Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/70—Maintenance
  • B29C33/72—Cleaning
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C48/25—Component parts, details or accessories; Auxiliary operations
  • B29C48/27—Cleaning; Purging; Avoiding contamination
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
  • C08K5/41—Compounds containing sulfur bound to oxygen
  • C08K5/42—Sulfonic acids; Derivatives thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/02—Fibres or whiskers
  • C08K7/04—Fibres or whiskers inorganic
  • C08K7/14—Glass
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
  • C08L25/02—Homopolymers or copolymers of hydrocarbons
  • C08L25/04—Homopolymers or copolymers of styrene
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
  • C08L25/02—Homopolymers or copolymers of hydrocarbons
  • C08L25/04—Homopolymers or copolymers of styrene
  • C08L25/08—Copolymers of styrene
  • C08L25/12—Copolymers of styrene with unsaturated nitriles
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
  • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
  • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
  • C08L71/02—Polyalkylene oxides

Definitions

• the present disclosure relates to a resin composition for cleaning molding machines that can be used for cleaning molding machines used for molding resins, such as extrusion machines and injection molding machines.
• Detergents for cleaning molding machines used for resin molding such as extrusion machines and injection molding machines, are known.
• Japanese Patent No. 5409522 contains (a) 30 to 90% by mass of thermoplastic resin and (b) 70 to 10% by mass of glass fiber having an average length of 100 ⁇ m or less, and has a flash temperature of 400 ° C. or higher.
• An invention of a cleaning agent for a molding machine is described (claim).
• thermoplastic resin includes polystyrene, polyamide, styrene-acrylonitrile copolymer, and polycarbonate. (Paragraph No. 0031).
• Japanese Patent No. 5171573 contains 100 parts by weight of polycarbonate (A), 0.1 to 100 parts by weight of silicate compound (B) and 0.001 to 10 parts by weight of organic acid and/or organic acid derivative (C).
• an invention of a cleaning agent is disclosed in which a mixture of a silicate compound (B) and an organic acid and/or an organic acid derivative (C) has a pH value of 5 to 8 (claims).
• WO2019/069798A1 describes a detergent resin composition for injection molding machines and molds containing a thermoplastic resin and a surfactant having a TGA (thermogravimetry) decomposition initiation temperature of 200°C or more and a melting point of less than 100°C.
• TGA thermogravimetry
• the surfactant is described to be a sulfonate (alpha sulfo fatty acid methyl ester salt) (claim).
• thermoplastic resins which it is particularly preferable to include polyethylene (paragraph number 0021).
• melt mass flow rate (MFR) under the conditions of a test temperature ( ⁇ ) of 220° C. and a nominal load (Mnom) of 10 kg is 1 g/10 min to 40 g/10 min of styrene- 30 to 90 parts by mass of acrylonitrile copolymer resin;
• a cleaning resin composition comprising 70 to 10 parts by mass of a polycarbonate resin having a particle size of 130 cm 3 /10 min, and a total of 100 parts by mass of components (A) and (B).
• the content of the polycarbonate resin in the resin composition for cleaning is 70 to 10 parts by mass with respect to the total of 100 parts by mass of components (A) and (B), and 60 parts by mass. to 20 parts by mass, more preferably 50 to 30 parts by mass (Paragraph No. 0022).
• An object of the present disclosure is to provide a resin composition for cleaning molding machines, which has good cleaning performance for resin molding machines such as extrusion molding machines and injection molding machines.
• the cleaning resin composition of the present disclosure contains (A) polycarbonate resin, (B) styrenic resin and (C-1) polyoxyethylene polyoxypropylene glycol, Provided is a cleaning resin composition in which the content of component (C-1) is 0.5 to 3.5 parts by mass per 100 parts by mass of components (A) and (B) combined.
• the cleaning resin composition of the present disclosure comprises (A) polycarbonate resin, (B) styrenic resin, (C-1) polyoxyethylene polyoxypropylene glycol and (C- 2) Contains sodium alkyl (C10-16) benzenesulfonate, and the content of component (C-1) is 20 to 80% by mass in the total 100% by mass of component (C-1) and component (C-2) %, the content of component (C-2) is 80 to 20% by mass, and the total content of component (C-1) and component (C-2) is the total content of component (A) and component (B).
• a cleaning resin composition is provided in an amount of 1 to 5 parts by mass per 100 parts by mass.
• the cleaning resin composition of the present disclosure has excellent cleaning performance for resin molding machines such as extruders and injection molding machines.
• component (A) polycarbonate resin for example, the same ones as those described in JP-A-2019-127516, JP-A-2021-734 and JP-A-5171573 can be used.
• styrene resins of component include polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene- Styrene resins (MBS resins), butyl acrylate-acrylonitrile-styrene resins (AAS resins) and the like can be mentioned, and among these, AS resins are preferred.
• PS polystyrene
• HIPS high impact polystyrene
• AS resin acrylonitrile-styrene resin
• ABS resin acrylonitrile-butadiene-styrene resin
• MFS resins methyl methacrylate-butadiene- Styrene resins
• AS resins butyl acrylate-acrylonitrile-styrene resins
• the content of component (A) is preferably 60 to 95% by mass, more preferably 70 to 90% by mass, and even more preferably 75 to 90% by mass, in a total of 100% by mass of components (A) and (B).
• the content of component (B) is preferably 40 to 5% by mass, more preferably 30 to 10% by mass, even more preferably 25 to 10% by mass.
• the content of component (A) in the total 100 mass% of components (A) and (B) is 75 to 95 mass%, and the content of component (B) is 25 to 5 mass%. %.
• the content of component (A) may be 80% by mass and the content of component (B) may be 20% by mass in a total of 100% by mass of components (A) and (B). .
• the cleaning resin composition of the present disclosure further contains, as a surfactant, (C-1) contains polyoxyethylene polyoxypropylene glycol alone, or both (C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzenesulfonate can contain
• the alkyl group of the component (C-2) alkyl (C10-16) sodium benzenesulfonate may be either a straight-chain alkyl group or a branched-chain alkyl group, but a straight-chain alkyl group is preferred, and the number of carbon atoms in the alkyl group is 10 to 13 are preferred.
• the content ratio is preferably 0.5 to 3.5 parts by mass, and 1 to 3.5 parts by mass per 100 parts by mass of the components (A) and (B). 5 parts by mass is more preferable, and 1.5 to 3 parts by mass is even more preferable.
• the content ratio when component (C-1) is contained alone may be 3 parts by mass with respect to the total of 100 parts by mass of components (A) and (B).
• the content ratio is preferably 1 to 5 parts by mass in total with respect to 100 parts by mass of components (A) and (B). , more preferably 1.5 to 4 parts by weight, more preferably 2 to 4 parts by weight.
• the content ratio when both the (C-1) component and the (C-2) component are contained is the total of 100 parts by mass of the component (A) and the component (B) may be 2 to 3 parts by mass.
• the content ratio of each is, in the total 100% by mass of the (C-1) component and the (C-2) component, (C-1
• the content of component (C-2) is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and the content of component (C-2) is preferably 80 to 20% by mass, more preferably 70 to 30% by mass.
• the mass ratio of the (C-1) component and the (C-2) component when both the (C-1) component and the (C-2) component are contained ((C-1) /(C-2)) can be from 1/2 to 2/1.
• the cleaning resin composition of the present disclosure contains other surfactants (anionic surfactants, nonionic surfactants, etc.) in addition to the components (C-1) and (C-2) described above.
• the content of the other surfactants is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 2% by mass or less in the total amount of the surfactants.
• the cleaning resin composition of the present disclosure can contain glass fiber as the (E) component.
• the glass fiber of component (E) known E-glass, C-glass, S-glass, and D-glass can be used, but glass fiber of E-glass is preferable.
• the content of component (E) is preferably 10 to 100 parts by mass per 100 parts by mass of components (A) and (B) combined. In one specific example, the content of component (E) may be 85 parts by mass with respect to a total of 100 parts by mass of components (A) and (B).
• the cleaning resin composition of the present disclosure is prepared by pre-mixing the above components with a mixer such as a Henschel mixer, a tumbler blender, or a kneader, followed by kneading with an extruder, or melt-kneading with a heating roll, Banbury mixer, or the like. It can be manufactured by a mixer such as a Henschel mixer, a tumbler blender, or a kneader, followed by kneading with an extruder, or melt-kneading with a heating roll, Banbury mixer, or the like. It can be manufactured by a mixer such as a Henschel mixer, a tumbler blender, or a kneader, followed by kneading with an extruder, or melt-kneading with a heating roll, Banbury mixer, or the like. It can be manufactured by a mixer such as a Henschel mixer, a tumbler blender,
• component styrene resin SAN-A 100LS (Techno UMG Co., Ltd.)
• C-2) component linear alkyl (C10-13) sodium benzenesulfonate Nurex Soft 60-N (NOF Corporation) (C10: 8% by mass, C11: 32% by mass, C12: 34% by mass, C13: 26% by mass)
• Comparative (C) component Sodium alkanesulfonate: WeylClean SAS93 (Clariant Japan Co., Ltd.) Ethylene glycol distearate: Emanone 3201M-V (Kao Corporation)
• E component glass fiber ECS03 T-571 (Nippon Electric Glass Co., Ltd.)
• Polycarbonate resin Caliber 200-10 (Sumika Styron Polycarbonate Co., Ltd.)
• Black master PLASBLAK UN2014 (Cabot Plastics Hong Kong Ltd.)
• a polycarbonate resin and a black master were mixed at a ratio of 100:0.5 using a tumbler blender (mixing time: 20 seconds, mixing speed: 120 r/min).
• Slipperiness is related to the slippage between the cleaning resin composition and the screw or cylinder, and if the slippage becomes severe, problems such as an extremely long weighing time or an inability to measure occur.
• the inside of the injection molding machine is replaced (purged) with the cleaning resin composition at a cylinder temperature of 300°C, and the cleaning is completed when the black color of the previous material disappears visually.
• the cleaning performance of the cleaning resin composition was evaluated by measuring the mass (g).
• the thermal stability of the cleaning resin composition was evaluated based on whether or not white smoke containing gas originating from the cleaning resin composition was generated when replacing with the cleaning resin composition.
• a case where white smoke containing gas was not generated (good thermal stability) was evaluated as ⁇ , and a case where white smoke containing gas was generated (bad thermal stability) was evaluated as ⁇ . The presence or absence of the white smoke was visually confirmed.
• the inside of the injection molding machine is replaced with the cleaning resin composition at a cylinder temperature of 300 ° C., and the cleaning is completed when the black color of the previous material is no longer visible. ) was measured to evaluate the cleaning performance of the cleaning resin composition.
• Comparative Example 3 had poor slipperiness. In Comparative Example 4, the replacement with the transparent AS resin was not possible because the cleaning resin composition did not melt.
• the cleaning resin composition of the present disclosure can be used for cleaning resin molding machines such as extruders and injection molding machines.

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• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Detergent Compositions (AREA)
• Compositions Of Macromolecular Compounds (AREA)

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Publications (1)

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Citations (4)

• 2021
  • 2021-03-24 JP JP2021050165A patent/JP2022148466A/ja active Pending
• 2022
  • 2022-03-18 CN CN202280023029.4A patent/CN117042943A/zh active Pending
  • 2022-03-18 KR KR1020237032023A patent/KR20230159432A/ko unknown
  • 2022-03-18 WO PCT/JP2022/012529 patent/WO2022202649A1/ja active Application Filing

Patent Citations (4)

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