WO2023082317A1 - 混接面板及拼接面板 - Google Patents

混接面板及拼接面板 Download PDF

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Publication number
WO2023082317A1
WO2023082317A1 PCT/CN2021/132084 CN2021132084W WO2023082317A1 WO 2023082317 A1 WO2023082317 A1 WO 2023082317A1 CN 2021132084 W CN2021132084 W CN 2021132084W WO 2023082317 A1 WO2023082317 A1 WO 2023082317A1
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WO
WIPO (PCT)
Prior art keywords
substrate
light
pad
emitting diode
disposed
Prior art date
Application number
PCT/CN2021/132084
Other languages
English (en)
French (fr)
Inventor
赵军
徐洪远
黎美楠
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Publication of WO2023082317A1 publication Critical patent/WO2023082317A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Definitions

  • the present application relates to the field of display technology, in particular to a hybrid panel and a splicing panel.
  • the present application provides a hybrid panel and a splicing panel, in which light-emitting diode substrates can be arranged in the non-display area of the display panel, thereby increasing the display area of the hybrid panel and reducing the distance between two adjacent display areas in the splicing panel role.
  • the application provides a hybrid panel, which includes:
  • a display panel comprising a display area and a non-display area disposed around the display area
  • a light emitting diode substrate, the light emitting diode substrate is formed on the display panel, and the light emitting diode substrate is located in the non-display area.
  • the light-emitting diode substrate is prepared in the non-display area of the display panel to increase the overall display area of the hybrid panel, and the light-emitting diode substrate is prepared on the display panel to achieve the effect of thinning the light-emitting diode substrate .
  • the display panel includes a first surface on the light-emitting side of the display panel, a second surface on the light-incident side of the display panel, and a a third side between one side and said second side;
  • the light-emitting diode substrate is arranged on the first surface, the light-emitting diode substrate includes a first driving wiring, the display panel includes a second driving wiring, and the hybrid panel includes a first lead and a second lead. , a first binding pad and a second binding pad, the first lead and the second lead are arranged on the third surface, the first lead is connected to the first driving trace, the The second lead is connected to the second driving wire; the first binding pad is connected to the first lead, and the second binding pad is connected to the second lead;
  • the first binding pad and the second binding pad are disposed on the third face or the second face.
  • the binding area of the display panel and the binding area of the light-emitting diode substrate are arranged on the second surface or the third surface, that is to say, the hybrid panel of this embodiment adopts side bonding or The way of binding on the back to achieve the effect of reducing the border.
  • the first binding pads and the second binding pads are arranged alternately, so that the spacing between the first driving trace and the second driving trace can be adjusted. layout, saving space.
  • the display panel includes a first substrate and a second substrate oppositely arranged, and a filling layer arranged between the first substrate and the second substrate, the The side of the first substrate, the side of the filling layer and the side of the second substrate are flush with each other and form the third surface.
  • the flat third surface facilitates the preparation of the first lead, the second lead, the first binding pad and the second binding pad.
  • the display panel includes a first substrate and a second substrate oppositely arranged, the second substrate is an array substrate, and the light emitting diode substrate includes a first driving wiring;
  • the first substrate includes a first substrate and an electrical connection structure, the electrical connection structure is located in the non-display area, the light-emitting diode substrate is disposed on the first substrate, and the electrical connection structure is disposed on the The side of the first substrate away from the light-emitting diode substrate;
  • the second substrate includes a second substrate, connection pads and first binding pads, the connection pads are disposed on a side of the second substrate close to the first substrate, and the first binding pads are disposed on the side of the second substrate away from the first substrate;
  • the first driving wire is electrically connected to the electrical connection structure, the electrical connection structure is electrically connected to the connection pad, and the connection pad is electrically connected to the first binding pad.
  • the electrical connection structure is prepared on the first substrate, and the connection pads are prepared on the second substrate.
  • the preparation process of this embodiment is simpler, and the frame width is further reduced.
  • the first substrate is provided with a first via hole
  • the electrical connection structure includes a bump and a conductive film
  • the bump is arranged on the first substrate
  • the conductive film covers the bump
  • the part of the conductive film covering the bump is connected to the connection pad
  • the part of the conductive film passes through the first A via hole is connected to the first driving trace.
  • this embodiment adopts the form of preparing a bump and a conductive film in the first substrate to realize the connection to the connection pad in the second substrate.
  • the first substrate further includes a common electrode
  • the common electrode is in the same layer as the conductive film and is insulated. That is, the common electrode and the conductive film are formed by the same photomask process, which saves process steps.
  • the second substrate further includes a second driving wire and a second bonding pad, and the second driving wire is arranged on the second substrate close to the On one side of the first substrate and spaced from the connection pad, the second binding pad is disposed on a side of the second substrate away from the first substrate and spaced from the first binding pad.
  • the second substrate is provided with a second via hole, and the second driving trace is connected to the second bonding pad through the second via hole, so as to realize back bonding.
  • the hybrid panel further includes a first flexible circuit board and a second flexible circuit board, the first flexible circuit board is connected to the first binding pad, and the The second flexible circuit board is connected to the second binding pad, so as to realize the respective driving connections of the LED substrate and the display panel.
  • the light-emitting diode substrate includes a metal layer, an insulating layer, a black light-absorbing layer, and a light-emitting diode disposed on the display panel
  • the metal layer includes the first driver wires and pads
  • the insulating layer covers the first driving wires and exposes the pads
  • the light emitting diode is disposed on the pads
  • the black light absorbing layer is disposed on the insulating layer and arranged between the light emitting diodes.
  • the black light-absorbing layer is used to cover the insulating layer and is arranged between the light-emitting diodes.
  • it can improve the contrast of the display screen of the light-emitting diode substrate;
  • the luminance difference between the substrate and the light-emitting diode substrate improves the overall display effect of the hybrid panel.
  • the embodiment of the present application also provides a splicing panel, the splicing panel includes at least two mixing panels; the splicing arrangement between the mixing panels forms a gap; the mixing panel includes:
  • a display panel comprising a display area and a non-display area disposed around the display area
  • the light emitting diode substrate is formed on the display panel, and the light emitting diode substrate is located in the non-display area;
  • the LED substrates are arranged on both sides of the gap.
  • the display panel includes a first surface on the light-emitting side of the display panel, a second surface on the light-incident side of the display panel, and a a third side between one side and said second side;
  • the light-emitting diode substrate is arranged on the first surface, the light-emitting diode substrate includes a first driving wiring, the display panel includes a second driving wiring, and the hybrid panel includes a first lead and a second lead. , a first binding pad and a second binding pad, the first lead and the second lead are arranged on the third surface, the first lead is connected to the first driving trace, the The second lead is connected to the second driving wire; the first binding pad is connected to the first lead, and the second binding pad is connected to the second lead;
  • the first binding pad and the second binding pad are disposed on the third face or the second face.
  • the binding area of the display panel and the binding area of the light-emitting diode substrate are arranged on the second surface or the third surface, that is to say, the hybrid panel of this embodiment adopts side bonding or The way of binding on the back to achieve the effect of reducing the border.
  • the first binding pads and the second binding pads are arranged alternately, so that the spacing between the first driving trace and the second driving trace can be adjusted. layout, saving space.
  • the display panel includes a first substrate and a second substrate oppositely arranged, and a filling layer arranged between the first substrate and the second substrate, the The side of the first substrate, the side of the filling layer and the side of the second substrate are flush with each other and form the third surface.
  • the flat third surface facilitates the preparation of the first lead, the second lead, the first binding pad and the second binding pad.
  • the display panel includes a first substrate and a second substrate oppositely arranged, the second substrate is an array substrate, and the light emitting diode substrate includes a first driving wiring;
  • the first substrate includes a first substrate and an electrical connection structure, the electrical connection structure is located in the non-display area, the light-emitting diode substrate is disposed on the first substrate, and the electrical connection structure is disposed on the The side of the first substrate away from the light-emitting diode substrate;
  • the second substrate includes a second substrate, connection pads and first binding pads, the connection pads are disposed on a side of the second substrate close to the first substrate, and the first binding pads are disposed on the side of the second substrate away from the first substrate;
  • the first driving wire is electrically connected to the electrical connection structure, the electrical connection structure is electrically connected to the connection pad, and the connection pad is electrically connected to the first binding pad.
  • the electrical connection structure is prepared on the first substrate, and the connection pads are prepared on the second substrate.
  • the preparation process of this embodiment is simpler, and the frame width is further reduced.
  • the first substrate is provided with a first via hole
  • the electrical connection structure includes a bump and a conductive film
  • the bump is arranged on the first substrate
  • the conductive film covers the bump
  • the part of the conductive film covering the bump is connected to the connection pad
  • the part of the conductive film passes through the first A via hole is connected to the first driving trace.
  • this embodiment adopts the form of preparing a bump and a conductive film in the first substrate to realize the connection to the connection pad in the second substrate.
  • the first substrate further includes a common electrode
  • the common electrode is in the same layer as the conductive film and is insulated. That is, the common electrode and the conductive film are formed by the same photomask process, which saves process steps.
  • the second substrate further includes a second driving wire and a second bonding pad, and the second driving wire is arranged on the second substrate close to the On one side of the first substrate and spaced from the connection pad, the second binding pad is disposed on a side of the second substrate away from the first substrate and spaced from the first binding pad.
  • the second substrate is provided with a second via hole, and the second driving trace is connected to the second bonding pad through the second via hole, so as to realize back bonding.
  • the hybrid panel further includes a first flexible circuit board and a second flexible circuit board, the first flexible circuit board is connected to the first binding pad, and the The second flexible circuit board is connected to the second binding pad, so as to realize the respective driving connections of the LED substrate and the display panel.
  • the light-emitting diode substrate includes a metal layer, an insulating layer, a black light-absorbing layer, and a light-emitting diode disposed on the display panel
  • the metal layer includes the first driver wires and pads
  • the insulating layer covers the first driving wires and exposes the pads
  • the light emitting diode is disposed on the pads
  • the black light absorbing layer is disposed on the insulating layer and arranged between the light emitting diodes.
  • the black light-absorbing layer is used to cover the insulating layer and is arranged between the light-emitting diodes.
  • it can improve the contrast of the display screen of the light-emitting diode substrate;
  • the luminance difference between the substrate and the light-emitting diode substrate improves the overall display effect of the hybrid panel.
  • the hybrid panel of the embodiment of the present application includes a display panel and an LED substrate, the display panel includes a display area and a non-display area arranged around the display area; the LED substrate is formed on the display panel, and the LED substrate is located in the non-display area.
  • the light-emitting diode substrate is prepared in the non-display area of the display panel to increase the overall display area of the hybrid panel, and the light-emitting diode substrate is prepared on the display panel to play the role of thinning the light-emitting diode substrate. Effect.
  • the splicing panel of this embodiment two adjacent hybrid panels are spliced to form a gap, and the light-emitting diode substrates are arranged on both sides of the gap to reduce the distance between the display areas between the two hybrid panels and improve the display. Effect.
  • Fig. 1 is a schematic structural diagram of a hybrid panel provided in the first embodiment of the present application
  • Fig. 2 is a schematic side view of the hybrid panel provided by the first embodiment of the present application.
  • Fig. 3 is a schematic structural diagram of a hybrid panel provided in the second embodiment of the present application.
  • Fig. 4 is a schematic side view of the hybrid panel provided by the second embodiment of the present application.
  • Fig. 5 is a schematic structural diagram of a hybrid panel provided by the third embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of a splicing panel provided by an embodiment of the present application.
  • the embodiment of the present application provides a hybrid panel and a splicing panel, which will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments.
  • the first embodiment of the present application provides a hybrid panel 100 , which includes a display panel 10 and an LED substrate 20 .
  • the display panel 10 includes a display area AA and a non-display area NA disposed around the display area AA.
  • the LED substrate 20 is formed on the display panel 10 .
  • the LED substrate 20 is located in the non-display area NA.
  • the LED substrate 20 may be disposed on at least one side of the non-display area NA.
  • the light-emitting diode substrate 20 is prepared on the non-display area NA of the display panel 10 to increase the overall display area of the hybrid panel 100 , and the light-emitting diode substrate 20 is prepared on the display panel 10 , to achieve the effect of thinning the LED substrate 20 .
  • the display panel 10 includes a first surface a1 on the light-emitting side of the display panel 10, a second surface a2 on the light-incident side of the display panel 10, and a first surface a1 connected between the first surface a1 and the second surface a2.
  • a first surface a1 on the light-emitting side of the display panel 10 a second surface a2 on the light-incident side of the display panel 10
  • a first surface a1 connected between the first surface a1 and the second surface a2.
  • the LED substrate 20 is disposed on the first surface a1.
  • the LED substrate 20 includes a metal layer 21 , an insulating layer 22 , a black light absorbing layer 23 and LEDs 24 disposed on the display panel 10 .
  • the metal layer 21 includes a first driving wire 211 and a pad 212 connected to the first driving wire 211 .
  • the insulating layer 22 covers the first driving wire 211 and exposes the bonding pad 212 .
  • the LED 24 is disposed on the pad 212 .
  • the black light absorbing layer 23 is disposed on the insulating layer 22 and disposed between the LEDs 24 .
  • the black light-absorbing layer 23 is used to cover the insulating layer 22 and is arranged between the light-emitting diodes 24.
  • it can improve the contrast when the light-emitting diode substrate 20 displays a picture; on the other hand, it can reduce the light-emitting brightness of the light-emitting diode substrate 20. , and further reduce the difference in luminous brightness between the display panel 10 and the LED substrate 20 , and improve the overall display effect of the hybrid panel 100 .
  • the material of the black light-absorbing layer 23 can be an inorganic metal material, such as Cr (chromium), Mo (molybdenum), Mn (manganese), etc., or a metal oxide material, such as CrO x , MoO x , MnO 2, etc., or a mixed film layer formed of metal and metal oxide; it can also be an organic black resin material, such as black polystyrene, black photoresist, etc.
  • an inorganic metal material such as Cr (chromium), Mo (molybdenum), Mn (manganese), etc.
  • a metal oxide material such as CrO x , MoO x , MnO 2, etc.
  • a mixed film layer formed of metal and metal oxide such as black polystyrene, black photoresist, etc.
  • the display panel 10 includes a first substrate 11 and a second substrate 12 oppositely arranged, and a filling layer 13 arranged between the first substrate 11 and the second substrate 12 .
  • the first substrate 11 is located on the light emitting side of the display panel 10 .
  • the second substrate 12 includes a second driving wire 121 .
  • the hybrid panel 100 includes a first lead 141 , a second lead 142 , a first binding pad 151 and a second binding pad 152 .
  • the first lead 141 and the second lead 142 are disposed on the third face a3.
  • the first lead 141 is connected to the first driving wire 211 .
  • the second lead wire 142 is connected to the second driving wire 121 .
  • the first bonding pad 151 is connected to the first lead 141 .
  • the second bonding pad 152 is connected to the second lead 142 .
  • the first binding pad 151 and the second binding pad 152 are disposed on the third face a3.
  • the hybrid panel 100 further includes a first flexible circuit board 161 and a second flexible circuit board 162 .
  • the first flexible circuit board 161 is connected to the first binding pad 151 .
  • the second flexible circuit board 162 is connected to the second bonding pad 152 .
  • the binding area of the display panel 10 and the binding area of the LED substrate 20 are set on the third surface a3, that is to say, the hybrid panel 100 of the first embodiment adopts The way of side binding achieves the effect of reducing the border.
  • the material of the first lead 141 and the second lead 142 may be silver or other metal materials.
  • first bonding pads 151 and the second bonding pads 152 are arranged alternately, so that the first driving traces 211 and the second driving traces 121 can be laid out at intervals to save space.
  • the side surfaces of the first substrate 11 and the filling layer 13 are flush with the side surfaces of the second substrate 12 to form the third surface a3.
  • the flat third surface a3 facilitates the preparation of the first lead 141 , the second lead 142 , the first bonding pad 151 and the second bonding pad 152 .
  • the first driving wiring 211 is connected between adjacent pads 212, wherein the first lead 141 is directly connected to the outermost pad 212, which saves part of the first driving wiring 211, thereby reducing
  • the frame width of the light emitting diode substrate 20 is reduced, thereby further reducing the distance between the light emitting diodes 24 on both sides of the gap in the two light emitting diode substrates 20 after the two display panels 10 are spliced together.
  • the display panel 10 may be an electroluminescence panel, such as an OLED panel or a QLED panel, or a liquid crystal display panel.
  • the first substrate 11 may be a glass substrate
  • the second substrate 12 is an organic/inorganic light-emitting diode substrate
  • the first substrate 11 may be a color film One of the substrate and the array substrate
  • the second substrate 12 may be the other of the color filter substrate and the array substrate.
  • the hybrid panel 100 of the first embodiment is described by taking the display panel 10 as a liquid crystal display panel as an example, but it is not limited thereto.
  • the first substrate 11 is a color filter substrate
  • the second substrate 12 is an array substrate.
  • the filling layer 13 may be sealant, or other filling materials used to fill the gap between the first substrate 11 and the second substrate 12 .
  • the resolution of the display panel 10 is the same as that of the LED substrate 20 to improve display efficiency.
  • the first substrate 11 further includes a first substrate 111 and a color filter layer 112 disposed on the first substrate 111 .
  • the material of the color filter layer 112 includes quantum dots, so that the color gamut of the display panel 10 is the same as that of the LED substrate 20 .
  • the second substrate 12 also includes a second substrate 122 .
  • the second driving wire 121 is disposed on a side of the second substrate 122 close to the first substrate 11 .
  • the hybrid panel 100 may further include a driving board 17 .
  • a driving board 17 is connected to the first flexible circuit board 161 .
  • Another driving board 17 is connected to the second flexible circuit board 162 .
  • a driving board 17 can be connected to the first flexible circuit board 161 and the second flexible circuit board 162 at the same time.
  • the difference between the hybrid panel 200 of this second embodiment and the hybrid panel 100 of the first embodiment is that the hybrid panel 200 of this second embodiment adopts the method of back binding Binding the flexible circuit board; that is, the first binding pad 151 and the second binding pad 152 are disposed on the second surface a2.
  • the back binding method further reduces the border width.
  • the hybrid panel 300 of the third embodiment includes the display panel 10 and the LED substrate 20 .
  • the display panel 10 includes a display area AA and a non-display area NA disposed around the display area AA.
  • the LED substrate 20 is formed on the display panel 10 .
  • the LED substrate 20 is located in the non-display area NA.
  • the light-emitting diode substrate 20 is prepared on the non-display area NA of the display panel 10 to increase the overall display area of the hybrid panel 100 , and the light-emitting diode substrate 20 is prepared on the display panel 10 , to achieve the effect of thinning the LED substrate 20 .
  • the display panel 10 includes a first substrate 11 and a second substrate 12 disposed opposite to each other.
  • the second substrate 12 is an array substrate.
  • the display panel 10 further includes a sealant 13 disposed between the first substrate 11 and the second substrate 12 .
  • the light emitting diode substrate 20 includes a metal layer 2a, an insulating layer 2b, a black light absorbing layer 2c and a light emitting diode 2d disposed on the first substrate 11 .
  • the metal layer 2a includes a first driving wire 2a1 and a pad 2a2 connected to the first driving wire 2a1.
  • the insulating layer 2b covers the first driving wire 2a1 and exposes the pad 2a2.
  • the light emitting diode 2d is provided on the pad 2a2.
  • the black light absorbing layer 2c is disposed on the insulating layer 2b and disposed between the light emitting diodes 2d.
  • the black light-absorbing layer 2c is used to cover the insulating layer 2b and is arranged between the light-emitting diodes 2d.
  • it can improve the contrast ratio of the display screen of the light-emitting diode substrate 20; on the other hand, it can reduce the light-emitting brightness of the light-emitting diode substrate 20. , and further reduce the difference in luminous brightness between the display panel 10 and the LED substrate 20 , and improve the overall display effect of the hybrid panel 300 .
  • the material of the black light-absorbing layer 2c can be an inorganic metal material, such as Cr (chromium), Mo (molybdenum), Mn (manganese), etc., or a metal oxide material, such as CrO x , MoO x , MnO 2, etc., or a mixed film layer formed of metal and metal oxide; it can also be an organic black resin material, such as black polystyrene, black photoresist, etc.
  • an inorganic metal material such as Cr (chromium), Mo (molybdenum), Mn (manganese), etc.
  • a metal oxide material such as CrO x , MoO x , MnO 2, etc.
  • a mixed film layer formed of metal and metal oxide such as black polystyrene, black photoresist, etc.
  • the first substrate 11 includes a first substrate 1a1 and an electrical connection structure 1a2.
  • the electrical connection structure 1a2 is located in the non-display area NA.
  • the light emitting diode substrate 20 is disposed on the first substrate 1a1.
  • the electrical connection structure 1a2 is disposed on a side of the first substrate 1a1 away from the LED substrate 20 .
  • the second substrate 12 includes a second substrate 1b1, connection pads 1b2, and first bonding pads 1b3.
  • the connection pad 1a2 is disposed on the side of the second substrate 1b1 close to the first substrate 11 .
  • the first binding pad 1b3 is disposed on the side of the second substrate 1b1 away from the first substrate 11 .
  • the first driving wire 2a1 is electrically connected to the electrical connection structure 1a2.
  • the electrical connection structure 1a2 is electrically connected to the connection pad 1b2.
  • the connection pad 1b2 is electrically connected to the first binding pad 1b3.
  • the first substrate 1a1 is provided with a first via hole 1a3.
  • the first driving wire 2a1 is connected to the electrical connection structure 1a2 through the first via hole 1a3.
  • a second via hole 1b4 is disposed on the second substrate 1b1, and the connection pad 1b2 is connected to the first binding pad 1b3 through the second via hole 1b4.
  • the first via hole 1a3 and the electrical connection structure 1a2 are provided on the first substrate 11, and the connection pad 1b2 and the second via hole 1b4 are provided on the second substrate 12.
  • the electrical connection channel of a driving trace 2a1 is guided to the back of the second substrate 12 to realize rear bonding.
  • the electrical connection structure 1a2 is prepared in the first substrate 11, and the connection pad 1b2 Prepared on the second substrate 12 , compared with the first embodiment and the second embodiment, the preparation process of the third embodiment is simpler, and the frame width is further reduced.
  • the electrical connection structure 1a2 includes a bump 1aa and a conductive film 1ab.
  • the bump 1aa is disposed on the side of the first substrate 1a1 away from the LED substrate 20 .
  • the conductive film 1ab covers the bump 1aa.
  • the portion of the conductive film 1ab covering the bump 1aa is connected to the connection pad 1b2.
  • Part of the conductive film 1ab is connected to the first driving wire 2a1 through the first via hole 1a3.
  • the first substrate 11 may further include a color filter layer 1a4, a black matrix 1a5 and spacer columns 1a6.
  • Spacer columns 1a6 are provided on the black matrix 1a5.
  • the spacer columns 1a6 and the bumps 1aa are formed by the same photomask process.
  • the material of the color filter layer 1a4 includes quantum dots, so that the color gamut of the display panel 10 is the same as that of the LED substrate 20 .
  • the black matrix 1a5 is also arranged in the non-display area NA.
  • the first substrate 11 further includes a common electrode 1a7.
  • the common electrode 1a7 covers the color filter layer 1a4 and the spacer column 1a6.
  • the common electrode 1a7 is in the same layer as the conductive film 1ab and is insulated. That is, the common electrode 1a7 and the conductive film 1ab are formed by the same photomask process.
  • the second substrate 12 further includes a second driving trace 1b5 and a second binding pad 1b6.
  • the second driving wire 1b5 is disposed on a side of the second substrate 1b1 close to the first substrate 11 and spaced apart from the connection pad 1b2.
  • the second binding pad 1b6 is disposed on the side of the second substrate 1b1 away from the first substrate 11 and spaced apart from the first binding pad 1b3.
  • the second driving trace 1b5 is connected to the second bonding pad 1b6 through a part of the second via hole 1b4.
  • the hybrid panel 300 further includes a first flexible circuit board 1c1 and a second flexible circuit board 1c2.
  • the first flexible circuit board 1c1 is connected to the first binding pad 1b3.
  • the second flexible circuit board 1c2 is connected to the second binding pad 1b6.
  • the resolution of the display panel 10 is the same as that of the LED substrate 20 to improve display efficiency.
  • the hybrid panel 300 may further include a driving board 1d.
  • a driving board 1d is connected to the first flexible circuit board 1c1.
  • Another driving board 1d is connected to the second flexible circuit board 1c2.
  • a driving board 1d may be connected to the first flexible circuit board 1c1 and the second flexible circuit board 1c2 respectively.
  • the length of the first substrate 11 is equal to the length of the second substrate 12 , so that the surrounding sides of the first substrate 11 are flush with the surrounding sides of the second substrate 12 .
  • the hybrid panel 300 of the third embodiment provides the electrical connection structure 1a2 by increasing the length of the first substrate 11, and the second substrate 12 transfers the second bonding pad 1b6 to the back of the second substrate 12, and use the connection pad 1b2 to be arranged on the second substrate 12 corresponding to the position where the second binding pad 1b6 was originally arranged, so as to achieve the situation that the non-display area NA of the display panel 10 is not increased. Realize back binding, which further reduces the width of the bezel.
  • the embodiment of the present application further provides a splicing panel 1000 , and the splicing panel 1000 includes at least two hybrid panels ( 100/200/300 ) according to any one of the above-mentioned embodiments.
  • the stitching setting between the blending panels (100/200/300) forms a gap fx. Both sides of the gap fx are provided with LED substrates 20 .
  • the splicing panel 1000 of this embodiment is described by taking the hybrid panel 100 of the first embodiment as an example, but it is not limited thereto.
  • first flexible circuit board 161 and the second flexible circuit board 162 are located in the gap fx.
  • the splicing panel 1000 of the embodiment of the present application includes at least two hybrid panels 100.
  • the hybrid panel 100 includes a display panel 10 and a light-emitting diode substrate 20.
  • the display panel 10 includes a display area AA and a non-display area arranged around the display area AA. Na.
  • the LED substrate 20 is formed on the display panel 10 .
  • the LED substrate 20 is located in the non-display area NA.
  • the light-emitting diode substrate 20 is prepared on the non-display area NA of the display panel 10 to increase the overall display area of the hybrid panel 100, and the light-emitting diode substrate 20 is prepared on the display panel 10 to thin the light-emitting diode. The effect of the substrate 20.
  • the LED substrates 20 are disposed on both sides of the gap fx, so as to reduce the distance between the two hybrid panels 100 in the overall display area and improve the display effect.

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Abstract

一种混接面板(100)及拼接面板(1000)，混接面板(100)包括显示面板(10)和发光二极管基板(20)，显示面板(10)包括显示区(AA)和设置在显示区(AA)周侧的非显示区(NA)；发光二极管基板(20)形成于显示面板(10)上；发光二极管基板(20)位于非显示区(NA)。

Description

混接面板及拼接面板 技术领域
本申请涉及显示技术领域，具体涉及一种混接面板及拼接面板。
 背景技术
在对现有技术的研究和实践过程中，本申请的发明人发现，随着户外显示市场的快速发展，大尺寸、高解析度成为户外显示的发展方向。而传统的液晶显示面板（LCD）不仅成本低，解析度也高，但是作为拼接屏之间的显示区相距较大，影响视觉效果。而次毫米级发光二极管（Mini LED）面板和微型发光二极管（Micro-LED）面板目前在小间距上工艺仍不成熟，解析度不及LCD，且成本过高。因此，解决LCD拼接屏的拼缝问题成为目前急需解决的关键突破点。
 技术问题
本申请提供一种混接面板及拼接面板，可以在显示面板的非显示区设置发光二极管基板，进而提高了混接面板的显示面积，且起到缩小拼接面板中相邻两个显示区的距离的作用。
 技术解决方案
本申请提供一种混接面板，其包括：
显示面板，所述显示面板包括显示区和设置在所述显示区周侧的非显示区；以及
发光二极管基板，所述发光二极管基板形成于所述显示面板上，所述发光二极管基板位于所述非显示区。
本申请的混接面板将发光二极管基板制备在显示面板的非显示区，以提高了混接面板整体的显示面积，且将发光二极管基板制备在显示面板上，起到薄化发光二极管基板的效果。
可选的，在本申请的一些实施例中，所述显示面板包括位于所述显示面板的出光侧的第一面、位于所述显示面板的入光侧的第二面和连接在所述第一面和所述第二面之间的第三面；
所述发光二极管基板设置在所述第一面上，所述发光二极管基板包括第一驱动走线，所述显示面板包括第二驱动走线，所述混接面板包括第一引线、第二引线、第一绑定垫和第二绑定垫，所述第一引线和所述第二引线设置在所述第三面上，所述第一引线连接于所述第一驱动走线，所述第二引线连接于所述第二驱动走线；所述第一绑定垫连接于所述第一引线，所述第二绑定垫连接于所述第二引线；
所述第一绑定垫和所述第二绑定垫设置在所述第三面或所述第二面上。
本申请实施例的混接面板将显示面板的绑定区和发光二极管基板的绑定区设置在第二面或第三面上，也就是说，本实施例的混接面板采用侧面绑定或背面绑定的方式，来达到缩小边框的效果。
可选的，在本申请的一些实施例中，所述第一绑定垫和所述第二绑定垫交替排布，使得第一驱动走线和第二驱动走线的可进行间距性的布局，节省空间。
可选的，在本申请的一些实施例中，所述显示面板包括相对设置的第一基板和第二基板以及设置在所述第一基板和所述第二基板之间的填充层，所述第一基板的侧面、所述填充层的侧面与所述第二基板的侧面齐平设置且形成所述第三面。
其中，平整的第三面便于制备第一引线、第二引线、第一绑定垫和第二绑定垫。
可选的，在本申请的一些实施例中，所述显示面板包括相对设置的第一基板和第二基板，所述第二基板为阵列基板，所述发光二极管基板包括第一驱动走线；
所述第一基板包括第一衬底和电连接结构，所述电连接结构位于所述非显示区，所述发光二极管基板设置在所述第一衬底上，所述电连接结构设置于所述第一衬底远离所述发光二极管基板的一面上；
所述第二基板包括第二衬底、连接垫和第一绑定垫，所述连接垫设置在所述第二衬底靠近所述第一基板的一面上，所述第一绑定垫设置在所述第二衬底远离所述第一基板的一面上；
所述第一驱动走线电性连接于所述电连接结构，所述电连接结构电连接于所述连接垫，所述连接垫电性连接于所述第一绑定垫。
本实施例将电连接结构制备于第一基板中，连接垫制备于第二基板中，相较于上述实施例，本实施例的制备过程更为简单，且进一步缩小了边框宽度。
可选的，在本申请的一些实施例中，所述第一衬底设置有第一过孔，所述电连接结构包括凸块和导电膜，所述凸块设置在所述第一衬底远离所述发光二极管基板的一面上，所述导电膜覆盖在所述凸块上，所述导电膜覆盖所述凸块的部分连接于所述连接垫，所述导电膜的部分通过所述第一过孔连接于所述第一驱动走线。
其中本实施例采用在第一基板中制备凸块和导电膜的形式以实现连接第二基板中的连接垫。
可选的，在本申请的一些实施例中，所述第一基板还包括公共电极，所述公共电极与所述导电膜同层且绝缘设置。也即，公共电极与导电膜采用同一光罩制程形成，节省工艺步骤。
可选的，在本申请的一些实施例中，所述第二基板还包括第二驱动走线和第二绑定垫，所述第二驱动走线设置在所述第二衬底靠近所述第一基板的一面上且与所述连接垫间隔设置，所述第二绑定垫设置在所述第二衬底远离所述第一基板的一面上且与所述第一绑定垫间隔设置；
所述第二衬底上设置有第二过孔，所述第二驱动走线通过所述第二过孔连接于所述第二绑定垫，以实现背面绑定。
可选的，在本申请的一些实施例中，所述混接面板还包括第一柔性电路板和第二柔性电路板，所述第一柔性电路板与所述第一绑定垫连接，所述第二柔性电路板与所述第二绑定垫连接，以实现发光二极管基板和显示面板二者各自的驱动连接。
可选的，在本申请的一些实施例中，所述发光二极管基板包括设置在所述显示面板上的金属层、绝缘层、黑色吸光层和发光二极管，所述金属层包括所述第一驱动走线和焊盘，所述绝缘层覆盖所述第一驱动走线且裸露出所述焊盘，所述发光二极管设置在所述焊盘上，所述黑色吸光层设置在所述绝缘层上且设置在所述发光二极管之间。
其中，采用黑色吸光层覆盖绝缘层且设置在发光二极管之间，一方面起到提高发光二极管基板显示画面时的对比度；另一方面起到降低发光二极管基板的发光亮度的目的，进而缩小显示面板和发光二极管基板之间的发光亮度差，提高混接面板整体的显示效果。
相应的，本申请实施例还提供一种拼接面板，所述拼接面板包括至少两个混接面板；所述混接面板之间拼接设置形成缝隙；所述混接面板包括：
显示面板，所述显示面板包括显示区和设置在所述显示区周侧的非显示区；以及
发光二极管基板，所述发光二极管基板形成于所述显示面板上，所述发光二极管基板位于所述非显示区；
所述缝隙的两侧设置有所述发光二极管基板。
可选的，在本申请的一些实施例中，所述显示面板包括位于所述显示面板的出光侧的第一面、位于所述显示面板的入光侧的第二面和连接在所述第一面和所述第二面之间的第三面；
所述发光二极管基板设置在所述第一面上，所述发光二极管基板包括第一驱动走线，所述显示面板包括第二驱动走线，所述混接面板包括第一引线、第二引线、第一绑定垫和第二绑定垫，所述第一引线和所述第二引线设置在所述第三面上，所述第一引线连接于所述第一驱动走线，所述第二引线连接于所述第二驱动走线；所述第一绑定垫连接于所述第一引线，所述第二绑定垫连接于所述第二引线；
所述第一绑定垫和所述第二绑定垫设置在所述第三面或所述第二面上。
本申请实施例的混接面板将显示面板的绑定区和发光二极管基板的绑定区设置在第二面或第三面上，也就是说，本实施例的混接面板采用侧面绑定或背面绑定的方式，来达到缩小边框的效果。
可选的，在本申请的一些实施例中，所述第一绑定垫和所述第二绑定垫交替排布，使得第一驱动走线和第二驱动走线的可进行间距性的布局，节省空间。
可选的，在本申请的一些实施例中，所述显示面板包括相对设置的第一基板和第二基板以及设置在所述第一基板和所述第二基板之间的填充层，所述第一基板的侧面、所述填充层的侧面与所述第二基板的侧面齐平设置且形成所述第三面。
其中，平整的第三面便于制备第一引线、第二引线、第一绑定垫和第二绑定垫。
可选的，在本申请的一些实施例中，所述显示面板包括相对设置的第一基板和第二基板，所述第二基板为阵列基板，所述发光二极管基板包括第一驱动走线；
所述第一基板包括第一衬底和电连接结构，所述电连接结构位于所述非显示区，所述发光二极管基板设置在所述第一衬底上，所述电连接结构设置于所述第一衬底远离所述发光二极管基板的一面上；
所述第二基板包括第二衬底、连接垫和第一绑定垫，所述连接垫设置在所述第二衬底靠近所述第一基板的一面上，所述第一绑定垫设置在所述第二衬底远离所述第一基板的一面上；
所述第一驱动走线电性连接于所述电连接结构，所述电连接结构电连接于所述连接垫，所述连接垫电性连接于所述第一绑定垫。
本实施例将电连接结构制备于第一基板中，连接垫制备于第二基板中，相较于上述实施例，本实施例的制备过程更为简单，且进一步缩小了边框宽度。
可选的，在本申请的一些实施例中，所述第一衬底设置有第一过孔，所述电连接结构包括凸块和导电膜，所述凸块设置在所述第一衬底远离所述发光二极管基板的一面上，所述导电膜覆盖在所述凸块上，所述导电膜覆盖所述凸块的部分连接于所述连接垫，所述导电膜的部分通过所述第一过孔连接于所述第一驱动走线。
其中本实施例采用在第一基板中制备凸块和导电膜的形式以实现连接第二基板中的连接垫。
可选的，在本申请的一些实施例中，所述第一基板还包括公共电极，所述公共电极与所述导电膜同层且绝缘设置。也即，公共电极与导电膜采用同一光罩制程形成，节省工艺步骤。
可选的，在本申请的一些实施例中，所述第二基板还包括第二驱动走线和第二绑定垫，所述第二驱动走线设置在所述第二衬底靠近所述第一基板的一面上且与所述连接垫间隔设置，所述第二绑定垫设置在所述第二衬底远离所述第一基板的一面上且与所述第一绑定垫间隔设置；
所述第二衬底上设置有第二过孔，所述第二驱动走线通过所述第二过孔连接于所述第二绑定垫，以实现背面绑定。
可选的，在本申请的一些实施例中，所述混接面板还包括第一柔性电路板和第二柔性电路板，所述第一柔性电路板与所述第一绑定垫连接，所述第二柔性电路板与所述第二绑定垫连接，以实现发光二极管基板和显示面板二者各自的驱动连接。
可选的，在本申请的一些实施例中，所述发光二极管基板包括设置在所述显示面板上的金属层、绝缘层、黑色吸光层和发光二极管，所述金属层包括所述第一驱动走线和焊盘，所述绝缘层覆盖所述第一驱动走线且裸露出所述焊盘，所述发光二极管设置在所述焊盘上，所述黑色吸光层设置在所述绝缘层上且设置在所述发光二极管之间。
其中，采用黑色吸光层覆盖绝缘层且设置在发光二极管之间，一方面起到提高发光二极管基板显示画面时的对比度；另一方面起到降低发光二极管基板的发光亮度的目的，进而缩小显示面板和发光二极管基板之间的发光亮度差，提高混接面板整体的显示效果。
 有益效果
本申请实施例的混接面板包括显示面板和发光二极管基板，显示面板包括显示区和设置在显示区周侧的非显示区；发光二极管基板形成于显示面板上，发光二极管基板位于非显示区。本实施例的混接面板将发光二极管基板制备在显示面板的非显示区，以提高了混接面板整体的显示面积，且将发光二极管基板制备在显示面板上，起到薄化发光二极管基板的效果。
另外，在本实施例的拼接面板中，相邻的两个混接面板拼接形成有缝隙，发光二极管基板设置在缝隙的两侧，以降低两个混接面板之间显示区的间距，提高显示效果。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请第一实施例提供的混接面板的结构示意图；
图2是本申请第一实施例提供的混接面板的侧视示意图；
图3是本申请第二实施例提供的混接面板的结构示意图；
图4是本申请第二实施例提供的混接面板的侧视示意图；
图5是本申请第三实施例提供的混接面板的结构示意图；
图6是本申请实施例提供的拼接面板的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种混接面板及拼接面板，下文进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参照图1，本申请第一实施例提供一种混接面板100，其包括显示面板10和发光二极管基板20。
显示面板10包括显示区AA和设置在显示区AA周侧的非显示区NA。
发光二极管基板20形成于显示面板10上。发光二极管基板20位于非显示区NA。可选的，发光二极管基板20可以设置在非显示区NA中的至少一侧。
本第一实施例的混接面板100将发光二极管基板20制备在显示面板10的非显示区NA，以提高了混接面板100整体的显示面积，且将发光二极管基板20制备在显示面板10上，起到薄化发光二极管基板20的效果。
可选的，显示面板10包括位于显示面板10的出光侧的第一面a1、位于显示面板10的入光侧的第二面a2和连接在第一面a1和第二面a2之间的第三面a3。
发光二极管基板20设置在第一面a1上。发光二极管基板20包括设置在显示面板10上的金属层21、绝缘层22、黑色吸光层23和发光二极管24。金属层21包括第一驱动走线211和连接于第一驱动走线211的焊盘212。绝缘层22覆盖第一驱动走线211且裸露出焊盘212。发光二极管24设置在焊盘212上。黑色吸光层23设置在绝缘层22上且设置在发光二极管24之间。
其中，采用黑色吸光层23覆盖绝缘层22且设置在发光二极管24之间，一方面起到提高发光二极管基板20显示画面时的对比度；另一方面起到降低发光二极管基板20的发光亮度的目的，进而缩小显示面板10和发光二极管基板20之间的发光亮度差，提高混接面板100整体的显示效果。
可选的，黑色吸光层23的材料可以是无机的金属材料，如Cr（铬）、Mo（钼）、Mn（锰）等，也可以是金属氧化物材料，如CrO x、MoO x、MnO 2等，或者由金属和金属氧化物形成的混合膜层；亦可以是有机黑色树脂材料，如黑色聚苯乙烯、黑色光刻胶等。
可选的，显示面板10包括相对设置的第一基板11和第二基板12以及设置在第一基板11和第二基板12之间的填充层13。
可选的，请参照图1和图2，第一基板11位于显示面板10的出光侧。第二基板12包括第二驱动走线121。
混接面板100包括第一引线141、第二引线142、第一绑定垫151和第二绑定垫152。第一引线141和第二引线142设置在第三面a3上。第一引线141连接于第一驱动走线211。第二引线142连接于第二驱动走线121。第一绑定垫151连接于第一引线141。第二绑定垫152连接于第二引线142。第一绑定垫151和第二绑定垫152设置在第三面a3上。
可选的，混接面板100还包括第一柔性电路板161和第二柔性电路板162。第一柔性电路板161与第一绑定垫151连接。第二柔性电路板162与第二绑定垫152连接。
本第一实施例的混接面板100将显示面板10的绑定区和发光二极管基板20的绑定区设置在第三面a3上，也就是说，本第一实施例的混接面板100采用侧面绑定的方式，达到缩小边框的效果。
可选的，第一引线141和第二引线142的材料可以是银或其他金属材料。
可选的，第一绑定垫151和第二绑定垫152交替排布，使得第一驱动走线211和第二驱动走线121的可进行间距的布局，节省空间。
可选的，第一基板11的侧面、填充层13的侧面与第二基板12的侧面齐平设置且形成第三面a3。平整的第三面a3便于制备第一引线141、第二引线142、第一绑定垫151和第二绑定垫152。
在一些实施例中，第一驱动走线211连接于相邻的焊盘212之间，其中第一引线141直接与最外围的焊盘212连接，节省了部分第一驱动走线211，进而缩小了发光二极管基板20的边框宽度，从而进一步缩小了两个显示面板10拼接后，两个发光二极管基板20中缝隙两侧的发光二极管24之间的间距。
可选的，显示面板10可以是电致发光面板，比如OLED面板或QLED面板，也可以是液晶显示面板。当显示面板10是电致发光面板时，第一基板11可以是玻璃基板，第二基板12是有机/无机发光二极管基板；当显示面板10是液晶显示面板时，第一基板11可以是彩膜基板和阵列基板中的一者，第二基板12可以是彩膜基板和阵列基板中的另一者。
本第一实施例的混接面板100以显示面板10为液晶显示面板为例进行说明，当不限于此。可选的，第一基板11是彩膜基板，第二基板12是阵列基板。
可选的，填充层13可以是框胶，也可以是其他用于填充第一基板11和第二基板12之间间隙的填充材料。
可选的，显示面板10的分辨率与发光二极管基板20的分辨率相同，以提高显示效率。
可选的，第一基板11还包括第一衬底111和设置在第一衬底111上的彩膜层112。彩膜层112的材料包括量子点，以使得显示面板10的色域与发光二极管基板20的色域相同。
第二基板12还包括第二衬底122。第二驱动走线121设置在第二衬底122靠近第一基板11的一面上。
可选的，混接面板100还可以包括驱动板17。一驱动板17与第一柔性电路板161连接。另一驱动板17与第二柔性电路板162连接。
在一些实施例中，一驱动板17可以同时与第一柔性电路板161和第二柔性电路板162连接。
请参照图3和图4，本第二实施例的混接面板200与第一实施例的混接面板100的不同之处在于，本第二实施例的混接面板200采用背面绑定的方式绑定柔性电路板；也即，第一绑定垫151和第二绑定垫152设置在第二面a2上。
采用背面绑定的方式相较于侧面绑定的方式，进一步缩小了边框宽度。
请参照图5，本第三实施例的混接面板300，其包括显示面板10和发光二极管基板20。
显示面板10包括显示区AA和设置在显示区AA周侧的非显示区NA。发光二极管基板20形成于显示面板10上。发光二极管基板20位于非显示区NA。
本第一实施例的混接面板100将发光二极管基板20制备在显示面板10的非显示区NA，以提高了混接面板100整体的显示面积，且将发光二极管基板20制备在显示面板10上，起到薄化发光二极管基板20的效果。
可选的，显示面板10包括相对设置的第一基板11和第二基板12。第二基板12为阵列基板。显示面板10还包括设置在第一基板11和第二基板12之间的框胶13。
可选的，发光二极管基板20包括设置在第一基板11的金属层2a、绝缘层2b、黑色吸光层2c和发光二极管2d。金属层2a包括第一驱动走线2a1和连接于第一驱动走线2a1的焊盘2a2。绝缘层2b覆盖第一驱动走线2a1且裸露出焊盘2a2。发光二极管2d设置在焊盘2a2上。黑色吸光层2c设置在绝缘层2b上且设置在发光二极管2d之间。
其中，采用黑色吸光层2c覆盖绝缘层2b且设置在发光二极管2d之间，一方面起到提高发光二极管基板20显示画面时的对比度；另一方面起到降低发光二极管基板20的发光亮度的目的，进而缩小显示面板10和发光二极管基板20之间的发光亮度差，提高混接面板300整体的显示效果。
可选的，黑色吸光层2c的材料可以是无机的金属材料，如Cr（铬）、Mo（钼）、Mn（锰）等，也可以是金属氧化物材料，如CrO x、MoO x、MnO 2等，或者由金属和金属氧化物形成的混合膜层；亦可以是有机黑色树脂材料，如黑色聚苯乙烯、黑色光刻胶等。
可选的，第一基板11包括第一衬底1a1和电连接结构1a2。电连接结构1a2位于非显示区NA。发光二极管基板20设置在第一衬底1a1上。电连接结构1a2设置于第一衬底1a1远离发光二极管基板20的一面上。
第二基板12包括第二衬底1b1、连接垫1b2和第一绑定垫1b3。连接垫1a2设置在第二衬底1b1靠近第一基板11的一面上。第一绑定垫1b3设置在第二衬底1b1远离第一基板11的一面上。
第一驱动走线2a1电性连接于电连接结构1a2。电连接结构1a2电连接于连接垫1b2。连接垫1b2电性连接于第一绑定垫1b3。
可选的，第一衬底1a1设置有第一过孔1a3。第一驱动走线2a1通过第一过孔1a3连接于电连接结构1a2。第二衬底1b1上设置有第二过孔1b4，连接垫1b2通过第二过孔1b4连接于第一绑定垫1b3。
本第三实施例的混接面板300采用在第一基板11上设置第一过孔1a3、电连接结构1a2，以及在第二基板12设置连接垫1b2和第二过孔1b4的方式，将第一驱动走线2a1的电性连接通道引导至第二基板12的背面实现背面绑定，本第三实施例的混接面板300中，电连接结构1a2制备于第一基板11中，连接垫1b2制备于第二基板12中，相较于第一实施例和第二实施例，本第三实施例的制备过程更为简单，且进一步缩小了边框宽度。
可选的，电连接结构1a2包括凸块1aa和导电膜1ab。凸块1aa设置在第一衬底1a1远离发光二极管基板20的一面上。导电膜1ab覆盖在凸块1aa上。导电膜1ab覆盖凸块1aa的部分连接于连接垫1b2。导电膜1ab的部分通过第一过孔1a3连接于第一驱动走线2a1。
可选的，第一基板11还可以包括彩膜层1a4、黑色矩阵1a5和间隔柱1a6。间隔柱1a6设置在黑色矩阵1a5上。间隔柱1a6与凸块1aa采用同一光罩制程形成。
可选的，彩膜层1a4的材料包括量子点，以使显示面板10的色域与发光二极管基板20的色域相同。
可选的，黑色矩阵1a5还设置在非显示区NA。
可选的，第一基板11还包括公共电极1a7。公共电极1a7覆盖彩膜层1a4和间隔柱1a6。公共电极1a7与导电膜1ab同层且绝缘设置。也即，公共电极1a7与导电膜1ab采用同一光罩制程形成。
可选的，第二基板12还包括第二驱动走线1b5和第二绑定垫1b6。第二驱动走线1b5设置在第二衬底1b1靠近第一基板11的一面上且与连接垫1b2间隔设置。第二绑定垫1b6设置在第二衬底1b1远离第一基板11的一面上且与第一绑定垫1b3间隔设置。
第二驱动走线1b5通过部分的第二过孔1b4连接于第二绑定垫1b6。
可选的，混接面板300还包括第一柔性电路板1c1和第二柔性电路板1c2。第一柔性电路板1c1与第一绑定垫1b3连接。第二柔性电路板1c2与第二绑定垫1b6连接。
可选的，显示面板10的分辨率与发光二极管基板20的分辨率相同，以提高显示效率。
可选的，混接面板300还可以包括驱动板1d。一驱动板1d与第一柔性电路板1c1连接。另一驱动板1d与第二柔性电路板1c2连接。
在一些实施例中，一驱动板1d可以分别与第一柔性电路板1c1和第二柔性电路板1c2连接。
可选的，第一基板11的长度等于第二基板12的长度，使得第一基板11的四周侧面与第二基板12的四周侧面齐平。相较于现有技术的液晶显示面板，本第三实施例的混接面板300通过增加第一基板11的长度，来设置电连接结构1a2，而第二基板12将第二绑定垫1b6转移至第二基板12的背面，并采用连接垫1b2设置在第二基板12对应于原来设置第二绑定垫1b6的位置，从而达到了在没有增加显示面板10的非显示区NA的情况下，实现背面绑定，进一步缩小了边框的宽度。
请参照图6，相应的，本申请实施例还提供一种拼接面板1000，拼接面板1000包括至少两个如上述任意一项实施例的混接面板（100/200/300）。混接面板（100/200/300）之间拼接设置形成缝隙fx。缝隙fx的两侧设置有发光二极管基板20。
其中关于上述实施例的混接面板（100/200/300）的结构，上文已有阐述，此处不再赘述。
本实施例的拼接面板1000以包括第一实施例的混接面板100为例进行说明，但不限于此。
其中第一柔性电路板161和第二柔性电路板162位于缝隙fx中。
本申请实施例的拼接面板1000包括至少两个混接面板100，混接面板100包括显示面板10和发光二极管基板20，显示面板10包括显示区AA和设置在显示区AA周侧的非显示区NA。发光二极管基板20形成于显示面板10上。发光二极管基板20位于非显示区NA。本实施例将发光二极管基板20制备在显示面板10的非显示区NA，以提高了混接面板100整体的显示面积，且将发光二极管基板20制备在显示面板10上，起到薄化发光二极管基板20的效果。
另外，在本实施例中，发光二极管基板20设置在缝隙fx的两侧，以降低两个混接面板100之间整体显示区的间距，提高显示效果。
以上对本申请实施例所提供的一种混接面板及拼接面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种混接面板，其包括：
    显示面板，所述显示面板包括显示区和设置在所述显示区周侧的非显示区；以及
    发光二极管基板，所述发光二极管基板形成于所述显示面板上，所述发光二极管基板位于所述非显示区。
  2. 根据权利要求1所述的混接面板，其中，所述显示面板包括位于所述显示面板的出光侧的第一面、位于所述显示面板的入光侧的第二面和连接在所述第一面和所述第二面之间的第三面；
    所述发光二极管基板设置在所述第一面上，所述发光二极管基板包括第一驱动走线，所述显示面板包括第二驱动走线，所述混接面板包括第一引线、第二引线、第一绑定垫和第二绑定垫，所述第一引线和所述第二引线设置在所述第三面上，所述第一引线连接于所述第一驱动走线，所述第二引线连接于所述第二驱动走线；所述第一绑定垫连接于所述第一引线，所述第二绑定垫连接于所述第二引线；
    所述第一绑定垫和所述第二绑定垫设置在所述第三面或所述第二面上。
  3. 根据权利要求2所述的混接面板，其中，所述第一绑定垫和所述第二绑定垫交替排布。
  4. 根据权利要求2所述的混接面板，其中，所述显示面板包括相对设置的第一基板和第二基板以及设置在所述第一基板和所述第二基板之间的填充层，所述第一基板的侧面、所述填充层的侧面与所述第二基板的侧面齐平设置且形成所述第三面。
  5. 根据权利要求1所述的混接面板，其中，所述显示面板包括相对设置的第一基板和第二基板，所述第二基板为阵列基板，所述发光二极管基板包括第一驱动走线；
    所述第一基板包括第一衬底和电连接结构，所述电连接结构位于所述非显示区，所述发光二极管基板设置在所述第一衬底上，所述电连接结构设置于所述第一衬底远离所述发光二极管基板的一面上；
    所述第二基板包括第二衬底、连接垫和第一绑定垫，所述连接垫设置在所述第二衬底靠近所述第一基板的一面上，所述第一绑定垫设置在所述第二衬底远离所述第一基板的一面上；
    所述第一驱动走线电性连接于所述电连接结构，所述电连接结构电连接于所述连接垫，所述连接垫电性连接于所述第一绑定垫。
  6. 根据权利要求5所述的混接面板，其中，所述第一衬底设置有第一过孔，所述电连接结构包括凸块和导电膜，所述凸块设置在所述第一衬底远离所述发光二极管基板的一面上，所述导电膜覆盖在所述凸块上，所述导电膜覆盖所述凸块的部分连接于所述连接垫，所述导电膜的部分通过所述第一过孔连接于所述第一驱动走线。
  7. 根据权利要求6所述的混接面板，其中，所述第一基板还包括公共电极，所述公共电极与所述导电膜同层且绝缘设置。
  8. 根据权利要求5所述的混接面板，其中，所述第二基板还包括第二驱动走线和第二绑定垫，所述第二驱动走线设置在所述第二衬底靠近所述第一基板的一面上且与所述连接垫间隔设置，所述第二绑定垫设置在所述第二衬底远离所述第一基板的一面上且与所述第一绑定垫间隔设置；
    所述第二衬底上设置有第二过孔，所述第二驱动走线通过所述第二过孔连接于所述第二绑定垫。
  9. 根据权利要求2所述的混接面板，其中，所述混接面板还包括第一柔性电路板和第二柔性电路板，所述第一柔性电路板与所述第一绑定垫连接，所述第二柔性电路板与所述第二绑定垫连接。
  10. 根据权利要求2所述的混接面板，其中，所述发光二极管基板包括设置在所述显示面板上的金属层、绝缘层、黑色吸光层和发光二极管，所述金属层包括所述第一驱动走线和焊盘，所述绝缘层覆盖所述第一驱动走线且裸露出所述焊盘，所述发光二极管设置在所述焊盘上，所述黑色吸光层设置在所述绝缘层上且设置在所述发光二极管之间。
  11. 一种拼接面板，其中，所述拼接面板包括至少两个混接面板；所述混接面板之间拼接设置形成缝隙；所述混接面板包括：
    显示面板，所述显示面板包括显示区和设置在所述显示区周侧的非显示区；以及
    发光二极管基板，所述发光二极管基板形成于所述显示面板上，所述发光二极管基板位于所述非显示区；
    所述缝隙的两侧设置有所述发光二极管基板。
  12. 根据权利要求11所述的拼接面板，其中，所述显示面板包括位于所述显示面板的出光侧的第一面、位于所述显示面板的入光侧的第二面和连接在所述第一面和所述第二面之间的第三面；
    所述发光二极管基板设置在所述第一面上，所述发光二极管基板包括第一驱动走线，所述显示面板包括第二驱动走线，所述混接面板包括第一引线、第二引线、第一绑定垫和第二绑定垫，所述第一引线和所述第二引线设置在所述第三面上，所述第一引线连接于所述第一驱动走线，所述第二引线连接于所述第二驱动走线；所述第一绑定垫连接于所述第一引线，所述第二绑定垫连接于所述第二引线；
    所述第一绑定垫和所述第二绑定垫设置在所述第三面或所述第二面上。
  13. 根据权利要求12所述的拼接面板，其中，所述第一绑定垫和所述第二绑定垫交替排布。
  14. 根据权利要求12所述的拼接面板，其中，所述显示面板包括相对设置的第一基板和第二基板以及设置在所述第一基板和所述第二基板之间的填充层，所述第一基板的侧面、所述填充层的侧面与所述第二基板的侧面齐平设置且形成所述第三面。
  15. 根据权利要求11所述的拼接面板，其中，所述显示面板包括相对设置的第一基板和第二基板，所述第二基板为阵列基板，所述发光二极管基板包括第一驱动走线；
    所述第一基板包括第一衬底和电连接结构，所述电连接结构位于所述非显示区，所述发光二极管基板设置在所述第一衬底上，所述电连接结构设置于所述第一衬底远离所述发光二极管基板的一面上；
    所述第二基板包括第二衬底、连接垫和第一绑定垫，所述连接垫设置在所述第二衬底靠近所述第一基板的一面上，所述第一绑定垫设置在所述第二衬底远离所述第一基板的一面上；
    所述第一驱动走线电性连接于所述电连接结构，所述电连接结构电连接于所述连接垫，所述连接垫电性连接于所述第一绑定垫。
  16. 根据权利要求15所述的拼接面板，其中，所述第一衬底设置有第一过孔，所述电连接结构包括凸块和导电膜，所述凸块设置在所述第一衬底远离所述发光二极管基板的一面上，所述导电膜覆盖在所述凸块上，所述导电膜覆盖所述凸块的部分连接于所述连接垫，所述导电膜的部分通过所述第一过孔连接于所述第一驱动走线。
  17. 根据权利要求16所述的拼接面板，其中，所述第一基板还包括公共电极，所述公共电极与所述导电膜同层且绝缘设置。
  18. 根据权利要求15所述的拼接面板，其中，所述第二基板还包括第二驱动走线和第二绑定垫，所述第二驱动走线设置在所述第二衬底靠近所述第一基板的一面上且与所述连接垫间隔设置，所述第二绑定垫设置在所述第二衬底远离所述第一基板的一面上且与所述第一绑定垫间隔设置；
    所述第二衬底上设置有第二过孔，所述第二驱动走线通过所述第二过孔连接于所述第二绑定垫。
  19. 根据权利要求18所述的拼接面板，其中，所述混接面板还包括第一柔性电路板和第二柔性电路板，所述第一柔性电路板与所述第一绑定垫连接，所述第二柔性电路板与所述第二绑定垫连接。
  20. 根据权利要求15所述的拼接面板，其中，所述发光二极管基板包括设置在所述显示面板上的金属层、绝缘层、黑色吸光层和发光二极管，所述金属层包括所述第一驱动走线和焊盘，所述绝缘层覆盖所述第一驱动走线且裸露出所述焊盘，所述发光二极管设置在所述焊盘上，所述黑色吸光层设置在所述绝缘层上且设置在所述发光二极管之间。
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114241943B (zh) * 2021-12-14 2024-03-15 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法
CN114299828B (zh) * 2022-02-14 2023-04-07 惠州华星光电显示有限公司 显示单元、拼接屏以及显示装置
CN114999338B (zh) * 2022-05-31 2023-11-28 Tcl华星光电技术有限公司 显示面板及制作方法、拼接显示装置
CN118056284A (zh) * 2022-08-11 2024-05-17 京东方科技集团股份有限公司 显示面板、显示装置及拼接显示装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201539403A (zh) * 2014-04-01 2015-10-16 Gio Optoelectronics Corp 拼接式顯示裝置
CN107742480A (zh) * 2017-10-30 2018-02-27 武汉华星光电技术有限公司 拼接显示装置
CN110379314A (zh) * 2019-07-23 2019-10-25 深圳市华星光电半导体显示技术有限公司 一种无缝拼接屏
CN111063693A (zh) * 2019-12-05 2020-04-24 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制备方法、显示装置
CN111223905A (zh) * 2020-01-10 2020-06-02 Tcl华星光电技术有限公司 显示面板及其制备方法
CN111653207A (zh) * 2020-07-30 2020-09-11 上海天马微电子有限公司 显示模组、显示装置和拼接屏
CN212161167U (zh) * 2020-05-13 2020-12-15 深圳雷曼光电科技股份有限公司 一种显示装置及显示屏
CN112837626A (zh) * 2021-01-11 2021-05-25 深圳市华星光电半导体显示技术有限公司 显示面板及显示面板的制作方法
CN113270049A (zh) * 2021-04-28 2021-08-17 惠州视维新技术有限公司 显示装置
CN113470538A (zh) * 2021-06-28 2021-10-01 Tcl华星光电技术有限公司 一种微型发光二极管拼接显示屏及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102032748B1 (ko) * 2013-06-28 2019-10-16 엘지디스플레이 주식회사 유기전계 발광소자의 제조 방법 및 그 방법에 의해 제조된 유기전계 발광소자
CN208655653U (zh) * 2018-07-26 2019-03-26 京东方科技集团股份有限公司 Oled封装结构和显示装置
TWI682530B (zh) * 2019-05-29 2020-01-11 友達光電股份有限公司 發光二極體面板與拼接顯示裝置
CN113327891A (zh) * 2021-05-18 2021-08-31 Tcl华星光电技术有限公司 一种显示面板的制备方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201539403A (zh) * 2014-04-01 2015-10-16 Gio Optoelectronics Corp 拼接式顯示裝置
CN107742480A (zh) * 2017-10-30 2018-02-27 武汉华星光电技术有限公司 拼接显示装置
CN110379314A (zh) * 2019-07-23 2019-10-25 深圳市华星光电半导体显示技术有限公司 一种无缝拼接屏
CN111063693A (zh) * 2019-12-05 2020-04-24 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制备方法、显示装置
CN111223905A (zh) * 2020-01-10 2020-06-02 Tcl华星光电技术有限公司 显示面板及其制备方法
CN212161167U (zh) * 2020-05-13 2020-12-15 深圳雷曼光电科技股份有限公司 一种显示装置及显示屏
CN111653207A (zh) * 2020-07-30 2020-09-11 上海天马微电子有限公司 显示模组、显示装置和拼接屏
CN112837626A (zh) * 2021-01-11 2021-05-25 深圳市华星光电半导体显示技术有限公司 显示面板及显示面板的制作方法
CN113270049A (zh) * 2021-04-28 2021-08-17 惠州视维新技术有限公司 显示装置
CN113470538A (zh) * 2021-06-28 2021-10-01 Tcl华星光电技术有限公司 一种微型发光二极管拼接显示屏及其制备方法

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