WO2022264794A1 - 固体電解コンデンサ素子及び固体電解コンデンサ - Google Patents

固体電解コンデンサ素子及び固体電解コンデンサ Download PDF

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Publication number
WO2022264794A1
WO2022264794A1 PCT/JP2022/021914 JP2022021914W WO2022264794A1 WO 2022264794 A1 WO2022264794 A1 WO 2022264794A1 JP 2022021914 W JP2022021914 W JP 2022021914W WO 2022264794 A1 WO2022264794 A1 WO 2022264794A1
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Prior art keywords
layer
electrolytic capacitor
solid electrolyte
solid electrolytic
capacitor element
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English (en)
French (fr)
Japanese (ja)
Inventor
康浩 玉谷
和哉 楠田
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2023529751A priority Critical patent/JP7658432B2/ja
Priority to CN202280042694.8A priority patent/CN117501394A/zh
Publication of WO2022264794A1 publication Critical patent/WO2022264794A1/ja
Priority to US18/539,769 priority patent/US12476054B2/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires

Definitions

  • the present invention relates to solid electrolytic capacitor elements and solid electrolytic capacitors.
  • Patent Document 1 discloses a solid electrolytic capacitor element in which a solid electrolyte layer containing a conductive polymer is provided on a dielectric oxide film formed on the surface of a valve action metal having micropores.
  • the solid electrolyte layer covers part of the cathode-side outer surface of the insulator layer separating the cathode and the anode.
  • a solid electrolytic capacitor element is disclosed that includes a structure in which a conductive paste layer is formed to a position spatially beyond the boundary of the cathode portion of the insulator layer in the horizontal direction.
  • the solid electrolyte layer covers part of an insulator layer formed on the outer surface of a valve metal that separates an anode and a cathode, and (2) a highly conductive paste. is applied so as to spatially exceed the boundary of the cathode portion of the insulator layer formed on the outer surface of the valve metal that separates the anode and cathode, thereby reducing the leakage current of the solid electrolytic capacitor. It is said that it is possible to lower the equivalent series resistance without increasing the number of defects.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a solid electrolytic capacitor element having a low equivalent series resistance and a low leakage current defect. A further object of the present invention is to provide a solid electrolytic capacitor comprising the above solid electrolytic capacitor element.
  • the solid electrolytic capacitor element of the present invention comprises a valve-acting metal substrate having a dielectric layer on at least one principal surface thereof, and an insulator provided on the dielectric layer for separating the valve-acting metal substrate into an anode portion and a cathode portion.
  • the tip of the solid electrolyte layer is provided so as to cover at least a portion of the outer surface of the insulating mask layer, and the tip of the carbon layer is positioned at the same position as the tip of the solid electrolyte layer on the outer surface of the insulating mask layer.
  • the cathode conductor layer is provided so as to cover a position closer to the cathode than the tip of the solid electrolyte layer, and the tip of the cathode conductor layer covers a position closer to the cathode than the tip of the carbon layer on the outer surface of the insulating mask layer.
  • the cathode portion has a cathode conductor layer non-formation region where the cathode conductor layer does not partially cover the carbon layer.
  • the solid electrolytic capacitor of the present invention comprises the solid electrolytic capacitor element of the present invention, an exterior body for sealing the solid electrolytic capacitor element, and the valve action metal substrate of the solid electrolytic capacitor element exposed from the exterior body. and a second external electrode electrically connected to the cathode conductor layer of the solid electrolytic capacitor element exposed from the exterior body.
  • FIG. 1 is a plan view schematically showing an example of a solid electrolytic capacitor element according to a first embodiment of the invention.
  • FIG. 2 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 1 taken along line XX.
  • FIG. 3 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 1 along line YY.
  • 4A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 4B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 1 is a plan view schematically showing an example of a solid electrolytic capacitor element according to a first embodiment of the invention.
  • FIG. 2 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 1 taken along line XX.
  • FIG. 4C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. FIG. 5 is an enlarged cross-sectional view of the V portion of the solid electrolytic capacitor element shown in FIG.
  • FIG. 6 is a plan view schematically showing an example of the solid electrolytic capacitor element according to the second embodiment of the invention.
  • 7 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 6 taken along line XX.
  • 8 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 6 along line YY.
  • FIG. 9A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. FIG. 10 is a plan view schematically showing an example of the solid electrolytic capacitor element according to the third embodiment of the invention. 11 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG.
  • FIG. 10 taken along line XX. 12 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 10 taken along line YY.
  • 13A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 14 is a schematic diagram showing an example of a process of preparing a valve-acting metal base on which an insulating mask layer is formed.
  • FIG. 15 is a schematic diagram showing an example of a process of forming a solid electrolyte layer.
  • FIG. 16 is a plan view schematically showing an example of an element portion after forming a solid electrolyte layer. 17 is a cross-sectional view of the element portion shown in FIG. 16 along line XX.
  • FIG. 18 is a perspective view schematically showing one example of the solid electrolytic capacitor of the present invention. 19 is a cross-sectional view of the solid electrolytic capacitor shown in FIG. 18 taken along line ZZ.
  • FIG. 20 is a plan view schematically showing an example of a solid electrolytic capacitor element according to Comparative Example.
  • FIG. 21 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 20 taken along line XX.
  • 22A is a plan view schematically showing an example of dielectric layers and insulating mask layers that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • a solid electrolytic capacitor element and a solid electrolytic capacitor according to the present invention will be described below.
  • the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. Combinations of two or more of the individual desirable configurations described below are also part of the present invention.
  • the solid electrolytic capacitor element of the present invention comprises a valve-acting metal substrate having a dielectric layer on at least one principal surface thereof, and an insulating mask layer provided on the dielectric layer for separating the valve-acting metal substrate into an anode portion and a cathode portion. , a solid electrolyte layer provided on the dielectric layer of the cathode section, a carbon layer provided on the solid electrolyte layer, and a cathode conductor layer provided on the carbon layer.
  • the tip of the solid electrolyte layer is provided so as to cover at least a portion of the outer surface of the insulating mask layer, and the tip of the carbon layer extends beyond the outer surface of the insulating mask layer.
  • the cathode conductor layer is provided so as to cover the same position as the tip or a position closer to the cathode part than the tip of the solid electrolyte layer (arrow A side in FIGS. 1, 6 and 10), and the tip of the cathode conductor layer is outside the insulating mask layer. It is provided so as to cover a position closer to the cathode portion than the tip of the carbon layer on the surface. This can reduce the equivalent series resistance.
  • the cathode portion has a cathode conductor layer non-formed region where the cathode conductor layer does not partially cover the carbon layer. As a result, leakage current defects can be reduced.
  • the thickness of the solid electrolyte layer in the vicinity of the insulating mask layer in the cathode part is reduced because the solid electrolyte layer hangs down from the vicinity of the insulating mask layer due to its own weight. It is smaller than the thickness of the solid electrolyte layer in the central region of the cathode section.
  • the present inventors considered that if the cathode conductor layer is not formed in the thin portion of the solid electrolyte layer, the equivalent series resistance can be lowered and the leakage current failure can be reduced.
  • the solid electrolyte layer is provided so as to cover the cathode portion and at least a portion of the outer surface of the insulating mask layer, and the carbon layer covers the cathode portion and provides insulation.
  • the cathode conductor layer is provided to cover at least a portion of the solid electrolyte layer on the outer surface of the mask layer, and the cathode conductor layer is provided to cover the cathode portion and at least a portion of the carbon layer on the outer surface of the insulating mask layer,
  • the equivalent series resistance can be lowered and the leakage current failure can be reduced.
  • the arc-shaped tip of the carbon layer is positioned closer to the cathode than the arc-shaped tip of the solid electrolyte layer, and the arc-shaped tip of the cathode conductor layer is carbon. It is positioned closer to the cathode than the arcuate tip of the layer.
  • the arc-shaped tips of the solid electrolyte layer, carbon layer, and cathode conductor layer are simply referred to as tips.
  • FIG. 1 is a plan view schematically showing an example of the solid electrolytic capacitor element according to the first embodiment of the invention.
  • FIG. 2 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 1 taken along line XX.
  • FIG. 3 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 1 along line YY.
  • Solid electrolytic capacitor element 1 shown in FIGS. A solid electrolyte layer 40 provided thereon, a carbon layer 50 provided on the solid electrolyte layer 40 , and a cathode conductor layer 60 provided on the carbon layer 50 .
  • FIG. 4A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 4B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 4C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 4A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 4B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 1.
  • FIG. 4C is a plan view schematically showing
  • an insulating mask layer 30 having a predetermined width is provided around the dielectric layer 20. As shown in FIGS. The insulating mask layers 30 are provided on both main surfaces and both side surfaces of the valve-acting metal substrate 10 along the short sides of the valve-acting metal substrate 10 . The insulating mask layer 30 separates the valve metal substrate 10 into an anode portion 31 and a cathode portion 32 .
  • the solid electrolyte layer 40 is provided on the dielectric layer 20 of the cathode section 32. As shown in FIGS. Solid electrolyte layer 40 is provided such that tip 40 a covers the outer surface of insulating mask layer 30 . Solid electrolyte layer 40 may be provided so as to partially cover the outer surface of insulating mask layer 30 , or may be provided so as to cover the entire outer surface of insulating mask layer 30 .
  • the carbon layer 50 is formed such that the tip 50a covers a position closer to the cathode section 32 than the tip 40a of the solid electrolyte layer 40 on the outer surface of the insulating mask layer 30. is provided in
  • the cathode conductor layer 60 is provided so that the tip 60a covers a position on the outer surface of the insulating mask layer 30 closer to the cathode section 32 than the tip 50a of the carbon layer 50 is.
  • the cathode section 32 has cathode conductor layer non-formation areas A1 and A2 where the cathode conductor layer 60 does not partially cover the carbon layer 50. As shown in FIGS. 1 and 3, the cathode section 32 has cathode conductor layer non-formation areas A1 and A2 where the cathode conductor layer 60 does not partially cover the carbon layer 50. As shown in FIGS. 1 and 3, the cathode conductor layer non-formation areas A1 and A2 where the cathode conductor layer 60 does not partially cover the carbon layer 50.
  • the cathode conductor layer 60 when viewed from the direction normal to the main surface of the valve metal substrate 10, the cathode conductor layer 60 has a tip 60a whose central portion is located on the insulating mask layer 30 and whose tip 60a is located on the insulating mask layer 30. Both ends are preferably provided so as to be positioned on the cathode section 32 .
  • the cathode conductor layer 60 is provided so as to approach the insulating mask layer 30 from both end portions of the tip 60a toward the central portion of the tip 60a. preferably.
  • the shape of the valve action metal substrate 10 when viewed from the normal direction of the main surface of the valve action metal substrate 10, that is, the shape of the valve action metal substrate 10 when viewed from above in the thickness direction is quadrangular. It has a rectangular shape with short sides.
  • FIG. 5 is an enlarged cross-sectional view of the V portion of the solid electrolytic capacitor element shown in FIG.
  • a plurality of recesses are provided on the main surface of the valve metal substrate 10, as shown in FIG. Therefore, the main surface of the valve metal substrate 10 is porous. Since the main surface of the valve action metal substrate 10 is porous, the surface area of the valve action metal substrate 10 is increased. Both the front and back surfaces of the valve action metal substrate 10 are not limited to being porous, and only one of the front and back surfaces of the valve action metal substrate 10 may be porous.
  • the valve action metal substrate 10 is made of, for example, a single metal such as aluminum, tantalum, niobium, titanium, or zirconium, or a valve action metal such as an alloy containing at least one of these metals.
  • An oxide film can be formed on the surface of the valve metal.
  • the valve action metal substrate 10 may be composed of a core portion and a porous portion provided on at least one main surface of the core portion.
  • a porous fine powder sintered body or the like can be used as appropriate.
  • the dielectric layer 20 is provided on at least one main surface of the valve action metal substrate 10 .
  • the dielectric layer 20 is preferably composed of an oxide film provided on the surface of the valve metal.
  • dielectric layer 20 is composed of an oxide of aluminum.
  • the oxide of aluminum is formed by anodizing the surface of the valve action metal substrate 10, as will be described later.
  • the insulating mask layer 30 is provided on the dielectric layer 20 . As shown in FIG. 5 , the insulating mask layer 30 is preferably provided so as to fill a plurality of pores (recesses) of the valve metal substrate 10 . However, the insulation mask layer 30 only needs to cover a portion of the outer surface of the dielectric layer 20, and there are pores (recesses) in the valve metal substrate 10 that are not filled with the insulation mask layer 30. good too.
  • the insulating mask layer 30 is formed by applying a mask material such as a composition containing an insulating resin, for example.
  • insulating resins include polyphenylsulfone (PPS), polyethersulfone (PES), cyanate ester resin, fluorine resin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), and soluble polyimide.
  • Compositions comprising siloxane and epoxy resins, polyimide resins, polyamideimide resins, derivatives or precursors thereof, and the like are included.
  • the application of the mask material can be performed by methods such as screen printing, roller transfer, dispenser application, and inkjet printing.
  • the solid electrolyte layer 40 is provided on the dielectric layer 20 . As shown in FIG. 5 , the solid electrolyte layer 40 is preferably provided so as to fill a plurality of pores (recesses) of the valve metal substrate 10 . However, it suffices that a portion of the outer surface of the dielectric layer 20 is covered with the solid electrolyte layer 40, and there are pores (recesses) of the valve metal substrate 10 that are not filled with the solid electrolyte layer 40. good too.
  • the material forming the solid electrolyte layer 40 for example, conductive polymers such as polypyrroles, polythiophenes, and polyanilines are used. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene) called PEDOT is particularly preferred. Moreover, the conductive polymer may contain a dopant such as polystyrene sulfonic acid (PSS).
  • PSS polystyrene sulfonic acid
  • the solid electrolyte layer 40 is formed by depositing a conductive material such as poly(3,4-ethylenedioxythiophene) on the surface of the dielectric layer 20 using a liquid containing a polymerizable monomer such as 3,4-ethylenedioxythiophene. It is formed by a method of forming a polymeric film, a method of applying a dispersion of a conductive polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric layer 20 and drying it, or the like. .
  • the inner layer can be formed by, for example, a dipping method, sponge transfer, screen printing, dispenser coating, inkjet printing, or the like.
  • the outer layer can be formed by, for example, dipping, sponge transfer, screen printing, dispenser coating, inkjet printing, or the like.
  • the carbon layer 50 is provided on the solid electrolyte layer 40 .
  • the carbon layer 50 is formed by, for example, a method of applying carbon paste to the surface of the solid electrolyte layer 40 and drying the paste.
  • the carbon paste can be applied by, for example, dipping, sponge transfer, screen printing, spray coating, dispenser coating, inkjet printing, or other methods.
  • the cathode conductor layer 60 is provided on the carbon layer 50 .
  • the cathode conductor layer 60 is formed, for example, by applying a conductive paste containing metal such as gold, silver, copper, platinum, etc. to the surface of the carbon layer 50 and drying the paste.
  • Cathode conductor layer 60 is preferably a silver layer.
  • the conductive paste can be applied by, for example, dipping, sponge transfer, screen printing, spray coating, dispenser coating, inkjet printing, or the like.
  • the tip of the carbon layer is at the same position as the tip of the solid electrolyte layer, and the tip of the cathode conductor layer is positioned closer to the cathode than the tip of the carbon layer. It is in. However, the top of the arcuate tip of the cathode conductor layer is at the same position as the top of the arcuate tip of the carbon layer.
  • FIG. 6 is a plan view schematically showing an example of the solid electrolytic capacitor element according to the second embodiment of the invention.
  • 7 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 6 taken along line XX.
  • 8 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 6 along line YY.
  • Solid electrolytic capacitor element 2 shown in FIGS. A solid electrolyte layer 40 provided thereon, a carbon layer 50 provided on the solid electrolyte layer 40 , and a cathode conductor layer 60 provided on the carbon layer 50 .
  • FIG. 9A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 6.
  • FIG. 9C is a plan view schematically showing
  • an insulating mask layer 30 having a predetermined width is provided around the dielectric layer 20. As shown in FIGS. The insulating mask layers 30 are provided on both main surfaces and both side surfaces of the valve-acting metal substrate 10 along the short sides of the valve-acting metal substrate 10 . The insulating mask layer 30 separates the valve metal substrate 10 into an anode portion 31 and a cathode portion 32 .
  • the solid electrolyte layer 40 is provided on the dielectric layer 20 of the cathode section 32. As shown in FIGS. Solid electrolyte layer 40 is provided such that tip 40 a covers the outer surface of insulating mask layer 30 . Solid electrolyte layer 40 may be provided so as to partially cover the outer surface of insulating mask layer 30 , or may be provided so as to cover the entire outer surface of insulating mask layer 30 .
  • the carbon layer 50 is provided so that the tip 50a covers the same position as the tip 40a of the solid electrolyte layer 40 on the outer surface of the insulating mask layer 30. .
  • the cathode conductor layer 60 is provided so that the tip 60a covers a position on the outer surface of the insulating mask layer 30 closer to the cathode section 32 than the tip 50a of the carbon layer 50 is.
  • the top of the tip 60 a of the cathode conductor layer 60 is at the same position as the top of the tip 50 a of the carbon layer 50 .
  • the cathode section 32 has cathode conductor layer non-formation regions A1 and A2 where the cathode conductor layer 60 does not partially cover the carbon layer 50 .
  • the cathode conductor layer 60 when viewed from the direction normal to the main surface of the valve metal substrate 10, the cathode conductor layer 60 has a tip 60a whose central portion is located on the insulating mask layer 30 and whose tip 60a is located on the insulating mask layer 30. Both ends are preferably provided so as to be positioned on the cathode section 32 .
  • the cathode conductor layer 60 is provided so as to approach the insulating mask layer 30 from both end portions of the tip 60a toward the central portion of the tip 60a. preferably.
  • the tip of the carbon layer is closer to the cathode than the tip of the solid electrolyte layer, and the tip of the cathode conductor layer is closer to the cathode than the tip of the carbon layer. It is located on the side of the department. However, the top of the arcuate tip of the cathode conductor layer is at the same position as the top of the arcuate tip of the carbon layer.
  • FIG. 10 is a plan view schematically showing an example of the solid electrolytic capacitor element according to the third embodiment of the invention.
  • 11 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 10 taken along line XX.
  • 12 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 10 taken along line YY.
  • the solid electrolytic capacitor element 3 shown in FIGS. 10, 11 and 12 comprises a valve action metal substrate 10 having a dielectric layer 20 on its surface, an insulating mask layer 30 provided on the dielectric layer 20, and the dielectric layer 20.
  • FIG. 13A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 10.
  • FIG. 13C is a plan view schematically showing
  • an insulating mask layer 30 having a predetermined width is provided around the dielectric layer 20. As shown in FIGS. The insulating mask layers 30 are provided on both main surfaces and both side surfaces of the valve-acting metal substrate 10 along the short sides of the valve-acting metal substrate 10 . The insulating mask layer 30 separates the valve metal substrate 10 into an anode portion 31 and a cathode portion 32 .
  • the solid electrolyte layer 40 is provided on the dielectric layer 20 of the cathode section 32. As shown in FIGS. Solid electrolyte layer 40 is provided such that tip 40 a covers the outer surface of insulating mask layer 30 . Solid electrolyte layer 40 may be provided so as to partially cover the outer surface of insulating mask layer 30 , or may be provided so as to cover the entire outer surface of insulating mask layer 30 .
  • the carbon layer 50 is formed so that the tip 50a covers a position closer to the cathode section 32 than the tip 40a of the solid electrolyte layer 40 on the outer surface of the insulating mask layer 30. is provided in
  • the cathode conductor layer 60 is provided so that the tip 60a covers a position on the outer surface of the insulating mask layer 30 closer to the cathode section 32 than the tip 50a of the carbon layer 50 is.
  • the top of the tip 60 a of the cathode conductor layer 60 is at the same position as the top of the tip 50 a of the carbon layer 50 .
  • the cathode section 32 has cathode conductor layer non-forming regions A1 and A2 in which the cathode conductor layer 60 does not partially cover the carbon layer 50. As shown in FIGS. 10 and 12, the cathode section 32 has cathode conductor layer non-forming regions A1 and A2 in which the cathode conductor layer 60 does not partially cover the carbon layer 50. As shown in FIGS. 10 and 12, the cathode section 32 has cathode conductor layer non-forming regions A1 and A2 in which the cathode conductor layer 60 does not partially cover the carbon layer 50. As shown in FIGS.
  • the cathode conductor layer 60 when viewed from the direction normal to the main surface of the valve metal substrate 10, the cathode conductor layer 60 has a tip 60a whose central portion is located on the insulating mask layer 30 and whose tip 60a is located on the insulating mask layer 30. Both ends are preferably provided so as to be positioned on the cathode section 32 .
  • the cathode conductor layer 60 is provided so as to approach the insulating mask layer 30 from both end portions of the tip 60a toward the central portion of the tip 60a. preferably.
  • the arc-shaped tip of the carbon layer is positioned closer to the cathode than the arc-shaped tip of the solid electrolyte layer, and the arc-shaped tip of the cathode conductor layer is positioned closer to the carbon layer. It may be positioned closer to the cathode portion than the arc-shaped tip, or the arc-shaped tip of the carbon layer is at the same position as the arc-shaped tip of the solid electrolyte layer, and the arc-shaped tip of the cathode conductor layer is at the same position as the carbon layer. may be positioned closer to the cathode than the arcuate tip of the .
  • the solid electrolytic capacitor element of the present invention is manufactured, for example, by the following method.
  • a method for simultaneously manufacturing a plurality of solid electrolytic capacitor elements using a large-sized valve action metal substrate will be described.
  • FIG. 14 is a schematic diagram showing an example of a process for preparing a valve-acting metal base on which an insulating mask layer is formed.
  • Valve action metal substrate 10A having a dielectric layer 20 on its surface is prepared.
  • Valve action metal substrate 10A includes a plurality of element portions 11 and support portions 12 .
  • Each element portion 11 is strip-shaped and protrudes from the support portion 12 .
  • An insulating mask layer 30 is formed on the dielectric layer 20 of each element portion 11 .
  • valve action metal substrate 10A having a porous portion on its surface is cut by laser processing, punching, or the like to be processed into a shape including a plurality of element portions 11 and support portions 12 .
  • insulating mask layers 30 are formed on both main surfaces and both side surfaces of each element portion 11 along the short sides of each element portion 11 .
  • valve action metal substrate 10A is anodized to form an oxide film that will become the dielectric layer 20 on the surface of the valve action metal substrate 10A.
  • an oxide film is also formed on the side surfaces of the element portion 11 cut by laser processing, punching, or the like.
  • a chemically processed foil on which aluminum oxide has already been formed may be used as the valve action metal substrate 10A.
  • an oxide film is formed on the side surface of the cut element portion 11 by anodizing the cut valve metal substrate 10A.
  • FIG. 15 is a schematic diagram showing an example of the process of forming a solid electrolyte layer.
  • a solid electrolyte layer 40 (see FIG. 4B, etc.) is formed on the dielectric layer 20 of the element section 11 .
  • FIG. 15 shows a state in which the processing liquid 70 containing the solid electrolyte is supplied to the processing bath 75 .
  • a conductive polymer dispersion is used as the treatment liquid 70 containing a solid electrolyte.
  • a conductive polymer film can be formed by applying a conductive polymer dispersion to the outer surface of the dielectric layer 20 and drying it.
  • a liquid containing a polymerizable monomer such as 3,4-ethylenedioxythiophene and an oxidizing agent may be used as the treatment liquid 70 containing a solid electrolyte.
  • a liquid containing a polymerizable monomer can be attached to the outer surface of the dielectric layer 20 to form a conductive polymer film by chemical polymerization. This conductive polymer film becomes the solid electrolyte layer 40 .
  • the treatment liquid 70 is impregnated into the porous portion of the valve action metal substrate 10A.
  • the valve metal substrate 10A is pulled out of the treatment liquid 70 and dried at a predetermined temperature for a predetermined time.
  • the solid electrolyte layer 40 is formed by repeating immersion in the treatment liquid 70 , pulling up, and drying a predetermined number of times.
  • the first solid electrolyte layer is formed by immersing the valve metal substrate 10A in a first dispersion containing a conductive polymer, pulling it out, and drying it. Immersion in the first dispersion, pulling out, and drying are performed multiple times.
  • the primer layer may be formed by immersing the valve metal substrate 10A in a solution containing a primer compound, pulling it out, and drying it.
  • valve metal substrate 10A is immersed in a second dispersion containing a conductive polymer, pulled out, and dried to form a second solid electrolyte layer.
  • concentration of the conductive polymer in the second dispersion is preferably higher than the concentration of the conductive polymer in the first dispersion.
  • the solid electrolyte layer formed by the above method includes a first solid electrolyte layer provided on the dielectric layer and a second solid electrolyte layer provided on the first solid electrolyte layer.
  • the content of the conductive polymer in the second solid electrolyte layer is higher than the content of the conductive polymer in the electrolyte layer.
  • valve action metal substrate 10A is washed with pure water to remove excess primer compound. After washing, a drying process is performed. As described above, the solid electrolyte layer 40 is formed in a predetermined region.
  • FIG. 16 is a plan view schematically showing an example of an element portion after forming a solid electrolyte layer. 17 is a cross-sectional view of the element portion shown in FIG. 16 along line XX.
  • the thickness of the solid electrolyte layer 40c provided in the region of the cathode section 32 contacting the insulating mask layer 30 is greater than the thickness of the solid electrolyte layer 40b provided in the central region of the cathode section 32. is preferred.
  • the tunnel current will cause a short circuit, or Leakage current may increase.
  • the thickness of the solid electrolyte layer 40c in the vicinity of the insulating mask layer 30 in the cathode section 32 is made larger than the thickness of the solid electrolyte layer 40b in the central region of the cathode section 32.
  • valve metal substrate 10A is immersed in the carbon paste, pulled out, and dried to form the carbon layer 50 (see FIG. 4C, etc.) in a predetermined region.
  • valve metal substrate 10A is immersed in a conductive paste such as silver paste, pulled out, and dried to form a cathode conductor layer 60 (see FIG. 1, etc.) in a predetermined area.
  • a conductive paste such as silver paste
  • the element portion 11 is separated by cutting the valve action metal substrate 10A.
  • a solid electrolytic capacitor element is obtained through the above steps.
  • Solid electrolytic capacitor An example of a solid electrolytic capacitor including the solid electrolytic capacitor element of the present invention will be described below.
  • the solid electrolytic capacitor element of the present invention may be included in solid electrolytic capacitors having other configurations.
  • lead frames may be used as external electrodes.
  • the solid electrolytic capacitor of the present invention may include solid electrolytic capacitor elements other than the solid electrolytic capacitor element of the present invention.
  • FIG. 18 is a perspective view schematically showing an example of the solid electrolytic capacitor of the present invention.
  • 19 is a cross-sectional view of the solid electrolytic capacitor shown in FIG. 18 taken along line ZZ.
  • L indicates the length direction of the solid electrolytic capacitor 100 and the exterior body 110
  • W indicates the width direction
  • T indicates the height direction.
  • the length direction L, the width direction W, and the height direction T are orthogonal to each other.
  • the solid electrolytic capacitor 100 has a substantially rectangular parallelepiped shape.
  • a solid electrolytic capacitor 100 includes an exterior body 110 , a first external electrode 120 , a second external electrode 130 , and a plurality of solid electrolytic capacitor elements 1 .
  • Solid electrolytic capacitor element 1 is an example of the solid electrolytic capacitor element of the present invention.
  • the exterior body 110 seals a plurality of solid electrolytic capacitor elements 1 . That is, a plurality of solid electrolytic capacitor elements 1 are embedded in exterior body 110 . Note that the exterior body 110 may seal one solid electrolytic capacitor element 1 . That is, one solid electrolytic capacitor element 1 may be embedded inside the exterior body 110 .
  • the exterior body 110 has a substantially rectangular parallelepiped outer shape.
  • the exterior body 110 has a first major surface 110a and a second major surface 110b that face each other in the height direction T, a first side face 110c and a second side face 110d that face each other in the width direction W, and a first side face 110c and a second side face 110d that face each other in the length direction L. It has one end face 110e and a second end face 110f.
  • the exterior body 110 has a substantially rectangular parallelepiped outer shape, and the corners and ridges are preferably rounded.
  • a corner is a portion where three surfaces of the exterior body 110 intersect, and a ridge is a portion where two surfaces of the exterior body 110 intersect.
  • the exterior body 110 is made of sealing resin, for example.
  • the sealing resin contains at least resin, and preferably contains resin and filler.
  • epoxy resin epoxy resin, phenol resin, polyimide resin, silicone resin, polyamide resin, liquid crystal polymer, etc. are preferably used.
  • Silica particles, alumina particles, metal particles, etc. are preferably used as fillers.
  • a material containing solid epoxy resin, phenol resin, and silica particles is preferably used as the sealing resin.
  • resin molds such as compression molds and transfer molds are preferably used, and compression molds are more preferably used.
  • molding methods such as a dispensing method and a printing method are preferably used. Among them, it is preferable to seal the periphery of the solid electrolytic capacitor element 1 with a sealing resin by compression molding to form the exterior body 110 .
  • the exterior body 110 may be composed of a substrate and a sealing resin provided on the substrate.
  • the substrate is, for example, an insulating resin substrate such as a glass epoxy substrate.
  • the bottom surface of the substrate constitutes the second main surface 110b of the exterior body 110.
  • the thickness of the substrate is, for example, 100 ⁇ m.
  • a plurality of solid electrolytic capacitor elements 1 are stacked in the height direction T.
  • the extension direction of each of the plurality of solid electrolytic capacitor elements 1 is substantially parallel to the first main surface 110a and the second main surface 110b of the exterior body 110 .
  • Solid electrolytic capacitor elements 1 may be bonded to each other via a conductive adhesive.
  • the first external electrode 120 is provided on the first end face 110e of the exterior body 110.
  • the first external electrode 120 is provided from the first end surface 110e of the exterior body 110 over each of the first main surface 110a, the second main surface 110b, the first side surface 110c and the second side surface 110d.
  • First external electrode 120 is electrically connected to valve metal substrate 10 of solid electrolytic capacitor element 1 exposed from exterior body 110 .
  • the first external electrode 120 may be directly or indirectly connected to the valve metal substrate 10 at the first end face 110 e of the exterior body 110 .
  • the second external electrode 130 is provided on the second end face 110f of the exterior body 110.
  • the second external electrode 130 is provided from the second end surface 110f of the exterior body 110 over each of the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d.
  • Second external electrode 130 is electrically connected to cathode conductor layer 60 of solid electrolytic capacitor element 1 exposed from package 110 .
  • the second external electrode 130 may be directly or indirectly connected to the cathode conductor layer 60 at the second end surface 110 f of the outer casing 110 .
  • the first external electrode 120 and the second external electrode 130 are each formed by a dip coating method, a screen printing method, a transfer method, an inkjet printing method, a dispensing method, a spray coating method, a brush coating method, a drop casting method, an electrostatic coating method, It is preferably formed by at least one method selected from the group consisting of plating and sputtering.
  • the first external electrode 120 preferably has a resin electrode layer containing a conductive component and a resin component. Since the first external electrode 120 contains a resin component, the adhesion between the first external electrode 120 and the sealing resin of the exterior body 110 is enhanced, thereby improving reliability.
  • the second external electrode 130 preferably has a resin electrode layer containing a conductive component and a resin component. Since the second external electrode 130 contains a resin component, the adhesion between the second external electrode 130 and the sealing resin of the exterior body 110 is enhanced, thereby improving the reliability.
  • the conductive component preferably contains, as a main component, an elemental metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals.
  • the resin component preferably contains epoxy resin, phenol resin, etc. as the main component.
  • the resin electrode layer is formed by methods such as dip coating, screen printing, transfer, inkjet printing, dispensing, spray coating, brush coating, drop casting, and electrostatic coating.
  • the resin electrode layer is preferably a printed resin electrode layer formed by applying a conductive paste by a screen printing method.
  • the resin electrode layer is formed by applying a conductive paste by a screen printing method, compared with the case where the resin electrode layer is formed by applying a conductive paste by a dip coating method, the first external electrode 120 And the second external electrode 130 tends to be flat. That is, the thicknesses of the first external electrode 120 and the second external electrode 130 tend to be uniform.
  • At least one of the first external electrode 120 and the second external electrode 130 may have a so-called plated layer formed by a plating method.
  • plating layers include zinc/silver/nickel layers, silver/nickel layers, nickel layers, zinc/nickel/gold layers, nickel/gold layers, zinc/nickel/copper layers, and nickel/copper layers.
  • a copper plated layer, a nickel plated layer, and a tin plated layer are preferably provided in this order (or with the exception of some plated layers).
  • At least one of the first external electrode 120 and the second external electrode 130 may have both a resin electrode layer and a plating layer.
  • the first external electrode 120 may have a resin electrode layer connected to the valve metal substrate 10 and an outer plated layer provided on the surface of the resin electrode layer.
  • the first external electrode 120 includes an inner plated layer connected to the valve action metal substrate 10, a resin electrode layer provided to cover the inner plated layer, and an outer plated layer provided on the surface of the resin electrode layer. and a layer.
  • Example 10 As Examples 1 to 10, a total of 10 solid electrolytic capacitor elements 1 shown in FIGS. 1, 2 and 3 were produced. The manufacturing method is shown below.
  • a strip-shaped valve action metal substrate 10A having a plurality of element portions 11 is formed by laser processing or punching.
  • the valve action metal substrate 10A has a porous portion etched with hydrochloric acid or the like.
  • An insulating mask layer 30 is formed on both main surfaces and both side surfaces of the element portion 11 along the short sides of the element portion 11 .
  • the dimension of the capacitance part in one element part 11 is set to a predetermined dimension in the length direction L: 4.5 mm or more and 7.0 mm or less, and the width direction W dimension: 3.0 mm or more and 4.0 mm.
  • An insulating mask layer 30 is formed on the .
  • the insulating mask layer 30 is formed so that the length along the length direction L of the capacitor portion is 0.5 mm or more and 2 mm or less.
  • valve action metal substrate 10 is anodized to form an oxide film that will become the dielectric layer 20 on the element portion 11 .
  • An oxide film is also formed on the side surface of the element portion 11 that has been laser processed or punched.
  • An oxide film is formed by anodizing the valve metal substrate 10A in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or sodium salts or ammonium salts thereof.
  • the dispersion By immersing the valve metal substrate 10A in a dispersion containing a conductive polymer that constitutes the first solid electrolyte layer, the dispersion is impregnated to form the first solid electrolyte layer in the region shown in FIG. 4B. Form. A drying process is performed after the immersion. (4) is repeated several times. By optimizing the drawing-down speed (immersion speed) in the immersion conditions, the impregnation of the porous portion with the dispersion is improved, and as a result, the capacitance described later is improved.
  • a solution containing a primer compound (see Japanese Patent No. 6449914; bifunctional or polyfunctional monomeric compound containing at least one amine group and at least one carboxylic acid group or sulfonic acid group);
  • a primer layer is formed in the areas shown in FIG. 4B.
  • a drying process is performed after the immersion.
  • immersion speed specifically, the speed at which the solution containing the primer compound permeates the valve action metal substrate 10A having a porous portion. Since the impregnation property to the porous portion is improved by making the pulling down speed slower than that, the adhesion amount of the primer compound after drying is increased.
  • the second solid electrolyte layer is formed in the region shown in FIG. 4B by being impregnated with the dispersion. Form. A drying process is performed after the immersion.
  • the drying process if the strip-shaped valve action metal substrate 10A is dried in a state of being turned over 180 degrees during drying, the solution containing the solid electrolyte tends to accumulate in the vicinity of the insulating mask layer 30, so that cross-linking with the primer compound occurs.
  • the reaction increases the thickness of the second solid electrolyte layer after drying. If the drying process (5) is turned 180 degrees, the cross-linking reaction with the primer compound is further promoted, so the thickness of the second solid electrolyte layer after drying is increased, but only the immersion conditions are optimized. But it works. These improve the equivalent series resistance (ESR), which will be described later.
  • ESR equivalent series resistance
  • the second solid electrolyte layer is formed by impregnating it with a dispersion having a higher conductive polymer concentration than the first solid electrolyte layer.
  • the thickness of the solid electrolyte layer 40 near the insulating mask layer 30 in the cathode portion 32 is greater than the thickness of the central region of the cathode portion 32 .
  • the strip-shaped valve action metal substrate 10A is washed with pure water to remove excess primer compound. After washing, a drying process is performed.
  • a carbon layer 50 is formed in the region shown in FIG. 4C by immersing the valve metal substrate 10A in carbon paste. A drying process is performed after the immersion.
  • the cathode conductor layer 60 is formed in the region shown in FIG. 1 by immersing the valve metal substrate 10A in silver paste. A drying process is performed after the immersion.
  • Comparative example As Comparative Examples 1 to 10, a total of 10 solid electrolytic capacitor elements 1A shown in FIGS. 20 and 21 were produced. The manufacturing method is the same as that of the example.
  • FIG. 20 is a plan view schematically showing an example of a solid electrolytic capacitor element according to Comparative Example. 21 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 20 taken along line XX.
  • a solid electrolytic capacitor element 1A shown in FIGS. a carbon layer 50 provided on the solid electrolyte layer 40 , and a cathode conductor layer 60 provided on the carbon layer 50 .
  • FIG. 22A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22C is a plan view schematically showing an example of a dielectric layer, an insulating mask layer, a solid electrolyte layer and a carbon layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22A is a plan view schematically showing an example of a dielectric layer and an insulating mask layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22B is a plan view schematically showing an example of a dielectric layer, an insulating mask layer and a solid electrolyte layer that constitute the solid electrolytic capacitor element shown in FIG. 20.
  • FIG. 22C is a
  • an insulating mask layer 30 having a predetermined width is provided around the dielectric layer 20 .
  • the insulating mask layers 30 are provided on both main surfaces and both side surfaces of the valve-acting metal substrate 10 along the short sides of the valve-acting metal substrate 10 .
  • the insulating mask layer 30 separates the valve metal substrate 10 into an anode portion 31 and a cathode portion 32 .
  • the solid electrolyte layer 40 is provided on the dielectric layer 20 of the cathode section 32. As shown in FIGS. The solid electrolyte layer 40 is provided so that the tip thereof covers the outer surface of the insulating mask layer 30 . Solid electrolyte layer 40 may be provided so as to partially cover the outer surface of insulating mask layer 30 , or may be provided so as to cover the entire outer surface of insulating mask layer 30 .
  • the carbon layer 50 is provided so that the tip 50a covers the outer surface of the insulating mask layer 30, and the tip 50a extends from the outer surface of the insulating mask layer 30 to the solid electrolyte layer.
  • 40 is provided so as to cover the same position as the tip 40a.
  • the cathode conductor layer 60 is provided so that the tip 60 a covers the same position as the tip 50 a of the carbon layer 50 on the outer surface of the insulating mask layer 30 .
  • the cathode portion 32 does not have a cathode conductor layer non-formed region where the cathode conductor layer 60 does not partially cover the carbon layer 50 .
  • the solid electrolytic capacitor element according to the example has a lower equivalent series resistance and less leakage current defects than the solid electrolytic capacitor element according to the comparative example.

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