranged opposite to each other.
  • the first display module 101 and the second display module 102 above only show the thin film transistor substrates 1011 and 1021, and the color filter substrates 1012 and 1022, respectively.
  • the color filter substrates 1012 and 1022 include black matrix (BM), RGB color resist layers, etc.
  • the film Transistor substrates 1011 and 1021 include TFT devices, scan lines, data lines, pixel electrodes, common electrodes, etc.
  • the double-sided display 10 also includes various other display components, such as the first thin film transistor substrate 1011 and Alignment film, sealant, etc. are provided between the first color filter substrate 1012, the second thin film transistor substrate 1021 and the second color filter substrate 1022, and these details can be implemented with reference to the prior art , I won’t repeat it here.
  • the conductive layer 103 is provided on one side of the double-sided display screen 10.
  • the conductive layer 103 is provided on the first thin film transistor substrate 1011 and the second thin film. The side surface of the same side of the transistor substrate 1021 is connected to the side surface.
  • the first thin film transistor substrate 1011 and the second thin film transistor substrate 1021 have the same side where the conductive layer 103 is provided.
  • the material of the conductive layer 103 includes conductive metal or conductive glue, wherein the conductive metal includes copper, aluminum, and the like.
  • the driving module 104 is disposed on the side of the double-sided display 10 where the conductive layer 103 is provided, and passes through the conductive layer 103 and the first thin film transistor substrate. 1011.
  • the second thin film transistor substrate 1021 is connected.
  • the driving module 104 includes a chip on film 1041 and a circuit board 1042, and one side of the chip on film 1041 is connected to the conduction layer 103, and the other side is connected to the circuit board 1042.
  • the conduction layer 103 plays a role of conducting current and transmitting signals, and connects the main control circuit in the first display module 101 and the second display module 102 with the overwrite
  • the crystal film 1041 is connected with the driving IC and other functional circuits in the circuit board 1042 to realize the transmission of data signals.
  • the double-sided display provided by this embodiment, by providing a conductive layer on the side, the thin film transistor substrates in the two display modules are connected to the same driving module, and then one driving module can be used to drive two
  • the display of a display module reduces the number of binding times of the double-sided display screen in the manufacturing process and the complexity of the circuit board, reduces the structural complexity of the display device, and saves the manufacturing cost.
  • the double-sided display 20 includes a first display module 201, a second display module 202, a conductive layer 203 and a driving module 204 arranged opposite to each other.
  • the first display module 201 includes a first thin film transistor substrate 2011 and a first color filter substrate 2012 disposed oppositely
  • the second display module 202 includes a second thin film transistor substrate 2021 and a first color film transistor substrate 2021 disposed oppositely.
  • Two color filter substrates 2022 wherein the first thin film transistor substrate 2011 and the second thin film transistor substrate 2021 are attached, and the first color filter substrate 2012 and the second color filter substrate 2022 are separated
  • the first thin film transistor substrate 2011 and the second thin film transistor substrate 2021 are arranged opposite to each other.
  • the first display module 201 and the second display module 202 described above only show the thin film transistor substrates 2011 and 2021, and the color film substrates 2012 and 2022, respectively.
  • the color filter substrates 2012 and 2022 include black matrix (BM), RGB color resist layers, etc.
  • the transistor substrates 2011 and 2021 include TFT devices, scan lines, data lines, pixel electrodes, common electrodes, etc.
  • the double-sided display screen 20 also includes various other display components, such as the first thin film transistor substrate 2011 and Alignment film, sealant, etc. are provided between the first color filter substrate 2012, the second thin film transistor substrate 2021 and the second color filter substrate 2022, and these details can be implemented with reference to the prior art , I won’t repeat it here.
  • the conduction layer 203 is provided on one side of the double-sided display screen 20.
  • the conduction layer 203 is provided on one side surface of the second thin film transistor substrate 2021, and Is connected to the side surface, the second thin film transistor substrate 2021 is connected to the driving module 204 through the conductive layer 203, and the first thin film transistor substrate 2011 is connected to the driving module 204 is connected and directly connected.
  • the first thin film transistor substrate 2011 and the second thin film transistor substrate 2021 are not flush on the side where the conduction layer 203 is provided, and all of the second thin film transistor substrate 2021 The side surface is smaller than the side surface of the first thin film transistor substrate 2011 to accommodate the thickness of the conductive layer 203.
  • the material of the conductive layer 203 includes conductive metal or conductive glue, wherein the conductive metal includes copper, aluminum, and the like.
  • the driving module 204 is disposed on the side of the double-sided display screen 20 where the conduction layer 203 is provided, and the conduction layer 203 is connected to the second thin film transistor substrate 2021. Connected to and directly connected to the first thin film transistor substrate 2011.
  • the driving module 204 includes a chip on film 2041 and a circuit board 2042, and one side of the chip on film 2041 is connected to the conduction layer 203 and the first thin film transistor substrate 2011, and the other The side is connected to the circuit board 2042.
  • the conduction layer 203 plays a role of conducting current and transferring signals, and connects the main control circuit in the second display module 202 with the flip chip film 2041 and the circuit board 2042.
  • the driving IC and other functional circuits are connected with each other, and the first display module 201 is directly connected with the flip chip film 2041 without passing through the conductive layer 203 to realize the transmission of data signals.
  • the double-sided display provided by this embodiment, by providing a conductive layer on the side, the thin film transistor substrates in the two display modules are connected to the same driving module, and then one driving module can be used to drive two
  • the display of a display module reduces the number of binding times of the double-sided display screen in the manufacturing process and the complexity of the circuit board, reduces the structural complexity of the display device, and saves the manufacturing cost.
  • the double-sided display 30 includes a first display module 301, a second display module 302, a conductive layer 303, and a driving module 304 arranged opposite to each other.
  • the first display module 301 includes a first thin film transistor substrate 3011 and a first color filter substrate 3012 that are disposed oppositely
  • the second display module 302 includes a second thin film transistor substrate 3021 and a first color film transistor substrate 3021 that are disposed oppositely.
  • Two color filter substrates 3022 wherein the first thin film transistor substrate 3011 and the second thin film transistor substrate 3021 are attached, and the first color filter substrate 3012 and the second color filter substrate 3022 are separated
  • the first thin film transistor substrate 3011 and the second thin film transistor substrate 3021 are arranged opposite to each other.
  • the first display module 301 and the second display module 302 above only show the thin film transistor substrates 3011 and 3021, the color filter substrates 3012 and 3022, and these structures
  • the color filter substrates 3012 and 3022 include black matrix (BM), RGB color resist layers, etc.
  • the film Transistor substrates 3011 and 3021 include TFT devices, scan lines, data lines, pixel electrodes, common electrodes, etc.
  • the double-sided display 30 also includes various other display components, such as the first thin film transistor substrate 3011 and Alignment film, sealant, etc. are provided between the first color filter substrate 3012, the second thin film transistor substrate 3021 and the second color filter substrate 3022, and these details can be implemented with reference to the prior art , I won’t repeat it here.
  • the conduction layer 303 is provided on one side of the double-sided display screen 30.
  • the conduction layer 303 is provided on one side surface of the first thin film transistor substrate 3011, and Connected to the side surface, the first thin film transistor substrate 3011 is connected to the driving module 304 through the conductive layer 303, and the second thin film transistor substrate 3021 is connected to the driving module 304. 304 is connected and directly connected.
  • the first thin film transistor substrate 3011 and the second thin film transistor substrate 3021 are not flush on the side where the conduction layer 303 is provided, and all of the first thin film transistor substrate 3011 The side surface is smaller than the side surface of the second thin film transistor substrate 3021 to accommodate the thickness of the conductive layer 303.
  • the material of the conductive layer 303 includes conductive metal or conductive glue, wherein the conductive metal includes copper, aluminum, and the like.
  • the driving module 304 is arranged on the side of the double-sided display 30 on which the conduction layer 303 is provided, and the conduction layer 303 is connected to the first thin film transistor substrate 3011. It is connected to and directly connected to the second thin film transistor substrate 3021.
  • the driving module 304 includes a chip on film 3041 and a circuit board 3042, and one side of the chip on film 3041 is connected to the conduction layer 303 and the second thin film transistor substrate 3021, and the other The side is connected to the circuit board 3042.
  • the conduction layer 303 plays the role of conducting current and transmitting signals, and connects the main control circuit in the first display module 301 with the flip chip film 3041 and the circuit board 3042.
  • the driving IC and other functional circuits are connected with each other, and the second display module 302 is directly connected with the flip chip film 3041 without passing through the conductive layer 303 to realize the transmission of data signals.
  • the double-sided display provided by this embodiment, by providing a conductive layer on the side, the thin film transistor substrates in the two display modules are connected to the same driving module, and then one driving module can be used to drive two
  • the display of a display module reduces the number of binding times of the double-sided display screen in the manufacturing process and the complexity of the circuit board, reduces the structural complexity of the display device, and saves the manufacturing cost.
  • an embodiment of the present invention further provides a display device, and the display device includes the double-sided display screen as described above, wherein the double-sided display screen connects the first display mode by arranging a conductive layer on the side surface.
  • the main control circuit in the group and the second display module are connected to the same drive module, that is, the two display modules share one drive module, which is conducive to the simplification of the drive system and the reduction of cost, and can make the inclusion of the Electronic products with double-sided displays are thinner and lighter.

Abstract

一种双面显示屏（10，20，30）及显示装置，双面显示屏（10，20，30）包括第一显示模组（101，201，301）、第二显示模组（102，202，302）、导通层（103，203，303）以及驱动模组（104，204，304），其中，驱动模组（104，204，304）通过导通层（103，203，303），与第一显示模组（101，201，301）中的第一薄膜电晶体基板（1011，2011，3011）、第二显示模组（102，202，302）中的第二薄膜电晶体基板（1021，2021，3021）中的至少一个电性连接。

Description

双面显示屏及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种双面显示屏及显示装置。
 背景技术
目前，电子产品的形式趋于多样化，双面显示功能成为新世代电子产品的重要特色，例如，手机内部的双面显示装置可以一面显示手机主功能窗口，另一面显示时间；例如，在公共场合使用双面显示器让显示器两侧的人员都能看到展示的各种内容。
在目前的设计方案中，常采用两片独立的面板来制作双面显示屏，由此导致面板需要进行两次绑定，同时需要两片独立的电路板驱动面板，从而致使显示系统成本增加，结构变得更为复杂。
 技术问题
目前，常采用两片独立的面板来制作双面显示屏，由此导致面板需要进行两次绑定，同时需要两片独立的电路板驱动面板，从而致使显示系统成本增加，结构变得更为复杂。
 技术解决方案
本发明提供一种双面显示屏及显示装置，能够解决现有技术中因制备两个显示屏，而导致绑定次数以及电路板的复杂性增加，进而影响显示的技术问题。
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种双面显示屏，其包括：
第一显示模组，包括第一薄膜电晶体基板；
第二显示模组，包括第二薄膜电晶体基板，且所述第二显示模组与所述第一显示模组相对设置，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相贴合；
导通层，设置于所述双面显示屏的一侧，且所述导通层设置于所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个的一侧表面，并与所述侧表面相连接；
驱动模组，设置于所述双面显示屏设有所述导通层的一侧，并通过所述导通层与所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个电性连接。
在本发明的一种实施例中，所述第一显示模组包括与所述第一薄膜电晶体基板相对设置的第一彩膜基板，所述第二显示模组包括与所述第二薄膜电晶体基板相对设置的第二彩膜基板，其中，所述第一彩膜基板与所述第二彩膜基板隔着所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相对设置。
在本发明的一种实施例中，所述导通层设置于所述第一薄膜电晶体基板以及所述第二薄膜电晶体基板的同一边侧表面，并与所述侧表面相连接，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板设置有所述导通层的一侧相平齐。
在本发明的一种实施例中，所述导通层设置于所述第一薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第一薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第二薄膜电晶体基板与所述驱动模组相连接。
在本发明的一种实施例中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第一薄膜电晶体基板的所述侧表面较所述第二薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
在本发明的一种实施例中，所述导通层设置于所述第二薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第二薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第一薄膜电晶体基板与所述驱动模组相连接。
在本发明的一种实施例中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第二薄膜电晶体基板的所述侧表面较所述第一薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
在本发明的一种实施例中，所述驱动模组包括电路板以及覆晶薄膜，且所述覆晶薄膜的一侧与所述第一显示模组、所述第二显示模组相连接，另一侧与所述电路板相连接。
在本发明的一种实施例中，所述导通层的材料包括导电金属或导电胶。
根据本发明的上述目的，提供一种显示装置，所述显示装置包括双面显示屏，且所述双面显示屏包括：
第一显示模组，包括第一薄膜电晶体基板；
第二显示模组，包括第二薄膜电晶体基板，且所述第二显示模组与所述第一显示模组相对设置，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相贴合；
导通层，设置于所述双面显示屏的一侧，且所述导通层设置于所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个的一侧表面，并与所述侧表面相连接；
驱动模组，设置于所述双面显示屏设有所述导通层的一侧，并通过所述导通层与所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个电性连接。
在本发明的一种实施例中，所述第一显示模组包括与所述第一薄膜电晶体基板相对设置的第一彩膜基板，所述第二显示模组包括与所述第二薄膜电晶体基板相对设置的第二彩膜基板，其中，所述第一彩膜基板与所述第二彩膜基板隔着所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相对设置。
在本发明的一种实施例中，所述导通层设置于所述第一薄膜电晶体基板以及所述第二薄膜电晶体基板的同一边侧表面，并与所述侧表面相连接，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板设置有所述导通层的一侧相平齐。
在本发明的一种实施例中，所述导通层设置于所述第一薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第一薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第二薄膜电晶体基板与所述驱动模组相连接。
在本发明的一种实施例中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第一薄膜电晶体基板的所述侧表面较所述第二薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
在本发明的一种实施例中，所述导通层设置于所述第二薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第二薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第一薄膜电晶体基板与所述驱动模组相连接。
在本发明的一种实施例中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第二薄膜电晶体基板的所述侧表面较所述第一薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
在本发明的一种实施例中，所述驱动模组包括电路板以及覆晶薄膜，且所述覆晶薄膜的一侧与所述第一显示模组、所述第二显示模组相连接，另一侧与所述电路板相连接。
在本发明的一种实施例中，所述导通层的材料包括导电金属或导电胶。
 有益效果
相较于现有技术，为解决上述技术问题，本发明通过在双面显示屏的侧面设置导通层，以将两个薄膜电晶体基板连接至同一驱动模组，使得两个显示模组共用一个驱动模组，减少了双面显示屏在制作过程中绑定的次数以及电路板的复杂性，降低了显示装置的结构复杂性，使得显示装置更加轻薄化，节省了制作成本。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种双面显示屏的结构示意图。
图2为本发明实施例提供的另一种双面显示屏的结构示意图。
图3为本发明实施例提供的又一种双面显示屏的结构示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的双面显示屏及显示装置，由于需要制作两个面板，则需要制作两个独立的驱动模组以分别驱动两个面板，使得结构变得复杂，增加了制作成本的技术问题，本实施例能够解决该缺陷。
本发明实施例提供一种双面显示屏，所述双面显示屏包括：
第一显示模组，包括第一薄膜电晶体基板；
第二显示模组，包括第二薄膜电晶体基板，且所述第二显示模组与所述第一显示模组相对设置，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相贴合；
导通层，设置于所述双面显示屏的一侧，且所述导通层设置于所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个的一侧表面，并与所述侧表面相连接；
驱动模组，设置于所述双面显示屏设有所述导通层的一侧，并通过所述导通层与所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个电性连接。
其中，具体地，请参照图1所示，所述双面显示屏10包括相对设置的第一显示模组101以及第二显示模组102，其中，所述第一显示模组101包括第一薄膜电晶体基板1011，以及所述第二显示模组102包括与所述第一薄膜电晶体基板1011相贴合的第二薄膜电晶体基板1021。
所述双面显示屏10还包括导通层103，且所述导通层103设置于所述双面显示屏10的一侧，其中，所述导通层103设置于所述第一薄膜电晶体基板1011、所述第二薄膜电晶体基板1021中的至少一个的一侧表面，并与所述侧表面相连接，图1中仅显示的是所述导通层103设置于所述第一薄膜电晶体基板1011、所述第二薄膜电晶体基板1021的同一边的侧表面的情况，其他情况见后续实施例。
另外，所述双面显示屏10还包括驱动模组104，且所述驱动模组104设置于所述双面显示屏10设有所述导通层103的一侧，并通过所述导通层103与所述第一薄膜电晶体基板1011、所述第二薄膜电晶体基板1021中的至少一个电性连接。
在实施应用过程中，现有的双面显示屏常采用两片独立的面板分别作为local dimming（局部调光）的控制屏和显示屏，由此导致面板需要进行两次绑定，同时需要两片独立的电路板驱动面板，从而致使显示系统成本增加，结构变得更为复杂，而本发明实施例所提供的显示面板通过在双面显示屏的侧面设置一导通层，可将两个显示模组的薄膜电晶体基板均与同一个驱动模组相连接，使得两个显示模组共用一个驱动模组，减少了双面显示屏在制作过程中绑定的次数以及电路板的复杂性，降低了显示装置的结构复杂性，节省了制作成本。
具体地，所述双面显示屏10的其余制作工艺可参照常规工艺制程进行制作，下面结合具体实施例以对本发明所提供的双面显示屏进行详述。
实施例一
请参照图1所示，所述双面显示屏10包括相对设置第一显示模组101、第二显示模组102、导通层103以及驱动模组104。
其中，所述第一显示模组101包括相对设置的第一薄膜电晶体基板1011以及第一彩膜基板1012，所述第二显示模组102包括相对设置的第二薄膜电晶体基板1021以及第二彩膜基板1022，其中，所述第一薄膜电晶体基板1011与所述第二薄膜电晶体基板1021相贴合，且所述第一彩膜基板1012与所述第二彩膜基板1022隔着所述第一薄膜电晶体基板1011和所述第二薄膜电晶体基板1021相对设置。
需要说明的是，如上的所述第一显示模组101和所述第二显示模组102仅分别示出了所述薄膜电晶体基板1011和1021、所述彩膜基板1012和1022，这些结构层只是简述了所述双面显示屏10的部分结构、构件，但并不限于此：例如所述彩膜基板1012和1022包含了黑色矩阵(BM)、RGB色阻层等，所述薄膜电晶体基板1011和1021包含了TFT器件、扫描线、数据线、像素电极、公共电极等，所述双面显示屏10还包含了各个其他显示部件，例如所述第一薄膜电晶体基板1011和所述第一彩膜基板1012之间、所述第二薄膜电晶体基板1021和所述第二彩膜基板1022之间均设置有配向膜、框胶等，这些细节都可以参照现有技术实现，在此不再赘述。
另外，所述双面显示屏10的一侧设置有所述导通层103，在本实施例中，所述导通层103设置于所述第一薄膜电晶体基板1011以及所述第二薄膜电晶体基板1021的同一边的侧表面，并与所述侧表面相连接。
其中，所述第一薄膜电晶体基板1011与所述第二薄膜电晶体基板1021设置有所述导通层103的一侧相平齐。
且所述导通层103的材料包括导电金属或导电胶，其中所述导电金属包括铜、铝等。
在本实施例中，所述驱动模组104设置于所述双面显示屏10设有所述导通层103的一侧，并通过所述导通层103与所述第一薄膜电晶体基板1011、所述第二薄膜电晶体基板1021相连接。
其中，所述驱动模组104包括覆晶薄膜1041以及电路板1042，且所述覆晶薄膜1041的一侧与所述导通层103相连接，另一侧与所述电路板1042相连接。
需要注意的是，所述导通层103起到导通电流、传递信号的作用，将所述第一显示模组101、所述第二显示模组102中的主控电路，与所述覆晶薄膜1041和所述电路板1042中的驱动IC以及其他功能电路相连接，实现数据信号的传递。
本实施例所提供的双面显示屏，通过在侧面设置一导通层，将两个显示模组中的薄膜电晶体基板连接至同一个驱动模组中，即可使用一个驱动模组驱动两个显示模组的显示，减少了双面显示屏在制作过程中绑定的次数以及电路板的复杂性，降低了显示装置的结构复杂性，节省了制作成本。
实施例二
请参照图2所示，所述双面显示屏20包括相对设置第一显示模组201、第二显示模组202、导通层203以及驱动模组204。
其中，所述第一显示模组201包括相对设置的第一薄膜电晶体基板2011以及第一彩膜基板2012，所述第二显示模组202包括相对设置的第二薄膜电晶体基板2021以及第二彩膜基板2022，其中，所述第一薄膜电晶体基板2011与所述第二薄膜电晶体基板2021相贴合，且所述第一彩膜基板2012与所述第二彩膜基板2022隔着所述第一薄膜电晶体基板2011和所述第二薄膜电晶体基板2021相对设置。
需要说明的是，如上的所述第一显示模组201和所述第二显示模组202仅分别示出了所述薄膜电晶体基板2011和2021、所述彩膜基板2012和2022，这些结构层只是简述了所述双面显示屏20的部分结构、构件，但并不限于此：例如所述彩膜基板2012和2022包含了黑色矩阵(BM)、RGB色阻层等，所述薄膜电晶体基板2011和2021包含了TFT器件、扫描线、数据线、像素电极、公共电极等，所述双面显示屏20还包含了各个其他显示部件，例如所述第一薄膜电晶体基板2011和所述第一彩膜基板2012之间、所述第二薄膜电晶体基板2021和所述第二彩膜基板2022之间均设置有配向膜、框胶等，这些细节都可以参照现有技术实现，在此不再赘述。
另外，所述双面显示屏20的一侧设置有所述导通层203，在本实施例中，所述导通层203设置于所述第二薄膜电晶体基板2021的一侧表面，并与所述侧表面相连接，则所述第二薄膜电晶体基板2021通过所述导通层203与所述驱动模组204相连接，所述第一薄膜电晶体基板2011与所述驱动模组204相连接，且为直接连接。
其中，所述第一薄膜电晶体基板2011与所述第二薄膜电晶体基板2021在设置有所述导通层203的一侧不相平齐，且所述第二薄膜电晶体基板2021的所述侧表面较所述第一薄膜电晶体基板2011的侧表面内缩，以容置所述导通层203的厚度。
且所述导通层203的材料包括导电金属或导电胶，其中所述导电金属包括铜、铝等。
在本实施例中，所述驱动模组204设置于所述双面显示屏20设有所述导通层203的一侧，通过所述导通层203与所述第二薄膜电晶体基板2021相连接，并与所述第一薄膜电晶体基板2011直接连接。
其中，所述驱动模组204包括覆晶薄膜2041以及电路板2042，且所述覆晶薄膜2041的一侧与所述导通层203以及所述第一薄膜电晶体基板2011相连接，另一侧与所述电路板2042相连接。
需要注意的是，所述导通层203起到导通电流、传递信号的作用，将所述第二显示模组202中的主控电路，与所述覆晶薄膜2041和所述电路板2042中的驱动IC以及其他功能电路相连接，且所述第一显示模组201直接与所述覆晶薄膜2041相连接，并不需要通过所述导通层203，以实现数据信号的传递。
本实施例所提供的双面显示屏，通过在侧面设置一导通层，将两个显示模组中的薄膜电晶体基板连接至同一个驱动模组中，即可使用一个驱动模组驱动两个显示模组的显示，减少了双面显示屏在制作过程中绑定的次数以及电路板的复杂性，降低了显示装置的结构复杂性，节省了制作成本。
实施例三
请参照图3所示，所述双面显示屏30包括相对设置第一显示模组301、第二显示模组302、导通层303以及驱动模组304。
其中，所述第一显示模组301包括相对设置的第一薄膜电晶体基板3011以及第一彩膜基板3012，所述第二显示模组302包括相对设置的第二薄膜电晶体基板3021以及第二彩膜基板3022，其中，所述第一薄膜电晶体基板3011与所述第二薄膜电晶体基板3021相贴合，且所述第一彩膜基板3012与所述第二彩膜基板3022隔着所述第一薄膜电晶体基板3011和所述第二薄膜电晶体基板3021相对设置。
需要说明的是，如上的所述第一显示模组301和所述第二显示模组302仅分别示出了所述薄膜电晶体基板3011和3021、所述彩膜基板3012和3022，这些结构层只是简述了所述双面显示屏30的部分结构、构件，但并不限于此：例如所述彩膜基板3012和3022包含了黑色矩阵(BM)、RGB色阻层等，所述薄膜电晶体基板3011和3021包含了TFT器件、扫描线、数据线、像素电极、公共电极等，所述双面显示屏30还包含了各个其他显示部件，例如所述第一薄膜电晶体基板3011和所述第一彩膜基板3012之间、所述第二薄膜电晶体基板3021和所述第二彩膜基板3022之间均设置有配向膜、框胶等，这些细节都可以参照现有技术实现，在此不再赘述。
另外，所述双面显示屏30的一侧设置有所述导通层303，在本实施例中，所述导通层303设置于所述第一薄膜电晶体基板3011的一侧表面，并与所述侧表面相连接，则所述第一薄膜电晶体基板3011通过所述导通层303与所述驱动模组304相连接，所述第二薄膜电晶体基板3021与所述驱动模组304相连接，且为直接连接。
其中，所述第一薄膜电晶体基板3011与所述第二薄膜电晶体基板3021在设置有所述导通层303的一侧不相平齐，且所述第一薄膜电晶体基板3011的所述侧表面较所述第二薄膜电晶体基板3021的侧表面内缩，以容置所述导通层303的厚度。
且所述导通层303的材料包括导电金属或导电胶，其中所述导电金属包括铜、铝等。
在本实施例中，所述驱动模组304设置于所述双面显示屏30设有所述导通层303的一侧，通过所述导通层303与所述第一薄膜电晶体基板3011相连接，并与所述第二薄膜电晶体基板3021直接连接。
其中，所述驱动模组304包括覆晶薄膜3041以及电路板3042，且所述覆晶薄膜3041的一侧与所述导通层303以及所述第二薄膜电晶体基板3021相连接，另一侧与所述电路板3042相连接。
需要注意的是，所述导通层303起到导通电流、传递信号的作用，将所述第一显示模组301中的主控电路，与所述覆晶薄膜3041和所述电路板3042中的驱动IC以及其他功能电路相连接，且所述第二显示模组302直接与所述覆晶薄膜3041相连接，并不需要通过所述导通层303，以实现数据信号的传递。
本实施例所提供的双面显示屏，通过在侧面设置一导通层，将两个显示模组中的薄膜电晶体基板连接至同一个驱动模组中，即可使用一个驱动模组驱动两个显示模组的显示，减少了双面显示屏在制作过程中绑定的次数以及电路板的复杂性，降低了显示装置的结构复杂性，节省了制作成本。
另外，本发明实施例还提供一种显示装置，且所述显示装置包括如上所述的双面显示屏，其中所述双面显示屏通过在侧表面设置一导通层，将第一显示模组以及第二显示模组中的主控电路连接至同一个驱动模组中，即两个显示模组共用一个驱动模组，有利于驱动系统的简单化和成本的降低，并且可以使得包含该双面显示屏的电子产品更加轻薄化。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种双面显示屏，其包括：
    第一显示模组，包括第一薄膜电晶体基板；
    第二显示模组，包括第二薄膜电晶体基板，且所述第二显示模组与所述第一显示模组相对设置，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相贴合；
    导通层，设置于所述双面显示屏的一侧，且所述导通层设置于所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个的一侧表面，并与所述侧表面相连接；
    驱动模组，设置于所述双面显示屏设有所述导通层的一侧，并通过所述导通层与所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个电性连接。
  2. 根据权利要求1所述的双面显示屏，其中，所述第一显示模组包括与所述第一薄膜电晶体基板相对设置的第一彩膜基板，所述第二显示模组包括与所述第二薄膜电晶体基板相对设置的第二彩膜基板，其中，所述第一彩膜基板与所述第二彩膜基板隔着所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相对设置。
  3. 根据权利要求1所述的双面显示屏，其中，所述导通层设置于所述第一薄膜电晶体基板以及所述第二薄膜电晶体基板的同一边侧表面，并与所述侧表面相连接，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板设置有所述导通层的一侧相平齐。
  4. 根据权利要求1所述的双面显示屏，其中，所述导通层设置于所述第一薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第一薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第二薄膜电晶体基板与所述驱动模组相连接。
  5. 根据权利要求4所述的双面显示屏，其中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第一薄膜电晶体基板的所述侧表面较所述第二薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
  6. 根据权利要求1所述的双面显示屏，其中，所述导通层设置于所述第二薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第二薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第一薄膜电晶体基板与所述驱动模组相连接。
  7. 根据权利要求6所述的双面显示屏，其中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第二薄膜电晶体基板的所述侧表面较所述第一薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
  8. 根据权利要求1所述的双面显示屏，其中，所述驱动模组包括电路板以及覆晶薄膜，且所述覆晶薄膜的一侧与所述第一显示模组、所述第二显示模组相连接，另一侧与所述电路板相连接。
  9. 根据权利要求1所述的双面显示屏，其中，所述导通层的材料包括导电金属或导电胶。
  10. 一种显示装置，所述显示装置包括双面显示屏，且所述双面显示屏包括：
    第一显示模组，包括第一薄膜电晶体基板；
    第二显示模组，包括第二薄膜电晶体基板，且所述第二显示模组与所述第一显示模组相对设置，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相贴合；
    导通层，设置于所述双面显示屏的一侧，且所述导通层设置于所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个的一侧表面，并与所述侧表面相连接；
    驱动模组，设置于所述双面显示屏设有所述导通层的一侧，并通过所述导通层与所述第一薄膜电晶体基板、所述第二薄膜电晶体基板中的至少一个电性连接。
  11. 根据权利要求10所述的显示装置，其中，所述第一显示模组包括与所述第一薄膜电晶体基板相对设置的第一彩膜基板，所述第二显示模组包括与所述第二薄膜电晶体基板相对设置的第二彩膜基板，其中，所述第一彩膜基板与所述第二彩膜基板隔着所述第一薄膜电晶体基板与所述第二薄膜电晶体基板相对设置。
  12. 根据权利要求10所述的显示装置，其中，所述导通层设置于所述第一薄膜电晶体基板以及所述第二薄膜电晶体基板的同一边侧表面，并与所述侧表面相连接，其中所述第一薄膜电晶体基板与所述第二薄膜电晶体基板设置有所述导通层的一侧相平齐。
  13. 根据权利要求10所述的显示装置，其中，所述导通层设置于所述第一薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第一薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第二薄膜电晶体基板与所述驱动模组相连接。
  14. 根据权利要求13所述的显示装置，其中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第一薄膜电晶体基板的所述侧表面较所述第二薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
  15. 根据权利要求10所述的显示装置，其中，所述导通层设置于所述第二薄膜电晶体基板的一侧表面，并与所述侧表面相连接，所述第二薄膜电晶体基板通过所述导通层与所述驱动模组相连接，且所述第一薄膜电晶体基板与所述驱动模组相连接。
  16. 根据权利要求15所述的显示装置，其中，所述第一薄膜电晶体基板与所述第二薄膜电晶体基板在设置所述导通层的一侧不相平齐，所述第二薄膜电晶体基板的所述侧表面较所述第一薄膜电晶体基板的侧表面内缩，以容置所述导通层的厚度。
  17. 根据权利要求10所述的显示装置，其中，所述驱动模组包括电路板以及覆晶薄膜，且所述覆晶薄膜的一侧与所述第一显示模组、所述第二显示模组相连接，另一侧与所述电路板相连接。
  18. 根据权利要求10所述的显示装置，其中，所述导通层的材料包括导电金属或导电胶。
PCT/CN2019/116384 2019-10-28 2019-11-07 双面显示屏及显示装置 WO2021082041A1 (zh)

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