WO2022262069A1 - 显示模组及其制作方法、显示装置 - Google Patents

显示模组及其制作方法、显示装置 Download PDF

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Publication number
WO2022262069A1
WO2022262069A1 PCT/CN2021/107791 CN2021107791W WO2022262069A1 WO 2022262069 A1 WO2022262069 A1 WO 2022262069A1 CN 2021107791 W CN2021107791 W CN 2021107791W WO 2022262069 A1 WO2022262069 A1 WO 2022262069A1
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WO
WIPO (PCT)
Prior art keywords
layer
display
buffer layer
segment
display area
Prior art date
Application number
PCT/CN2021/107791
Other languages
English (en)
French (fr)
Inventor
覃黎君
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/599,592 priority Critical patent/US20240029591A1/en
Publication of WO2022262069A1 publication Critical patent/WO2022262069A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present application relates to the field of display modules, in particular to a display module, a manufacturing method thereof, and a display device.
  • the market mainly uses the terminal bending process to bend the FPC&GOA wiring to the back of the screen for binding to achieve the narrow border effect.
  • the minimization of the bending radius is pursued, that is, the thickness of the display module is also required to be reduced accordingly; the thickness of the display module is affected by the module
  • the influence of material thickness can be reduced to a limited extent; at the same time, some module materials will also bring some loss in material performance while pursuing thinning.
  • the thickness of the foam cushion layer is reduced or the polyimide film layer is removed, resulting in a decrease in the compressive performance of the buffer layer, and the adhesive layer print on the module is displayed after binding Obviously, it seriously affects the appearance of the product.
  • the embodiment of the present application provides a display module, its manufacturing method, and a display device to solve the problem of excessive thinning of the buffer layer in order to achieve a narrow frame effect in the existing terminal bending process, which leads to obvious imprints of the adhesive layer on the display module and affects the display.
  • Technical issues with the appearance of the module product are described.
  • the application provides a display module, including a display area and a non-display area, and the display module includes:
  • a substrate including a display segment and an extension segment disposed opposite to each other, and a bent segment that bends and connects the display segment and the extension segment and is located in the non-display area;
  • a display function layer arranged on a side of the display segment away from the extension segment and located in the display area;
  • the support layer is arranged on the side of the substrate away from the display function layer, including a first support layer arranged on the extension section close to the display section and a second support layer arranged on the display section near the extension section support layer;
  • a buffer layer disposed on a side of the second support layer away from the substrate
  • a first adhesive layer disposed on the first support layer and between the buffer layer;
  • the distance from the end of the first bonding layer away from the non-display area to the non-display area is greater than or equal to the distance from the end of the buffer layer away from the non-display area to the non-display area.
  • the projection of the first adhesive layer in the direction perpendicular to the buffer layer covers the projection of the first support layer in the direction perpendicular to the buffer layer.
  • the projection of the first bonding layer in the direction perpendicular to the buffer layer coincides with the projection of the first support layer in the direction perpendicular to the buffer layer.
  • the material of the first adhesive layer includes pressure sensitive adhesive.
  • a second adhesive layer is provided between the second support layer and the buffer layer, and the projection of the second adhesive layer in a direction perpendicular to the buffer layer at least covers the first The projection of the two support layers in a direction perpendicular to the buffer layer.
  • the projection of the second bonding layer in the direction perpendicular to the buffer layer coincides with the projection of the second support layer in the direction perpendicular to the buffer layer.
  • the display module further includes a strained adhesive layer, the strained adhesive layer is disposed on a side of the substrate away from the support layer, and the strained adhesive layer at least covers the bent section.
  • the first adhesive layer includes pressure sensitive adhesive or foam adhesive.
  • the buffer layer includes stainless steel, foam pad or polyimide film.
  • the present application also provides a method for manufacturing a display module, including the following steps:
  • a substrate is provided, the display module includes a display area and a non-display area, the substrate includes a display segment and an extension segment, and a bend connecting the display segment and the extension segment and located in the non-display area part;
  • a support layer is formed on the side of the substrate away from the display function layer, and the support layer includes a first support layer formed on the side of the extension segment close to the display segment and a first support layer formed on the display segment close to the display segment.
  • the second support layer on one side of the extension section forms a buffer layer on the side of the second support layer away from the substrate, and forms a first adhesive layer on the side of the first support layer away from the substrate;
  • the distance from one end of the non-display area to the non-display area is greater than or equal to the distance from the end of the buffer layer away from the non-display area to the non-display area.
  • a support layer is formed on the side of the substrate away from the display function layer, the support layer includes a first support layer formed on the side of the extension segment close to the display segment, and on the In the step of forming the first adhesive layer on the side of the first support layer away from the substrate:
  • the first support layer and the first adhesive layer are formed by the same patterning process, so that the projection of the first adhesive layer in a direction perpendicular to the buffer layer is perpendicular to the first support layer The projections in the direction of the buffer layer coincide.
  • the present application also provides a display device, including a display module, the display module includes a display area and a non-display area, and the display module includes:
  • a substrate including a display segment and an extension segment disposed opposite to each other, and a bent segment that bends and connects the display segment and the extension segment and is located in the non-display area;
  • a display function layer arranged on a side of the display segment away from the extension segment and located in the display area;
  • the support layer is arranged on the side of the substrate away from the display function layer, including a first support layer arranged on the extension section close to the display section and a second support layer arranged on the display section near the extension section support layer;
  • a buffer layer disposed on a side of the second support layer away from the substrate
  • a first adhesive layer disposed on the first support layer and between the buffer layer;
  • the distance from the end of the first bonding layer away from the non-display area to the non-display area is greater than or equal to the distance from the end of the buffer layer away from the non-display area to the non-display area.
  • the projection of the first adhesive layer in the direction perpendicular to the buffer layer covers the projection of the first support layer in the direction perpendicular to the buffer layer.
  • the projection of the first bonding layer in the direction perpendicular to the buffer layer coincides with the projection of the first support layer in the direction perpendicular to the buffer layer.
  • the material of the first adhesive layer includes pressure sensitive adhesive.
  • a second adhesive layer is provided between the second support layer and the buffer layer, and the projection of the second adhesive layer in a direction perpendicular to the buffer layer at least covers the first The projection of the two support layers in a direction perpendicular to the buffer layer.
  • the projection of the second bonding layer in the direction perpendicular to the buffer layer coincides with the projection of the second support layer in the direction perpendicular to the buffer layer.
  • the display module further includes a strained adhesive layer, the strained adhesive layer is disposed on a side of the substrate away from the support layer, and the strained adhesive layer at least covers the bent section.
  • the first adhesive layer includes pressure sensitive adhesive or foam adhesive.
  • the buffer layer includes stainless steel, foam pad or polyimide film.
  • the support layer includes a first support layer disposed on the extension segment close to the display segment and a first support layer disposed on the display segment close to the extension The second support layer of the segment; a buffer layer is provided on the side of the second support layer away from the substrate, and a first adhesive layer is provided between the first support layer and the buffer layer, wherein the The distance from the end of the first adhesive layer away from the non-display area to the non-display area is greater than or equal to the distance from the end of the buffer layer away from the non-display area to the non-display area, and then in the subsequent lamination
  • the pressing area of the first adhesive layer and the buffer layer is effectively increased, and the pressure is reduced, thus solving the problem of reducing the compressive capacity of the buffer layer due to excessive thinning of the buffer layer in order to achieve the narrow frame effect in the current terminal bending process , the obvious problem of the first adhesive layer imprint in the display area of the display module improves the
  • FIG. 1 is a schematic structural diagram of a display module in the prior art of the present application
  • Fig. 2 is the structural representation of the display module in the embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display module with a second adhesive layer provided in an embodiment of the present application
  • FIG. 4 is a schematic structural diagram of a display module with a first adhesive layer provided in another embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display module in which the edge of the first adhesive layer is chamfered in an embodiment of the present application;
  • FIG. 6 is a schematic view showing the structure of the module before bending in an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a manufacturing process of a display module according to an embodiment of the present application.
  • the present application provides a display module, a manufacturing method thereof, and a display device.
  • a display module a manufacturing method thereof, and a display device.
  • the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.
  • Embodiments of the present application provide a display module, a manufacturing method thereof, and a display device. Each will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments.
  • the thickness of the display module is required to be reduced accordingly; and
  • the thickness of the display module is affected by the thickness of the display module material, and the degree of reduction is limited; at the same time, some display module materials will also bring some loss in material performance while pursuing thinning.
  • the thickness of the foam cushion layer in the buffer layer 300 is usually reduced or the polyimide film layer is canceled, which reduces the compressive performance of the buffer layer 300 and makes the display after binding
  • the adhesive layer 500 on the module has obvious imprints, which seriously affects the appearance of the product. Therefore, a display module is needed, which can reduce the thickness of the buffer layer 300 while preventing the adhesive layer 500 from being damaged in the subsequent binding and pressing process.
  • the reduced pressure resistance of the too thin buffer layer 300 will cause the imprint of the adhesive layer 500 to be displayed on the display module, affecting the appearance of the product.
  • the present application provides a display module, as shown in Figure 2, including a display area 01 and a non-display area 02, and the display module includes:
  • the substrate 100 includes a display segment a and an extension segment c disposed opposite to each other, and a bending segment b that bends and connects the display segment a and the extension segment c and is located in the non-display area 02;
  • the display function layer 101 is arranged on the side of the display segment a away from the extension segment c and located in the display area 01;
  • the support layer is arranged on the side of the substrate 100 away from the display function layer 101, including a first support layer 200c arranged on the extension section c close to the display section a and a first support layer 200c arranged on the display section a close to the display section a.
  • the buffer layer 300 is disposed on the side of the second support layer 200a away from the substrate 100;
  • the first adhesive layer 400c is disposed on the first support layer 200c and between the buffer layer 300;
  • the distance from the end of the first adhesive layer 400c away from the non-display area 02 to the non-display area 02 is greater than or equal to the distance from the end of the buffer layer 300 away from the non-display area 02 to the non-display area 02 distance.
  • the substrate 100 may include a display segment a (section a in FIG. 2 ), an extension segment c (section c in FIG. 2 ), and a bending segment b connecting the display segment a and the extension segment c (in FIG. 2 b part);
  • the display segment a has a display side and a back side opposite to each other in the thickness direction of the display module.
  • the display function layer 101 of the embodiment of the present disclosure may be an OLED (Organic Light-Emitting Diode, organic light-emitting diode) structure .
  • the material of the first support layer 200c and the second support layer 200a can be polyethylene terephthalate (PET, Polyethylene terephthalate) or polyimide (PI, Polyimide), but not limited thereto; the materials of the first support layer 200c and the second support layer 200a may be the same.
  • PET Polyethylene terephthalate
  • PI polyimide
  • the buffer layer 300 may be a multi-layer composite structure, and its material includes stainless steel (SUS), foam pad or polyimide film, but is not limited thereto, and may also be other materials;
  • SUS stainless steel
  • foam pad or polyimide film but is not limited thereto, and may also be other materials;
  • the reference plane mentioned in the embodiments of the present disclosure may be a plane perpendicular to the thickness direction of the display module.
  • the first adhesive layer 400c is disposed on the first support layer 200c and between the buffer layer 300. It can be understood that the adhesive layer is compatible with the first support layer 200c and the buffer layer.
  • the layers 300 are in contact, and stacked in the order of the buffer layer 300, the first adhesive layer 400c and the first support layer 200c; the material of the first adhesive layer 400c can be one of optical adhesive layer and foam glue or more.
  • the material of the first adhesive layer 400c of the present application is not limited thereto, and it also has good adhesive properties while ensuring good adhesive properties. Materials with excellent bending performance and good recovery deformation ability are all within the protection scope of this application.
  • the actual thickness of the optical adhesive layer is calculated according to the actual bending radius; while ensuring good adhesive performance, it also has good bending performance and Thick materials with good ability to recover from deformation are all within the scope of protection of this application.
  • the edge portion of the first bonding layer 400c close to the buffer layer 300 may have a certain angle of chamfering, so as to further reduce the impact of the print on the display area 01 of the display panel. risk.
  • the distance from the end of the first adhesive layer 400c away from the non-display area 02 to the non-display area 02 is greater than or equal to the distance from the end of the buffer layer 300 away from the non-display area 02 to the non-display area 02.
  • the distance of the display area 02 specifically, as shown in FIG.
  • the distance between the end 401 of the first adhesive layer 400c and the non-display area 02 is greater than or equal to the end 201 of the first supporting layer 200c
  • the distance from the non-display area 02 using this technical solution, after reducing the thickness of the buffer layer 300 as much as possible, when performing subsequent pressure bonding and binding, by increasing the pressure of the first adhesive layer 400c and the buffer layer 300 area, effectively reducing the pressure, thereby solving the problem of reducing the pressure resistance of the buffer layer 300 due to the excessive thinning of the buffer layer 300 in order to achieve the narrow frame effect in the existing terminal bending process.
  • the problem of obvious imprints reduces the risk of adhesive layer imprints appearing in the display area of the display module, and solves the problem that the first adhesive layer 400c is located inside the first support layer 200c on the existing narrow frame display panel, and the buffer layer Too thin 300 leads to weak compressive capacity, which leads to the problem that the impression affects the appearance of the display panel.
  • the projection of the first adhesive layer 400c in the direction perpendicular to the buffer layer 300 covers the projection of the first supporting layer 200c in the direction perpendicular to the buffer layer 300 .
  • the projection of the first adhesive layer 400c in the direction perpendicular to the buffer layer 300 is the same as the projection of the first supporting layer 200c in the direction perpendicular to the buffer layer 300 The projections in the direction coincide.
  • the projections of the first adhesive layer 400c and the first supporting layer 200c in the direction perpendicular to the buffer layer 300 coincide, and further, the first adhesive layer 400c coincide with the projection of the first support layer 200c in the direction perpendicular to the substrate 100, so that the first adhesive layer 400c and the first support layer 200c can be produced by the same patterning process, reducing the number of steps , reducing production costs.
  • the support layer and the first adhesive layer 400c can be prepared by the same patterning process, which saves the manufacturing process and effectively reduces the production cost.
  • the material of the first adhesive layer 400c includes pressure-sensitive adhesive, and the first adhesive layer 400c obtained when pressure-sensitive adhesive is used as the material is different from other types of adhesive (such as foam glue) as the material.
  • the first bonding layer 400c obtained during this process can have a better bonding effect with the first support layer 200c, and at the same time, the cutting difficulty in the subsequent display panel cutting process is effectively reduced.
  • a second adhesive layer 400a is provided between the second support layer 200a and the buffer layer 300, and the second adhesive layer 400a is perpendicular to the buffer layer.
  • the projection in the direction of the layer 300 at least covers the projection of the second supporting layer 200 a in the direction perpendicular to the buffer layer 300 .
  • the support layer, the first adhesive layer 400c and the second adhesive layer 400a can be prepared by the same patterning process, which saves the manufacturing process and effectively reduces the production cost.
  • the second adhesive layer 400a is disposed between the second supporting layer 200a and the buffer layer 300, and when the buffer layer 300 is set too thin, the second adhesive layer 400a can also act as a buffer layer. To achieve a certain buffering effect, at the same time further bond the second supporting layer and the buffering layer 300 to improve the binding stability of the display panel.
  • the projection of the second adhesive layer 400a in the direction perpendicular to the buffer layer 300 coincides with the projection of the second supporting layer 200a in the direction perpendicular to the buffer layer 300;
  • the material of the second bonding layer 400a includes one or more of optical adhesive layer and foam glue, and can also be a single colloid. This application does not limit the material of the second bonding layer 400a. Colloids with good adhesion effects are all within the protection scope of this application, and can be selected according to actual production conditions.
  • the materials of the second adhesive layer 400a and the first adhesive layer 400c can be the same or different, and can be adjusted according to actual production needs; when the materials are the same, the patterning process can be effectively reduced, reduce manufacturing cost.
  • the display module may further include a strained adhesive layer 600 , and the strained adhesive layer 600 at least covers the bent section b.
  • the strain adhesive layer 600 covers the outside of the bent section b, and covers the edge portions of the display section a and the extension section c.
  • the bending section b of the substrate 100 can be protected by setting the strain adhesive layer 600 to prevent it from breaking during the bending process.
  • its material can be an organic adhesive material, which can be specifically For photosensitive adhesive.
  • the present application also provides a method for manufacturing a display module, as shown in FIG. 7 , including the following steps:
  • the display module includes a display area 01 and a non-display area 02
  • the substrate 100 includes a display segment a and an extension segment c
  • the display segment a and the extension segment c are bent and connected And located at the bending section b of the non-display area 02;
  • the support layer includes the first support layer 200c formed on the side of the extension segment c close to the display segment a and the first support layer 200c formed on the side of the display segment a.
  • the second support layer 200a on the side of the display section a close to the extension section c forms a buffer layer 300 on the side of the second support layer 200a away from the substrate 100, and forms a buffer layer 300 on the side of the second support layer 200a away from the substrate 100, and forms a buffer layer 300 on the side of the first support layer 200c away from A first bonding layer 400c is formed on one side of the substrate 100;
  • the substrate 100 presents a planar structure as shown in FIG. After the layer 400c is bonded, the substrate 100 is bent. After the bending process, the strained adhesive layer 600 can be covered on the periphery of the bent section b of the substrate 100 in time. The strained adhesive layer 600 also covers the display section a and The edge portion of the extension section c protects the bending section b of the display panel, preventing it from being broken during the bending process.
  • a support layer is formed on the side of the substrate 100 away from the display function layer 101, and the support layer includes a first support formed on the side of the extension section c close to the display section a.
  • the first support layer 200c and the first adhesive layer 400c are formed by the same patterning process, so that the projection of the first adhesive layer 400c in a direction perpendicular to the buffer layer 300 is the same as that of the first adhesive layer 400c.
  • the projections of the support layer 200c in a direction perpendicular to the buffer layer 300 coincide.
  • the present application also provides a display device, including the display module described in any one of the above embodiments.
  • the present invention provides a support layer on the side of the substrate 100 away from the display function layer 101, and the support layer includes a first support layer disposed on the extension section c close to the display section a 200c and the second support layer 200a disposed on the display section a close to the extension section c; a buffer layer 300 is provided on the side of the second support layer 200a away from the substrate 100, and a buffer layer 300 is provided on the first support layer 200c and the buffer layer 300 are provided with a first adhesive layer 400c, wherein the distance from the end of the first adhesive layer 400c away from the non-display area 02 to the non-display area 02 is greater than or equal to the The buffer layer 300 is away from the distance from the end of the non-display area 02 to the non-display area 02, and then in the subsequent lamination process, the lamination area between the first adhesive layer 400c and the buffer layer 300 is effectively increased, reducing The pressure is reduced, thereby solving the problem that in the current terminal bending process, in order to achieve the narrow frame effect

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Abstract

一种显示模组及其制作方法、显示装置，该显示模组包括基板（100）、显示功能层（101）、支撑层（200a、200c）、缓冲层（300）和第一粘结层（400c），其中，基板（100）包括相对设置的显示段a和延伸段c、以及弯折连接显示段a和延伸段c且位于非显示区（02）的弯折段b，第一粘结层（400c）远离非显示区（02）一端到非显示区（02）的距离大于或等于第一支撑层（200c）远离非显示区（02）一端到非显示区（02）的距离。

Description

显示模组及其制作方法、显示装置 技术领域
本申请涉及显示模组领域，特别涉及一种显示模组及其制作方法、显示装置。
 背景技术
随着电子设备呈现逐步追求轻薄化和窄边框的发展趋势，受柔性电路板（FPC，FlexiblePrintedCircuit）&行驱动阵列基板（GOA，Gate driver On Array）走线排布等限制，显示模组的下边框处的绑定制约了手机窄边框的发展。
现阶段市面主要通过端子弯曲工艺将FPC&GOA走线弯折至屏体背面进行绑定实现窄边框效果。为了进一步降低边框的宽度，在显示模组进行端子弯曲工艺绑定时，追求弯折半径的极小化，即同时也要求显示模组厚度也随之减小；显示模组的厚度受模组材料厚度的影响，降低程度有限；同时，有些模组材料在追求薄化的同时，也会带来一些材料性能上的损失。
目前，缓冲层为了达到厚度减薄的目的，降低其中的泡沫垫层厚度或者取消其中的聚酰亚胺薄膜层，导致缓冲层抗压性能降低，绑定后显示模组上的粘结层印痕明显，严重影响产品外观。
 技术问题
本申请实施例提供一种显示模组及其制作方法、显示装置，以解决现有的端子弯曲工艺中为实现窄边框效果过度减薄缓冲层导致显示模组上粘结层印痕明显，影响显示模组产品外观的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供了一种显示模组，包括显示区和非显示区，所述显示模组包括：
基板，包括相对设置的显示段和延伸段、以及弯折连接所述显示段和所述延伸段且位于所述非显示区的弯折段；
显示功能层，设置于所述显示段远离所述延伸段的一侧且位于所述显示区内；
支撑层，设置在所述基板远离所述显示功能层的一侧，包括设置于所述延伸段靠近所述显示段的第一支撑层和设置于所述显示段靠近所述延伸段的第二支撑层；
缓冲层，设置在于所述第二支撑层背离所述基板的一侧；
第一粘结层，设置在所述第一支撑层上与所述缓冲层之间；
其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离。
在一实施例中，所述第一粘结层在垂直于所述缓冲层方向上的投影覆盖所述第一支撑层在垂直于所述缓冲层方向上的投影。
在一实施例中，所述第一粘结层在垂直于所述缓冲层方向上的投影与所述第一支撑层在垂直于所述缓冲层方向上的投影重合。
在一实施例中，所述第一粘结层的材料包括压敏胶。
在一实施例中，所述第二支撑层与所述缓冲层之间设有第二粘结层，所述第二粘结层在垂直于所述缓冲层方向上的投影至少覆盖所述第二支撑层在垂直于所述缓冲层方向上的投影。
在一实施例中，所述第二粘结层在垂直于所述缓冲层方向上的投影与所述第二支撑层在垂直于所述缓冲层方向上的投影重合。
在一实施例中，所述显示模组还包括应变胶层，所述应变胶层设置在所述基板背离所述支撑层的一侧，所述应变胶层至少覆盖所述弯折段。
在一实施例中，所述第一粘结层包括压敏胶或泡棉胶。
在一实施例中，所述缓冲层包括不锈钢、泡沫垫或聚酰亚胺薄膜。
本申请还提供一种显示模组的制作方法，包括以下步骤：
提供一基板，所述显示模组包括显示区和非显示区，所述基板包括显示段和延伸段、以及弯折连接所述显示段和所述延伸段且位于所述非显示区的弯折段；
在所述显示段远离所述延伸段的一侧形成位于所述显示区内的显示功能层；
在所述基板远离所述显示功能层的一侧形成支撑层，所述支撑层包括形成于所述延伸段靠近所述显示段一侧的第一支撑层和形成于所述显示段靠近所述延伸段一侧的第二支撑层，在所述第二支撑层背离所述基板的一侧形成缓冲层，在所述第一支撑层背离所述基板的一侧形成第一粘结层；
弯折所述弯折段，使所述显示段与所述延伸段相对设置，且使所述第一粘结层与所述缓冲层压合，其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离。
在一实施例中，在所述基板远离所述显示功能层的一侧形成支撑层,所述支撑层包括形成于所述延伸段靠近所述显示段一侧的第一支撑层，在所述第一支撑层背离所述基板的一侧形成第一粘结层的步骤中:
所述第一支撑层与所述第一粘结层采用同一图案化制程形成，以使所述第一粘结层在垂直于所述缓冲层方向上的投影与所述第一支撑层在垂直于所述缓冲层方向上的投影重合。
本申请还提供一种显示装置，包括显示模组，所述显示模组包括显示区和非显示区，所述显示模组包括：
基板，包括相对设置的显示段和延伸段、以及弯折连接所述显示段和所述延伸段且位于所述非显示区的弯折段；
显示功能层，设置于所述显示段远离所述延伸段的一侧且位于所述显示区内；
支撑层，设置在所述基板远离所述显示功能层的一侧，包括设置于所述延伸段靠近所述显示段的第一支撑层和设置于所述显示段靠近所述延伸段的第二支撑层；
缓冲层，设置在于所述第二支撑层背离所述基板的一侧；
第一粘结层，设置在所述第一支撑层上与所述缓冲层之间；
其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离。
在一实施例中，所述第一粘结层在垂直于所述缓冲层方向上的投影覆盖所述第一支撑层在垂直于所述缓冲层方向上的投影。
在一实施例中，所述第一粘结层在垂直于所述缓冲层方向上的投影与所述第一支撑层在垂直于所述缓冲层方向上的投影重合。
在一实施例中，所述第一粘结层的材料包括压敏胶。
在一实施例中，所述第二支撑层与所述缓冲层之间设有第二粘结层，所述第二粘结层在垂直于所述缓冲层方向上的投影至少覆盖所述第二支撑层在垂直于所述缓冲层方向上的投影。
在一实施例中，所述第二粘结层在垂直于所述缓冲层方向上的投影与所述第二支撑层在垂直于所述缓冲层方向上的投影重合。
在一实施例中，所述显示模组还包括应变胶层，所述应变胶层设置在所述基板背离所述支撑层的一侧，所述应变胶层至少覆盖所述弯折段。
在一实施例中，所述第一粘结层包括压敏胶或泡棉胶。
在一实施例中，所述缓冲层包括不锈钢、泡沫垫或聚酰亚胺薄膜。
 有益效果
通过在所述基板在远离所述显示功能层的一侧上设置支撑层，支撑层包括设置于所述延伸段靠近所述显示段的第一支撑层和设置于所述显示段靠近所述延伸段的第二支撑层；在所述第二支撑层背离所述基板的一侧设置缓冲层，在所述第一支撑层上与所述缓冲层之间设置第一粘结层，其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离，进而在后续的压合工艺中，有效增大了第一粘结层与缓冲层的压合面积，降低了压强，从而解决了目前端子弯曲工艺中为实现窄边框效果，过度减薄缓冲层导致缓冲层抗压能力降低，显示模组的显示区第一粘结层印痕明显的问题，提升了显示模组的外观良率。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请现有技术中的显示模组结构示意图；
图2为本申请实施例中的显示模结构示意图；
图3为本申请一实施例中的设置第二粘结层的显示模组结构示意图；
图4为本申请另一实施例中的设置第一粘结层的显示模组结构示意图；
图5为本申请一实施例中的第一粘结层边缘为倒角的显示模组结构示意图；
图6为本申请一实施例中显示模组未弯折前的结构示意图；
图7为本申请一实施例的显示模组的制作流程示意图。
 本发明的实施方式
本申请提供一种显示模组及其制作方法、显示装置，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请实施例提供显示模组及其制作方法、显示装置。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
目前，如图1所示，在显示模组进行端子弯曲工艺绑定时，为了进一步的降低边框的宽度，追求弯折半径的极小化，即要求显示模组厚度也随之减小；而显示模组的厚度受显示模组材料厚度的影响，降低程度有限；同时，有些显示模组材料在追求薄化的同时也会带来一些材料性能上的损失。
目前，缓冲层300为了达到厚度减薄的目的，通常采用降低缓冲层300中的泡沫垫层厚度或者取消其中的聚酰亚胺薄膜层，导致缓冲层300抗压性能降低，使得绑定后显示模组上的粘胶层500印痕明显，严重影响产品外观，因此需要一种显示模组，其能够在降低缓冲层300厚度的同时，防止粘胶层500在后续绑定压合工艺中，因过薄的缓冲层300的抗压能力降低导致显示模组上显示粘胶层500的印痕，影响产品外观。
现结合具体实施例对本申请的技术方案进行描述，具体如图2~7所示。
本申请提供了一种显示模组，如图2所示，包括显示区01和非显示区02，所述显示模组包括：
基板100，包括相对设置的显示段a和延伸段c、以及弯折连接所述显示段a和所述延伸段c且位于所述非显示区02的弯折段b；
显示功能层101，设置于所述显示段a远离所述延伸段c的一侧且位于所述显示区01内；
支撑层，设置在所述基板100远离所述显示功能层101的一侧，包括设置于所述延伸段c靠近所述显示段a的第一支撑层200c和设置于所述显示段a靠近所述延伸段c的第二支撑层200a；
缓冲层300，设置在于所述第二支撑层200a背离所述基板100的一侧；
第一粘结层400c，设置在所述第一支撑层200c上与所述缓冲层300之间；
其中，所述第一粘结层400c远离所述非显示区02一端到所述非显示区02的距离大于或等于所述缓冲层300远离所述非显示区02一端到所述非显示区02的距离。
具体地，所述基板100可包括显示段a(图2中a段部位)、延伸段c(图2中c段部位)及连接显示段a和延伸段c的弯折段b(图2中b处部位)；
其中，此显示段a具有在显示模组的厚度方向上相对的显示侧和背侧，进一步地，本公开实施例的显示功能层101可为OLED(Organic Light‑Emitting Diode，有机发光二极管)结构。
具体地，所述第一支撑层200c和所述第二支撑层200a的材料可为聚对苯二甲酸乙二醇酯(PET，Polyethylene terephthalate)或聚酰亚胺(PI，Polyimide)，但不限于此；所述第一支撑层200c和所述第二支撑层200a的材料可相同。
具体地，所述缓冲层300可以为多层复合结构，其材质包括不锈钢(SUS)、泡沫垫或者聚酰亚胺薄膜，但不限于此，也可为其他材料；
需要说明的是，本公开实施例提到的参考平面可为与显示模组的厚度方向相垂直的平面。
具体地，所述第一粘结层400c设置在第一支撑层200c上与所述缓冲层300之间，可以理解的是，所述粘结层与所述第一支撑层200c和所述缓冲层300相接触，按照缓冲层300、第一粘结层400c和第一支撑层200c的顺序叠设；所述第一粘结层400c的材质可以为光学胶层、泡棉胶中的一种或多种。
承上，在本实施例中可以为光学胶层，具体可以为压敏胶；但是本申请的第一粘结层400c的材料不限于此，在保证具有良好粘接性能的同时，还具有良好的弯折性能和良好的恢复变形能力的材料均在本申请保护范围内。
具体地，在第一粘结层400c为压敏胶时，光学胶层的实际厚度根据实际的弯折半径进行计算得到；能够保证具有良好粘接性能的同时，还具有良好的弯折性能和良好的恢复变形能力的厚度材料均在本申请的保护范围内。
具体地，如图5所示，所述第一粘结层400c靠近所述缓冲层300的一侧的边缘部分可以具有一定角度的倒角，用以进一步降低显示面板的显示区01印痕产生的风险。
可以理解的是，所述第一粘结层400c远离所述非显示区02一端到所述非显示区02的距离大于或等于所述缓冲层300远离所述非显示区02一端到所述非显示区02的距离，具体地，如图2所示，所述第一粘结层400c的端部401距离所述非显示区02的距离大于或等于所述第一支撑层200c的端部201距离所述非显示区02的距离，采用该技术方案，在尽量减薄所述缓冲层300后，进行后续压合绑定时，通过增大第一粘结层400c与缓冲层300的压合面积，有效降低了压强，从而解决了现有的端子弯曲工艺中为实现窄边框效果，过度减薄缓冲层300导致缓冲层300抗压能力降低显示模组的显示区01第一粘结层400c印痕明显的问题，降低了粘结层印痕出现在显示模组的显示区的风险，解决了现有的窄边框显示面板上因第一粘结层400c位于第一支撑层200c内侧，且缓冲层300过薄导致的抗压能力弱进而产生印痕影响显示面板外观的问题。
另外需要注意的是，即使第一粘结层400c因面积大于所述第一支撑层200c的面积产生溢胶现象，也并不会对显示面板的显示功能、组装及显示区01的显示面板的外观产生影响，因此可以忽略不计。
在一实施例中，所述第一粘结层400c在垂直于所述缓冲层300方向上的投影覆盖所述第一支撑层200c在垂直于所述缓冲层300方向上的投影。
承上，本实施例中，如图3所示，所述第一粘结层400c在垂直于所述缓冲层300方向上的投影与所述第一支撑层200c在垂直于所述缓冲层300方向上的投影重合。
可以理解的是，采用该技术方案，所述第一粘结层400c和所述第一支撑层200c在垂直所述缓冲层300方向上的投影重合，进一步地，所述第一粘结层400c和所述第一支撑层200c在垂直所述基板100方向上的投影重合，使得所述第一粘结层400c和所述第一支撑层200c能够采用同一图案化制程进行制作，减少了操作步骤，降低了生产成本。
采用该技术方案，能够在进行支撑层和第一粘结层400c的制备时，采用同一图案化工艺形成，节约了制程，有效降低了生产成本。
在一实施例中，所述第一粘结层400c的材料包括压敏胶，采用压敏胶作为材料时得到的第一粘结层400c相对于其它种类的胶（例如泡棉胶）作为材料时得到的第一粘结层400c能够与所述第一支撑层200c起到更好的粘合效果，同时，在后续的显示面板切割制程中切割难度得到有效降低。
在一实施例中，如图4所示，所述第二支撑层200a与所述缓冲层300之间设有第二粘结层400a，所述第二粘结层400a在垂直于所述缓冲层300方向上的投影至少覆盖所述第二支撑层200a在垂直于所述缓冲层300方向上的投影。
采用该技术方案，能够在进行支撑层、第一粘结层400c和第二粘结层400a的制备时，采用同一图案化工艺形成，节约了制程，有效降低了生产成本。
可以理解的是，所述第二粘结层400a设置于所述第二支撑层200a与所述缓冲层300之间，当缓冲层300设置的过于薄时，第二粘结层400a也能够起到一定的缓冲效果，同时进一步粘合第二支撑层和缓冲层300，提高显示面板的绑定稳定程度。
承上，本实施例中，所述第二粘结层400a在垂直于所述缓冲层300方向上的投影与所述第二支撑层200a在垂直于所述缓冲层300方向上的投影重合；
具体地，第二粘结层400a的材料包括光学胶层、泡棉胶中的一种或多种，也可以为单胶体，本申请不限制所述第二粘结层400a的材质，能够起到良好粘合效果的胶体均在本申请保护范围内，具体可以根据实际生产情况进行选择。
具体地，所述第二粘结层400a和所述第一粘结层400c的材料可以相同也可以不同，具体可以根据实际的生产需要进行调整；当材料相同时，能够有效减少图案化制程，降低生产成本。
在一实施例中，所述显示模组还可以包括应变胶层600，所述应变胶层600至少覆盖所述弯折段b。
具体地，所述应变胶层600覆盖在所述弯折段b的外侧，以及覆盖显示段a和延伸段c的边缘部分。
可以理解的是，通过设置应变胶层600可对所述基板100的弯折段b进行保护，避免其在弯折过程中出现断裂的情况，具体地，其材质可为有机胶材，具体可以为光敏胶。
本申请还提供一种显示模组的制作方法，如图7所示，包括以下步骤：
S1、提供一基板100，所述显示模组包括显示区01和非显示区02，所述基板100包括显示段a和延伸段c、以及弯折连接所述显示段a和所述延伸段c且位于所述非显示区02的弯折段b；
S2、在所述显示段a远离所述延伸段c的一侧形成位于所述显示区01内的显示功能层101；
S3、在所述基板100远离所述显示功能层101的一侧形成支撑层，所述支撑层包括形成于所述延伸段c靠近所述显示段a一侧的第一支撑层200c和形成于所述显示段a靠近所述延伸段c一侧的第二支撑层200a，在所述第二支撑层200a背离所述基板100的一侧形成缓冲层300，在所述第一支撑层200c背离所述基板100的一侧形成第一粘结层400c；
S4、弯折所述弯折段b，使所述显示段a与所述延伸段c相对设置，且使所述第一粘结层400c与所述缓冲层300压合，其中，所述第一粘结层400c远离所述非显示区02一端到所述非显示区02的距离大于或等于所述缓冲层300远离所述非显示区02一端到所述非显示区02的距离。
具体地，在制备显示模组时，所述基板100呈现如图6所示的平面结构，所述基板100的弯折段b还未弯折，在形成支撑层、缓冲层300和第一粘结层400c后，再对基板100进行弯折处理，在弯折处理后还可以及时在基板100的弯折段b外围覆盖应变胶层600，此应变胶层600还覆盖所述显示段a和所述延伸段c的边缘部分，对显示面板的弯折段b进行保护，避免其在弯折过程中出现断裂的情况。
可以理解的是，通过将所述第一粘结层400c和所述第一支撑层200c制程一体化，可以减少一道贴合工艺，减少对产品缓冲层300的压合次数，降低印痕风险。
在一实施例中，在S3所述基板100远离所述显示功能层101的一侧形成支撑层,所述支撑层包括形成于所述延伸段c靠近所述显示段a一侧的第一支撑层200c，在所述第一支撑层200c背离所述基板100的一侧形成第一粘结层400c的步骤中:
所述第一支撑层200c与所述第一粘结层400c采用同一图案化制程形成，以使所述第一粘结层400c在垂直于所述缓冲层300方向上的投影与所述第一支撑层200c在垂直于所述缓冲层300方向上的投影重合。
可以理解的是，当所述第一粘结层400c和所述第二粘结层400a材料相同时，能够有效减少制程，降低生产成本。
本申请还提供一种显示装置，包括上述任一实施例所述的显示模组。
综上所述，本发明通过在所述基板100在远离所述显示功能层101的一侧上设置支撑层，支撑层包括设置于所述延伸段c靠近所述显示段a的第一支撑层200c和设置于所述显示段a靠近所述延伸段c的第二支撑层200a；在所述第二支撑层200a背离所述基板100的一侧设置缓冲层300，在所述第一支撑层200c上与所述缓冲层300之间设置第一粘结层400c，其中，所述第一粘结层400c远离所述非显示区02一端到所述非显示区02的距离大于或等于所述缓冲层300远离所述非显示区02一端到所述非显示区02的距离，进而在后续的压合工艺中，有效增大了第一粘结层400c与缓冲层300的压合面积，降低了压强，从而解决了目前端子弯曲工艺中为实现窄边框效果，过度减薄缓冲层300导致缓冲层300抗压能力降低显示模组的显示区01第一粘结层400c印痕明显的问题，提升了显示模组的外观良率。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示模组，其中，包括显示区和非显示区，所述显示模组包括：
    基板，包括相对设置的显示段和延伸段、以及弯折连接所述显示段和所述延伸段且位于所述非显示区的弯折段；
    显示功能层，设置于所述显示段远离所述延伸段的一侧且位于所述显示区内；
    支撑层，设置在所述基板远离所述显示功能层的一侧，包括设置于所述延伸段靠近所述显示段的第一支撑层和设置于所述显示段靠近所述延伸段的第二支撑层；
    缓冲层，设置在于所述第二支撑层背离所述基板的一侧；
    第一粘结层，设置在所述第一支撑层上与所述缓冲层之间；
    其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离。
  2. 根据权利要求1所述的显示模组，其中，所述第一粘结层在垂直于所述缓冲层方向上的投影覆盖所述第一支撑层在垂直于所述缓冲层方向上的投影。
  3. 根据权利要求2所述的显示模组，其中，所述第一粘结层在垂直于所述缓冲层方向上的投影与所述第一支撑层在垂直于所述缓冲层方向上的投影重合。
  4. 根据权利要求1所述的显示模组，其中，所述第一粘结层的材料包括压敏胶。
  5. 根据权利要求1所述的显示模组，其中，所述第二支撑层与所述缓冲层之间设有第二粘结层，所述第二粘结层在垂直于所述缓冲层方向上的投影至少覆盖所述第二支撑层在垂直于所述缓冲层方向上的投影。
  6. 根据权利要求5所述的显示模组，其中，所述第二粘结层在垂直于所述缓冲层方向上的投影与所述第二支撑层在垂直于所述缓冲层方向上的投影重合。
  7. 根据权利要求1所述的显示模组，其中，所述显示模组还包括应变胶层，所述应变胶层设置在所述基板背离所述支撑层的一侧，所述应变胶层至少覆盖所述弯折段。
  8. 根据权利要求1所述的显示模组，其中，所述第一粘结层包括压敏胶或泡棉胶。
  9. 根据权利要求1所述的显示模组，其中，所述缓冲层包括不锈钢、泡沫垫或聚酰亚胺薄膜。
  10. 一种显示模组的制作方法，其中，包括以下步骤：
    提供一基板，所述显示模组包括显示区和非显示区，所述基板包括显示段和延伸段、以及弯折连接所述显示段和所述延伸段且位于所述非显示区的弯折段；
    在所述显示段远离所述延伸段的一侧形成位于所述显示区内的显示功能层；
    在所述基板远离所述显示功能层的一侧形成支撑层，所述支撑层包括形成于所述延伸段靠近所述显示段一侧的第一支撑层和形成于所述显示段靠近所述延伸段一侧的第二支撑层，在所述第二支撑层背离所述基板的一侧形成缓冲层，在所述第一支撑层背离所述基板的一侧形成第一粘结层；
    弯折所述弯折段，使所述显示段与所述延伸段相对设置，且使所述第一粘结层与所述缓冲层压合，其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离。
  11. 根据权利要求10所述的显示模组的制备方法，其中，在所述基板远离所述显示功能层的一侧形成支撑层,所述支撑层包括形成于所述延伸段靠近所述显示段一侧的第一支撑层，在所述第一支撑层背离所述基板的一侧形成第一粘结层的步骤中:
    所述第一支撑层与所述第一粘结层采用同一图案化制程形成，以使所述第一粘结层在垂直于所述缓冲层方向上的投影与所述第一支撑层在垂直于所述缓冲层方向上的投影重合。
  12. 一种显示装置，其中，包括显示模组，所述显示模组包括显示区和非显示区，所述显示模组包括：
    基板，包括相对设置的显示段和延伸段、以及弯折连接所述显示段和所述延伸段且位于所述非显示区的弯折段；
    显示功能层，设置于所述显示段远离所述延伸段的一侧且位于所述显示区内；
    支撑层，设置在所述基板远离所述显示功能层的一侧，包括设置于所述延伸段靠近所述显示段的第一支撑层和设置于所述显示段靠近所述延伸段的第二支撑层；
    缓冲层，设置在于所述第二支撑层背离所述基板的一侧；
    第一粘结层，设置在所述第一支撑层上与所述缓冲层之间；
    其中，所述第一粘结层远离所述非显示区一端到所述非显示区的距离大于或等于所述缓冲层远离所述非显示区一端到所述非显示区的距离。
  13. 根据权利要求12所述的显示装置，其中，所述第一粘结层在垂直于所述缓冲层方向上的投影覆盖所述第一支撑层在垂直于所述缓冲层方向上的投影。
  14. 根据权利要求13所述的显示装置，其中，所述第一粘结层在垂直于所述缓冲层方向上的投影与所述第一支撑层在垂直于所述缓冲层方向上的投影重合。
  15. 根据权利要求12所述的显示装置，其中，所述第一粘结层的材料包括压敏胶。
  16. 根据权利要求12所述的显示装置，其中，所述第二支撑层与所述缓冲层之间设有第二粘结层，所述第二粘结层在垂直于所述缓冲层方向上的投影至少覆盖所述第二支撑层在垂直于所述缓冲层方向上的投影。
  17. 根据权利要求16所述的显示装置，其中，所述第二粘结层在垂直于所述缓冲层方向上的投影与所述第二支撑层在垂直于所述缓冲层方向上的投影重合。
  18. 根据权利要求12所述的显示装置，其中，所述显示模组还包括应变胶层，所述应变胶层设置在所述基板背离所述支撑层的一侧，所述应变胶层至少覆盖所述弯折段。
  19. 根据权利要求12所述的显示装置，其中，所述第一粘结层包括压敏胶或泡棉胶。
  20. 根据权利要求12所述的显示装置，其中，所述缓冲层包括不锈钢、泡沫垫或聚酰亚胺薄膜。
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Publication number Priority date Publication date Assignee Title
CN114038339B (zh) * 2021-12-09 2023-01-10 武汉华星光电半导体显示技术有限公司 显示模组及移动终端
CN114333583A (zh) * 2021-12-27 2022-04-12 昆山国显光电有限公司 显示模组及显示装置
CN114666997A (zh) * 2022-03-29 2022-06-24 京东方科技集团股份有限公司 显示模组的制作方法、制作显示模组的设备及显示模组
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180182829A1 (en) * 2016-12-22 2018-06-28 Lg Display Co., Ltd. Organic Light Emitting Display Device
CN112017540A (zh) * 2020-08-11 2020-12-01 武汉华星光电半导体显示技术有限公司 一种背板结构、显示面板及背板结构的制作方法
CN112071197A (zh) * 2020-09-09 2020-12-11 武汉华星光电半导体显示技术有限公司 一种显示装置及电子设备
CN112530295A (zh) * 2020-12-28 2021-03-19 厦门天马微电子有限公司 一种显示装置
CN213183388U (zh) * 2020-11-06 2021-05-11 京东方科技集团股份有限公司 显示模组及显示装置
CN113140158A (zh) * 2021-04-06 2021-07-20 武汉华星光电半导体显示技术有限公司 显示面板和显示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106847871B (zh) * 2017-03-22 2020-06-16 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN111968521A (zh) * 2020-09-09 2020-11-20 合肥维信诺科技有限公司 显示面板及显示装置
CN112820199A (zh) * 2021-02-10 2021-05-18 合肥维信诺科技有限公司 一种柔性显示面板及柔性显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180182829A1 (en) * 2016-12-22 2018-06-28 Lg Display Co., Ltd. Organic Light Emitting Display Device
CN112017540A (zh) * 2020-08-11 2020-12-01 武汉华星光电半导体显示技术有限公司 一种背板结构、显示面板及背板结构的制作方法
CN112071197A (zh) * 2020-09-09 2020-12-11 武汉华星光电半导体显示技术有限公司 一种显示装置及电子设备
CN213183388U (zh) * 2020-11-06 2021-05-11 京东方科技集团股份有限公司 显示模组及显示装置
CN112530295A (zh) * 2020-12-28 2021-03-19 厦门天马微电子有限公司 一种显示装置
CN113140158A (zh) * 2021-04-06 2021-07-20 武汉华星光电半导体显示技术有限公司 显示面板和显示装置

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