WO2023093220A1 - 显示面板及其制作方法、终端设备 - Google Patents

显示面板及其制作方法、终端设备 Download PDF

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Publication number
WO2023093220A1
WO2023093220A1 PCT/CN2022/118105 CN2022118105W WO2023093220A1 WO 2023093220 A1 WO2023093220 A1 WO 2023093220A1 CN 2022118105 W CN2022118105 W CN 2022118105W WO 2023093220 A1 WO2023093220 A1 WO 2023093220A1
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WO
WIPO (PCT)
Prior art keywords
area
layer structure
display panel
peripheral area
organic layer
Prior art date
Application number
PCT/CN2022/118105
Other languages
English (en)
French (fr)
Inventor
安亚斌
屈维
张峰
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/007,854 priority Critical patent/US20240130177A1/en
Priority to EP22814276.6A priority patent/EP4210107A4/en
Publication of WO2023093220A1 publication Critical patent/WO2023093220A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the technical field of terminals, in particular to a display panel, a manufacturing method thereof, and a terminal device.
  • terminal devices such as mobile phones have become more commonly used tools in people's life and work, and as users have higher and higher requirements for terminal devices, terminal devices with narrow borders are gradually favored by users.
  • the terminal equipment with narrow frame has gradually become the trend pursued by the industry.
  • the frame width of the side where the binding area of the rigid display panel is located is relatively large.
  • Embodiments of the present application provide a display panel, a manufacturing method thereof, and a terminal device, so as to reduce a border width of a rigid display panel on a side where a binding region is located.
  • the embodiment of the present application provides a display panel, the display panel has a display area and a frame area surrounding the display area, the frame area includes a first peripheral area, a bending area and a binding area, the first peripheral area, the bending area
  • the folding area and the binding area are set away from the display area in turn, and the binding area is bent to the backlight side of the display panel through the bending area
  • the display panel includes: a rigid substrate, a driving circuit layer arranged on the rigid substrate, and sequentially The first organic layer structure, the conductive layer and the second organic layer structure arranged away from the rigid substrate; the rigid substrate and the driving circuit layer are arranged away from the bending area; the first organic layer structure, the conductive layer and the second organic layer structure, Distributed at least in the first peripheral region, the bending region and the binding region, the first organic layer structure at the first peripheral region is located on the side of the driving circuit layer away from the rigid substrate.
  • the display panel at the bending area can be bent, so that the display panel at the binding area can be bent to the backlight side of the display panel,
  • a first organic layer structure, a first inorganic layer structure, a conductive layer and a second organic layer are arranged in the first peripheral area, the bending area and the binding area
  • the structure can strengthen the rigidity of the display panel at the bending area to better maintain the bending shape at the bending area; in addition, since the driving circuit layer is avoided at the bending area, the conductive layer can The signal lines in the driving circuit layer are connected to the driving chip at the bonding area, so that the signals output by the driving chip can be transmitted to the signal lines.
  • the display panel further includes a first inorganic layer structure disposed between the first organic layer structure and the conductive layer; the first inorganic layer structure includes at least one inorganic layer, and the first inorganic layer The structures are distributed at least in the first peripheral area, the bending area and the binding area. In this way, water and oxygen can be blocked by arranging the first inorganic layer structure, so as to reduce the corrosion caused by water and oxygen to the connection leads in the conductive layer.
  • the frame area further includes a second peripheral area, a third peripheral area and a fourth peripheral area, the first peripheral area and the third peripheral area are located on opposite sides of the display area, and the second peripheral area and the fourth peripheral area are located between the first peripheral area and the third peripheral area, and the second peripheral area and the fourth peripheral area are also located on opposite sides of the display area; the first organic layer structure and the first inorganic layer structure are also Distributed in the display area, the second peripheral area, the third peripheral area and the fourth peripheral area.
  • the process complexity of the patterning process of the first organic layer structure and the first inorganic layer structure can be reduced, and the second An organic layer structure and the first inorganic layer structure can also be used as insulating film layers in the display area at the same time, so as to reduce the number of insulating film layers that need to be fabricated in the display area.
  • the conductive layer includes a plurality of connection leads, and one end of the connection lead is connected to the signal line in the driving circuit layer through the first via hole passing through the first inorganic layer structure and the first organic layer structure.
  • the other end of the connection lead is also connected to the driving chip arranged in the bonding area through the second via hole penetrating through the second organic layer structure.
  • the display panel is a liquid crystal display (liquid crystal display, LCD) display panel, and the conductive layer and the second organic layer structure are set away from the display area; the signal line also extends to the first peripheral area, and the second A via hole is located in the first peripheral area.
  • the conductive layer and the second organic layer structure are set away from the display area; the signal line also extends to the first peripheral area, and the second A via hole is located in the first peripheral area.
  • the display panel is an organic light-emitting diode (organic light-emitting diode, OLED) display panel, and the conductive layer and the second organic layer structure are also distributed in the display area; the signal line also extends to the first periphery area, the first via hole is located in the first peripheral area; or, the first via hole is located in the display area.
  • OLED organic light-emitting diode
  • the frame area further includes a second peripheral area, a third peripheral area and a fourth peripheral area, the first peripheral area and the third peripheral area are located on opposite sides of the display area, and the second peripheral area and the fourth peripheral area are located between the first peripheral area and the third peripheral area, and the second peripheral area and the fourth peripheral area are also located on opposite sides of the display area; the conductive layer and the second organic layer structure are also distributed in the second peripheral area The second peripheral area, the third peripheral area and the fourth peripheral area.
  • the process complexity of the patterning process of the conductive layer and the second organic layer structure can be reduced, and, by adding the second organic layer structure in the display area
  • the organic layer structure can improve the flatness of the film layer in the display area.
  • both the first organic layer structure and the second organic layer structure include at least one organic layer.
  • the first organic layer structure includes multiple organic layers
  • the display panel further includes a second inorganic layer structure disposed between two adjacent organic layers
  • the second inorganic layer structure includes at least one An inorganic layer
  • the second inorganic layer structure is at least distributed in the first peripheral area, the bending area and the binding area.
  • the display panel further includes: an anode layer, distributed in the display area, and located on the side of the second organic layer structure away from the rigid substrate; a pixel defining layer, distributed at least In the display area, the first peripheral area, the bending area and the binding area, the pixel defining layer is located on the side of the second organic layer structure away from the first organic layer structure. In this way, by extending the pixel defining layer to the bending area, the rigidity of the bending area can be further improved.
  • the display panel further includes an adhesive layer, and the adhesive layer is located between the rigid substrate at the binding area and the rigid substrate at the display area.
  • the rigid substrate at the binding area is bonded to the rigid substrate at the display area through the adhesive layer, so that the film layer structure at the binding area can be stably fixed on the backlight side of the display panel.
  • the embodiment of the present application proposes a method for manufacturing a display panel, including: providing a rigid substrate; the rigid substrate is divided into a display area and a frame area surrounding the display area, and the frame area includes a first peripheral area, The bending area and the binding area, the first peripheral area, the bending area and the binding area are set away from the display area in turn; the driving circuit layer is formed on the rigid substrate; the first organic layer structure, conductive layer and the second organic layer structure; the first organic layer structure, the conductive layer and the second organic layer structure are distributed at least in the first peripheral region, the bending region and the binding region; the rigid substrate and the driving region at the bending region The circuit layer is peeled off; the bending area is bent toward the backlight side of the display panel, so that the binding area is bent to the backlight side of the display panel.
  • peeling the rigid substrate and the driving circuit layer at the bending area includes: using a light-shielding jig to irradiate the rigid substrate on the side away from the driving circuit layer with laser, so as to separate the bending The rigid substrate and the driving circuit layer at the area are peeled off; wherein, the light-shielding fixture includes a light-shielding area and a light-transmitting area, the light-transmitting area is set correspondingly to the bending area, and the light-shielding area is set correspondingly to the area outside the bending area.
  • before bending the bending region toward the backlight side of the display panel further includes: on the surface of the rigid substrate at the display region on the side away from the first organic layer structure, and/or , setting an adhesive layer on the surface of the rigid substrate at the binding area away from the first organic layer structure; after bending the bending area toward the backlight side of the display panel, it also includes: placing the rigid substrate at the binding area The substrate is bonded to the rigid substrate at the display area through an adhesive layer.
  • the embodiment of the present application proposes a terminal device, including a driver chip and the above-mentioned display panel; the driver chip is located in the binding area of the display panel, and the driver chip passes through the second organic layer structure in the display panel Two through holes are connected with the connection leads in the display panel.
  • FIG. 1 is a schematic structural diagram of a flexible display module in the related art
  • FIG. 2 is a schematic structural diagram of a rigid display panel in the related art
  • FIG. 3 is a schematic structural diagram of a terminal device provided in an embodiment of the present application.
  • FIG. 4 is a schematic plan view of a rigid display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional view of the first rigid display panel provided by the embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional view of a second rigid display panel provided by an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional view of a third rigid display panel provided by an embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of a fourth rigid display panel provided by an embodiment of the present application.
  • FIG. 9 is a flow chart of a method for manufacturing a rigid display panel provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of peeling off the rigid substrate and the driving circuit layer at the bending area using laser lift-off technology in the present application;
  • FIG. 11 is a schematic structural view of the rigid display panel provided by the embodiment of the present application before the rigid substrate and the driving circuit layer at the bending area are peeled off;
  • FIG. 12 is a schematic structural view of the rigid display panel provided by the embodiment of the present application after peeling off the rigid substrate and the driving circuit layer at the bending region.
  • words such as “first” and “second” are used to distinguish the same or similar items with basically the same function and effect.
  • the first chip and the second chip are only used to distinguish different chips, and their sequence is not limited.
  • words such as “first” and “second” do not limit the quantity and execution order, and words such as “first” and “second” do not necessarily limit the difference.
  • “at least one” means one or more, and “multiple” means two or more.
  • “And/or” describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B, which can mean: A exists alone, A and B exist at the same time, and B exists alone, where A, B can be singular or plural.
  • the character “/” generally indicates that the contextual objects are an “or” relationship.
  • “At least one of the following” or similar expressions refer to any combination of these items, including any combination of single or plural items.
  • At least one item (piece) of a, b, or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple .
  • terminal devices such as mobile phones have become more commonly used tools in people's life and work, and as users have higher and higher requirements for terminal devices, terminal devices with narrow borders are gradually favored by users.
  • the terminal equipment with narrow frame has gradually become the trend pursued by the industry.
  • the flexible display module includes: a flexible display panel 101, a first back film 102, an adhesive layer 103, a support pad 104, a second back film 105, a metal cover layer (metal cover layer) , MCL) 106, encapsulation layer 107, touch layer 108, polarizer 109, optical adhesive layer 110 and cover plate 111; and, the flexible display module is divided into a display area AA and a frame area NA, and the frame area NA includes a peripheral area B1, the bending area B2 and the binding area B3, the peripheral area B1 refers to the area between the display area AA and the boundary of the encapsulation layer 107 .
  • the flexible display panel 101 at the bending area B2 can be bent, and the flexible display panel 101 at the binding area B3 can pass through the flexible display panel at the bending area B2.
  • the display panel 101 is bent to the backlight side of the flexible display panel 101 , thereby reducing the border width of the flexible display panel 101 on the side where the binding region B3 is located.
  • the manufacturing cost of the flexible display panel 101 is generally greater than that of the rigid display panel.
  • a rigid display panel can be used as the display panel of the terminal device.
  • the rigid display panel includes a rigid backplane 21, and the rigid backplane 21 is divided into a display area AA and a frame area NA.
  • the frame area NA includes a peripheral area and an edge area B4, and the peripheral area includes a wiring overlapping area B11.
  • the edge area B4 refers to the area between the packaging area B12 and the edge of the rigid backplane 21, and the edge area B4 includes a binding area for binding the driving chip.
  • Structures such as light-emitting devices 221 are arranged on the rigid backplane 21 at the display area AA, and structures 222 such as overlapping wiring are arranged on the rigid backplane 21 at the wiring overlapping area B11.
  • the rigidity at the packaging area B12 An encapsulation structure 223 is disposed on the backplane 21 ; in addition, the rigid display panel also includes a cover plate 23 .
  • the substrate material in the rigid backplane 21 is a rigid material, so the rigid backplane 21 cannot be bent, thus resulting in a larger frame width on the side where the binding area of the rigid display panel is located.
  • the width of the frame area NA of the rigid display panel shown in FIG. 2 is generally greater than or equal to 2.3 mm, while the edge area B4 basically occupies about 1.67 mm.
  • an embodiment of the present application provides a display panel.
  • the display panel at the bending area can be bent, so that the bonding area
  • the display panel can be bent to the backlight side of the display panel, so as to reduce the frame width of the side where the binding area of the display panel is located; and, the first organic layer structure, the second An inorganic layer structure, a conductive layer and a second organic layer structure can strengthen the rigidity of the display panel at the bending area to better maintain the bending shape at the bending area;
  • the driving circuit layer is bending Avoid setting at the area, in order to make the signal lines in the driving circuit layer can be connected to the driving chip at the binding area, the signal line can be connected to the driving chip through the conductive layer, so that the signal output by the driving chip can be transmitted to the signal line , and the corrosion of the connecting wires in the conductive layer by water and oxygen can also be reduced through the structure of the first inorganic layer.
  • the display panel provided by the embodiment of the present application can be applied to a terminal device with a display function. Border device.
  • a terminal device 300 includes a display panel 30 and a casing 40 .
  • the display panel 30 is a rigid display panel, and the display panel 30 is installed on the casing 40, which is used for displaying images or videos;
  • the accommodating cavity places the electronic devices of the terminal device 300 and the like, and at the same time forms a function of sealing and protecting the electronic devices located in the accommodating cavity.
  • the display panel 30 has a display area AA and a frame area NA surrounding the display area AA.
  • the frame area NA includes a first peripheral area N11, a bending area N12 and a binding area N13.
  • the first peripheral area N11 , the bending area N12 and the binding area N13 are set away from the display area AA in turn, that is, in the direction along the display area AA pointing to the binding area N13, each area of the display panel 30 is the display area AA, the first peripheral area N11, Bending region N12 and binding region N13.
  • the first peripheral area N11, the bending area N12 and the binding area N13 are located on one side of the display area AA; of course, the first peripheral area N11 may also be provided on at least two sides of the display area AA , bending region N12 and binding region N13.
  • the first peripheral area N11 refers to the area between the display area AA and the bending area N12. Because in actual products, it is necessary to package the periphery of the display area AA of the display panel 30 through a packaging structure such as a sealant or a packaging film layer, and it is necessary to overlap the signal lines in the display area AA with the peripheral leads, etc. Therefore, the first peripheral area N11 may include the area occupied by the packaging structure, and the overlapping area between the signal lines and the peripheral leads in the display area AA, and the like.
  • the border area NA further includes a second peripheral area N21, a third peripheral area N31, and a fourth peripheral area N41.
  • a peripheral area N11 and the third peripheral area N31 are located on opposite sides of the display area AA
  • the second peripheral area N21 and the fourth peripheral area N41 are both located between the first peripheral area N11 and the third peripheral area N31
  • the second peripheral area The area N21 and the fourth peripheral area N41 are also located on opposite sides of the display area AA.
  • the first peripheral area N11, the bending area N12 and the binding area N13 may be located on the lower side of the display area AA
  • the third peripheral area N31 is located on the upper side of the display area AA
  • the second peripheral area N21 is located on the left side of the display area AA.
  • the fourth peripheral area N41 is located on the right side of the display area AA.
  • the specific structure of the rigid display panel in the embodiment of the present application will be described below in four different structural implementation manners.
  • the structure of the display panel 30 shown in FIG. 5 to FIG. 8 is a cross-sectional view taken along section C-C' after the binding region N13 is bent to the backlight side of the display panel 30 shown in FIG. 4 .
  • the display panel 30 includes a rigid substrate 31, a driving circuit layer 32, and a first organic layer structure 33, a first inorganic layer structure 34, and a conductive layer 35 and a second organic layer structure 36 .
  • the rigid substrate 31 is arranged avoiding the bending area N12, that is, the rigid substrate 31 is distributed in the display area AA, the first peripheral area N11, the binding area N13, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N31.
  • the rigid substrate 31 is disconnected at the position where the bending area N12 is located.
  • the rigid substrate 31 located in the display area AA, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41 is an integral structure, which includes a first surface and a second surface oppositely arranged, And the first side, the second side, the third side and the fourth side arranged between the first surface and the second surface and connected end to end, the first side is the side where the first peripheral area N11 is located, and the second side is the second side The side where the second peripheral area N21 is located, the third side is the side where the third peripheral area N31 is located, and the fourth side is the side where the fourth peripheral area N41 is located.
  • the rigid substrate 31 located in the binding area N13 is an integrated structure, which includes a third surface and a fourth surface oppositely arranged, and a fifth side and a sixth side arranged between the third surface and the fourth surface and connected end to end , the seventh side and the eighth side.
  • the fourth surface is on the same plane as the first surface
  • the third surface is on the same plane as the second surface
  • the seventh side is on the same plane as the first side.
  • the fifth side is oppositely disposed, and the fifth side is located on a side of the seventh side away from the first peripheral area N11
  • the bending area N12 is also an area between the first side and the seventh side.
  • the first surface is opposite to the fourth surface, and the third surface is located on the side of the fourth surface away from the first surface, and the second surface It is located on the side of the first surface away from the fourth surface, and the seventh side can be located on the same plane as the first side.
  • the backlight side of the display panel 30 also refers to the side where the first surface of the rigid substrate 31 is located.
  • the rigid substrate 31 may be a glass substrate or a polymethyl methacrylate (PMMA) substrate, etc., and the PMMA substrate may also be called an acrylic substrate.
  • PMMA polymethyl methacrylate
  • the driving circuit layer 32 is disposed on the third surface of the bottom 31 .
  • the driving circuit layer 32 is set away from the bending area N12, that is, the driving circuit layer 32 is distributed in the display area AA, the first peripheral area N11, the binding area N13, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41, the driving circuit layer 32 is disconnected at the position where the bending area N12 is located.
  • the display panel 30 may be an OLED display panel, and the OLED display panel 30 located in the display area AA actually includes a plurality of sub-pixels, each sub-pixel includes a pixel driving circuit and a light-emitting device, and the light-emitting device is arranged on the pixel
  • the driving circuit is away from the side of the rigid substrate 31 and connected to the pixel driving circuit, which can provide driving voltage to the light-emitting device to control the light-emitting state of the light-emitting device. Therefore, the driving circuit layer 32 located in the display area AA actually refers to the pixel driving circuit corresponding to each sub-pixel in the display area AA.
  • the structure of the pixel driving circuit can be 6T1C pixel driving circuit, 7T1C pixel driving circuit, and 3T1C pixel driving circuit.
  • T represents a transistor in the pixel driving circuit
  • the number before “T” indicates the number of transistors in the pixel driving circuit
  • C indicates the storage capacitor in the pixel driving circuit
  • the number before “C” indicates the number of storage capacitors in the pixel driving circuit.
  • the transistor in the pixel driving circuit is composed of an active layer 321 , a gate insulating layer 322 , a gate layer 323 , an interlayer dielectric layer 324 and a source-drain electrode layer.
  • the driving circuit layer 32 located in the display area AA includes an active layer 321 , a gate insulating layer 322 , a gate layer 323 , an interlayer dielectric layer 324 and a source-drain electrode layer.
  • the active layer 321 is located on the second surface of the rigid substrate 31
  • the gate insulating layer 322 covers the active layer 321 and the second surface of the rigid substrate 31
  • the gate layer 323 is located on the second surface of the rigid substrate 31.
  • the gate insulating layer 322 is on the side away from the rigid substrate 31
  • the interlayer dielectric layer 324 covers the gate layer 323 and the gate insulating layer 322
  • the source and drain electrode layers are located on the side of the interlayer dielectric layer 324 away from the rigid substrate 31 .
  • the gate layer 323 includes the gate of each transistor, and EM (emission control) signal line, gate line, reset signal line, etc.
  • the source-drain electrode layer includes the source 3251 and drain 3252 of each transistor, and the data line and VDD (high level power supply) signal line, etc.
  • the driving circuit layer 32 in the first peripheral area N11, bonding area N13, second peripheral area N21, third peripheral area N31, and fourth peripheral area N41 actually refers to the insulating medium layer in the driving circuit layer 32. , such as the gate insulating layer 322 and the interlayer dielectric layer 324 in the driving circuit layer 32 .
  • the gate insulating layer 322 is located on the third surface of the rigid substrate 31
  • the interlayer dielectric layer 324 is located on a side of the gate insulating layer 322 away from the rigid substrate 31 .
  • the transistors in the driving circuit layer 32 shown in FIG. 5 are bottom-gate transistors.
  • the transistors in the driving circuit layer 32 in the embodiment of the present application may also be top-gate transistors.
  • the number of layers of the gate layer in the driving circuit layer 32 can also be multiple layers, and the gate insulating layer needs to be arranged between two adjacent gate layers, and the source-drain electrode layer in the driving circuit layer 32
  • the number of layers can also be multiple layers, and the source and drain electrode layers of two adjacent layers need to be separated by an interlayer dielectric layer.
  • first peripheral area N11 In the display area AA, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31, the fourth peripheral area N41, the bending area N12, and the bonding area N13, there are stacked first organic layers.
  • Structure 33 first inorganic layer structure 34 , conductive layer 35 and second organic layer structure 36 .
  • the bonding area N13, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41, the first organic layer structure 33, the first inorganic layer structure 34, the conductive Layer 35 and second organic layer structure 36 are in turn arranged away from the second surface of rigid substrate 31 .
  • the first organic layer structure 33 is located on the side of the driving circuit layer 32 away from the rigid substrate 31
  • the first inorganic layer structure 34 is located on the side of the first organic layer structure 33 away from the rigid substrate 31
  • the conductive layer 35 is located on the side of the first organic layer structure 33.
  • An inorganic layer structure 34 is located on a side away from the rigid substrate 31
  • a second organic layer structure 36 is located on a side of the conductive layer 35 away from the rigid substrate 31 .
  • the first organic layer structure 33, the first inorganic layer structure 34, the conductive layer 35 and the second organic layer structure 36 in the bending region N12 are separated from the rigid substrate 31 in sequence.
  • the structure 36 is set away from the first side of the rigid substrate 31 in turn, that is, there is a certain space between the first organic layer structure 33 and the first side of the rigid substrate 31, and the first inorganic layer structure 34 is located on the first organic layer structure 33
  • the conductive layer 35 is located on the side of the first inorganic layer structure 34 away from the first side of the rigid substrate 31
  • the second organic layer structure 36 is located on the side of the conductive layer 35 away from the rigid substrate. 31 on one side of the
  • the first organic layer structure 33 includes an organic layer, which can also be called a planar layer, and the material of the organic layer can be an organic material such as resin, and the thickness of the organic layer in the first organic layer structure 33 can be 2 ⁇ m;
  • the first inorganic layer structure 34 includes an inorganic layer, which can also be called a passivation layer, and the material of the inorganic layer can be inorganic materials such as silicon oxide or silicon nitride;
  • the material of the conductive layer 35 can be titanium , aluminum, molybdenum, copper and other metal materials;
  • the second organic layer structure 36 also includes an organic layer, which can also be called a planar layer, and the material of this organic layer can be organic materials such as resin, and the second organic layer structure
  • the thickness of the organic layer in 36 may be 2 ⁇ m.
  • the conductive layer 35 actually includes a plurality of connection leads, one end of the connection lead is connected to the signal line in the driving circuit layer 32 through the first via hole passing through the first inorganic layer structure 34 and the first organic layer structure 33, and the connection lead The other end is also connected to the driver chip (not shown in FIG. 5 ) disposed in the bonding area N13 through the second via hole 50 penetrating through the second organic layer structure 36 .
  • the driver chip can be fixed on the binding area N13 of the display panel 30 by COP (chip on panel), and COP refers to the process of directly binding the driver chip on the display panel 30; of course, other methods can be used.
  • the driver chip is fixed on the binding area N13 of the display panel 30, for example, the driving chip is fixed on the binding area N13 of the display panel 30 by means of chip on film (COF) or COG (chip on glass).
  • COF chip on film
  • COG chip on glass
  • the driving chip can be connected to the signal line in the driving circuit layer 32 through the conductive layer 35, so that the signal output by the driving chip can be transmitted to the driving circuit
  • the signal lines in the layer 32 enable the pixel driving circuit in the driving circuit layer 32 to work normally.
  • the signal line in the driving circuit layer 32 can be a data line, a VDD signal line, etc., and the data line and the VDD signal line are connected to the source of the transistor in the driving circuit layer 32. Therefore, in FIG.
  • the first via hole is connected to the source 3251 of the transistor to represent the connection relationship between the connection lead and the signal line in the driving circuit layer 32 .
  • the signal lines in the driving circuit layer 32 can only be distributed in the display area AA, then the first via hole is arranged in the display area AA, and the connecting lead is in the display area AA, and passes through the first via hole and the driving circuit. Signal line connections in layer 32.
  • first organic layer structure 33, the first inorganic layer structure 34, the conductive layer 35 and the second organic layer structure 36 may also be distributed only in the first peripheral region N11, the bending region N12 and the bonding region.
  • Region N13 at this time, the first organic layer structure 33 in the first peripheral region N11 is located on the side of the driving circuit layer 32 away from the rigid substrate 31 .
  • the conductive layer 35 and the second organic layer structure 36 may also be distributed only in the first peripheral region N11, the bending region N12, the bonding region N13, the second peripheral region N21, the third peripheral region N31 and the fourth peripheral region N41 , that is, the conductive layer 35 and the second organic layer structure 36 are only arranged to avoid the bending region N12.
  • first organic layer structure 33, the first inorganic layer structure 34, the conductive layer 35 and the second organic layer structure 36 at the bending region N12 can strengthen the rigidity of the display panel 30 at the bending region N12, To better maintain the bending shape at the bending region N12, wherein maintaining the bending shape at the bending region N12 is mainly through the organic layer structure at the bending region N12 (that is, the first organic layer structure 33 and The second organic layer structure 36) is realized.
  • the organic layer structure provided at the bending region N12 includes the first organic layer structure 33 and the second organic layer structure 36, instead of only including a single-layer organic layer, the purpose of which is that the two-layer organic layer structure can be better Support the bending area N12 to maintain the bending shape at the bending area N12. If only a single-layer organic layer structure is set in the bending area N12, the supporting effect is not good, and it is difficult to better maintain the bending area N12 bending shape.
  • first organic layer structure 33, the first inorganic layer structure 34, the conductive layer 35 and the second organic layer structure 36 also extend to the first peripheral region N11 and the binding region N13, mainly to make the first organic layer structure 33,
  • the first inorganic layer structure 34 , the conductive layer 35 and the second organic layer structure 36 can be normally overlapped on the driving circuit layer 32 of the first peripheral region N11 and the bonding region N13 .
  • the rigid substrate 31 and the driving circuit layer at the bending region N12 will After 32 is peeled off, the first organic layer structure 33, the first inorganic layer structure 34, the conductive layer 35 and the second organic layer structure 36 at the bending region N12 will be broken, and the shape of the bending region N12 cannot be maintained.
  • the conductive layer 35 provided in the bending area N12, the first peripheral area N11, and the bonding area N13 is mainly for connecting the signal line in the driving circuit layer 32 to the driving chip at the bonding area N13, so that the driving chip outputs The signal can be transmitted to the signal line through the conductive layer 35 .
  • the first inorganic layer structure 34 disposed in the bending region N12 , the first peripheral region N11 and the bonding region N13 is mainly for blocking water and oxygen, and reducing the erosion of the connection leads in the conductive layer 35 caused by water and oxygen. Therefore, in some embodiments, the first inorganic layer structure 34 shown in FIG. 5 can also be removed, so that the first organic layer structure 33 is sequentially stacked in the bending region N12, the first peripheral region N11 and the bonding region N13. , the conductive layer 35 and the second organic layer structure 36 .
  • the display panel 30 further includes structures such as an anode layer 41 , a pixel defining layer 37 , a light emitting layer 42 , a cathode layer 43 , and an encapsulation layer 44 .
  • the anode layer 41 is distributed in the display area AA and is located on a side of the second organic layer structure 36 away from the rigid substrate 31 .
  • the anode layer 41 includes an anode corresponding to each sub-pixel, and the anodes between two adjacent sub-pixels are disconnected, and the material of the anode layer 41 can be metal materials such as aluminum and silver.
  • the pixel defining layer 37 is distributed in the display area AA, the first peripheral area N11 , the bending area N12 and the binding area N13 . At this time, the second via hole 50 also penetrates the pixel defining layer 37 at the binding area N13 .
  • the pixel defining layer 37 can also be distributed in the second peripheral region N21 , the third peripheral region N31 and the fourth peripheral region N41 , and the pixel defining layer 37 is located on the side of the second organic layer structure 36 away from the first organic layer structure 33 .
  • the pixel defining layer has a plurality of pixel openings, and each pixel opening exposes at least part of the anode, and the thickness of the pixel defining layer 37 may be 1.5 ⁇ m.
  • the light emitting layer 42 is located in the display area AA, specifically located in the pixel opening defined by the pixel defining layer 37 .
  • the cathode layer 43 can be distributed in the display area AA, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41, which are located on the side of the pixel defining layer 37 away from the rigid substrate 31
  • the material of the cathode layer 43 is a conductive material with high transmittance, such as indium tin oxide (indium tin oxides, ITO) and other materials.
  • the anode layer 41, the light-emitting layer 42 and the cathode layer 43 together constitute a light-emitting device, and the light-emitting side of the light emitted by the light-emitting device is the side facing the cathode layer 43. Therefore, the cathode layer 43 is made of a conductive material with high transmittance, which can The loss caused by the light emitted by the light emitting device passing through the cathode layer 43 is reduced.
  • the encapsulation layer 44 can be distributed in the display area AA, the first peripheral area N11 , the second peripheral area N21 , the third peripheral area N31 and the fourth peripheral area N41 , which are located on the side of the cathode layer 43 away from the rigid substrate 31 .
  • the film layer structure at the bending region N12 includes: a stacked first organic layer structure 33, a first inorganic layer structure 34, a conductive layer 35, a second organic layer structure 36, and a pixel defining layer 37, and the first The organic layer structure 33 , the first inorganic layer structure 34 , the conductive layer 35 , the second organic layer structure 36 and the pixel defining layer 37 are sequentially disposed away from the first side of the rigid substrate 31 .
  • the display panel 30 can also be provided with structures such as a touch layer, a polarizer, an optical adhesive layer, and a cover plate on the side of the encapsulation layer 44 away from the rigid substrate 31 .
  • a rigid substrate 31 at the bonding region N13 and the rigid substrate 31 at the display region AA can be placed An adhesive layer 38 is set, and the rigid substrate 31 at the binding area N13 is bonded to the rigid substrate 31 at the display area AA through the adhesive layer 38, so that the structure at the binding area N13 can be stably fixed on the display area.
  • the backlight side of the panel 30 the adhesive layer 38 is actually located between the first surface of the rigid substrate 31 in the display area AA and the fourth surface of the rigid substrate 31 in the bonding area N13.
  • the display panel 30 at the binding area N13 can be bent to the backlight side of the display panel 30 through the bending area N12, so that The frame width of the display panel 30 on the side where the binding region N13 is located is reduced.
  • the bending shape at the folding area N12 enables the driving chip to be connected to the signal lines in the driving circuit layer 32 through the conductive layer 35 , and can reduce the erosion of the connection leads in the conductive layer 35 by water and oxygen.
  • the display panel 30 includes a rigid substrate 31, a driving circuit layer 32, and a stacked first organic layer structure 33, a first inorganic layer structure 34, a conductive layer 35 and a second organic layer structure 36 .
  • the first organic layer structure 33 includes two layers of organic layers, which are respectively the first organic layer 331 and the second organic layer 332, and the first organic layer 331 and the second organic layer 332 are distributed in the display area AA, the first peripheral The area N11, the second peripheral area N21, the third peripheral area N31, the fourth peripheral area N41, the bending area N12 and the binding area N13.
  • the second organic layer 332 is located away from the rigid substrate from the first organic layer 331 31 side.
  • the second organic layer 332 in the bending region N12 is located on the plane where the second surface of the first organic layer 331 is away from the rigid substrate 31.
  • the second organic layer 332 in the bending region N12 is located on the first side of the first organic layer 331 away from the rigid substrate 31 .
  • the materials of the first organic layer 331 and the second organic layer 332 can be the same, for example, the materials of the first organic layer 331 and the second organic layer 332 are resin materials; or, the first organic layer 331 and the second organic layer The materials of the two organic layers 332 can also be different.
  • the thickness of the first organic layer 331 and the second organic layer 332 can be equal, for example, the thickness of the first organic layer 331 and the second organic layer 332 is 2 ⁇ m; Or, the thickness of the first organic layer 331 and the second organic layer 332 They may also be unequal, which is not limited in this embodiment of the present application.
  • the difference between the display panel 30 shown in FIG. 5 and the display panel 30 shown in FIG. 6 is that the first organic layer structure 33 in the display panel 30 shown in FIG. 5 includes an organic layer , while the first organic layer structure 33 in the display panel 30 shown in FIG. 6 includes two organic layers, and the rest of the structures are basically similar, and will not be repeated here to avoid repetition.
  • the specific structure of the rigid substrate 31, the driving circuit layer 32, the first organic layer structure 33, the first inorganic layer structure 34, the conductive layer 35 and the second organic layer structure 36 please refer to the first optional description in the implementation.
  • the rigidity of the display panel 30 at the bending region N12 can be further enhanced to better maintain the bending shape at the bending region N12.
  • the width of the bending region N12 may be 0.25 mm, and the width of the first peripheral region N11 may be 0.7 mm, which means that the first peripheral region N11 points to the third
  • the dimension in the direction of the peripheral area N13 can reduce the border width of the display panel 30 on the side where the binding area N13 is located to 0.95 mm.
  • the display panel 30 includes a rigid substrate 31, a driving circuit layer 32, and a stacked first organic layer 331, a second inorganic layer structure 39, a second The organic layer 332 , the first inorganic layer structure 34 , the conductive layer 35 and the second organic layer structure 36 .
  • the first organic layer structure 33 includes two layers of organic layers, which are respectively the first organic layer 331 and the second organic layer 332, and a second inorganic layer is also arranged between the first organic layer 331 and the second organic layer 332.
  • the layer structure 39, the second inorganic layer structure 39 includes an inorganic layer, and the second inorganic layer structure 39 is distributed in the display area AA, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31, the fourth peripheral area Inside the peripheral area N41, the bending area N12 and the binding area N13.
  • the second inorganic layer structure 39 may also be distributed only in the first peripheral region N11, the bending region N12, and the binding region N13; and the number of inorganic layers in the second inorganic layer structure 39 is also It is not limited to one layer, and the second inorganic layer structure 39 may also include two inorganic layers or three inorganic layers.
  • the number of organic layers included in the first organic layer structure 33 may also be greater than 2 layers.
  • the second inorganic layer structure 39 may be arranged between any two adjacent organic layers, or a part A second inorganic layer structure 39 is arranged between two adjacent organic layers.
  • the first organic layer structure 33 includes three organic layers, which are respectively the first organic layer 331, the second organic layer 332 and the third organic layer, and the second inorganic layer is arranged on the first organic layer 331 and the second organic layer 332.
  • the layer structure 39, and/or, the second inorganic layer structure 39 is arranged between the second organic layer 332 and the third organic layer.
  • the source electrode 3251 of the transistor represents the signal line in the driving circuit layer 32.
  • the signal lines in the driving circuit layer 32 are not only distributed in the display area AA, but also extend into the first peripheral area N11.
  • the first via hole may be disposed in the first peripheral region N11 , and the connection lead is in the first peripheral region N11 and connected to the signal line in the driving circuit layer 32 through the first via hole penetrating through.
  • the first via hole actually penetrates the first inorganic layer structure 34 , the second organic layer 332 , the second inorganic layer structure 39 and the first organic layer 331 .
  • the first organic layer structure 33 in the display panel 30 shown in FIG. 6 includes a first organic layer 331 and a second organic layer 332, while in the display panel 30 shown in FIG.
  • a second inorganic layer structure 39 is also provided between the first organic layer 331 and the second organic layer 332;
  • the display panel 30 shown in FIG. 6 The first via holes in the display panel 30 are located in the display area AA, while the first via holes in the display panel 30 shown in FIG. 7 are located in the first peripheral area N11. The rest of the structures are basically similar, and will not be repeated here to avoid repetition.
  • the display panels 30 shown in FIG. 5 to FIG. 7 are all OLED display panels, and the display panel in the embodiment of the present application may also be an LCD display panel as shown in FIG. 8 .
  • a display panel 30 includes a rigid substrate 31, a driving circuit layer 32, and a stacked first organic layer structure 33, a first inorganic layer structure 34, a conductive layer 35 and a second organic layer structure 36 .
  • the driving circuit layer 32 is also arranged avoiding the bending area N12, and the driving circuit layer 32 located in the display area AA actually refers to structures such as pixel transistors corresponding to each sub-pixel in the display area AA, and the gate of the pixel transistor
  • the electrode is connected to the gate line
  • the source of the pixel transistor is connected to the data line
  • the drain of the pixel transistor is connected to the pixel electrode 51, which is used to provide a pixel voltage to the pixel electrode 51 under the action of the gate line and the data line
  • the liquid crystal molecules in the liquid crystal layer 52 are deflected under the action of the pixel voltage provided by the pixel electrode 51 and the common voltage provided by the common electrode, so as to realize the display function.
  • the first peripheral area N11, the second peripheral area N21, the third peripheral area N31, the fourth peripheral area N41, the bending area N12, and the bonding area N13 there are stacked first organic layers. structure 33 and the first inorganic layer structure 34.
  • the binding area N13, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41, the first inorganic layer structure 34 is located far away from the first organic layer structure 33 One side of the second surface of the substrate 31 .
  • the first organic layer structure 33 and the first inorganic layer structure 34 in the bending region N12 are sequentially arranged away from the plane where the second surface of the rigid substrate 31 is located; After the bending region N12 of the panel 30 is bent, the first organic layer structure 33 and the first inorganic layer structure 34 in the bending region N12 are arranged away from the first side of the rigid substrate 31 in turn.
  • the conductive layer 35 and the second organic layer structure 36 are arranged away from the display area AA, that is, the conductive layer 35 and the second organic layer structure 36 are distributed in the first peripheral region N11, the second peripheral region N21, the third peripheral region N31, the In the surrounding area N41, the bending area N12 and the binding area N13.
  • the second organic layer structure 36 is located on the second surface of the conductive layer 35 away from the rigid substrate 31 side.
  • the conductive layer 35 and the second organic layer structure 36 in the bending region N12 are sequentially arranged away from the plane where the second surface of the rigid substrate 31 is located; After bending in the bending region N12 , in the bending region N12 , the second organic layer structure 36 is located on the first side of the conductive layer 35 away from the rigid substrate 31 .
  • the conductive layer 35 and the second organic layer structure 36 may also be provided only in the first peripheral region N11 , the bending region N12 and the binding region N13 .
  • the signal lines (such as data lines, etc.) in the driving circuit layer 32 also extend to the first peripheral area N11, and the first via hole is located in the first peripheral area N11; in the first peripheral area N11, the conductive layer 35 includes The connection lead passes through the first via hole of the first inorganic layer structure 34 and the first organic layer structure 33 , and is connected to the signal line in the driving circuit layer 32 .
  • the first via holes may be distributed in the second peripheral region N21, the third peripheral region N31 and the fourth peripheral region N41.
  • the corresponding signal lines also need to extend to any one or more areas in the second peripheral area N21, the third peripheral area N31, and the fourth peripheral area N41.
  • the conductive layer 35 includes the first via hole through which the connecting lead penetrates and is connected to the signal line in the driving circuit layer 32 .
  • the display panel 30 also includes structures such as a pixel electrode 51 , a liquid crystal layer 52 , a color filter substrate 53 , and a cover plate 54 that are sequentially disposed away from the first inorganic layer structure 34 .
  • the pixel electrode 51 and the liquid crystal layer 52 may only be distributed in the display area AA, and the color filter substrate 53 may be distributed in the display area AA, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41.
  • the cover plate 54 not only covers the display area AA, the first peripheral area N11 , the second peripheral area N21 , the third peripheral area N31 and the fourth peripheral area N41 , but also extends to the position where the bending area N12 is located.
  • the width of the bending region N12 can be 0.3 mm, and the width of the first peripheral region N11 can be 0.8 mm, so that the side where the binding region N13 of the display panel 30 is located can be The bezel width is reduced to 1.1mm.
  • the first organic layer structure 33 in the embodiment of the present application may include at least one organic layer, and correspondingly, the second organic layer structure 36 may also include at least one organic layer, and the first inorganic layer structure 34 includes at least one inorganic layer.
  • the above shows four different display panels 30.
  • the display panel 30 at the binding area N13 can be bent through the bending area N12. Fold to the backlight side of the display panel 30 to reduce the frame width of the side where the binding area N13 of the display panel 30 is located.
  • the display panel 30 can be an OLED display panel or an LCD display panel.
  • the display panel 30 in this example may also be a quantum dot light emitting diode (quantum dot light emitting diodes, QLED) display panel.
  • QLED quantum dot light emitting diodes
  • the bending shape at the folding area N12 enables the driving chip to be connected to the signal lines in the driving circuit layer 32 through the conductive layer 35 , and can reduce the erosion of the connection leads in the conductive layer 35 by water and oxygen.
  • FIG. 9 is a flow chart of a method for manufacturing a rigid display panel provided by an embodiment of the present application.
  • the manufacturing method of the rigid display panel may specifically include the following steps:
  • Step 901 providing a rigid substrate; the rigid substrate is divided into a display area and a frame area surrounding the display area, the frame area includes a first peripheral area, a bending area and a binding area, the first peripheral area, the bending area and The binding area is set away from the display area in turn.
  • Step 902 forming a driving circuit layer on the rigid substrate.
  • an active layer 321, a gate insulating layer 322, a gate layer 323, an interlayer dielectric layer 324, a source-drain electrode layer, etc. are sequentially formed on a rigid substrate 31, thereby manufacturing a driving circuit layer 32 .
  • Step 903 sequentially forming the first organic layer structure, the first inorganic layer structure, the conductive layer and the second organic layer structure on the driving circuit layer; the first organic layer structure, the first inorganic layer structure, the conductive layer and the second organic layer
  • the structure is at least distributed in the first peripheral area, the bending area and the binding area.
  • the first organic layer structure 33 is first formed on the driving circuit layer 32, and then the first inorganic layer is formed on the first organic layer structure 33 structure34.
  • the connecting wires included in the subsequently formed conductive layer 35 need to pass through the first via holes passing through the first inorganic layer structure 34 and the first organic layer structure 33, the signal lines in the driving circuit layer 32 are connected, therefore, in the first organic layer After the first inorganic layer structure 34 is formed on the structure 33 , it is necessary to perform patterning treatment on the first inorganic layer structure 34 and the first organic layer structure 33 to form the first through hole.
  • the patterning process includes process steps such as photoresist coating, exposure, development, etching, and photoresist stripping.
  • the first inorganic layer structure 34 and the first organic layer structure 33 are only distributed in the first peripheral region N11, the bending region N12 and the binding region N13, when the first via hole is formed, the display region AA , the first inorganic layer structure 34 and the first organic layer structure 33 in the second peripheral region N21 , the third peripheral region N31 and the fourth peripheral region N41 are removed.
  • a conductive film is formed on the side of the first inorganic layer structure 34 away from the rigid substrate 31, and then the conductive film is patterned to form a plurality of Connect the conductive layer 35 of the leads; finally, form the second organic layer structure 36 on the side of the conductive layer 35 away from the rigid substrate 31 .
  • the second organic layer structure 36 and the conductive layer 35 are only distributed in the first peripheral region N11, the second peripheral region N21, the third peripheral region N31, the fourth peripheral region N41, the bending region N12 and the binding region N13, in When patterning the conductive film to form the conductive layer 35, it is necessary to remove the conductive film in the display area AA at the same time, and when forming the second organic layer structure 36, it is also necessary to remove the second organic layer structure in the display area AA. 36 for material removal.
  • the first inorganic layer structure 34 is not provided in the first peripheral region N11, the bending region N12 and the binding region N13, the first organic layer structure 33 and the conductive layer can be sequentially formed on the driving circuit layer 32. 35 and the second organic layer structure 36 .
  • the material of the first organic layer structure 33 as an example of photosensitive resin, the first via hole penetrating through the first organic layer structure 33 can be formed directly by exposure and development.
  • an OLED display panel after the second organic layer structure 36 is formed, structures such as an anode layer 41, a pixel defining layer 37, a light emitting layer 42, a cathode layer 43, and an encapsulation layer 44 need to be sequentially formed;
  • the pixel electrode 51 needs to be formed, and the color filter substrate 53 and the rigid substrate 31 formed with the pixel electrode 51 are aligned, and liquid crystal molecules are injected to form the liquid crystal layer 52.
  • the cover plate 54 is pasted on the side of the color filter substrate 53 away from the rigid substrate 31 .
  • Step 904 peel off the rigid substrate and the driving circuit layer at the bending area.
  • the rigid substrate 31 and the driving circuit layer 32 at the bending region N12 are peeled off.
  • a light-shielding jig can be used to irradiate the rigid substrate 31 with laser light on the side away from the driving circuit layer 32, so as to peel off the rigid substrate 31 and the driving circuit layer 32 at the bending region N12.
  • the interface between the interlayer dielectric layer 324 in the driving circuit layer 32 and the first organic layer structure 33 is separated due to ashing, so that the The rigid substrate 31 and the driving circuit layer 32 at the bending area N12 are peeled off from the display panel 30 .
  • laser lift-off (laser lift-off, LLO) equipment includes a laser source 61, an attenuator 62, an optical system 63, a reflection device 64 and a light-shielding jig 65.
  • the laser source 61 is used to emit laser light
  • the attenuator 62 is used to modulate the laser light emitted by the laser source 61
  • the optical system 63 is used to perform processing such as shaping and homogenizing the laser light modulated by the attenuator 62 to obtain a uniform and long-term stable line
  • the light beam, the reflecting device 64 is used to reflect the laser light processed by the optical system 63 to the position where the light-shielding fixture 65 is located.
  • the light-shielding fixture 65 includes a light-shielding area 651 and a light-transmitting area 652, the light-shielding area 652 is set corresponding to the bending area N12 of the display panel 30, and the light-shielding area 651 is set correspondingly to the area other than the bending area N12, that is, the light-shielding area 651 It is set corresponding to the display area AA, the binding area N13, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31 and the fourth peripheral area N41.
  • the laser light emitted by the reflective device 64 can be patterned by the light-shielding jig 65, so that the laser light can pass through the light-transmitting region 652 of the light-shielding jig 65 and irradiate to the bending area N12 of the display panel 30, and the bending area N12
  • the rigid substrate 31 and the driving circuit layer 32 are peeled off.
  • the light-shielding area 651 of the light-shielding jig 65 blocks the laser light to prevent the laser light from reaching the display area AA, the binding area N13, the first peripheral area N11, the second peripheral area N21, the third peripheral area N31, and the second peripheral area N31 of the display panel 30.
  • the surrounding area N41 affects the performance of the display panel 30 .
  • FIG. 11 is a schematic structural view of the display panel 30 before the rigid substrate 31 and the driving circuit layer 32 at the bending area N12 are peeled off.
  • the rigid substrate 31 and the driving circuit layer 32 at the folding area N12 can obtain a display panel 30 as shown in FIG. 12 .
  • the rigid substrate 31 at the bending region N12 , the gate insulating layer 322 and the interlayer dielectric layer 324 in the driving circuit layer 32 are peeled off.
  • the panel group 70 includes two rows of display panels 30, each row of display panels 30 includes a plurality of display panels 30, and the bending regions N12 of the two rows of display panels 30 are directed toward the two rows of display panels 30 Therefore, when the rigid substrate 31 and the driving circuit layer 32 at the bending area N12 of the display panel 30 are peeled off using the light-shielding jig 65, all the display panels in the panel group 70 can be removed at one time. Both the rigid substrate 31 and the driving circuit layer 32 at the bending region N12 are peeled off.
  • the light-shielding jig 65 may also be used to perform a laser lift-off to lift off the rigid substrate 31 and the driving circuit layer 32 at the bending region N12 of a display panel 30 or a row of display panels 30 .
  • the driving chip is bound in the bonding region N13 of the display panel 30 .
  • Step 905 bending the bending area toward the backlight side of the display panel, so that the binding area is bent to the backlight side of the display panel.
  • an adhesive layer 38 is disposed.
  • the bending area N12 of the display panel 30 is bent toward the backlight side of the display panel 30, and the binding area N13 is bent to the backlight side of the display panel 30, because the first surface of the rigid substrate 31 at the display area AA and/or the fourth surface of the rigid substrate 31 at the binding area N13 is provided with an adhesive layer 38, and by pressing the display panel 30, the rigid substrate 31 at the binding area N13 can be connected to the display area AA
  • the rigid substrate 31 is bonded by an adhesive layer 38 .

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Abstract

本申请实施例提供一种显示面板及其制作方法、终端设备，应用于终端技术领域。该显示面板包括刚性衬底、设置在刚性衬底上的驱动电路层，以及依次远离刚性衬底设置的第一有机层结构、导电层和第二有机层结构，刚性衬底和驱动电路层避开弯折区设置，第一有机层结构、导电层和第二有机层结构，至少分布在第一周边区、弯折区和绑定区。通过将弯折区处的刚性衬底和驱动电路层剥离，使得弯折区处的显示面板可以进行弯折，则绑定区处的显示面板可以弯折至显示面板的背光侧，以减小显示面板绑定区所在侧的边框宽度；并且，通过第一有机层结构、导电层和第二有机层结构，可加强弯折区处的显示面板的刚性，以维持弯折区处的弯折形貌。

Description

显示面板及其制作方法、终端设备
本申请要求于2021年11月29日提交中国国家知识产权局、申请号为202111428818.X、申请名称为“显示面板及其制作方法、终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端技术领域，尤其涉及一种显示面板及其制作方法、终端设备。
背景技术
随着信息时代的不断发展，手机等终端设备已成为人们生活和工作中较为常用的工具，并且，随着用户对终端设备的要求越来越高，窄边框的终端设备逐渐受到用户的青睐，使得窄边框的终端设备逐渐成为行业追逐的趋势。
但是，针对终端设备中的刚性显示面板，由于其需要在周边区设置驱动芯片等结构，导致刚性显示面板的绑定区所在侧的边框宽度较大。
发明内容
本申请实施例提供一种显示面板及其制作方法、终端设备，以减小刚性显示面板的绑定区所在侧的边框宽度。
第一方面，本申请实施例提出一种显示面板，该显示面板具有显示区和围绕显示区的边框区，边框区包括第一周边区、弯折区和绑定区，第一周边区、弯折区和绑定区依次远离显示区设置，绑定区通过弯折区弯折至显示面板的背光侧；该显示面板包括：刚性衬底、设置在刚性衬底上的驱动电路层，以及依次远离刚性衬底设置的第一有机层结构、导电层和第二有机层结构；刚性衬底和驱动电路层避开弯折区设置；第一有机层结构、导电层和第二有机层结构，至少分布在第一周边区、弯折区和绑定区，第一周边区处的第一有机层结构位于驱动电路层远离刚性衬底的一侧。
这样，通过将弯折区处的刚性衬底和驱动电路层剥离，使得弯折区处的显示面板可以进行弯折，从而使得绑定区处的显示面板可以弯折至显示面板的背光侧，以减小显示面板绑定区所在侧的边框宽度；并且，在第一周边区、弯折区和绑定区内设置第一有机层结构、第一无机层结构、导电层和第二有机层结构，可加强弯折区处的显示面板的刚性，以更好地维持弯折区处的弯折形貌；另外，由于驱动电路层在弯折区处避开设置，因此，通过导电层可以将驱动电路层中的信号线与绑定区处的驱动芯片连接，以使得驱动芯片输出的信号可以传输至信号线。
在一种可选的实施方式中，显示面板还包括设置在第一有机层结构与导电层之间的第一无机层结构；第一无机层结构包括至少一层无机层，且第一无机层结构至少分布在第一周边区、弯折区和绑定区。这样，可通过设置第一无机层结构阻隔水氧，减少水氧对导电层中的连接引线造成的侵蚀。
在一种可选的实施方式中，边框区还包括第二周边区、第三周边区和第四周边区，第一周边区与第三周边区位于显示区相对的两侧，第二周边区和第四周边区均位于第一周边区与第三周边区之间，且第二周边区与第四周边区也位于显示区相对的两侧； 第一有机层结构和第一无机层结构还分布在显示区、第二周边区、第三周边区和第四周边区。这样，通过在显示面板的各个区域均设置第一有机层结构和第一无机层结构，可降低第一有机层结构和第一无机层结构在图案化处理时的工艺复杂度，并且，该第一有机层结构和第一无机层结构也可以同时作为显示区内的绝缘膜层，以减少显示区内需要制作的绝缘膜层的数量。
在一种可选的实施方式中，导电层包括多条连接引线，连接引线的一端通过贯穿第一无机层结构和第一有机层结构的第一过孔，与驱动电路层中的信号线连接，连接引线的另一端还通过贯穿第二有机层结构的第二过孔，与设置在绑定区的驱动芯片连接。这样，通过连接引线可实现驱动电路层中的信号线与绑定区处的驱动芯片的连接，使得驱动芯片输出的信号可以传输至信号线。
在一种可选的实施方式中，显示面板为液晶显示器(liquid crystal display，LCD)显示面板，导电层和第二有机层结构避开显示区设置；信号线还延伸至第一周边区，第一过孔位于第一周边区内。这样，通过在显示区内不设置导电层和第二有机层结构，可减少显示区内的膜层的层数，提高显示区处的显示面板的透过率。
在一种可选的实施方式中，显示面板为有机发光二极管(organic light-emitting diode，OLED)显示面板，导电层和第二有机层结构还分布在显示区；信号线还延伸至第一周边区，第一过孔位于第一周边区内；或者，第一过孔位于显示区内。这样，由于OLED可以自发光，因此，显示区内的导电层和第二有机层结构不会影响显示面板的透过率；并且，当导电层还分布在显示区内时，也可以在显示区处，将驱动电路层中的信号线与绑定区处的驱动芯片进行连接。
在一种可选的实施方式中，边框区还包括第二周边区、第三周边区和第四周边区，第一周边区与第三周边区位于显示区相对的两侧，第二周边区和第四周边区均位于第一周边区与第三周边区之间，且第二周边区与第四周边区也位于显示区相对的两侧；导电层和第二有机层结构还分布在第二周边区、第三周边区和第四周边区。这样，通过在显示面板的各个区域均设置导电层和第二有机层结构，可降低导电层和第二有机层结构在图案化处理时的工艺复杂度，并且，通过在显示区内增设第二有机层结构，可提高显示区内的膜层的平整度。
在一种可选的实施方式中，第一有机层结构和第二有机层结构均包括至少一层有机层。
在一种可选的实施方式中，第一有机层结构包括多层有机层，显示面板还包括设置在相邻两层有机层之间的第二无机层结构；第二无机层结构包括至少一层无机层，且第二无机层结构至少分布在第一周边区、弯折区和绑定区。这样，通过增设第二无机层结构，可进一步减少水氧对导电层中的连接引线造成的侵蚀，并且可在一定程度上增强弯折区的刚性。
在一种可选的实施方式中，该显示面板还包括：阳极层，阳极层分布在显示区，且位于第二有机层结构远离刚性衬底的一侧；像素界定层，像素界定层至少分布在显示区、第一周边区、弯折区和绑定区，且像素界定层位于第二有机层结构远离第一有机层结构的一侧。这样，通过将像素界定层延伸至弯折区，可进一步提高弯折区的刚性。
在一种可选的实施方式中，显示面板还包括粘接层，粘接层位于绑定区处的刚性衬底与显示区处的刚性衬底之间。这样，通过粘接层将绑定区处的刚性衬底与显示区处的刚性衬底粘接，使得绑定区处的膜层结构可以稳定的固定在显示面板的背光侧。
第二方面，本申请实施例提出了一种显示面板的制作方法，包括：提供一刚性衬底；刚性衬底被划分为显示区和围绕显示区的边框区，边框区包括第一周边区、弯折区和绑定区，第一周边区、弯折区和绑定区依次远离显示区设置；在刚性衬底上形成驱动电路层；在驱动电路层上依次形成第一有机层结构、导电层和第二有机层结构；第一有机层结构、导电层和第二有机层结构，至少分布在第一周边区、弯折区和绑定区；将弯折区处的刚性衬底和驱动电路层剥离；将弯折区朝向显示面板的背光侧弯折，使得绑定区弯折至显示面板的背光侧。
在一种可选的实施方式中，将弯折区处的刚性衬底和驱动电路层剥离，包括：采用遮光治具对刚性衬底远离驱动电路层的一侧进行激光照射，以将弯折区处的刚性衬底和驱动电路层剥离；其中，遮光治具包括遮光区和透光区，透光区与弯折区对应设置，遮光区与弯折区以外的区域对应设置。
在一种可选的实施方式中，将弯折区朝向显示面板的背光侧弯折之前，还包括：在显示区处的刚性衬底远离第一有机层结构一侧的表面上，和/或，绑定区处的刚性衬底远离第一有机层结构一侧的表面上设置粘接层；在将弯折区朝向显示面板的背光侧弯折之后，还包括：将绑定区处的刚性衬底与显示区处的刚性衬底通过粘接层粘接。
第三方面，本申请实施例提出了一种终端设备，包括驱动芯片以及上述的显示面板；驱动芯片位于显示面板的绑定区，且驱动芯片通过贯穿显示面板中的第二有机层结构的第二过孔，与显示面板中的连接引线连接。
第二方面和第三方面的各可能的实现方式，效果与第一方面以及第一方面的可能的设计中的效果类似，在此不再赘述。
附图说明
图1为相关技术中的柔性显示模组的结构示意图；
图2为相关技术中的刚性显示面板的结构示意图；
图3为本申请实施例提供的终端设备的结构示意图；
图4为本申请实施例提供的刚性显示面板的平面示意图；
图5为本申请实施例提供的第一种刚性显示面板的截面示意图；
图6为本申请实施例提供的第二种刚性显示面板的截面示意图；
图7为本申请实施例提供的第三种刚性显示面板的截面示意图；
图8为本申请实施例提供的第四种刚性显示面板的截面示意图；
图9为本申请实施例提供的一种刚性显示面板的制作方法的流程图；
图10为本申请采用激光剥离技术，剥离弯折区处的刚性衬底和驱动电路层的示意图；
图11为本申请实施例提供的刚性显示面板在剥离弯折区处的刚性衬底和驱动电路层前的结构示意图；
图12为本申请实施例提供的刚性显示面板在剥离弯折区处的刚性衬底和驱动电路层后的结构示意图。
具体实施方式
为了便于清楚描述本申请实施例的技术方案，在本申请的实施例中，采用了“第一”、“第二”等字样对功能和作用基本相同的相同项或相似项进行区分。例如，第一芯片和第二芯片仅仅是为了区分不同的芯片，并不对其先后顺序进行限定。本领域技术人员可以理解“第一”、“第二”等字样并不对数量和执行次序进行限定，并且“第一”、“第二”等字样也并不限定一定不同。
需要说明的是，本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其他实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
本申请实施例中，“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况，其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a，b，或c中的至少一项(个)，可以表示：a，b，c，a-b，a-c，b-c，或a-b-c，其中a，b，c可以是单个，也可以是多个。
随着信息时代的不断发展，手机等终端设备已成为人们生活和工作中较为常用的工具，并且，随着用户对终端设备的要求越来越高，窄边框的终端设备逐渐受到用户的青睐，使得窄边框的终端设备逐渐成为行业追逐的趋势。
在相关技术中，如图1所示，柔性显示模组包括：柔性显示面板101、第一背膜102、粘接层103、支撑垫104、第二背膜105、金属覆盖层(metal cover layer，MCL)106、封装层107、触控层108、偏光片109、光学胶层110以及盖板111；并且，柔性显示模组被划分为显示区AA和边框区NA，边框区NA包括周边区B1、弯折区B2和绑定区B3，周边区B1指的是显示区AA到封装层107的边界之间的区域。
通过采用柔性材料作为柔性显示面板101的衬底材料，使得弯折区B2处的柔性显示面板101可以弯折，则绑定区B3处的柔性显示面板101，可通过弯折区B2处的柔性显示面板101弯折至柔性显示面板101的背光侧，从而减小柔性显示面板101的绑定区B3所在侧的边框宽度。
但是，柔性显示面板101的制作成本通常大于刚性显示面板的制作成本，为了降低终端设备的制作成本，可采用刚性显示面板作为终端设备的显示面板。
如图2所示，刚性显示面板包括刚性背板21，刚性背板21被划分为显示区AA和边框区NA，边框区NA包括周边区和边缘区B4，周边区包括走线搭接区B11和封装区B12，边缘区B4指的是封装区B12到刚性背板21的边缘之间的区域，且边缘区B4包括用于绑定驱动芯片的绑定区。
在显示区AA处的刚性背板21上设置有发光器件221等结构，在走线搭接区B11处的刚性背板21上设置有搭接走线等结构222，在封装区B12处的刚性背板21上设置有封装结构223；此外，该刚性显示面板还包括盖板23。
其中，刚性背板21中的衬底材料为刚性材料，则刚性背板21无法进行弯折，因 此会导致刚性显示面板的绑定区所在侧的边框宽度较大。经测试，图2所示的刚性显示面板的边框区NA的宽度一般大于或等于2.3mm，而边缘区B4基本上会占到1.67mm左右。
基于此，本申请实施例提供了一种显示面板，通过将弯折区处的刚性衬底和驱动电路层剥离，使得弯折区处的显示面板可以进行弯折，从而使得绑定区处的显示面板可以弯折至显示面板的背光侧，以减小显示面板绑定区所在侧的边框宽度；并且，在第一周边区、弯折区和绑定区内设置第一有机层结构、第一无机层结构、导电层和第二有机层结构，可加强弯折区处的显示面板的刚性，以更好地维持弯折区处的弯折形貌；另外，由于驱动电路层在弯折区处避开设置，为了使得驱动电路层中的信号线可以与绑定区处的驱动芯片连接，可通过导电层将信号线与驱动芯片连接，以使得驱动芯片输出的信号可以传输至信号线，且还可以通过第一无机层结构减少水氧对导电层中的连接引线的侵蚀。
本申请实施例提供的显示面板，可以应用在具备显示功能的终端设备中，该终端设备可以是手机、平板电脑、电子阅读器、笔记本电脑、车载设备、可穿戴设备、电视等需要设置成窄边框的设备。
本申请实施例以终端设备为手机为例进行说明。如图3所示，终端设备300包括显示面板30和壳体40。其中，显示面板30为刚性显示面板，显示面板30安装于壳体40上，其用于显示图像或视频等；显示面板30和壳体40共同围设出终端设备300的容纳腔体，以便通过该容纳腔体放置终端设备300的电子器件等，同时对位于容纳腔体内的电子器件形成密封和保护的作用。
其中，如图4所示，显示面板30具有显示区AA和围绕显示区AA的边框区NA，边框区NA包括第一周边区N11、弯折区N12和绑定区N13，第一周边区N11、弯折区N12和绑定区N13依次远离显示区AA设置，即沿着显示区AA指向绑定区N13的方向上，显示面板30的各区域依次为显示区AA、第一周边区N11、弯折区N12和绑定区N13。
在一些实施例中，第一周边区N11、弯折区N12和绑定区N13位于显示区AA的其中一侧；当然，在显示区AA的至少两侧，也可以设置有第一周边区N11、弯折区N12和绑定区N13。
第一周边区N11指的是显示区AA与弯折区N12之间的区域。由于在实际产品中，需要在显示面板30的显示区AA的外围，通过封框胶或者封装膜层等封装结构进行封装，以及需要将显示区AA内的信号线与外围引线进行搭接等，因此，第一周边区N11可以包括封装结构所占用的区域，以及显示区AA内的信号线与外围引线的搭接区域等。
当第一周边区N11、弯折区N12和绑定区N13位于显示区AA的其中一侧时，边框区NA还包括第二周边区N21、第三周边区N31和第四周边区N41，第一周边区N11与第三周边区N31位于显示区AA相对的两侧，第二周边区N21和第四周边区N41均位于第一周边区N11与第三周边区N31之间，且第二周边区N21与第四周边区N41也位于显示区AA相对的两侧。
例如，第一周边区N11、弯折区N12和绑定区N13可以位于显示区AA的下侧， 第三周边区N31位于显示区AA的上侧，第二周边区N21位于显示区AA的左侧，第四周边区N41位于显示区AA的右侧。
下面以四种不同的结构实施方式，说明本申请实施例中的刚性显示面板的具体结构。图5至图8所示的显示面板30的结构，为图4所示的显示面板30将绑定区N13弯折至显示面板30的背光侧后，沿截面C-C’得到的剖视图。
在第一种可选的实施方式中，如图5所示，显示面板30包括刚性衬底31、驱动电路层32，以及层叠设置的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36。
其中，刚性衬底31避开弯折区N12设置，即刚性衬底31分布在显示区AA、第一周边区N11、绑定区N13、第二周边区N21、第三周边区N31和第四周边区N41，刚性衬底31在弯折区N12所在的位置断开设置。
位于显示区AA、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41的刚性衬底31为一体结构，其包括相对设置的第一表面和第二表面，以及设置在第一表面与第二表面之间且首尾连接的第一侧面、第二侧面、第三侧面和第四侧面，第一侧面为第一周边区N11所在的侧面，第二侧面为第二周边区N21所在的侧面，第三侧面为第三周边区N31所在的侧面，第四侧面为第四周边区N41所在的侧面。
位于绑定区N13的刚性衬底31为一体结构，其包括相对设置的第三表面和第四表面，以及设置在第三表面与第四表面之间且首尾连接的第五侧面、第六侧面、第七侧面和第八侧面。在绑定区N13通过弯折区N12弯折至显示面板30的背光侧之前，第四表面与第一表面位于同一平面，第三表面与第二表面位于同一平面，第七侧面与第一侧面相对设置，且第五侧面位于第七侧面远离第一周边区N11的一侧，弯折区N12也就是第一侧面与第七侧面之间的区域。在绑定区N13通过弯折区N12弯折至显示面板30的背光侧之后，第一表面与第四表面相对设置，且第三表面位于第四表面远离第一表面的一侧，第二表面位于第一表面远离第四表面的一侧，而第七侧面与第一侧面可以位于同一平面。显示面板30的背光侧也就指的是刚性衬底31的第一表面所在的一侧。
刚性衬底31可以为玻璃衬底或者聚甲基丙烯酸甲酯(polymethyl methacrylate，PMMA)衬底等，PMMA衬底也可称为亚克力衬底。
在位于显示区AA、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41的刚性衬底31的第二表面上，以及在位于绑定区N13的刚性衬底31的第三表面上，均设置有驱动电路层32。驱动电路层32避开弯折区N12设置，即驱动电路层32分布在显示区AA、第一周边区N11、绑定区N13、第二周边区N21、第三周边区N31和第四周边区N41，驱动电路层32在弯折区N12所在的位置断开设置。
在本申请实施例中，该显示面板30可以为OLED显示面板，则位于显示区AA的OLED显示面板30实际上包括多个子像素，每个子像素包括像素驱动电路和发光器件，发光器件设置在像素驱动电路远离刚性衬底31的一侧，且与像素驱动电路连接，像素驱动电路能够提供驱动电压至发光器件，以控制该发光器件的发光状态。因此，位于显示区AA的驱动电路层32实际上指的是，显示区AA内的各个子像素对应的像素驱动电路。
需要说明的是，像素驱动电路的结构包括多种，例如，像素驱动电路的结构可以为6T1C像素驱动电路、7T1C像素驱动电路以及3T1C像素驱动电路等，“T”表示像素驱动电路中的晶体管，位于“T”前面的数字表示像素驱动电路中的晶体管的数量，“C”表示像素驱动电路中的存储电容，“C”前面的数字表示像素驱动电路中的存储电容的数量。
而像素驱动电路中的晶体管，是通过层叠设置的有源层321、栅极绝缘层322、栅极层323、层间介质层324和源漏电极层构成的。此时，位于显示区AA的驱动电路层32包括层叠设置的有源层321、栅极绝缘层322、栅极层323、层间介质层324和源漏电极层。针对位于显示区AA的驱动电路层32，有源层321位于刚性衬底31的第二表面，栅极绝缘层322覆盖有源层321和刚性衬底31的第二表面，栅极层323位于栅极绝缘层322远离刚性衬底31的一侧，层间介质层324覆盖栅极层323和栅极绝缘层322，源漏电极层位于层间介质层324远离刚性衬底31的一侧。
其中，栅极层323包括各个晶体管的栅极，以及EM(发光控制)信号线、栅线、复位信号线等，源漏电极层包括各个晶体管的源极3251和漏极3252，以及数据线和VDD(高电平电源)信号线等。
而第一周边区N11、绑定区N13、第二周边区N21、第三周边区N31和第四周边区N41内的驱动电路层32，实际上指的是驱动电路层32中的绝缘介质层，如驱动电路层32中的栅极绝缘层322和层间介质层324。针对位于绑定区N13的驱动电路层32，栅极绝缘层322位于刚性衬底31的第三表面上，层间介质层324位于栅极绝缘层322远离刚性衬底31的一侧。
图5示出的驱动电路层32中的晶体管为底栅型晶体管，当然，本申请实施例中的驱动电路层32中的晶体管还可以为顶栅型晶体管。另外，驱动电路层32中的栅极层的层数也可以为多层，且相邻两层栅极层之间需要通过栅极绝缘层间隔设置，驱动电路层32中的源漏电极层的层数也可以为多层，且相邻两层源漏电极层之间需要通过层间介质层间隔设置。
在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41、弯折区N12以及绑定区N13内，均设置有层叠设置的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36。
在显示区AA、绑定区N13、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41内，第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36依次远离刚性衬底31的第二表面设置。具体的，第一有机层结构33位于驱动电路层32远离刚性衬底31的一侧，第一无机层结构34位于第一有机层结构33远离刚性衬底31的一侧，导电层35位于第一无机层结构34远离刚性衬底31的一侧，第二有机层结构36位于导电层35远离刚性衬底31的一侧。
在显示面板30的弯折区N12弯折前，弯折区N12内的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，依次远离刚性衬底31的第二表面所在的平面设置；在显示面板30的弯折区N12弯折后，弯折区N12内的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，依次远离刚性衬底31的第一侧面设置，即第一有机层结构33与刚性衬底31的第一侧面存在一定的间隔区 域，第一无机层结构34位于第一有机层结构33远离刚性衬底31的第一侧面的一侧，导电层35位于第一无机层结构34远离刚性衬底31的第一侧面的一侧，第二有机层结构36位于导电层35远离刚性衬底31的第一侧面的一侧。
其中，第一有机层结构33包括一层有机层，该有机层也可称为平坦层，该有机层的材料可以为树脂等有机材料，第一有机层结构33中的有机层的厚度可以为2μm；第一无机层结构34包括一层无机层，该无机层也可称为钝化层，该无机层的材料可以为氧化硅或氮化硅等无机材料；导电层35的材料可以为钛、铝、钼、铜等金属材料；第二有机层结构36也包括一层有机层，该机层也可称为平坦层，该有机层的材料可以为树脂等有机材料，第二有机层结构36中的有机层的厚度可以为2μm。
导电层35实际上包括多条连接引线，连接引线的一端通过贯穿第一无机层结构34和第一有机层结构33的第一过孔，与驱动电路层32中的信号线连接，连接引线的另一端还通过贯穿第二有机层结构36的第二过孔50，与设置在绑定区N13的驱动芯片(未在图5中示出)连接。
在实际产品中，驱动芯片可采用COP(chip on panel)固定在显示面板30的绑定区N13，COP指的是直接将驱动芯片绑定在显示面板30上的工艺；当然，可以采用其他方式将驱动芯片固定在显示面板30的绑定区N13，如采用覆晶薄膜(chip on film，COF)或COG(chip on glass)等方式将驱动芯片固定在显示面板30的绑定区N13。
因此，在驱动电路层32在弯折区N12处避开设置的情况下，可通过导电层35将驱动芯片与驱动电路层32中的信号线连接，使得驱动芯片输出的信号可以传输至驱动电路层32中的信号线，使得驱动电路层32中的像素驱动电路可以正常工作。
驱动电路层32中的信号线可以为数据线、VDD信号线等，且数据线、VDD信号线是与驱动电路层32中的晶体管的源极连接，因此，在图5中以连接引线通过贯穿的第一过孔与晶体管的源极3251连接，来表示连接引线与驱动电路层32中的信号线的连接关系。
此时，驱动电路层32中的信号线可以仅分布在显示区AA内，则将第一过孔设置显示区AA内，连接引线在显示区AA内，通过贯穿的第一过孔与驱动电路层32中的信号线连接。
当然，可以理解的是，第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，也可以仅分布在第一周边区N11、弯折区N12和绑定区N13，此时，第一周边区N11处的第一有机层结构33位于驱动电路层32远离刚性衬底31的一侧。或者，导电层35和第二有机层结构36还可以仅分布在第一周边区N11、弯折区N12、绑定区N13、第二周边区N21、第三周边区N31和第四周边区N41，即导电层35和第二有机层结构36仅避开弯折区N12设置。
需要说明的是，弯折区N12处的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，可加强弯折区N12处的显示面板30的刚性，以更好地维持弯折区N12处的弯折形貌，其中，维持弯折区N12处的弯折形貌主要是通过弯折区N12处的有机层结构(即第一有机层结构33和第二有机层结构36)来实现的。并且，在弯折区N12处设置的有机层结构包括第一有机层结构33和第二有机层结构36，而不是仅包括单层的有机层，其目的是两层有机层结构可以更好地支撑弯折区N12，以 维持弯折区N12处的弯折形貌，若仅在弯折区N12设置单层的有机层结构，其支撑效果不佳，难以更好地维持弯折区N12处的弯折形貌。
而第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36还延伸至第一周边区N11和绑定区N13，主要是为了使得第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，可以正常搭接在第一周边区N11和绑定区N13的驱动电路层32上。若仅在弯折区N12处设置第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，在将弯折区N12处的刚性衬底31和驱动电路层32剥离后，弯折区N12处的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36会出现断裂，无法维持弯折区N12的形貌。
而弯折区N12、第一周边区N11和绑定区N13内设置的导电层35，主要是为了将驱动电路层32中的信号线与绑定区N13处的驱动芯片连接，使得驱动芯片输出的信号可以通过导电层35传输至信号线。
而弯折区N12、第一周边区N11和绑定区N13内设置的第一无机层结构34，其主要是为了阻隔水氧，减少水氧对导电层35中的连接引线造成的侵蚀。因此，在一些实施例中，也可以将图5所示的第一无机层结构34去除，使得弯折区N12、第一周边区N11和绑定区N13内依次层叠设置第一有机层结构33、导电层35和第二有机层结构36。
在申请实施例中，如图5所示，显示面板30还包括阳极层41、像素界定层37、发光层42、阴极层43和封装层44等结构。
阳极层41分布在显示区AA内，且位于第二有机层结构36远离刚性衬底31的一侧。在实际产品中，阳极层41包括每个子像素对应的阳极，且相邻两个子像素之间的阳极断开设置，阳极层41的材料可以为铝、银等金属材料。
像素界定层37分布在显示区AA、第一周边区N11、弯折区N12和绑定区N13，此时，在绑定区N13处，第二过孔50还贯穿像素界定层37。当然，像素界定层37还可以分布在第二周边区N21、第三周边区N31和第四周边区N41，像素界定层37位于第二有机层结构36远离第一有机层结构33的一侧。并且，在显示区AA内，像素界定层具有多个像素开口，且每个像素开口至少暴露出部分的阳极，该像素界定层37的厚度可以为1.5μm。
发光层42位于显示区AA内，其具体位于像素界定层37限定出的像素开口内。
而阴极层43可以分布在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41内，其位于像素界定层37远离刚性衬底31的一侧，该阴极层43的材料为具有高透过率的导电材料，如氧化铟锡(indium tin oxides，ITO)等材料。
阳极层41、发光层42和阴极层43共同构成发光器件，且发光器件发出的光线的出光侧为朝向阴极层43的一侧，因此，采用高透过率的导电材料制作阴极层43，可减少发光器件的发出的光线经过阴极层43造成的损失。
封装层44可以分布在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41内，其位于阴极层43远离刚性衬底31的一侧。
此时，弯折区N12处的膜层结构包括：层叠设置的第一有机层结构33、第一无机 层结构34、导电层35、第二有机层结构36和像素界定层37，且第一有机层结构33、第一无机层结构34、导电层35、第二有机层结构36和像素界定层37依次远离刚性衬底31的第一侧面设置。
需要说明的是，显示面板30还可以设置在封装层44远离刚性衬底31一侧的触控层、偏光片、光学胶层以及盖板等结构。
另外，为了使得弯折区N12处的显示面板30弯折后，显示面板30的结构稳定性，可以在位于绑定区N13处的刚性衬底31与显示区AA处的刚性衬底31之间设置粘接层38，通过粘接层38将绑定区N13处的刚性衬底31与显示区AA处的刚性衬底31进行粘接，使得绑定区N13处的结构可以稳定的固定在显示面板30的背光侧。此时，粘接层38实际上位于显示区AA的刚性衬底31的第一表面，以及绑定区N13处的刚性衬底31的第四表面之间。
综上，通过将弯折区N12处的刚性衬底31和驱动电路层32剥离，使得绑定区N13处的显示面板30，可以通过弯折区N12弯折至显示面板30的背光侧，以减小显示面板30的绑定区N13所在侧的边框宽度。另外，通过在第一周边区N11、弯折区N12和绑定区N13内，设置第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，在维持弯折区N12处的弯折形貌的同时，使得驱动芯片可以通过导电层35与驱动电路层32中的信号线连接，且可减少水氧对导电层35中的连接引线造成的侵蚀。
在第二种可选的实施方式中，如图6所示，显示面板30包括刚性衬底31、驱动电路层32，以及层叠设置的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36。
其中，第一有机层结构33包括两层有机层，其分别为第一有机层331和第二有机层332，且第一有机层331和第二有机层332分布在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41、弯折区N12以及绑定区N13内。
在显示区AA、绑定区N13、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41内，第二有机层332位于第一有机层331远离刚性衬底31的一侧。而在显示面板30的弯折区N12弯折前，弯折区N12内的第二有机层332位于第一有机层331远离刚性衬底31的第二表面所在的平面，在显示面板30的弯折区N12弯折后，弯折区N12内的第二有机层332位于第一有机层331远离刚性衬底31的第一侧面。
在实际产品中，第一有机层331和第二有机层332的材料可以相同，例如，第一有机层331和第二有机层332的材料均为树脂材料；或者，第一有机层331和第二有机层332的材料也可以不同。第一有机层331和第二有机层332的厚度可以相等，例如，第一有机层331和第二有机层332的厚度均为2μm；或者，第一有机层331和第二有机层332的厚度也可以不相等，本申请实施例对此不作限制。
需要说明的是，图5所示的显示面板30与图6所示的显示面板30，其不同之处在于，图5所示的显示面板30中的第一有机层结构33包括一层有机层，而图6所示的显示面板30中的第一有机层结构33包括两层有机层，其余结构基本类似，为避免重复，在此不再赘述。关于刚性衬底31、驱动电路层32、第一有机层结构33、第一 无机层结构34、导电层35和第二有机层结构36等膜层的具体结构，可参照第一种可选的实施方式中的描述。
当第一有机层结构33包括两层有机层时，可进一步加强弯折区N12处的显示面板30的刚性，以更好地维持弯折区N12处的弯折形貌。
经测试发现，在图6所示的显示面板30中，弯折区N12的宽度可以为0.25mm，第一周边区N11的宽度为0.7mm，该宽度指的是第一周边区N11指向第三周边区N13的方向上的尺寸，则可以使得显示面板30的绑定区N13所在侧的边框宽度减小至0.95mm。
在第三种可选的实施方式中，如图7所示，显示面板30包括刚性衬底31、驱动电路层32，以及层叠设置的第一有机层331、第二无机层结构39、第二有机层332、第一无机层结构34、导电层35和第二有机层结构36。
此时，第一有机层结构33包括两层有机层，其分别为第一有机层331和第二有机层332，在第一有机层331与第二有机层332之间还设置有第二无机层结构39，第二无机层结构39包括一层无机层，且该第二无机层结构39分布在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41、弯折区N12以及绑定区N13内。
当然，在一些实施例中，第二无机层结构39也可以仅分布在第一周边区N11、弯折区N12以及绑定区N13内；而第二无机层结构39中的无机层的数量也可以不局限于1层，第二无机层结构39也可以包括两层无机层或三层无机层等。
在另一些实施例中，第一有机层结构33包括的有机层的数量也可以大于2层，此时，可以在任意相邻两层有机层之间均设置第二无机层结构39，或者部分相邻的两层有机层之间设置第二无机层结构39。例如，第一有机层结构33包括三层有机层，其分别为第一有机层331、第二有机层332和第三有机层，在第一有机层331与第二有机层332设置第二无机层结构39，和/或，在第二有机层332与第三有机层之间设置第二无机层结构39。
如图7所示，以晶体管的源极3251表示驱动电路层32中的信号线，驱动电路层32中的信号线不仅分布在显示区AA，其还延伸至第一周边区N11内，此时，第一过孔可设置在第一周边区N11内，连接引线在第一周边区N11内，通过贯穿的第一过孔与驱动电路层32中的信号线连接。并且，该第一过孔实际上贯穿的是第一无机层结构34、第二有机层332、第二无机层结构39和第一有机层331。
需要说明的是，图7所示的显示面板30与图6所示的显示面板30，其不同之处有两点。其中一个不同之处在于，图6所示的显示面板30中的第一有机层结构33包括第一有机层331和第二有机层332，而图7所示的显示面板30中，除了第一有机层331和第二有机层332外，在第一有机层331与第二有机层332之间还设置有第二无机层结构39；另一个不同之处在于，图6所示的显示面板30中的第一过孔位于显示区AA内，而图7所示的显示面板30中的第一过孔位于第一周边区N11内。其余结构基本类似，为避免重复，在此不再赘述。
综上，图5至图7所示的显示面板30均为OLED显示面板，而本申请实施例的显示面板也可以为如图8所示的LCD显示面板。
在第四种可选的实施方式中，如图8所示，显示面板30包括刚性衬底31、驱动电路层32，以及层叠设置的第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36。
其中，驱动电路层32也避开弯折区N12设置，位于显示区AA的驱动电路层32实际上指的是，显示区AA内的各个子像素对应的像素晶体管等结构，该像素晶体管的栅极与栅线连接，该像素晶体管的源极与数据线连接，该像素晶体管的漏极与像素电极51连接，其用于在栅线和数据线的作用下，向像素电极51提供像素电压，使得液晶层52内的液晶分子在像素电极51提供的像素电压，以及公共电极提供的公共电压的作用下发生偏转，以实现显示功能。
在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41、弯折区N12以及绑定区N13内，均设置有层叠设置的第一有机层结构33和第一无机层结构34。在显示区AA、绑定区N13、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41内，第一无机层结构34位于第一有机层结构33远离刚性衬底31的第二表面的一侧。
在显示面板30的弯折区N12弯折前，弯折区N12内的第一有机层结构33和第一无机层结构34，依次远离刚性衬底31的第二表面所在的平面设置；在显示面板30的弯折区N12弯折后，弯折区N12内的第一有机层结构33和第一无机层结构34，依次远离刚性衬底31的第一侧面设置。
而导电层35和第二有机层结构36避开显示区AA设置，即导电层35和第二有机层结构36分布在第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41、弯折区N12以及绑定区N13内。通过将显示区AA内的导电层35和第二有机层结构36去除，可减少显示区AA内的膜层的层数，提高显示区AA处的显示面板30的透过率。
在第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41和绑定区N13内，第二有机层结构36位于导电层35远离刚性衬底31的第二表面的一侧。在显示面板30的弯折区N12弯折前，弯折区N12内的导电层35和第二有机层结构36，依次远离刚性衬底31的第二表面所在的平面设置；在显示面板30的弯折区N12弯折后，在弯折区N12内，第二有机层结构36位于导电层35远离刚性衬底31的第一侧面。
当然，在一些实施例中，也可以仅在第一周边区N11、弯折区N12以及绑定区N13内设置导电层35和第二有机层结构36。此时，驱动电路层32中的信号线(如数据线等)还延伸至第一周边区N11，第一过孔位于第一周边区N11；在第一周边区N11内，导电层35包括的连接引线贯穿第一无机层结构34和第一有机层结构33的第一过孔，与驱动电路层32中的信号线连接。
可以理解的是，当导电层35还延伸至第二周边区N21、第三周边区N31和第四周边区N41时，第一过孔可以分布在第二周边区N21、第三周边区N31和第四周边区N41中的任意一个或多个区域，对应的信号线也需要延伸至第二周边区N21、第三周边区N31和第四周边区N41中的任意一个或多个区域，在第二周边区N21、第三周边区N31和第四周边区N41中的任意一个或多个区域内，导电层35包括的连接引线贯 穿的第一过孔与驱动电路层32中的信号线连接。
此外，如图8所示，显示面板30还包括依次远离第一无机层结构34设置的像素电极51、液晶层52、彩膜基板53和盖板54等结构。像素电极51和液晶层52可以仅分布在显示区AA内，彩膜基板53可分布在显示区AA、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41，而盖板54除了覆盖显示区AA、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41外，还延伸至弯折区N12所在的位置。
经测试发现，在图8所示的显示面板中，弯折区N12的宽度可以为0.3mm，第一周边区N11的宽度可以为0.8mm，则可以使得显示面板30的绑定区N13所在侧的边框宽度减小至1.1mm。
综上，可以看出，本申请实施例中的第一有机层结构33可以包括至少一层有机层，相应的，第二有机层结构36也可以包括至少一层有机层，第一无机层结构34包括至少一层无机层。
上述示出了四种不同的显示面板30，其通过将弯折区N12处的刚性衬底31和驱动电路层32剥离，使得绑定区N13处的显示面板30，可以通过弯折区N12弯折至显示面板30的背光侧，以减小显示面板30的绑定区N13所在侧的边框宽度，该显示面板30可以为OLED显示面板或LCD显示面板，当然，在一些产品中，本申请实施例中的显示面板30也可以为量子点发光二极管(quantum dot light emitting diodes，QLED)显示面板。
另外，通过在第一周边区N11、弯折区N12和绑定区N13内，设置第一有机层结构33、第一无机层结构34、导电层35和第二有机层结构36，在维持弯折区N12处的弯折形貌的同时，使得驱动芯片可以通过导电层35与驱动电路层32中的信号线连接，且可减少水氧对导电层35中的连接引线造成的侵蚀。
图9为本申请实施例提供的一种刚性显示面板的制作方法的流程图。参照图9所示，刚性显示面板的制作方法具体可以包括如下步骤：
步骤901，提供一刚性衬底；刚性衬底被划分为显示区和围绕显示区的边框区，边框区包括第一周边区、弯折区和绑定区，第一周边区、弯折区和绑定区依次远离显示区设置。
步骤902，在刚性衬底上形成驱动电路层。
在本申请实施例中，在刚性衬底31上依次形成有源层321、栅极绝缘层322、栅极层323、层间介质层324和源漏电极层等，从而制作得到驱动电路层32。
步骤903，在驱动电路层上依次形成第一有机层结构、第一无机层结构、导电层和第二有机层结构；第一有机层结构、第一无机层结构、导电层和第二有机层结构，至少分布在第一周边区、弯折区和绑定区。
在本申请实施例中，在刚性衬底31上形成驱动电路层32之后，在驱动电路层32上先形成第一有机层结构33，然后，在第一有机层结构33上形成第一无机层结构34。
由于后续形成的导电层35包括的连接引线需要通过贯穿第一无机层结构34和第一有机层结构33的第一过孔，驱动电路层32中的信号线连接，因此，在第一有机层结构33上形成第一无机层结构34之后，还需要对第一无机层结构34和第一有机层结 构33进行图案化处理，形成贯穿的第一过孔。其中，图案化处理的工艺包括光刻胶涂覆、曝光、显影、刻蚀以及光刻胶剥离等工艺步骤。
当然，若第一无机层结构34和第一有机层结构33仅分布在第一周边区N11、弯折区N12和绑定区N13时，在形成第一过孔时，可同时将显示区AA、第二周边区N21、第三周边区N31和第四周边区N41内的第一无机层结构34和第一有机层结构33去除。
在第一有机层结构33上形成第一无机层结构34之后，在第一无机层结构34远离刚性衬底31的一侧形成导电薄膜，然后，对导电薄膜进行图案化处理，形成包括多条连接引线的导电层35；最后，在导电层35远离刚性衬底31的一侧形成第二有机层结构36。
若第二有机层结构36和导电层35仅分布在第一周边区N11、第二周边区N21、第三周边区N31、第四周边区N41、弯折区N12和绑定区N13时，在对导电薄膜进行图案化处理形成导电层35时，需要同时将显示区AA内的导电薄膜去除，并且，在形成第二有机层结构36时，也需要将显示区AA内的第二有机层结构36的材料去除。
需要说明的是，若第一周边区N11、弯折区N12和绑定区N13内不设置第一无机层结构34时，可以在驱动电路层32上依次形成第一有机层结构33、导电层35和第二有机层结构36。以第一有机层结构33的材料为感光型树脂为例，可直接采用曝光显影的方式，形成贯穿第一有机层结构33的第一过孔。
此外，针对OLED显示面板，在形成第二有机层结构36之后，还需要依次形成阳极层41、像素界定层37、发光层42、阴极层43和封装层44等结构；针对LCD显示面板，在形成第二有机层结构36之后，还需要形成像素电极51，并将彩膜基板53与形成有像素电极51的刚性衬底31对盒，并注入液晶分子形成液晶层52，最后，将盖板54贴合在彩膜基板53远离刚性衬底31的一侧。
步骤904，将弯折区处的刚性衬底和驱动电路层剥离。
在本申请实施例中，在制作完成显示面板30的各个膜层之后，将弯折区N12处的刚性衬底31和驱动电路层32剥离。
具体的，可采用遮光治具对刚性衬底31远离驱动电路层32的一侧进行激光照射，以将弯折区N12处的刚性衬底31和驱动电路层32剥离。当激光照射到刚性衬底31远离驱动电路层32的一侧时，驱动电路层32中的层间介质层324与第一有机层结构33之间的界面因灰化而发生分离，从而可以将弯折区N12处的刚性衬底31和驱动电路层32，从显示面板30中剥离出去。
如图10所示，激光剥离(laser lift-off，LLO)设备包括激光源61、衰减器62、光学系统63、反射器件64和遮光治具65。激光源61用于发出激光，衰减器62用于对激光源61发出的激光进行调制，光学系统63用于对衰减器62调制的激光进行整形、匀束等处理，得到均匀且长期稳定的线光束，反射器件64用于将光学系统63处理得到的激光反射至遮光治具65所在的位置。
其中，遮光治具65包括遮光区651和透光区652，透光区652与显示面板30的弯折区N12对应设置，遮光区651与弯折区N12以外的区域对应设置，即遮光区651与显示区AA、绑定区N13、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41对应设置。
因此，可通过遮光治具65对反射器件64发射的激光进行图案化，使得激光可以通过遮光治具65的透光区652，照射至显示面板30的弯折区N12，以弯折区N12处的刚性衬底31和驱动电路层32剥离。而遮光治具65的遮光区651对激光进行遮挡，防止激光照射到显示面板30的显示区AA、绑定区N13、第一周边区N11、第二周边区N21、第三周边区N31和第四周边区N41，而影响显示面板30的性能。
图11为显示面板30在剥离弯折区N12处的刚性衬底31和驱动电路层32前的结构示意图，在采用遮光治具65对显示面板30的弯折区N12进行照射后，可去除弯折区N12处的刚性衬底31和驱动电路层32，得到如图12所示的显示面板30。具体的，是将弯折区N12处的刚性衬底31、驱动电路层32中的栅极绝缘层322和层间介质层324剥离。
需要说明的是，如图10所示，在显示面板30的实际制作过程中，是一次性制作多个显示面板30，这多个显示面板30可共同称为母板，然后将母板切割成多个面板组70，该面板组70包括两列显示面板30，每列显示面板30包括多个显示面板30，则将这两列显示面板30的弯折区N12均朝向这两列显示面板30之间的区域设置，因此，在采用遮光治具65对显示面板30的弯折区N12处的刚性衬底31和驱动电路层32进行剥离时，可一次性将面板组70中的所有显示面板的弯折区N12处的刚性衬底31和驱动电路层32均进行剥离。
当然，也可以采用遮光治具65执行一次激光剥离，对一个显示面板30或一列显示面板30的弯折区N12处的刚性衬底31和驱动电路层32进行剥离。
在将显示面板30的弯折区N12处的刚性衬底31和驱动电路层32进行剥离之后，将驱动芯片绑定在显示面板30的绑定区N13内。
步骤905，将弯折区朝向显示面板的背光侧弯折，使得绑定区弯折至显示面板的背光侧。
在本申请实施例中，在将驱动芯片绑定在显示面板30的绑定区N13内之后，首先，在显示区AA处的刚性衬底31远离第一有机层结构33一侧的表面(即第一表面)上，和/或，绑定区N13处的刚性衬底31远离第一有机层结构33一侧的表面(即第四表面)上设置粘接层38。
然后，将显示面板30的弯折区N12朝向显示面板30的背光侧弯折，将绑定区N13弯折至显示面板30的背光侧，由于显示区AA处的刚性衬底31的第一表面上，和/或绑定区N13处的刚性衬底31的第四表面上设置有粘接层38，通过压合显示面板30，可使得绑定区N13处的刚性衬底31与显示区AA处的刚性衬底31通过粘接层38粘接。
因此，在将图12所示的显示面板30的绑定区N13，通过弯折区N12弯折至显示面板30的背光侧，并将绑定区N13处的刚性衬底31与显示区AA处的刚性衬底31通过粘接层38粘接后，可得到如图5所示的显示面板30。
以上的具体实施方式，对本申请的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上仅为本申请的具体实施方式而已，并不用于限定本申请的保护范围，凡在本申请的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本申请的保护范围之内。

Claims (25)

  1. 一种显示面板，其特征在于，所述显示面板具有显示区和围绕所述显示区的边框区，所述边框区包括第一周边区、弯折区和绑定区，所述第一周边区、所述弯折区和所述绑定区依次远离所述显示区设置，所述绑定区通过所述弯折区弯折至所述显示面板的背光侧；
    所述显示面板包括：刚性衬底、设置在所述刚性衬底上的驱动电路层，以及依次远离所述刚性衬底设置的第一有机层结构、导电层和第二有机层结构；
    所述刚性衬底和所述驱动电路层避开所述弯折区设置；所述第一有机层结构、所述导电层和所述第二有机层结构，至少分布在所述第一周边区、所述弯折区和所述绑定区，所述第一周边区处的所述第一有机层结构位于所述驱动电路层远离所述刚性衬底的一侧。
  2. 根据权利要求1所述的显示面板，其特征在于，所述显示面板还包括设置在所述第一有机层结构与所述导电层之间的第一无机层结构；
    所述第一无机层结构包括至少一层无机层，且所述第一无机层结构至少分布在所述第一周边区、所述弯折区和所述绑定区。
  3. 根据权利要求2所述的显示面板，其特征在于，所述边框区还包括第二周边区、第三周边区和第四周边区，所述第一周边区与所述第三周边区位于所述显示区相对的两侧，所述第二周边区和所述第四周边区均位于所述第一周边区与所述第三周边区之间，且所述第二周边区与所述第四周边区也位于所述显示区相对的两侧；
    所述第一有机层结构和所述第一无机层结构还分布在所述显示区、所述第二周边区、所述第三周边区和所述第四周边区。
  4. 根据权利要求2所述的显示面板，其特征在于，所述导电层包括多条连接引线，所述连接引线的一端通过贯穿所述第一无机层结构和所述第一有机层结构的第一过孔，与所述驱动电路层中的信号线连接，所述连接引线的另一端还通过贯穿所述第二有机层结构的第二过孔，与设置在所述绑定区的驱动芯片连接。
  5. 根据权利要求4所述的显示面板，其特征在于，所述显示面板为LCD显示面板，所述导电层和所述第二有机层结构避开所述显示区设置；
    所述信号线还延伸至所述第一周边区，所述第一过孔位于所述第一周边区内。
  6. 根据权利要求4所述的显示面板，其特征在于，所述显示面板为OLED显示面板，所述导电层和所述第二有机层结构还分布在所述显示区；
    所述信号线还延伸至所述第一周边区，所述第一过孔位于所述第一周边区内；或者，所述第一过孔位于所述显示区内。
  7. 根据权利要求5或6所述的显示面板，其特征在于，所述边框区还包括第二周边区、第三周边区和第四周边区，所述第一周边区与所述第三周边区位于所述显示区相对的两侧，所述第二周边区和所述第四周边区均位于所述第一周边区与所述第三周边区之间，且所述第二周边区与所述第四周边区也位于所述显示区相对的两侧；
    所述导电层和所述第二有机层结构还分布在所述第二周边区、所述第三周边区和所述第四周边区。
  8. 根据权利要求1所述的显示面板，其特征在于，所述第一有机层结构和所述第 二有机层结构均包括至少一层有机层。
  9. 根据权利要求8所述的显示面板，其特征在于，所述第一有机层结构包括多层有机层，所述显示面板还包括设置在相邻两层有机层之间的第二无机层结构；
    所述第二无机层结构包括至少一层无机层，且所述第二无机层结构至少分布在所述第一周边区、所述弯折区和所述绑定区。
  10. 根据权利要求6所述的显示面板，其特征在于，所述显示面板还包括：
    阳极层，所述阳极层分布在所述显示区，且位于所述第二有机层结构远离所述刚性衬底的一侧；
    像素界定层，所述像素界定层至少分布在所述显示区、所述第一周边区、所述弯折区和所述绑定区，且所述像素界定层位于所述第二有机层结构远离所述第一有机层结构的一侧。
  11. 根据权利要求1所述的显示面板，其特征在于，所述显示面板还包括粘接层，所述粘接层位于所述绑定区处的刚性衬底与所述显示区处的刚性衬底之间。
  12. 一种显示面板的制作方法，其特征在于，包括：
    提供一刚性衬底；所述刚性衬底被划分为显示区和围绕所述显示区的边框区，所述边框区包括第一周边区、弯折区和绑定区，所述第一周边区、所述弯折区和所述绑定区依次远离所述显示区设置；
    在所述刚性衬底上形成驱动电路层；
    在所述驱动电路层上依次形成第一有机层结构、导电层和第二有机层结构；所述第一有机层结构、所述导电层和所述第二有机层结构，至少分布在所述第一周边区、所述弯折区和所述绑定区；
    将所述弯折区处的所述刚性衬底和所述驱动电路层剥离；
    将所述弯折区朝向所述显示面板的背光侧弯折，使得所述绑定区弯折至所述显示面板的背光侧。
  13. 根据权利要求12所述的方法，其特征在于，所述将所述弯折区处的所述刚性衬底和所述驱动电路层剥离，包括：
    采用遮光治具对所述刚性衬底远离所述驱动电路层的一侧进行激光照射，以将所述弯折区处的所述刚性衬底和所述驱动电路层剥离；
    其中，所述遮光治具包括遮光区和透光区，所述透光区与所述弯折区对应设置，所述遮光区与所述弯折区以外的区域对应设置。
  14. 根据权利要求12所述的方法，其特征在于，在所述将所述弯折区朝向所述显示面板的背光侧弯折之前，还包括：
    在所述显示区处的所述刚性衬底远离所述第一有机层结构一侧的表面上，和/或，所述绑定区处的所述刚性衬底远离所述第一有机层结构一侧的表面上设置粘接层；
    在所述将所述弯折区朝向所述显示面板的背光侧弯折之后，还包括：
    将所述绑定区处的刚性衬底与所述显示区处的刚性衬底通过所述粘接层粘接。
  15. 一种终端设备，其特征在于，包括驱动芯片以及如权利要求1至11中任一项所述的显示面板；
    所述驱动芯片位于所述显示面板的绑定区，且所述驱动芯片通过贯穿所述显示面 板中的第二有机层结构的第二过孔，与所述显示面板中的连接引线连接。
  16. 一种显示面板，其特征在于，所述显示面板具有显示区和围绕所述显示区的边框区，所述边框区包括第一周边区、弯折区和绑定区，所述第一周边区、所述弯折区和所述绑定区依次远离所述显示区设置，所述绑定区通过所述弯折区弯折至所述显示面板的背光侧；
    所述显示面板包括：刚性衬底、设置在所述刚性衬底上的驱动电路层，以及依次远离所述刚性衬底设置的第一有机层结构、导电层和第二有机层结构；
    所述刚性衬底和所述驱动电路层避开所述弯折区设置；所述第一有机层结构、所述导电层和所述第二有机层结构，至少分布在所述第一周边区、所述弯折区和所述绑定区，所述第一周边区处的所述第一有机层结构位于所述驱动电路层远离所述刚性衬底的一侧；
    所述显示面板还包括设置在所述第一有机层结构与所述导电层之间的第一无机层结构；
    所述第一无机层结构包括至少一层无机层，且所述第一无机层结构至少分布在所述第一周边区、所述弯折区和所述绑定区；所述无机层的材料为氮化硅或氧化硅。
  17. 根据权利要求16所述的显示面板，其特征在于，所述边框区还包括第二周边区、第三周边区和第四周边区，所述第一周边区与所述第三周边区位于所述显示区相对的两侧，所述第二周边区和所述第四周边区均位于所述第一周边区与所述第三周边区之间，且所述第二周边区与所述第四周边区也位于所述显示区相对的两侧；
    所述第一有机层结构和所述第一无机层结构还分布在所述显示区、所述第二周边区、所述第三周边区和所述第四周边区。
  18. 根据权利要求16所述的显示面板，其特征在于，所述导电层包括多条连接引线，所述连接引线的一端通过贯穿所述第一无机层结构和所述第一有机层结构的第一过孔，与所述驱动电路层中的信号线连接，所述连接引线的另一端还通过贯穿所述第二有机层结构的第二过孔，与设置在所述绑定区的驱动芯片连接。
  19. 根据权利要求18所述的显示面板，其特征在于，所述显示面板为LCD显示面板，所述导电层和所述第二有机层结构避开所述显示区设置；
    所述信号线还延伸至所述第一周边区，所述第一过孔位于所述第一周边区内。
  20. 根据权利要求18所述的显示面板，其特征在于，所述显示面板为OLED显示面板，所述导电层和所述第二有机层结构还分布在所述显示区；
    所述信号线还延伸至所述第一周边区，所述第一过孔位于所述第一周边区内；或者，所述第一过孔位于所述显示区内。
  21. 根据权利要求19或20所述的显示面板，其特征在于，所述边框区还包括第二周边区、第三周边区和第四周边区，所述第一周边区与所述第三周边区位于所述显示区相对的两侧，所述第二周边区和所述第四周边区均位于所述第一周边区与所述第三周边区之间，且所述第二周边区与所述第四周边区也位于所述显示区相对的两侧；
    所述导电层和所述第二有机层结构还分布在所述第二周边区、所述第三周边区和所述第四周边区。
  22. 根据权利要求16所述的显示面板，其特征在于，所述第一有机层结构和所述 第二有机层结构均包括至少一层有机层。
  23. 根据权利要求22所述的显示面板，其特征在于，所述第一有机层结构包括多层有机层，所述显示面板还包括设置在相邻两层有机层之间的第二无机层结构；
    所述第二无机层结构包括至少一层无机层，且所述第二无机层结构至少分布在所述第一周边区、所述弯折区和所述绑定区。
  24. 根据权利要求20所述的显示面板，其特征在于，所述显示面板还包括：
    阳极层，所述阳极层分布在所述显示区，且位于所述第二有机层结构远离所述刚性衬底的一侧；
    像素界定层，所述像素界定层至少分布在所述显示区、所述第一周边区、所述弯折区和所述绑定区，且所述像素界定层位于所述第二有机层结构远离所述第一有机层结构的一侧。
  25. 根据权利要求16所述的显示面板，其特征在于，所述显示面板还包括粘接层，所述粘接层位于所述绑定区处的刚性衬底与所述显示区处的刚性衬底之间。
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