WO2023050473A1 - 显示面板及显示装置 - Google Patents
显示面板及显示装置 Download PDFInfo
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- WO2023050473A1 WO2023050473A1 PCT/CN2021/123351 CN2021123351W WO2023050473A1 WO 2023050473 A1 WO2023050473 A1 WO 2023050473A1 CN 2021123351 W CN2021123351 W CN 2021123351W WO 2023050473 A1 WO2023050473 A1 WO 2023050473A1
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- WIPO (PCT)
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- sub
- conductive glue
- display panel
- thickness
- Prior art date
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- 239000003292 glue Substances 0.000 claims abstract description 97
- 230000007423 decrease Effects 0.000 claims description 44
- 238000013459 approach Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 57
- 238000010586 diagram Methods 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 26
- 230000001070 adhesive effect Effects 0.000 description 26
- 239000000758 substrate Substances 0.000 description 9
- 230000007547 defect Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Definitions
- the present application relates to the field of display technology, in particular to a display panel and a display device.
- the driver chip is designed to improve the ultra-narrow lower border of the display panel, specifically, it will be used to transmit display signals
- the drive terminal of the chip is placed on one side of the driver chip, while no drive terminal is placed in other areas.
- the uneven distribution of the drive terminals on the drive chip with this design will lead to unbalanced support of the drive chip.
- the drive chip is bound to the display panel, there will be a "seesaw” effect, and some drive terminals will be lifted.
- the conductive particles between the drive terminal and the display panel are shallow, and the drive terminal cannot be bound to the pad of the display panel, which leads to a decrease in the performance of the display panel, or even malfunctions.
- the embodiment of the present application provides a display panel and a display device to solve the "seesaw" effect that occurs when the driver chip in the existing display panel is bound to the display panel, causing some of the drive terminals to be lifted and unable to be bound to the display panel. Display technical problems on the panel.
- the present application provides a display panel, including a display area and a binding area, the binding area is located on one side of the display area, and the binding area is provided with a plurality of bonding pads, a driver chip and the The conductive glue electrically connected to the driver chip and the plurality of bonding pads, the conductive glue is anisotropic conductive glue;
- the drive chip includes a first area close to the display area and a second area far away from the display area, the second area is provided with a plurality of drive terminals, the drive terminals and the corresponding bonding pads One-to-one electrical connection through the conductive glue;
- the thickness of at least part of the conductive glue corresponding to the first region is greater than the thickness of the conductive glue corresponding to the second region.
- the driving chip includes a first side close to the display area, and the first area corresponding to at least part of the conductive glue includes a blank area, and a portion corresponding to the blank area
- the thickness of the conductive glue gradually decreases along a direction from approaching the first side to being away from the first side.
- the thickness of the conductive glue corresponding to the blank area decreases stepwise from close to the first side to away from the first side, and/or, corresponding to the The thickness of the conductive glue in the blank area decreases gradually along the direction from close to the first side to away from the first side.
- the blank area is the entire first area.
- the plurality of driving terminals located in the second area are arranged in at least two rows, and the distance between each of the driving terminals located in the same row and the first side is equal.
- the second area includes a first sub-area, a second sub-area and a third sub-area sequentially arranged along the direction of the first side;
- the distance between each of the driving terminals in the same row in the second sub-area and the first side is equal; along the direction in which the first sub-area approaches the second sub-area, the The distance between each of the drive terminals in the same row in the first sub-area and the first side gradually decreases, and the distance between each of the drive terminals in the same row in the third sub-area and the first side The distance between the sides gradually increases.
- the present application provides a display panel, including a display area and a binding area, the binding area is located on one side of the display area, and the binding area is provided with a plurality of bonding pads, a driver chip and the The conductive glue electrically connecting the driving chip and the plurality of bonding pads;
- the drive chip includes a first area close to the display area and a second area far away from the display area, the second area is provided with a plurality of drive terminals, the drive terminals and the corresponding bonding pads One-to-one electrical connection through the conductive glue;
- the thickness of at least part of the conductive glue corresponding to the first region is greater than the thickness of the conductive glue corresponding to the second region.
- the driving chip includes a first side close to the display area, and the first area corresponding to at least part of the conductive glue includes a blank area, and a portion corresponding to the blank area
- the thickness of the conductive glue gradually decreases along a direction from approaching the first side to being away from the first side.
- the thickness of the conductive glue corresponding to the blank area decreases stepwise from close to the first side to away from the first side, and/or, corresponding to the The thickness of the conductive glue in the blank area decreases gradually along the direction from close to the first side to away from the first side.
- the blank area is the entire first area.
- the plurality of driving terminals located in the second area are arranged in at least two rows, and the distance between each of the driving terminals located in the same row and the first side is equal.
- the second area includes a first sub-area, a second sub-area and a third sub-area sequentially arranged along the direction of the first side;
- the distance between each of the driving terminals in the same row in the second sub-area and the first side is equal; along the direction in which the first sub-area approaches the second sub-area, the The distance between each of the drive terminals in the same row in the first sub-area and the first side gradually decreases, and the distance between each of the drive terminals in the same row in the third sub-area and the first side The distance between the sides gradually increases.
- the first area includes a dummy terminal area, and the dummy terminal area is provided with a plurality of dummy terminals;
- the blank area includes a first blank area and a second blank area, and the first blank area area, the dummy terminal area and the second blank area are arranged in sequence along the first side;
- the thickness of the conductive glue corresponding to the first blank area decreases gradually along the direction from close to the first edge to away from the first edge
- the thickness of the conductive glue corresponding to the second blank area The thickness gradually decreases along the direction from approaching the first side to away from the first side.
- the thickness of the conductive glue corresponding to the first blank area gradually decreases along the direction from close to the dummy terminal area to away from the dummy terminal area; corresponding to the second blank area
- the thickness of the conductive glue decreases gradually along the direction from close to the dummy terminal area to away from the dummy terminal area.
- the plurality of driving terminals located in the second area are arranged in at least two rows, and the distance between each of the driving terminals located in the same row and the first side is equal.
- the second area includes a first sub-area, a second sub-area and a third sub-area arranged in sequence along the direction of the first side, and the same sub-areas located in the second sub-area
- the distance between each of the driving terminals in the row and the first side is equal; along the direction in which the first sub-area approaches the second sub-area, each of the driving terminals in the same row in the first sub-area
- the distance between the drive terminals and the first side gradually decreases; along the direction that the third sub-area approaches the second sub-area, each of the drive terminals in the same row in the third sub-area The distance between the terminal and the first side decreases gradually.
- each row of the driving terminals located in the second sub-area corresponds to at least two rows of the driving terminals located in the first sub-area and the third sub-area.
- a thickness difference between at least part of the conductive glue in the first region and the conductive glue in the second region is greater than or equal to 0.1 micron.
- the display panel further includes a flexible circuit board disposed in the binding area, the flexible circuit board includes a main body section and a connection section, and the main body section is located on the drive chip.
- the connection section is located on two opposite sides of the driving chip.
- the present application provides a display device, including the above-mentioned display panel, the display panel includes a display area and a binding area, the binding area is located on one side of the display area, and the binding area is provided with a plurality of binding Pads, driver chips and conductive glue electrically connected to the driver chip and a plurality of bonding pads;
- the drive chip includes a first area close to the display area and a second area far away from the display area, the second area is provided with a plurality of drive terminals, the drive terminals and the corresponding bonding pads One-to-one electrical connection through the conductive glue;
- the thickness of at least part of the conductive glue corresponding to the first region is greater than the thickness of the conductive glue corresponding to the second region.
- the display panel and the display device provided by the application includes a plurality of binding pads arranged in the binding area, the conductive glue electrically connecting the driving chip and the driving chip and the binding pads, the driving The chip includes a first area close to the display area and a second area away from the display area.
- a plurality of driving terminals are arranged in the second area, and the driving terminals and corresponding bonding pads are electrically connected one by one through conductive glue.
- the thickness of at least part of the conductive adhesive in the first area is set to be greater than the thickness of the corresponding conductive adhesive in the second area to compensate for the height difference caused by the warping of the drive terminals on the drive chip when the drive chip is bound, so as to ensure that the drive chip can be bonded well. Set it on the display panel to avoid shallow leading phenomenon.
- FIG. 1A is a schematic plan view of a display panel provided by an embodiment of the present application.
- FIG. 1B is a schematic cross-sectional view of the display panel along A-A in FIG. 1A;
- FIG. 2A is a schematic diagram of the first planar structure of the driver chip provided by the embodiment of the present application.
- Fig. 2B is a schematic diagram of the thickness region of the conductive adhesive corresponding to the driver chip in Fig. 2A;
- FIG. 3A is a schematic diagram of a second planar structure of the driver chip provided by the embodiment of the present application.
- Fig. 3B is a schematic diagram of the thickness region of the conductive adhesive corresponding to the driver chip in Fig. 3A;
- FIG. 4A is a schematic diagram of a third planar structure of the driver chip provided by the embodiment of the present application.
- Fig. 4B is a schematic diagram of the thickness region of the conductive adhesive corresponding to the driver chip in Fig. 4A;
- FIG. 5A is a schematic diagram of a fourth planar structure of the driver chip provided by the embodiment of the present application.
- Fig. 5B is a schematic diagram of the thickness region of the conductive adhesive corresponding to the driver chip in Fig. 5A;
- FIG. 6A is a schematic diagram of a fifth planar structure of the driver chip provided by the embodiment of the present application.
- Fig. 6B is a schematic diagram of the thickness region of the conductive adhesive corresponding to the driver chip in Fig. 6A;
- FIG. 7A is a schematic diagram of a sixth planar structure of the driver chip provided by the embodiment of the present application.
- Fig. 7B is a schematic diagram of the thickness region of the conductive adhesive corresponding to the driver chip in Fig. 7A;
- FIG. 8 is a schematic plan view of another display panel provided by an embodiment of the present application.
- FIG. 9 is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present application.
- 100a display area; 100b, binding area; 101, binding pad; 1001b, first binding area; 1002b, second binding area; 102, substrate; 103, driving circuit layer; 1031, semiconductor layer; 1032 , gate insulating layer; 1033, gate layer; 1034, interlayer dielectric layer; 1035, source-drain metal layer; 104, planarization layer; 1041, first flat portion; 1042, second flat portion; 105, second A transparent electrode layer; 106, a second transparent electrode layer; 107, a light-shielding layer; 108, a buffer layer; 109, an insulating layer;
- 201 the first side; 202, the second side; 203, the third side; 204, the fourth side; 210, the first area; 211, the blank area; 2111, the first blank area; 2112, the second blank area; 212 , virtual terminal area; 2121, virtual terminal; 220, second area; 221, drive terminal; 2201, first sub-area; 2202, second sub-area; 2203, third sub-area;
- Figure 1A is a schematic plan view of a display panel provided by an embodiment of the present application;
- the embodiment of the present application provides a display panel.
- the display panel 100 includes a display area 100a and a binding area 100b.
- the binding area 100b is located on one side of the display area 100a.
- a bonding pad 101, a driving chip 200, and a conductive glue 300 electrically connected to the driving chip 200 and a plurality of bonding pads 101.
- the driving chip 200 is disposed in the binding area 100b in a COG manner, the driving chip 200 includes a first area 210 close to the display area 100a and a second area 220 far away from the display area 100a, the first The second area 220 is provided with a plurality of drive terminals 221, and the drive terminals 221 are electrically connected to the corresponding bonding pads 101 through the conductive glue 300, so that the signals in the drive chip 200 are transmitted to the The display area 100a.
- the conductive adhesive 300 is an anisotropic conductive adhesive, and a plurality of conductive particles 301 are distributed in the conductive adhesive 300. Make an electrical connection.
- the driver chip 200 is not provided with any terminal in the region.
- the uneven distribution of the supporting force received by the driver chip 200 and other regions causes the unbalanced support of the driver chip 200.
- the end of the driver chip 200 near the region where no terminals are provided is inclined to the side close to the display panel 100.
- the driver chip 200 The end of the chip 200 away from the region not provided with any terminal is tilted toward the side away from the display panel 100 , thus causing the drive terminal 221 at the end of the driver chip 200 away from the region not provided with any terminal to be lifted.
- the driving terminals 221 and the bonding pads 101 cannot squeeze the conductive particles 301 in the conductive adhesive 300 to deform them, so that the driving terminals 221 cannot be connected to the corresponding bonding pads.
- the fixed pad 101 is electrically connected, thereby causing a part of the driving terminals 221 to be shallowed.
- the present application makes the thickness of at least part of the conductive glue 300 corresponding to the first region 210 greater than the thickness of the conductive glue 300 corresponding to the second region 220, and the thickness difference between the two is used After compensating for the height difference caused by the warping of the driving terminal 221 on the driving chip 200 , so that the driving chip 200 is bonded to the display panel 100 , at least part of the conductive parts corresponding to the first region 210
- the thickness of the glue 300 is larger than the thickness of the conductive glue 300 corresponding to the second region 220, so that the conductive particles between the driving terminal 221 and the corresponding bonding pad 101 can 301 can be squeezed to produce deformation, thereby ensuring that the driving chip 200 and the corresponding bonding pad 101 can be connected, and the driving chip 200 can be normally bound to the display panel 100 to avoid the occurrence of the conductive Particle 301 guide shallow phenomenon.
- the thickness difference between at least part of the conductive glue 300 corresponding to the first region 210 and the conductive glue 300 corresponding to the second region 220 is greater than or equal to 0.1 micron.
- the thickness of the conductive adhesive 300 should be adjusted appropriately. Fluidity, for example, replace the constituent material components of the conductive adhesive 300 with materials with poor fluidity, or add material components with poor fluidity to the constituent material components of the conductive adhesive 300, so that the conductive adhesive The fluidity of 300 becomes worse.
- FIG. 2A is a schematic diagram of the first planar structure of the driving chip provided by the embodiment of the present application;
- the first area 210 corresponding to the glue 300 includes a blank area 211.
- the blank area 211 is an area on the driver chip 200 that is not provided with any of the terminals. As a result, the portion of the driving terminals 221 disposed on the second region 220 is likely to be lifted.
- the driving chip 200 further includes a second side 202, a third side 203 and a fourth side 204, the first side 201 and the second side 202 are arranged oppositely, and the third side 203 is set opposite to the fourth side 204, the third side 203 is respectively connected to the first side 201 and the second side 202, and the fourth side 204 is respectively connected to the first side 201 and the The second edge 202 is connected.
- the thickness of the conductive glue 300 corresponding to the blank area 211 gradually decreases along the direction from close to the first side 201 to away from the first side 201 , because To the direction away from the first side 201, the degree of tilting of the driver chip 200 gradually increases.
- the thickness of the conductive glue 300 corresponding to the blank area 211 approach the first side along the 201 to the direction away from the first side 201 adopts a decreasing design to adapt to different degrees of warping.
- the embodiment of the present application does not impose any restrictions on the thickness variation of the conductive adhesive 300 , and it is only necessary to make targeted adjustments according to the tilting situation of the driving chip 200 .
- the thickness of the conductive glue 300 corresponding to the blank area 211 decreases stepwise along the direction from close to the first side 201 to away from the first side 201
- the thickness of the conductive glue 300 corresponding to the blank area 211 gradually decreases along the direction from close to the first side 201 to away from the first side 201
- the thickness of the conductive glue 300 corresponding to the blank area 211 decreases linearly along the direction from close to the first side 201 to away from the first side 201; as another example, in one embodiment
- the thickness of the conductive glue 300 corresponding to the blank area 211 may be reduced in steps or gradually in a direction from close to the first side 201 to away from the first side 201 .
- FIG. 3A is the second planar structure of the driving chip provided by the embodiment of the present application Schematic diagram
- FIG. 3B is a schematic diagram of the thickness area of the conductive adhesive corresponding to the driver chip in FIG. 3A.
- the blank area 211 is the entire first area 210, since the first area 210 is all the blank area 211, no driver is set in the first area 210. Terminals 221 and virtual terminals for support, therefore, all driving terminals 221 in the second area 220 will be lifted, the present application makes the thickness of the conductive glue 300 corresponding to the blank area 211 along the The direction from close to the first side 201 to away from the first side 201 gradually decreases, so as to overcome the defect that the driving terminal 221 is raised.
- the blank area 211 is the entire first area 210, and the plurality of driving terminals 221 located in the second area 220 are arranged in at least two rows, Each row of the driving terminals 221 is arranged side by side in a straight line along the direction of the first side 201 , and the distance between each of the driving terminals 221 in the same row and the first side 201 is equal.
- the row of drive terminals 221 arranged close to the first side 201 is closer to the middle position of the driver chip 200 than the row of drive terminals 221 arranged away from the first side 201
- the row of drive terminals 221 disposed away from the first side 201 is close to the edge position of the drive chip 200, and the row of drive terminals 221 disposed away from the first side 201 is prone to warping. Therefore, In the present application, the thickness of the conductive glue 300 corresponding to the first region 210 gradually decreases along the direction from close to the first side 201 to away from the first side 201 to overcome the generation of the driving terminal 221. Lifting defect.
- the second region 220 includes a first subregion 2201 , a second subregion 2202 and a third subregion arranged in sequence along the direction of the first side 201 2203; wherein, the distance between each of the drive terminals 221 located in the same row in the second sub-region 2202 and the first side 201 is equal; along the first sub-region 2201 close to the second sub-region In the direction of the area 2202, the distance between each of the driving terminals 221 in the same row in the first sub-area 2201 and the first side 201 gradually decreases, and the distance between the driving terminals 221 in the same row in the third sub-area 2203 The distance between each driving terminal 221 of the row and the first side 201 gradually increases.
- the first sub-area 2201 and the third sub-area 2203 are located at both ends of the second sub-area 2202, and the plurality of driving terminals 221 located in the first sub-area 2201 are arranged downwards. sunken arrangement, the plurality of drive terminals 221 located in the third sub-area 2203 are arranged in a sunken form, and the plurality of drive terminals 221 located in the second sub-area 2202 are arranged along the side of the first side 201
- the directions are arranged side by side in a straight line, such an arrangement makes when the driving chip 200 is bound on the display panel 100 by COG, the multiple bonding pads 101 of the display panel 100 are also arranged in a sinking manner at both ends. , so that the bending area of the fan-out line can be set in the binding area 100b, thereby reducing the width of the frame where the fan-out area of the display panel 100 is located, and realizing narrow frame.
- the present application uses the corresponding The thickness of the conductive glue 300 gradually decreases along the direction from close to the first side 201 to away from the first side 201 , so as to overcome the defect that the driving terminals 221 are raised.
- Figure 4A is a schematic diagram of the third planar structure of the driver chip provided by the embodiment of the present application;
- Figure 4B is the same as Figure 4B 4A is a schematic diagram of the thickness area of the conductive adhesive corresponding to the driver chip;
- FIG. 5A is a schematic diagram of the fourth planar structure of the driver chip provided by the embodiment of the present application;
- FIG. 5B is a thickness area of the conductive adhesive corresponding to the driver chip in FIG.
- FIG. 5A Schematic diagram
- Figure 6A is a schematic diagram of the fifth planar structure of the driver chip provided by the embodiment of the application
- Figure 6B is a schematic diagram of the thickness area of the conductive glue corresponding to the driver chip in Figure 6A
- Figure 7A is a schematic diagram of the driver chip provided by the embodiment of the application
- FIG. 7B is a schematic diagram of the thickness area of the conductive adhesive corresponding to the driving chip in FIG. 7A.
- FIGS. 2A-2B and 3A-3B are different from FIGS. 2A-2B and 3A-3B in that the first region 210 includes A virtual terminal area 212, the virtual terminal area 212 is provided with a plurality of virtual terminals 2121, that is to say, the blank area 211 is part of the first area 210, and the blank area 211 is located in the first area 210 two ends and close to the third side 203 and the fourth side 204 are set.
- the blank area 211 includes a first blank area 2111 and a second blank area 2112
- the dummy terminal area 212 is located between the first blank area 2111 and the second blank area 2112 .
- the driving terminals 221 can transmit electrical signals, while the dummy terminals 2121 are only used for supporting and will not transmit electrical signals.
- the dummy terminals 2121 are connected to the dummy pads on the display panel 100 in one-to-one correspondence, so that the dummy terminals corresponding to the dummy terminal area 212
- the driving terminals 221 in the second area 220 are connected to the binding pads 101 on the display panel 100 in one-to-one correspondence without lifting, and because the first blank area 2111 and the second
- the dummy terminal 2121 is not provided in the second blank area 2112, and the driving terminal 221 in the second area 220 corresponding to the first blank area 2111 and the second blank area 2112 cannot be connected to the
- the bonding pads 101 on the display panel 100 are connected in a one-to-one correspondence to lift up.
- the thickness of the conductive adhesive 300 corresponding to the first blank area 2111 gradually decreases along the direction from close to the first side 201 to away from the first side 201, corresponding to the first blank area 2111.
- the thickness of the conductive glue 300 in the second blank area 2112 gradually decreases along the direction from close to the first side 201 to away from the first side 201, so as to overcome the connection between the first blank area 2111 and the second
- the driving terminal 221 in the second area 220 corresponding to the blank area 2112 has a raised defect.
- the application adopts the distance difference design of the driving terminals 221 in the horizontal arrangement direction, so that the thickness of the conductive glue 300 corresponding to the first blank area 2111 is along the distance from the dummy terminal area 212
- the direction away from the dummy terminal area 212 gradually decreases; the thickness of the conductive glue 300 corresponding to the second blank area 2112 gradually decreases along the direction from close to the dummy terminal area 212 to away from the dummy terminal area 212. reduced to overcome the above drawbacks.
- the plurality of driving terminals 221 located in the second area 220 are arranged in at least two rows, and the second area 220 includes first sub-areas 2201, The second sub-area 2202 and the third sub-area 2203, the dummy terminal area 212 is set corresponding to the second sub-area 2202, the first blank area 2111 is set corresponding to the first sub-area 2201, the first blank area 2111 is set corresponding to the first sub-area 2201, and the second Two blank areas 2112 are set corresponding to the third sub-area 2203 .
- the distances between the driving terminals 221 in the same row and the first side 201 are equal. It can be understood that, for the plurality of drive terminals 221 located in the first sub-area 2201 and the third sub-area 2203, a row of the drive terminals 221 disposed close to the first side 201 is compared with The row of drive terminals 221 set away from the first side 201 is close to the middle position of the drive chip 200 , and the row of drive terminals 221 set away from the first side 201 is close to the drive chip 200 edge position, the row of driving terminals 221 disposed far away from the first side 201 is prone to warping, therefore, the present application uses the thickness of the conductive adhesive 300 corresponding to the first blank area 2111 along the The direction from the first side 201 to away from the first side 201 gradually decreases, and the thickness of the conductive adhesive 300 corresponding to the second blank area 2112 is from close to the first side 201 to far away from the first
- the distance between each of the driving terminals 221 located in the second sub-region 2202 and the first side 201 is equal; As the area 2201 approaches the second sub-area 2202, the distance between each of the driving terminals 221 in the same row in the first sub-area 2201 and the first side 201 decreases gradually; along the As the third sub-region 2203 approaches the second sub-region 2202 , the distance between each of the driving terminals 221 in the same row in the third sub-region 2203 and the first side 201 gradually increases.
- the first sub-area 2201 and the third sub-area 2203 are located at both ends of the second sub-area 2202, and the plurality of driving terminals 221 located in the first sub-area 2201 are sunken arrangement, the plurality of drive terminals 221 located in the third sub-area 2203 are arranged in a sunken manner, and the plurality of drive terminals 221 located in the second sub-area 2202 are arranged along the direction of the first side 201 Arranged side by side in a straight line, such an arrangement makes when the driving chip 200 is bound on the display panel 100 by COG, the multiple bonding pads 101 of the display panel 100 are arranged in a sinking manner at both ends, so that The bending area of the fan-out line can be set in the binding area 100b, thereby reducing the width of the frame where the fan-out area of the display panel 100 is located, and realizing narrow frame.
- the present application uses the corresponding The thickness of the conductive glue 300 gradually decreases along the direction from close to the first side 201 to away from the first side 201 , so as to overcome the defect that the driving terminals 221 are raised.
- each row of the driving terminals 221 located in the second sub-area 2202 is correspondingly located in the first sub-area 2201 and the There are at least two rows of the drive terminals 221 in the third sub-area 2203.
- the fan-out wiring can be close to the third side 203 from the side of the first sub-area 2201 and the drive terminals 221.
- One end of the drive terminal 221 can also be electrically connected to the end of the drive terminal 221 close to the fourth side 204 from the side of the third sub-region 2203, so as to save wiring space and further reduce the size of the display panel 100. the bottom border of the .
- FIG. 8 is a schematic plan view of another display panel provided by the embodiment of the present application; the display panel 100 also includes a flexible circuit board 400 disposed in the binding area 100b, and the flexible circuit board 400 includes a main body section 401 and a connecting section 402 for connecting the driving terminal 221, the main body section 401 is located on the side of the driving chip 200 away from the display area 100a, and the connecting section 402 is located at opposite sides of the driving terminal 221 .
- the binding area includes a first binding area 1001b and a second binding area 1002b, the first binding area 1001b corresponds to the first area 210, and the second binding area 1002b Corresponding to the second region 220, when the driver chip 200 is bound on the display panel 100, the first binding region 1001b is bound and connected to the first region 210, and the second binding Zone 1002b is bound and connected to the second zone 220 .
- the display panel 100 includes a substrate 102, a driving circuit layer 103, a planarization layer 104, a first transparent electrode layer 105 and a second transparent electrode layer 106, the driving circuit layer 103 is located on the substrate 102, and the planarization A layer 104 covers the driving circuit layer 103 and the substrate 102, the planarization layer 104 includes a first flat portion 1041 and a second flat portion 1042, and the first flat portion 1041 is located at the first bonding Region 1001b, the second flat portion 1042 is located in the second binding region 1002b; the first transparent electrode layer 105 is located on the side of the planarization layer 104 away from the substrate 102; the second transparent electrode The layer 106 is located on the side of the first transparent electrode layer 105 away from the substrate 102 ; wherein, the thickness of the second flat portion 1042 is greater than the thickness of the first flat portion 1041 .
- the first flat part 1041 located in the first binding area 1001b is removed, which can reduce the thickness of the conductive glue 300 corresponding to the blank area, so that the conductive glue 300 corresponding to the blank area 211 The thickness difference between the conductive glue 300 corresponding to the second region 220 is reduced.
- the thickness of the driving terminal 221 is 9 microns.
- the conductive glue 300 corresponding to the blank area 211 and the conductive glue 300 corresponding to the second area 220 The thickness difference between them should be at least 9 microns; when the first flat part 1041 is partially removed, for example, the thickness difference between the second flat part 1042 and the first flat part 1041 is 2 microns to 3 microns , the thickness difference between the conductive glue 300 corresponding to the blank area 211 and the conductive glue 300 corresponding to the second area 220 can be reduced to 6 microns to 7 microns.
- the driving circuit layer 103 includes a semiconductor layer 1031, a gate insulating layer 1032, a gate layer 1033, an interlayer dielectric layer 1034, and a source-drain metal layer 1035, and the semiconductor layer 1031 is disposed on the substrate 102 , the gate insulating layer 1032 covers the semiconductor layer 1031, the gate layer 1033 is disposed on the gate insulating layer 1032, and the interlayer dielectric layer 1034 covers the gate layer 1033 , the source-drain metal layer 1035 is disposed on the interlayer dielectric layer 1034 , and the planarization layer 104 covers the source-drain metal layer 1035 .
- a light-shielding layer 107 and a buffer layer 108 are also provided between the substrate 102 and the driving circuit layer 103, the light-shielding layer 107 is disposed on the substrate 102, and the buffer layer 108 covers the light-shielding layer 108. on layer 107.
- the first transparent electrode layer 105 is a pixel electrode, and the second transparent electrode layer 106 is a common electrode; or, the first transparent electrode layer 105 is a common electrode, and the second transparent electrode layer 106 is a pixel electrode, so An insulating layer 109 is further disposed between the first transparent electrode layer 105 and the second transparent electrode layer 106 .
- the embodiment of the present application also provides a display device, the display device includes the above-mentioned display panel 100, and the display device can be any device with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc. products or components.
- a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc. products or components.
- the display panel and the display device provided by the embodiment of the present application
- the display panel includes a plurality of binding pads arranged in the binding area, the conductive glue electrically connecting the driving chip with the driving chip and the binding pads, and the driving chip It includes a first area close to the display area and a second area away from the display area.
- a plurality of driving terminals are arranged in the second area, and the driving terminals and corresponding bonding pads are electrically connected one by one through conductive glue.
- the thickness of at least part of the conductive glue in the region is set to be greater than the thickness of the conductive glue corresponding to the second region, so as to compensate for the height difference caused by the warpage of the drive terminal on the driver chip when the driver chip is bound, so as to ensure that the driver chip can be well bonded On the display panel, avoid shallow guide phenomenon.
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Abstract
一种显示面板（100）及显示装置，显示面板（100）的绑定区（100b）设置有多个绑定焊盘（101）、驱动芯片（200）和导电胶（300），驱动芯片（200）包括第一区（210）和第二区（220），第二区（220）设置有多个驱动端子（221），驱动端子（221）和绑定焊盘（101）通过导电胶（300）一一对应电连接，通过将第一区（210）的至少部分导电胶（300）的厚度设置为大于第二区（220）的导电胶（300）的厚度，以补偿驱动端子（221）翘曲导致的高度差，避免导浅现象。
Description
本申请涉及显示技术领域，尤其涉及一种显示面板及显示装置。
为改善COG（chip on glass，芯片被直接绑定在玻璃上）显示面板下边框较大的弊端，对驱动芯片进行改进设计以实现显示面板超级窄下边框，具体为，将用于传输显示信号的驱动端子放在驱动芯片的一侧，而其他区域未放置驱动端子。然而，采用此种设计的驱动芯片上的驱动端子分布不均，会导致驱动芯片支撑失衡，当驱动芯片绑定在显示面板上时，会出现“跷跷板”效应，部分驱动端子出现翘起，从而导致驱动端子和显示面板之间的导电粒子发生导浅，驱动端子无法绑定于显示面板的焊盘上，进而导致显示面板性能降低，甚至不能正常工作。
本申请实施例提供一种显示面板及显示装置，以解决现有的显示面板中的驱动芯片在与显示面板绑定时会出现“跷跷板”效应，导致部分驱动端子出现翘起而无法绑定于显示面板上的技术问题。
为解决上述问题，本发明提供的技术方案如下：
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，包括显示区和绑定区，所述绑定区位于所述显示区的一侧，所述绑定区设置有多个绑定焊盘、驱动芯片和与所述驱动芯片和多个所述绑定焊盘电连接的导电胶，所述导电胶为各向异性导电胶；
所述驱动芯片包括靠近所述显示区的第一区和远离所述显示区的第二区，所述第二区设置有多个驱动端子，所述驱动端子和对应的所述绑定焊盘通过所述导电胶一一对应电连接；
其中，对应所述第一区的至少部分所述导电胶的厚度大于对应所述第二区的所述导电胶的厚度。
根据本申请提供的显示面板，所述驱动芯片包括靠近所述显示区的第一边，与所述至少部分所述导电胶相对应的所述第一区包括空白区，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小。
根据本申请提供的显示面板，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈阶梯式减小，和/或，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈渐变式减小。
根据本申请提供的显示面板，所述空白区为整个所述第一区。
根据本申请提供的显示面板，位于所述第二区内的多个所述驱动端子呈至少两排排列，位于同一排的各个所述驱动端子与所述第一边之间的距离相等。
根据本申请提供的显示面板，所述第二区包括沿所述第一边的方向依次排列的第一子区、第二子区和第三子区；
其中，位于所述第二子区内的同排的各个所述驱动端子与所述第一边之间的距离相等；沿所述第一子区靠近所述第二子区的方向，位于所述第一子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小，位于所述第三子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐增加。
本申请提供一种显示面板，包括显示区和绑定区，所述绑定区位于所述显示区的一侧，所述绑定区设置有多个绑定焊盘、驱动芯片和与所述驱动芯片和多个所述绑定焊盘电连接的导电胶；
所述驱动芯片包括靠近所述显示区的第一区和远离所述显示区的第二区，所述第二区设置有多个驱动端子，所述驱动端子和对应的所述绑定焊盘通过所述导电胶一一对应电连接；
其中，对应所述第一区的至少部分所述导电胶的厚度大于对应所述第二区的所述导电胶的厚度。
根据本申请提供的显示面板，所述驱动芯片包括靠近所述显示区的第一边，与所述至少部分所述导电胶相对应的所述第一区包括空白区，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小。
根据本申请提供的显示面板，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈阶梯式减小，和/或，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈渐变式减小。
根据本申请提供的显示面板，所述空白区为整个所述第一区。
根据本申请提供的显示面板，位于所述第二区内的多个所述驱动端子呈至少两排排列，位于同一排的各个所述驱动端子与所述第一边之间的距离相等。
根据本申请提供的显示面板，所述第二区包括沿所述第一边的方向依次排列的第一子区、第二子区和第三子区；
其中，位于所述第二子区内的同排的各个所述驱动端子与所述第一边之间的距离相等；沿所述第一子区靠近所述第二子区的方向，位于所述第一子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小，位于所述第三子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐增加。
根据本申请提供的显示面板，所述第一区包括虚拟端子区，所述虚拟端子区设置有多个虚拟端子；所述空白区包括第一空白区和第二空白区，所述第一空白区、所述虚拟端子区和所述第二空白区沿所述第一边依次排列；
其中，对应所述第一空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小，对应所述第二空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小。
根据本申请提供的显示面板，对应所述第一空白区的所述导电胶的厚度沿自靠近所述虚拟端子区至远离所述虚拟端子区的方向逐渐减小；对应所述第二空白区的所述导电胶的厚度沿自靠近所述虚拟端子区至远离所述虚拟端子区的方向逐渐减小。
根据本申请提供的显示面板，位于所述第二区内的多个所述驱动端子呈至少两排排列，位于同一排的各个所述驱动端子与所述第一边之间的距离相等。
根据本申请提供的显示面板，所述第二区包括沿所述第一边的方向依次排列的第一子区、第二子区和第三子区，位于所述第二子区内的同排的各个所述驱动端子与所述第一边之间的距离相等；沿所述第一子区靠近所述第二子区的方向，位于所述第一子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小；沿所述第三子区靠近所述第二子区的方向，位于所述第三子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小。
根据本申请提供的显示面板，位于所述第二子区内的每一排所述驱动端子对应位于所述第一子区及所述第三子区内的至少两排所述驱动端子。
根据本申请提供的显示面板，所述第一区的至少部分所述导电胶与所述第二区的所述导电胶之间的厚度差大于或等于0.1微米。
根据本申请提供的显示面板，所述显示面板还包括设置于所述绑定区的柔性电路板，所述柔性电路板包括主体区段和连接区段，所述主体区段位于所述驱动芯片远离所述显示区的一侧，所述连接区段位于所述驱动芯片的相对两侧。
本申请提供一种显示装置，包括上述显示面板，所述显示面板包括显示区和绑定区，所述绑定区位于所述显示区的一侧，所述绑定区设置有多个绑定焊盘、驱动芯片和与所述驱动芯片和多个所述绑定焊盘电连接的导电胶；
所述驱动芯片包括靠近所述显示区的第一区和远离所述显示区的第二区，所述第二区设置有多个驱动端子，所述驱动端子和对应的所述绑定焊盘通过所述导电胶一一对应电连接；
其中，对应所述第一区的至少部分所述导电胶的厚度大于对应所述第二区的所述导电胶的厚度。
本申请的有益效果为：本申请提供的显示面板及显示装置，显示面板包括设置于绑定区的多个绑定焊盘、驱动芯片与驱动芯片和绑定焊盘电连接的导电胶，驱动芯片包括靠近显示区的第一区和远离显示区的第二区，第二区内设置有多个驱动端子，驱动端子和对应的绑定焊盘通过导电胶一一对应电连接，通过将第一区的至少部分导电胶的厚度设置为大于对应第二区的导电胶的厚度，以补偿绑定驱动芯片时驱动芯片上驱动端子发生翘曲而导致的高度差，保证驱动芯片能良好地绑定于显示面板上，避免产生导浅现象。
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A是本申请实施例提供的一种显示面板的平面结构示意图；
图1B是图1A中的显示面板沿A-A的剖切结构示意图；
图2A是本申请实施例提供的驱动芯片的第一种平面结构示意图；
图2B是与图2A中的驱动芯片对应的导电胶的厚度区域示意图；
图3A是本申请实施例提供的驱动芯片的第二种平面结构示意图；
图3B是与图3A中的驱动芯片对应的导电胶的厚度区域示意图；
图4A是本申请实施例提供的驱动芯片的第三种平面结构示意图；
图4B是与图4A中的驱动芯片对应的导电胶的厚度区域示意图；
图5A是本申请实施例提供的驱动芯片的第四种平面结构示意图；
图5B是与图5A中的驱动芯片对应的导电胶的厚度区域示意图；
图6A是本申请实施例提供的驱动芯片的第五种平面结构示意图；
图6B是与图6A中的驱动芯片对应的导电胶的厚度区域示意图；
图7A是本申请实施例提供的驱动芯片的第六种平面结构示意图；
图7B是与图7A中的驱动芯片对应的导电胶的厚度区域示意图；
图8是本申请实施例提供的另一种显示面板的平面结构示意图；
图9是本申请实施例提供的一种显示面板的截面结构示意图。
附图标记说明：
100、显示面板；200、驱动芯片；300、导电胶；301、导电粒子；400、柔性电路板；
100a、显示区；100b、绑定区；101、绑定焊盘；1001b、第一绑定区；1002b、第二绑定区；102、基板；103、驱动电路层；1031、半导体层；1032、栅极绝缘层；1033、栅极层；1034、层间介质层；1035、源漏极金属层；104、平坦化层；1041、第一平坦部；1042、第二平坦部；105、第一透明电极层；106、第二透明电极层；107、遮光层；108、缓冲层；109、绝缘层；
201、第一边；202、第二边；203、第三边；204、第四边；210、第一区；211、空白区；2111、第一空白区；2112、第二空白区；212、虚拟端子区；2121、虚拟端子；220、第二区；221、驱动端子；2201、第一子区；2202、第二子区；2203、第三子区；
401、主体区段；402、连接区段。
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
请参阅图1A、图1B和图9，图1A是本申请实施例提供的一种显示面板的平面结构示意图；图1B是图1A中的显示面板沿A-A的剖切结构示意图，图9是本申请实施例提供的一种显示面板的截面结构示意图。本申请实施例提供一种显示面板，所述显示面板100包括显示区100a和绑定区100b，所述绑定区100b位于所述显示区100a的一侧，所述绑定区100b设置有多个绑定焊盘101、驱动芯片200以及与所述驱动芯片200和多个所述绑定焊盘101电连接的导电胶300。
所述驱动芯片200以COG方式设置于所述绑定区100b，所述驱动芯片200包括靠近所述显示区100a的第一区210和远离所述显示区100a的第二区220，所述第二区220设置有多个驱动端子221，所述驱动端子221和对应的所述绑定焊盘101通过所述导电胶300一一对应电连接，以使所述驱动芯片200中的信号传递至所述显示区100a。
具体地，所述导电胶300为各向异性导电胶，所述导电胶300内分布有多个导电粒子301，所述驱动端子221和所述绑定焊盘101通过挤压所述导电粒子301实现电连接。
可以理解的是，所述驱动芯片200与所述显示面板100对位后，由于所述第一区210的至少部分区域未设置有任何端子，导致所述驱动芯片200在未设置有端子的区域和其它区域受到的支撑力分布不均而引起所述驱动芯片200支撑失衡，所述驱动芯片200靠近未设置有任何端子的区域的一端向靠近所述显示面板100的一侧倾斜，所述驱动芯片200远离未设置有任何端子的区域的一端向远离所述显示面板100的一侧翘起，从而导致所述驱动芯片200远离未设置有任何端子的区域的一端的所述驱动端子221翘起，所述驱动端子221和所述绑定焊盘101无法对所述导电胶300中的所述导电粒子301造成挤压而使其产生变形，导致所述驱动端子221无法与对应的所述绑定焊盘101进行电连接，进而导致部分所述驱动端子221发生导浅现象。
有鉴于此，本申请通过使对应所述第一区210的至少部分所述导电胶300的厚度大于对应所述第二区220的所述导电胶300的厚度，两者之间的厚度差用于补偿所述驱动芯片200上的所述驱动端子221翘曲导致的高度差，使得所述驱动芯片200与所述显示面板100压合之后，对应所述第一区210的至少部分所述导电胶300的厚度相较于对应所述第二区220的所述导电胶300的厚度较大，从而能够使所述驱动端子221和对应的所述绑定焊盘101之间的所述导电粒子301能够挤压产生变形，进而保证所述驱动芯片200和对应的所述绑定焊盘101能够实现连接，所述驱动芯片200能够正常绑定于所述显示面板100上，避免出现所述导电粒子301导浅现象。
具体地，在本申请实施例中，对应所述第一区210的至少部分所述导电胶300与对应所述第二区220的所述导电胶300之间的厚度差大于或等于0.1微米。
进一步地，为了保证所述导电胶300在对应所述绑定区100b的不同区域具有厚度差，以起到更好的支撑作用，在本申请实施例中，应适当调整所述导电胶300的流动性，例如，将所述导电胶300的组成材料成分替换成流动性较差的材料，或将所述导电胶300的组成材料成分添加流动性较差的材料成分，以使所述导电胶300的流动性变差。
请参阅图2A，图2A是本申请实施例提供的驱动芯片的第一种平面结构示意图；所述驱动芯片200包括靠近所述显示区100a的第一边201，与所述至少部分所述导电胶300相对应的所述第一区210包括空白区211，需要说明的是，所述空白区211即为所述驱动芯片200上未设置有任何所述端子的区域，由于未设置有任何所述端子，导致设置于所述第二区220的部分所述驱动端子221容易发生翘起。
在本申请实施例中，所述驱动芯片200还包括第二边202、第三边203和第四边204，所述第一边201和所述第二边202相对设置，所述第三边203和所述第四边204相对设置，所述第三边203分别与所述第一边201及所述第二边202连接，所述第四边204分别与所述第一边201及所述第二边202连接。
进一步地，对应所述空白区211的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，由于沿自靠近所述第一边201至远离所述第一边201的方向，所述驱动芯片200翘起的程度逐渐增加，本申请通过使对应所述空白区211的所述导电胶300的厚度在沿自靠近所述第一边201至远离所述第一边201的方向上采用递减设计以适应不同的翘曲程度。
需要说明的是，本申请实施例并不对所述导电胶300的厚度变化做任何限制，根据所述驱动芯片200的翘起情况做出针对性调整即可。
具体地，例如，在一种实施例中，对应所述空白区211的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向呈阶梯式减小；再如，在一种实施例中，对应所述空白区211的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向呈渐变式减小，进一步地，对应所述空白区211的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向呈线性减小；又如，在一种实施例中，对应所述空白区211的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向可以呈阶梯式减小和渐变式减小结合的方式。
以下将结合具体实施例对本申请所述驱动端子221在所述驱动芯片200上的位置和排布情况，进行详细描述。
请参阅图2A~图2B、图3A~图3B，图2B是与图2A中的驱动芯片对应的导电胶的厚度区域示意图；图3A是本申请实施例提供的驱动芯片的第二种平面结构示意图；图3B是与图3A中的驱动芯片对应的导电胶的厚度区域示意图。
在一种实施例中，所述空白区211为整个所述第一区210，由于所述第一区210均为所述空白区211，所述第一区210内未设置有任何所述驱动端子221以及用于支撑的虚拟端子，因此，所述第二区220中的所有驱动端子221均会产生翘起，本申请通过使对应所述空白区211的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，以克服所述驱动端子221产生翘起的缺陷。
在一种实施例中，请参阅图2A~2B，所述空白区211为整个所述第一区210，位于所述第二区220内的多个所述驱动端子221呈至少两排排列，每一排所述驱动端子221沿所述第一边201的方向呈直线并排设置，位于同一排的各个所述驱动端子221与所述第一边201之间的距离相等。
可以理解的是，靠近所述第一边201设置的一排所述驱动端子221相较于远离所述第一边201设置的一排所述驱动端子221靠近于所述驱动芯片200的中间位置，远离所述第一边201设置的一排所述驱动端子221靠近所述驱动芯片200的边缘位置，远离所述第一边201设置的一排所述驱动端子221容易发生翘起，因此，本申请通过使对应所述第一区210的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，以克服所述驱动端子221产生翘起的缺陷。
在一种实施例中，请参阅图3A~图3B，所述第二区220包括沿所述第一边201的方向依次排列的第一子区2201、第二子区2202和第三子区2203；其中，位于所述第二子区2202内的同排的各个所述驱动端子221与所述第一边201之间的距离相等；沿所述第一子区2201靠近所述第二子区2202的方向，位于所述第一子区2201内的同排的各个所述驱动端子221与所述第一边201之间的距离逐渐减小，位于所述第三子区2203内的同排的各个所述驱动端子221与所述第一边201之间的距离逐渐增加。
可以理解的是，所述第一子区2201和所述第三子区2203位于所述第二子区2202的两端，位于所述第一子区2201的多个所述驱动端子221呈下沉式排列，位于所述第三子区2203的多个所述驱动端子221呈下沉式排列，位于所述第二子区2202的多个所述驱动端子221沿所述第一边201的方向呈直线并排设置，这样的设置方式使得所述驱动芯片200以COG绑定于所述显示面板100上时，所述显示面板100的多个绑定焊盘101同样呈两端下沉式排列，使得扇出线的弯折区域可设置于所述绑定区100b，进而减小所述显示面板100的扇出区所在的边框的宽度，实现窄边框化。
由于位于所述第二子区2202的多个所述驱动端子221相较于位于所述第一子区2201和所述第三子区2203的多个所述驱动端子221靠近于所述驱动芯片200的中间位置，位于所述第一子区2201和所述第三子区2203的多个所述驱动端子221容易产生翘起，因此，本申请通过对应所述第一子区2201的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，以克服所述驱动端子221产生翘起的缺陷。
请参阅图4A~图4B、图5A~图5B、图6A~图6B和图7A~图7B，图4A是本申请实施例提供的驱动芯片的第三种平面结构示意图；图4B是与图4A中的驱动芯片对应的导电胶的厚度区域示意图；图5A是本申请实施例提供的驱动芯片的第四种平面结构示意图；图5B是与图5A中的驱动芯片对应的导电胶的厚度区域示意图；图6A是本申请实施例提供的驱动芯片的第五种平面结构示意图；图6B是与图6A中的驱动芯片对应的导电胶的厚度区域示意图；图7A是本申请实施例提供的驱动芯片的第六种平面结构示意图；图7B是与图7A中的驱动芯片对应的导电胶的厚度区域示意图。
其中，图4A~图4B、图5A~图5B、图6A~图6B及图7A~图7B与图2A~图2B及图3A~图3B的不同之处在于，所述第一区210包括虚拟端子区212，所述虚拟端子区212设置有多个虚拟端子2121，也就是说，所述空白区211所述第一区210的部分区域，所述空白区211位于所述第一区210的两端且靠近所述第三边203和所述第四边204设置。
具体地，所述空白区211包括第一空白区2111和第二空白区2112，所述虚拟端子区212位于所述第一空白区2111和所述第二空白区2112之间。
可以理解的是，所述驱动端子221均会传输电信号，而所述虚拟端子2121仅用于起到支撑作用，不会传输电信号。当所述驱动芯片200绑定于所述显示面板100上时，所述虚拟端子2121与所述显示面板100上的虚拟焊盘一一对应连接，使得与所述虚拟端子区212对应的所述第二区220内的所述驱动端子221与所述显示面板100上的所述绑定焊盘101一一对应连接而不会发生翘起，而由于所述第一空白区2111和所述第二空白区2112内未设置有所述虚拟端子2121，与所述第一空白区2111和所述第二空白区2112对应的所述第二区220内的所述驱动端子221则无法与所述显示面板100上的所述绑定焊盘101一一对应连接而发生翘起。
本申请实施例则通过使对应所述第一空白区2111的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，对应所述第二空白区2112的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，以克服与所述第一空白区2111和所述第二空白区2112对应的所述第二区220内的所述驱动端子221产生翘起的缺陷。
进一步地，由于在沿自靠近所述虚拟端子区212至远离所述虚拟端子区212的方向上，所述驱动端子221距离所述虚拟端子2121越远，则所述驱动端子221翘起的高度越高，则本申请通过将所述驱动端子221在水平排列方向上采用距离差异化设计，使得对应所述第一空白区2111的所述导电胶300的厚度沿自靠近所述虚拟端子区212至远离所述虚拟端子区212的方向逐渐减小；对应所述第二空白区2112的所述导电胶300的厚度沿自靠近所述虚拟端子区212至远离所述虚拟端子区212的方向逐渐减小，以克服上述缺陷。
具体地，位于所述第二区220内的多个所述驱动端子221呈至少两排排列，所述第二区220包括沿所述第一边201的方向依次排列的第一子区2201、第二子区2202和第三子区2203，所述虚拟端子区212与所述第二子区2202对应设置，所述第一空白区2111与所述第一子区2201对应设置，所述第二空白区2112与所述第三子区2203对应设置。
请参阅图4A~图4B，在一种实施例中，位于同一排的各个所述驱动端子221与所述第一边201之间的距离相等。可以理解的是，对于位于所述第一子区2201和所述第三子区2203中的多个所述驱动端子221，靠近所述第一边201设置的一排所述驱动端子221相较于远离所述第一边201设置的一排所述驱动端子221靠近于所述驱动芯片200的中间位置，远离所述第一边201设置的一排所述驱动端子221靠近所述驱动芯片200的边缘位置，远离所述第一边201设置的一排所述驱动端子221容易发生翘起，因此，本申请通过对应所述第一空白区2111的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，对应所述第二空白区2112的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，以克服位于所述第一子区2201和所述第三子区2203中的所述驱动端子221产生翘起的缺陷。
请参阅图5A~图5B，在一种实施例中，位于所述第二子区2202内的各个所述驱动端子221与所述第一边201之间的距离相等；沿所述第一子区2201靠近所述第二子区2202的方向，位于所述第一子区2201内的同排的各个所述驱动端子221与所述第一边201之间的距离逐渐减小；沿所述第三子区2203靠近所述第二子区2202的方向，位于所述第三子区2203内的同排的各个所述驱动端子221与所述第一边201之间的距离逐渐增加。
同理地，所述第一子区2201和所述第三子区2203位于所述第二子区2202的两端，位于所述第一子区2201的多个所述驱动端子221呈下沉式排列，位于所述第三子区2203的多个所述驱动端子221呈下沉式排列，位于所述第二子区2202的多个所述驱动端子221沿所述第一边201的方向呈直线并排设置，这样的设置方式使得所述驱动芯片200以COG绑定于所述显示面板100上时，所述显示面板100的多个绑定焊盘101呈两端下沉式排列，使得扇出线的弯折区域可设置于所述绑定区100b，进而减小所述显示面板100的扇出区所在的边框的宽度，实现窄边框化。
由于位于所述第二子区2202的多个所述驱动端子221相较于位于所述第一子区2201和所述第三子区2203的多个所述驱动端子221靠近于所述驱动芯片200的中间位置，位于所述第一子区2201和所述第三子区2203的多个所述驱动端子221容易产生翘起，因此，本申请通过对应所述第一子区2201的所述导电胶300的厚度沿自靠近所述第一边201至远离所述第一边201的方向逐渐减小，以克服所述驱动端子221产生翘起的缺陷。
请参阅图6A~图6B和图7A~图7B，在一种实施例中，位于所述第二子区2202内的每一排所述驱动端子221对应位于所述第一子区2201及所述第三子区2203内的至少两排所述驱动端子221，采用此种设置方式，扇出走线可以从所述第一子区2201的侧面与所述驱动端子221靠近所述第三边203的一端电连接，也可以从所述第三子区2203的侧面与所述驱动端子221靠近所述第四边204的一端电连接，以节省布线空间，有利于进一步减小所述显示面板100的下边框。
请参阅图8，图8是本申请实施例提供的另一种显示面板的平面结构示意图；所述显示面板100还包括设置于所述绑定区100b的柔性电路板400，所述柔性电路板400包括主体区段401和用于连接所述驱动端子221的连接区段402，所述主体区段401位于所述驱动芯片200远离所述显示区100a的一侧，所述连接区段402位于所述驱动端子221的相对两侧。
请继续参阅图9，所述绑定区包括第一绑定区1001b和第二绑定区1002b，所述第一绑定区1001b对应所述第一区210，所述第二绑定区1002b对应所述第二区220，当所述驱动芯片200绑定于所述显示面板100上时，所述第一绑定区1001b与所述第一区210绑定连接，所述第二绑定区1002b与所述第二区220绑定连接。
现对所述显示面板100的膜层结构进行阐述说明。
所述显示面板100包括基板102、驱动电路层103、平坦化层104、第一透明电极层105和第二透明电极层106，所述驱动电路层103位于所述基板102上，所述平坦化层104覆于所述驱动电路层103和所述基板102上，所述平坦化层104包括第一平坦部1041和第二平坦部1042，所述第一平坦部1041位于所述第一绑定区1001b，所述第二平坦部1042位于所述第二绑定区1002b；所述第一透明电极层105位于所述平坦化层104远离所述基板102的一侧；所述第二透明电极层106位于所述第一透明电极层105远离所述基板102的一侧；其中，所述第二平坦部1042的厚度大于所述第一平坦部1041的厚度。
可以理解的是，为便于所述绑定焊盘101制备，提升所述绑定焊盘101电性能，同时保证所述第一绑定区1001b内相邻金属层之间电信号互不干扰，位于所述第一绑定区1001b的所述第一平坦部1041被去除，能够减小对应所述空白区的所述导电胶300的厚度，使得对应所述空白区211的所述导电胶300与对应所述第二区220的所述导电胶300之间的厚度差减小。
例如，所述驱动端子221的厚度为9微米，当所述第一平坦部1041保留时，对应所述空白区211的所述导电胶300与对应所述第二区220的所述导电胶300之间的厚度差至少应为9微米；当所述第一平坦部1041被部分去除时，例如，所述第二平坦部1042与所述第一平坦部1041之间厚度差2微米~3微米，对应所述空白区211的所述导电胶300与对应所述第二区220的所述导电胶300之间的厚度差可减小至6微米~7微米。
具体地，所述驱动电路层103包括半导体层1031、栅极绝缘层1032、栅极层1033、层间介质层1034和源漏极金属层1035，所述半导体层1031设置于所述基板102上，所述栅极绝缘层1032覆于所述半导体层1031上，所述栅极层1033设置于所述栅极绝缘层1032上，所述层间介质层1034覆于所述栅极层1033上，所述源漏极金属层1035设置于所述层间介质层1034上，所述平坦化层104覆于所述源漏极金属层1035上。
具体地，所述基板102和所述驱动电路层103之间还设置有遮光层107和缓冲层108，所述遮光层107设置于所述基板102上，所述缓冲层108覆于所述遮光层107上。
具体地，所述第一透明电极层105为像素电极，第二透明电极层106为公共电极；或者，所述第一透明电极层105为公共电极，第二透明电极层106为像素电极，所述第一透明电极层105和所述第二透明电极层106之间还设置有绝缘层109。
本申请实施例还提供一种显示装置，所述显示装置包括上述显示面板100，所述显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
有益效果为：本申请实施例提供的显示面板及显示装置，显示面板包括设置于绑定区的多个绑定焊盘、驱动芯片与驱动芯片和绑定焊盘电连接的导电胶，驱动芯片包括靠近显示区的第一区和远离显示区的第二区，第二区内设置有多个驱动端子，驱动端子和对应的绑定焊盘通过导电胶一一对应电连接，通过将第一区的至少部分导电胶的厚度设置为大于对应第二区的导电胶的厚度，以补偿绑定驱动芯片时驱动芯片上驱动端子发生翘曲而导致的高度差，保证驱动芯片能良好地绑定于显示面板上，避免产生导浅现象。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。
Claims (20)
- 一种显示面板，包括显示区和绑定区，所述绑定区位于所述显示区的一侧，所述绑定区设置有多个绑定焊盘、驱动芯片和与所述驱动芯片和多个所述绑定焊盘电连接的导电胶，所述导电胶为各向异性导电胶；所述驱动芯片包括靠近所述显示区的第一区和远离所述显示区的第二区，所述第二区设置有多个驱动端子，所述驱动端子和对应的所述绑定焊盘通过所述导电胶一一对应电连接；其中，对应所述第一区的至少部分所述导电胶的厚度大于对应所述第二区的所述导电胶的厚度。
- 根据权利要求1所述的显示面板，其中，所述驱动芯片包括靠近所述显示区的第一边，与所述至少部分所述导电胶相对应的所述第一区包括空白区，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小。
- 根据权利要求2所述的显示面板，其中，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈阶梯式减小，和/或，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈渐变式减小。
- 根据权利要求2所述的显示面板，其中，所述空白区为整个所述第一区。
- 根据权利要求4所述的显示面板，其中，位于所述第二区内的多个所述驱动端子呈至少两排排列，位于同一排的各个所述驱动端子与所述第一边之间的距离相等。
- 根据权利要求4所述的显示面板，其中，所述第二区包括沿所述第一边的方向依次排列的第一子区、第二子区和第三子区；其中，位于所述第二子区内的同排的各个所述驱动端子与所述第一边之间的距离相等；沿所述第一子区靠近所述第二子区的方向，位于所述第一子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小，位于所述第三子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐增加。
- 一种显示面板，包括显示区和绑定区，所述绑定区位于所述显示区的一侧，所述绑定区设置有多个绑定焊盘、驱动芯片和与所述驱动芯片和多个所述绑定焊盘电连接的导电胶；所述驱动芯片包括靠近所述显示区的第一区和远离所述显示区的第二区，所述第二区设置有多个驱动端子，所述驱动端子和对应的所述绑定焊盘通过所述导电胶一一对应电连接；其中，对应所述第一区的至少部分所述导电胶的厚度大于对应所述第二区的所述导电胶的厚度。
- 根据权利要求7所述的显示面板，其中，所述驱动芯片包括靠近所述显示区的第一边，与所述至少部分所述导电胶相对应的所述第一区包括空白区，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小。
- 根据权利要求8所述的显示面板，其中，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈阶梯式减小，和/或，对应所述空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向呈渐变式减小。
- 根据权利要求8所述的显示面板，其中，所述空白区为整个所述第一区。
- 根据权利要求10所述的显示面板，其中，位于所述第二区内的多个所述驱动端子呈至少两排排列，位于同一排的各个所述驱动端子与所述第一边之间的距离相等。
- 根据权利要求10所述的显示面板，其中，所述第二区包括沿所述第一边的方向依次排列的第一子区、第二子区和第三子区；其中，位于所述第二子区内的同排的各个所述驱动端子与所述第一边之间的距离相等；沿所述第一子区靠近所述第二子区的方向，位于所述第一子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小，位于所述第三子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐增加。
- 根据权利要求8所述的显示面板，其中，所述第一区包括虚拟端子区，所述虚拟端子区设置有多个虚拟端子；所述空白区包括第一空白区和第二空白区，所述第一空白区、所述虚拟端子区和所述第二空白区沿所述第一边依次排列；其中，对应所述第一空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小，对应所述第二空白区的所述导电胶的厚度沿自靠近所述第一边至远离所述第一边的方向逐渐减小。
- 根据权利要求13所述的显示面板，其中，对应所述第一空白区的所述导电胶的厚度沿自靠近所述虚拟端子区至远离所述虚拟端子区的方向逐渐减小；对应所述第二空白区的所述导电胶的厚度沿自靠近所述虚拟端子区至远离所述虚拟端子区的方向逐渐减小。
- 根据权利要求14所述的显示面板，其中，位于所述第二区内的多个所述驱动端子呈至少两排排列，位于同一排的各个所述驱动端子与所述第一边之间的距离相等。
- 根据权利要求14所述的显示面板，其中，所述第二区包括沿所述第一边的方向依次排列的第一子区、第二子区和第三子区，位于所述第二子区内的同排的各个所述驱动端子与所述第一边之间的距离相等；沿所述第一子区靠近所述第二子区的方向，位于所述第一子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小；沿所述第三子区靠近所述第二子区的方向，位于所述第三子区内的同排的各个所述驱动端子与所述第一边之间的距离逐渐减小。
- 根据权利要求16所述的显示面板，其中，位于所述第二子区内的每一排所述驱动端子对应位于所述第一子区及所述第三子区内的至少两排所述驱动端子。
- 根据权利要求7所述的显示面板，其中，所述第一区的至少部分所述导电胶与所述第二区的所述导电胶之间的厚度差大于或等于0.1微米。
- 根据权利要求7所述的显示面板，其中，所述显示面板还包括设置于所述绑定区的柔性电路板，所述柔性电路板包括主体区段和连接区段，所述主体区段位于所述驱动芯片远离所述显示区的一侧，所述连接区段位于所述驱动芯片的相对两侧。
- 一种显示装置，包括显示面板，所述显示面板包括显示区和绑定区，所述绑定区位于所述显示区的一侧，所述绑定区设置有多个绑定焊盘、驱动芯片和与所述驱动芯片和多个所述绑定焊盘电连接的导电胶；所述驱动芯片包括靠近所述显示区的第一区和远离所述显示区的第二区，所述第二区设置有多个驱动端子，所述驱动端子和对应的所述绑定焊盘通过所述导电胶一一对应电连接；其中，对应所述第一区的至少部分所述导电胶的厚度大于对应所述第二区的所述导电胶的厚度。
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| CN112037649A (zh) * | 2020-08-12 | 2020-12-04 | 上海中航光电子有限公司 | 显示面板和显示装置 |
| CN112530291A (zh) * | 2020-12-18 | 2021-03-19 | 合肥京东方光电科技有限公司 | 驱动芯片、驱动模块、显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113823183B (zh) | 2022-09-09 |
| CN113823183A (zh) | 2021-12-21 |
| US20240055439A1 (en) | 2024-02-15 |
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