WO2023098693A1 - 双面封装组件及其形成方法 - Google Patents

双面封装组件及其形成方法 Download PDF

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Publication number
WO2023098693A1
WO2023098693A1 PCT/CN2022/135232 CN2022135232W WO2023098693A1 WO 2023098693 A1 WO2023098693 A1 WO 2023098693A1 CN 2022135232 W CN2022135232 W CN 2022135232W WO 2023098693 A1 WO2023098693 A1 WO 2023098693A1
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Prior art keywords
adapter
double
substrate
sided
glue
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Ceased
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English (en)
French (fr)
Inventor
姚力
尹红成
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Spreadtrum Communications Shanghai Co Ltd
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Spreadtrum Communications Shanghai Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Definitions

  • the present application belongs to the technical field of packaging, and in particular relates to a double-sided packaging component and a forming method thereof.
  • the double-sided SIP is a double-sided sticker, and an Interposer (transfer piece) is set on the back as a supporting structure and a signal lead-out end.
  • the Interposer is easy to fall off during the reflow (reflow soldering) process, and it needs to be reinforced by dispensing Connection strength, but glue dispensing will bring overflow glue problem, which will greatly reduce the surface area of the back surface.
  • the flatness of the glue edge is not controlled, and the Sputtering (sputtering) process cannot be completed to achieve the EMI Coating (electromagnetic interference) of the entire package component. effect of the coating process).
  • the technical problem to be solved in this application is to provide a double-sided packaging component and a forming method thereof in order to overcome the above-mentioned defects in the prior art.
  • a double-sided package assembly including a substrate, devices are provided on the front and back of the substrate, and an adapter is provided on the back of the substrate, and the height of the adapter is not less than the height of any device arranged on the back high;
  • the highest point of the outer colloid of the adapter is higher than the highest point of the inner colloid of the adapter
  • the adapter is fixedly connected to the substrate by external glue dispensing on the outside of the adapter to form the outer glue and the inner glue.
  • a retaining wall is provided on the base plate
  • the adapter is located on the outside of the retaining wall, the retaining wall is located on the outside of all devices on the back, and the height of the retaining wall is smaller than that of the adapter.
  • the outer rubber surface of the outer rubber is a flat cut surface.
  • a shielding layer is formed on the outer surface of the double-sided packaging component including the outer adhesive surface.
  • the material of the retaining wall is insulating.
  • a method of forming a double-sided package assembly comprising:
  • An adapter and at least one device are arranged on the back of the substrate; the height of the adapter is not less than the height of any device arranged on the back;
  • the adapter is fixedly connected to the substrate by external glue dispensing on the outside of the adapter, and an outer glue and an inner glue of the adapter are formed.
  • the Formation methods also include:
  • the adapter is located on the outside of the retaining wall
  • the retaining wall is located on the outside of all the devices on the back
  • the height of the retaining wall is smaller than that of the adapter
  • the forming method further includes:
  • the outer rubber surface of the outer rubber body is cut to obtain a flat cut surface.
  • the forming method further includes:
  • a shielding layer is formed on the outer surface of the double-sided packaging assembly including the outer adhesive surface.
  • the setting of the retaining wall on the back of the substrate specifically includes:
  • the barrier wall is formed when ink is printed on the back surface of the substrate.
  • the substrate is used to make a plurality of double-sided packaging components, and each double-sided packaging component is correspondingly provided with an adapter, and the cutting of the outer adhesive surface of the adapter to obtain a flat cut surface includes :
  • the glue between two adjacent adapters is cut to obtain a plurality of double-sided packaging components whose outer glue surfaces are flat cut surfaces.
  • the positive and progressive effect of this application lies in: adopting the method of dispensing glue on the entire periphery of the chip, that is, the outside of the adapter, to fix the adapter, cooperate with the design of the substrate retaining wall, control the overflow distance of the glue, and prevent the bottom device from contacting the glue.
  • the single cutting process makes the dispensing surface smooth, which meets the process requirements of sputtering, making the shielding layer complete and effective.
  • FIG. 1 is a schematic structural diagram of a double-sided packaging assembly according to Embodiment 1 of the present application.
  • FIG. 2 is a partial structural schematic diagram of a double-sided packaging assembly according to Embodiment 1 of the present application.
  • FIG. 3 is a schematic structural diagram of a double-sided packaging assembly according to Embodiment 2 of the present application.
  • FIG. 4 is a flowchart of a method for forming a double-sided package assembly according to Embodiment 3 of the present application.
  • FIG. 5 is a schematic diagram of the process of the forming method of the double-sided package assembly according to Embodiment 3 of the present application.
  • FIG. 6 is a flowchart of a method for forming a double-sided package assembly according to Embodiment 4 of the present application.
  • FIG. 7 is a schematic diagram of the process of cutting the glue and forming a shielding layer in the process method of the double-sided packaging assembly according to Embodiment 4 of the present application.
  • FIG. 8 is a flowchart of a method for forming a double-sided package assembly according to Embodiment 5 of the present application.
  • FIG. 9 is a schematic process diagram of a method for forming a double-sided package assembly according to Embodiment 5 of the present application.
  • FIG. 10 is a schematic diagram of the process of the method for forming the double-sided package assembly according to Embodiment 6 of the present application.
  • a double-sided package assembly as shown in FIG.
  • the height of the connector 3 is not less than the height of any device 2 arranged on the back surface 102;
  • the highest point of the outer colloid of the adapter 3 is higher than the highest point of the inner colloid of the adapter 3;
  • the adapter 3 is fixedly connected to the substrate 1 by means of external glue dispensing on the outside of the adapter 3 to form the outer glue and the inner glue.
  • the outer side dispensing can be realized by the glue dispenser 4 .
  • the outer rubber surface 5 of the outer rubber is a flat cut surface.
  • a shielding layer 6 is formed on the outer surface of the double-sided packaging component including the outer adhesive surface 5 .
  • the external dispensing is used instead of dispensing the internal chip.
  • the area on the substrate that can be attached is increased, and on the other hand, the overflow of glue is controlled to a certain extent. distance to prevent the bottom device from contacting the glue.
  • the outer rubber surface of the adapter is a flat surface, which facilitates the formation of a complete shielding layer and improves the effectiveness of electromagnetic shielding.
  • the double-sided packaging assembly of this embodiment is further improved on the basis of Embodiment 1.
  • the substrate 1 is provided with a retaining wall 7;
  • the adapter 3 is located outside the retaining wall 7 , and the retaining wall 7 is located outside all the components 2 on the back surface 102 .
  • the height of the retaining wall 7 is smaller than that of the adapter 3 .
  • the material of the retaining wall 7 is insulating.
  • a retaining wall is set on the inner side of the chip adapter, and when dispensing glue on the outer side of the adapter, combined with the design of the substrate retaining wall, it can effectively control the distance of glue overflow and prevent the components mounted on the substrate from contact with glue.
  • a method for forming a double-sided packaging component as shown in Figure 4, the method for forming includes:
  • Step 10 providing a substrate
  • Step 11 setting the adapter and at least one device on the back of the substrate; the height of the adapter is not less than the height of any device arranged on the back; see Figure 5-b for details;
  • the front side of the substrate may include mounting components on the front side of the substrate based on a mounting process, and performing underfill and injection molding on the front side of the substrate. See Figure 5-a for details;
  • packaging components may also include but not limited to substrate baking, solder paste printing, surface inspection, surface mount, optical inspection, reflow soldering, flux removal, X-ray inspection, mechanical slotting, plasma cleaning, printing Operation processes such as wire bonding are specifically performed as required, which is not limited in this application.
  • Step 12 The adapter is fixedly connected to the substrate by dispensing glue on the outside of the adapter, and the outer glue and the inner glue of the adapter are formed. See Figure 5-c for details;
  • the external dispensing is used instead of dispensing the internal chip.
  • the area on the substrate that can be attached is increased, and on the other hand, the overflow of glue is controlled to a certain extent. distance to prevent the bottom device from contacting the glue.
  • the method for forming the double-sided packaging assembly of this embodiment is further improved on the basis of Embodiment 3, as shown in Figure 6, after step 12, the forming method further includes:
  • Step 131 cutting the outer glue surface of the outer glue to obtain a flat cut surface.
  • 7-a is a partial schematic diagram of the double-sided packaging assembly before the colloid is not cut
  • 7-b is a partial schematic diagram of the double-sided packaging assembly after the colloid is cut
  • 7-c is a double-sided packaging assembly based on a flat cutting surface.
  • the generation of the shielding layer is realized based on the EMI Coating method, which is mainly divided into two types: Sputtering (sputtering) and Spray Coating (spraying).
  • the Coating (coating) material is grounded as a whole to complete the role of electromagnetic shielding. Realize the generation of shielding layer.
  • the packaging singulation process is used to make the outer rubber surface of the adapter a flat surface, thereby facilitating the formation of a complete shielding layer and improving the effectiveness of electromagnetic shielding.
  • the method for forming the double-sided package assembly of this embodiment is further improved on the basis of Embodiment 3, as shown in Figure 8, after step 10, the manufacturing method further includes:
  • Step 101 setting a retaining wall on the back of the substrate; see Figure 9-a for details;
  • the adapter is located on the outer side of the retaining wall, and the retaining wall is located on the outer side of all devices on the back, and the height of the retaining wall is smaller than that of the adapter.
  • a mold can be used to form the barrier wall when ink is printed on the back of the substrate, that is, the barrier wall is formed by ink. What needs to be said is that if the barrier wall is not formed when printing ink on the back of the substrate, and if the barrier wall is set based on other mounting processes, it is only necessary to set the barrier wall between dispensing.
  • Figure 9-b shows the substrate front mounting, front underfill and injection molding
  • Figure 9-c corresponds to step 11
  • Figure 9-d corresponds to step 12;
  • the forming method further includes:
  • Step 141 cutting the outer glue surface of the outer glue to obtain a flat cut surface.
  • the overall periphery of the chip that is, the outside of the adapter, is used to fix the adapter by dispensing glue.
  • the glue overflow distance is controlled, and the bottom device is effectively prevented from contacting the glue.
  • the adapter The outer rubber surface is a flat surface, which facilitates the formation of a complete shielding layer and improves the effectiveness of electromagnetic shielding.
  • FIG. 10 it is a schematic diagram of two double-sided packaging components, on the chip (ie corresponding to each double-sided packaging component) There is a space between the chip and the chip, so that the dispensing equipment can directly dispens each double-sided packaging component before the substrate is cut. After dispensing, cut from the arrow when cutting, and directly form multiple outer glue surfaces. Double-sided encapsulation components with flat cut surfaces.
  • a shielding layer is generated on the outer surface of each surface package component containing a flat outer adhesive surface based on EMI Coating.
  • the EMI Coating method is mainly divided into Sputtering (sputtering) and Spray Coating (spraying).
  • the Coating (coating) material is grounded as a whole to complete the role of electromagnetic shielding.
  • the shielding layer can also be generated by other methods.

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Packages (AREA)

Abstract

本申请公开了一种双面封装组件及其形成方法，包括基板，所述基板的正面和背面均设有器件，所述基板的背面设有转接件，所述转接件的高度不小于设置在背面的任一器件的高度；所述转接件的外侧胶体的最高点高于所述转接件的内侧胶体的最高点；其中，在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接并形成所述外侧胶体和所述内侧胶体。本申请采用芯片整体外围也即转接件的外侧进行点胶的方式固定转接件，配合基板挡墙设计，控制溢胶距离，防止底部器件接触胶水，另外，利用封装切单工序，使点胶面平整，符合sputtering的工艺要求，使得屏蔽层完整、有效。

Description

双面封装组件及其形成方法
本申请要求申请日为2021年12月1日的中国专利申请CN202111454151.0的优先权。本申请引用上述中国专利申请的全文。
技术领域
本申请属于封装技术领域，特别涉及一种双面封装组件及其形成方法。
背景技术
传统的单层SIP(系统级封装)封装过程中，由于器件只放在单面，通常采用外部EMI Coating(电磁干扰涂层工艺)或者Metal CAN(金属盖工艺)的形式即可达到屏蔽电磁干扰的目的。但是，由于单层摆放数量有限，且数字/模拟/射频信号都在同一面，隔离度差，内部器件之间容易互相干扰，由此双面SIP被应用于实际。
双面SIP为双面贴件，并在背面设置Interposer(转接件)作为支撑结构和信号引出端，而现有技术中，Interposer在reflow(回流焊)过程中容易脱落，需要增加点胶加强连接强度，但点胶会带来溢胶问题，大幅降低背面的贴件面积，同时进胶边平整度不受控，无法完成Sputtering(溅射)工艺以达成整个封装组件的EMI Coating(电磁干扰涂层工艺)的效果。
发明内容
本申请要解决的技术问题是为了克服现有技术中的上述缺陷，提供一种双面封装组件及其形成方法。
本申请是通过下述技术方案来解决上述技术问题：
一种双面封装组件，包括基板，所述基板的正面和背面均设有器件，所述基板的背面设有转接件，所述转接件的高度不小于设置在背面的任一器件 的高度；
所述转接件的外侧胶体的最高点高于所述转接件的内侧胶体的最高点；
其中，在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接并形成所述外侧胶体和所述内侧胶体。
较佳地，所述基板上设有挡墙；
所述转接件位于所述挡墙的外侧，所述挡墙位于背面的所有器件的外侧，所述挡墙的高度小于所述转接件的高度。
较佳地，所述外侧胶体的外侧胶面为平整切面。
较佳地，包含所述外侧胶面的双面封装组件的外表面生成有屏蔽层。
较佳地，所述挡墙的材质是绝缘的。
一种双面封装组件的形成方法，所述形成方法包括：
提供一基板；
在基板的背面设置转接件和至少一个器件；所述转接件的高度不小于设置在背面的任一器件的高度；
在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接，并形成所述转接件的外侧胶体和内侧胶体。
较佳地，所述在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接，并形成所述转接件的外侧胶体和内侧胶体之前，所述形成方法还包括：
在基板的背面设置挡墙；
其中，所述转接件位于所述挡墙的外侧，所述挡墙位于背面的所有器件的外侧，所述挡墙的高度小于所述转接件的高度。
较佳地，所述形成方法还包括：
对所述外侧胶体的外侧胶面进行切割以得到平整切面。
较佳地，所述对所述转接件的外侧胶面进行切割以得到平整切面之后，所述形成方法还包括：
在包含所述外侧胶面的双面封装组件的外表面生成屏蔽层。
较佳地，所述在基板的背面设置挡墙具体包括：
在对所述基板的背面印刷油墨时形成所述挡墙。
较佳地，所述基板用于制作多个双面封装组件，每个双面封装组件对应设置有一个转接件，所述对所述转接件的外侧胶面进行切割以得到平整切面包括：
对相邻两个转接件之间的胶体进行切割得到多个外侧胶面为平整切面的双面封装组件。
本申请的积极进步效果在于：采用芯片整体外围也即转接件的外侧进行点胶的方式固定转接件，配合基板挡墙设计，控制溢胶距离，防止底部器件接触胶水，另外，利用封装切单工序，使点胶面平整，符合sputtering的工艺要求，使得屏蔽层完整、有效。
附图说明
图1为本申请实施例1的双面封装组件的结构示意图。
图2为本申请实施例1的双面封装组件的部分结构示意图。
图3为本申请实施例2的双面封装组件的结构示意图。
图4为本申请实施例3的双面封装组件的形成方法的流程图。
图5为本申请实施例3的双面封装组件的形成方法的工序示意图。
图6为本申请实施例4的双面封装组件的形成方法的流程图。
图7为本申请实施例4的双面封装组件的工艺方法中胶体切割和形成屏蔽层的工序示意图。
图8为本申请实施例5的双面封装组件的形成方法的流程图。
图9为本申请实施例5的双面封装组件的形成方法的工序示意图。
图10为本申请实施例6的双面封装组件的形成方法的工序示意图。
具体实施方式
下面通过实施例的方式进一步说明本申请，但并不因此将本申请限制在所述的实施例范围之中。
实施例1
一种双面封装组件，如图1所示，包括基板1，所述基板1的正面101和背面102均设有器件2，所述基板1的背面102设有转接件3，所述转接件3的高度不小于设置在背面102的任一器件2的高度；
所述转接件3的外侧胶体的最高点高于所述转接件3的内侧胶体的最高点；
其中，在所述转接件3的外侧通过外部点胶的方式将所述转接件3与所述基板1固定连接并形成所述外侧胶体和所述内侧胶体。具体可以通过点胶机4实现外侧点胶。
参见图2，所述外侧胶体的外侧胶面5为平整切面。
包含所述外侧胶面5的双面封装组件的外表面生成有屏蔽层6。
本实施例中，在对转接件进行点胶时，采用外部点胶代替对内部芯片进行点胶，一方面使得基板上能够贴件的面积增大，另一方面，一定程度上控制溢胶距离，防止底部器件接触胶水。另外，转接件的外侧胶面为平整面，进而便于生成完整的屏蔽层，提高电磁屏蔽的有效性。
实施例2
本实施例的双面封装组件是在实施例1的基础上进一步改进，如图3所示，所述基板1上设有挡墙7；
所述转接件3位于所述挡墙7的外侧，所述挡墙7位于背面102的所有器件2的外侧，所述挡墙7的高度小于所述转接件3的高度。
所述挡墙7的材质是绝缘的。
本实施例中，在芯片转接件的内侧设置挡墙，进而在对转接件进行外侧点胶操作时，配合基板挡墙设计，能够有效控制溢胶的距离，防止基板上贴 装的器件接触到胶水。
实施例3
一种双面封装组件的形成方法，如图4所示，形成方法包括：
步骤10、提供一基板；
步骤11、在基板的背面设置转接件和至少一个器件；转接件的高度不小于设置在背面的任一器件的高度；具体参见图5-b；
需要说明的是，对于基板的正面可以包括基于贴装工艺在基板的正面进行器件贴件，以及对基板的正面进行底部填充和注塑。具体参见图5-a；
另外，封装组件的工艺流程还可能包括但不限于基板烘烤、印锡膏、表面检查、表面贴装、光学检测、回流焊、去助焊剂、X光检测、机械开槽、等离子清洗、打线键合等操作流程，根据需要具体进行执行，本申请不作限定。
步骤12、在转接件的外侧通过外部点胶的方式将转接件与基板固定连接，并形成转接件的外侧胶体和内侧胶体。具体参见图5-c；
本实施例中，在对转接件进行点胶时，采用外部点胶代替对内部芯片进行点胶，一方面使得基板上能够贴件的面积增大，另一方面，一定程度上控制溢胶距离，防止底部器件接触胶水。
实施例4
本实施例的双面封装组件的形成方法是在实施例3的基础上进一步改进，如图6所示，步骤12之后，形成方法还包括：
步骤131、对外侧胶体的外侧胶面进行切割以得到平整切面。
步骤132、在包含外侧胶面的双面封装组件的外表面生成屏蔽层。步骤131-132具体参见图5-d；
其中，参见图7，7-a为胶体未切割前的双面封装组件的部分示意图，7-b为胶体切割后的双面封装组件的部分示意图，7-c为基于平整切割面形成双面封装组件外表面的屏蔽层。利用封装切单工序，使点胶面平整，符合 sputtering的工艺要求，进一步有利于后续屏蔽层的完整、有效。
其中，基于EMI Coating方式实现屏蔽层的生成，主要分为Sputtering(溅射)和Spray Coating(喷涂)两种，Coating(涂层)材料整体接地，以完成电磁屏蔽的作用，也可以通过其他方式实现屏蔽层的生成。
本实施例中，利用封装切单工序，使得转接件的外侧胶面为平整面，进而便于生成完整的屏蔽层，提高电磁屏蔽的有效性。
实施例5
本实施例的双面封装组件的形成方法是在实施例3的基础上进一步改进，如图8所示，步骤10之后，制作方法还包括：
步骤101、在基板的背面设置挡墙；具体参见图9-a；
其中，转接件位于挡墙的外侧，挡墙位于背面的所有器件的外侧，挡墙的高度小于转接件的高度。
实际应用中，可以在对基板的背面印刷油墨时利用模具来形成挡墙，也即挡墙由油墨形成。需要说的是，若不通过基于基板的背面印刷油墨时形成挡墙，基于其他贴装工艺设置挡墙的话，只要在点胶之间进行挡墙设置即可。
另外，图9-b为基板正面贴件、正面的底部填充和注塑，图9-c为与步骤11对应，图9-d为与步骤12对应；
步骤12之后，参见图8，形成方法还包括：
步骤141、对外侧胶体的外侧胶面进行切割以得到平整切面。
步骤142、在包含外侧胶面的双面封装组件的外表面生成屏蔽层。步骤141-142具体参见图9-e；
本实施例中，采用芯片整体外围也即转接件的外侧进行点胶的方式固定转接件，配合基板挡墙设计，控制溢胶距离，有效防止底部器件接触胶水，另外，转接件的外侧胶面为平整面，进而便于生成完整的屏蔽层，提高电磁屏蔽的有效性。
实施例6
本实施例的双面封装组件的形成方法是在实施例4或5的基础上进一步改进，参见图10，为两个双面封装组件的示意图，在芯片(即对应每个双面封装组件)与芯片之间留出空间，便于点胶设备在基板未切割之前直接对每个双面封装组件进行点胶，点胶完毕后，切割时从箭头处进行切割，直接形成多个外侧胶面为平整切面的双面封装组件。
进一步，生成屏蔽层的过程中，基于EMI Coating对包含平整外侧胶面的每个面封装组件的外表面生成屏蔽层。
其中，EMI Coating方式主要分为Sputtering(溅射)和Spray Coating(喷涂)两种，Coating(涂层)材料整体接地，以完成电磁屏蔽的作用，也可以通过其他方式实现屏蔽层的生成。
虽然以上描述了本申请的具体实施方式，但是本领域的技术人员应当理解，这仅是举例说明，本申请的保护范围是由所附权利要求书限定的。本领域的技术人员在不背离本申请的原理和实质的前提下，可以对这些实施方式做出多种变更或修改，但这些变更和修改均落入本申请的保护范围。

Claims (11)

  1. 一种双面封装组件，其特征在于，包括基板，所述基板的正面和背面均设有器件，所述基板的背面设有转接件，所述转接件的高度不小于设置在背面的任一器件的高度；
    所述转接件的外侧胶体的最高点高于所述转接件的内侧胶体的最高点；
    其中，在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接并形成所述外侧胶体和所述内侧胶体。
  2. 如权利要求1所述的双面封装组件，其特征在于，所述基板上设有挡墙；
    所述转接件位于所述挡墙的外侧，所述挡墙位于背面的所有器件的外侧，所述挡墙的高度小于所述转接件的高度。
  3. 如权利要求1所述的双面封装组件，其特征在于，所述外侧胶体的外侧胶面为平整切面。
  4. 如权利要求3所述的双面封装组件，其特征在于，包含所述外侧胶面的双面封装组件的外表面生成有屏蔽层。
  5. 如权利要求2所述的双面封装组件，其特征在于，所述挡墙的材质是绝缘的。
  6. 一种双面封装组件的形成方法，其特征在于，所述形成方法包括：
    提供一基板；
    在基板的背面设置转接件和至少一个器件；所述转接件的高度不小于设置在背面的任一器件的高度；
    在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接，并形成所述转接件的外侧胶体和内侧胶体。
  7. 如权利要求6所述的双面封装组件的形成方法，其特征在于，所述在所述转接件的外侧通过外部点胶的方式将所述转接件与所述基板固定连接， 并形成所述转接件的外侧胶体和内侧胶体之前，所述形成方法还包括：
    在基板的背面设置挡墙；
    其中，所述转接件位于所述挡墙的外侧，所述挡墙位于背面的所有器件的外侧，所述挡墙的高度小于所述转接件的高度。
  8. 如权利要求6所述的双面封装组件的形成方法，其特征在于，所述形成方法还包括：
    对所述外侧胶体的外侧胶面进行切割以得到平整切面。
  9. 如权利要求8所述的双面封装组件的形成方法，其特征在于，所述对所述转接件的外侧胶面进行切割以得到平整切面之后，所述形成方法还包括：
    在包含所述外侧胶面的双面封装组件的外表面生成屏蔽层。
  10. 如权利要求7所述的双面封装组件的形成方法，其特征在于，所述在基板的背面设置挡墙具体包括：
    在对所述基板的背面印刷油墨时形成所述挡墙。
  11. 如权利要求8所述的双面封装组件的形成方法，其特征在于，所述基板用于制作多个双面封装组件，每个双面封装组件对应设置有一个转接件，所述对所述转接件的外侧胶面进行切割以得到平整切面包括：
    对相邻两个转接件之间的胶体进行切割得到多个外侧胶面为平整切面的双面封装组件。
PCT/CN2022/135232 2021-12-01 2022-11-30 双面封装组件及其形成方法 Ceased WO2023098693A1 (zh)

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