WO2022202333A1 - フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物 - Google Patents

フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物 Download PDF

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WO2022202333A1
WO2022202333A1 PCT/JP2022/010360 JP2022010360W WO2022202333A1 WO 2022202333 A1 WO2022202333 A1 WO 2022202333A1 JP 2022010360 W JP2022010360 W JP 2022010360W WO 2022202333 A1 WO2022202333 A1 WO 2022202333A1
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group
phenolic resin
resin composition
real number
curable resin
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PCT/JP2022/010360
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English (en)
French (fr)
Japanese (ja)
Inventor
篤彦 長谷川
政隆 中西
一真 井上
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日本化薬株式会社
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Priority to KR1020237031845A priority Critical patent/KR20230158497A/ko
Priority to CN202280023890.0A priority patent/CN117043219A/zh
Priority to JP2022548392A priority patent/JP7160511B1/ja
Publication of WO2022202333A1 publication Critical patent/WO2022202333A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • the present invention relates to a phenolic resin mixture, a curable resin composition, and a cured product thereof.
  • phenolic resins are used as curing agents for epoxy resins.
  • the resin composition has been improved in terms of moisture resistance, adhesion, dielectric properties, low viscosity for high filling of fillers (inorganic or organic fillers), and shortening of the molding cycle. Further improvements in various properties such as increased reactivity are required.
  • the shape of the semiconductor package has become more complicated with thinning, stacking, systemization, and three-dimensionalization in accordance with the change, and the pitch of the wire wiring is becoming narrower and finer. Poor fluidity of the resin composition induces wire sweep. Furthermore, a burden is placed on the connection portion of the wire, which has an adverse effect.
  • a method called mold underfill (hereinafter referred to as "MUF"), which seals at once without using underfill, is attracting attention from the viewpoint of a low-cost manufacturing method.
  • the resin needs to pass through a very narrow gap between the chip and the package substrate, so miniaturization of the filler is important.
  • the viscosity of the system increases, causing voids (air gaps) to occur.
  • the sealing resin used in the rewiring layer of wafer-level packages and the correlative insulating film used in the build-up layer must be thin. Since it is necessary to fill the resin composition with a filler, it is also desired to lower the viscosity of the resin composition.
  • Patent Document 1 crystalline epoxy resins is being studied.
  • problems such as that there is a limit to the decrease in fluidity during molding, and that it is difficult to maintain handling properties due to the loss of crystallinity due to mixing with phenol resin after making a composition.
  • a crystalline epoxy resin when used, it must be kneaded at a temperature above the melting point of the crystalline epoxy resin in a kneader, otherwise the epoxy resin will not be sufficiently melted and uniformly dispersed.
  • the molded product of the resin molding material becomes non-uniform, and the strength of the molded product differs depending on the part, so that the characteristics of the semiconductor device deteriorate.
  • the curing reaction proceeds in the kneader, which may lead to a decrease in fluidity and the generation of gelled substances that cause unfilling during molding. .
  • the crystallinity remains even after heat kneading, and this residual crystal melts only during molding, resulting in low curability, burrs and voids, and poor curability.
  • the formed semiconductor device may be inferior in formability, such as stains being likely to be formed on the surface thereof.
  • Patent Document 2 in order to solve the problem of undissolved residue when using a crystalline phenol compound, a quaternary phosphonium compound in a molten state is used as a solvent, and a crystalline phenol compound is added to the solvent. It discloses that the complete dissolution provides a molten mixture that does not leave undissolved parts and has excellent storage stability. However, since it involves heating and melting at about 100° C., there is a possibility that a stable and homogeneous resin composition cannot be obtained when cooled to room temperature.
  • the present invention relates to the following [1] to [5].
  • [1] containing a phenolic resin (A) represented by the following formula (1) or the following formula (2) and a crystalline alkyl-substituted biphenol compound (B) having a melting point of 70 to 300° C.; Phenolic resin mixtures in which the weight ratio of component (B) is from 95/5 to 85/15.
  • R 1 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group which may have the same substituents as described above
  • p is a real number of 0 to 3.
  • n is a repeating number and is a real number of 1 to 20.
  • R 1 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group which may have the same substituents as described above
  • p is a real number of 0 to 3.
  • n is a repeating number and is a real number of 1 to 20.
  • the phenolic resin mixture of the present invention has very high fluidity and excellent handling properties, it contributes to productivity, and is used as an insulating material for electric and electronic parts, laminates (printed wiring boards, build-up boards, etc.) and carbon fiber reinforced composite materials. (hereinafter also referred to as "CFRP"), various composite materials, adhesives, paints and the like. It is particularly useful as a semiconductor encapsulating material for protecting semiconductor elements.
  • the phenol resin mixture of the present invention comprises a phenol resin represented by the following formula (1) or formula (2) (hereinafter also referred to as component (A)) and a crystalline alkyl having a melting point of 70 to 300 ° C. It contains a substituted biphenol compound (B) (hereinafter also referred to as component (B)).
  • R 1 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group which may have the same substituents as described above
  • p is a real number of 0 to 3.
  • n is a repeating number and is a real number of 1 to 20.
  • R 1 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group which may have the same substituents as described above
  • p is a real number of 0 to 3.
  • n is a repeating number and is a real number of 1 to 20.
  • R 1 in the above formulas (1) and (2) is preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, A hydrogen atom is particularly preferred.
  • p is a real number of 0 or 1, particularly preferably 0.
  • n in the formulas (1) and (2) is the value of the number average molecular weight obtained by measurement of phenolic resin gel permeation chromatography (GPC, detector: RI), or each of the separated peaks can be calculated from the area ratio of
  • n in the formulas (1) and (2) is usually 1-20, preferably 1.1-20, more preferably 1.1-10. If n is less than 1, the crystallinity is so strong that a homogeneous resin mixture cannot be obtained even by mechanical kneading. On the other hand, when n is larger than 20, the melt viscosity is high, and it is difficult to use from the viewpoint of fluidity and high filler filling.
  • the phenolic resins represented by the above formulas (1) and (2) can be synthesized based on publicly known synthesis methods, but can also be easily obtained from the market.
  • the phenolic resin represented by the formula (1) is KAYAHARD GPH-65 (manufactured by Nippon Kayaku Co., Ltd., softening point 65°C)
  • the phenolic resin represented by the formula (2) is MEHC-7840-4S (available from Meiwa Kasei Co., Ltd., softening point 58-65°C).
  • Component (B) is a biphenol compound with improved compatibility with component (A) by introducing an alkyl group.
  • a semi-crystalline phenolic resin mixture can be obtained by semi-melting and mixing the crystalline components to homogenously disperse them.
  • the term "semicrystalline” refers to a state in which the resin is turbid and not transparent, and in which fine crystals are uniformly dispersed in the resin.
  • the crystalline alkyl-substituted phenol resin is not completely melted, but is dispersed while maintaining the crystalline state to form a homogeneous semi-crystalline resin composition. It achieves both fluidity and handling characteristics. In other words, it can be used as a phenolic resin mixture with component (A) containing component (B) as an organic filler as a matrix.
  • the component (B) it is important to knead the component (B) at a temperature below the melting point and uniformly disperse it in the resin matrix. After kneading, whether or not the phenolic resin mixture maintains a crystalline state and is uniformly dispersed can be determined by visually confirming the appearance of the phenolic resin mixture after preparation. For example, if the resin and crystal clumps are dispersed unevenly, it indicates that the biphenol compound is not evenly dispersed. can.
  • the melting point of component (B) is usually 70-300°C, preferably 100-250°C. If the temperature is lower than 70° C., it is completely melted by the heat during kneading, making it difficult to maintain the crystallinity. If the temperature is higher than 300° C., the crystals do not melt and are not uniformly dispersed during curing and molding, making it difficult to produce a homogeneous cured product from this molding material.
  • the melting point can be determined from the endothermic peak temperature using, for example, a commercially available differential scanning calorimeter (DSC).
  • DSC differential scanning calorimeter
  • the molecular weight of component (B) is preferably as small as possible, preferably 190-400, more preferably 210-350, particularly preferably 240-300. Further, the hydroxyl equivalent of component (B) is 95 to 200 g/eq. is preferably 105 to 175 g/eq. is more preferably 120 to 150 g/eq. is particularly preferred.
  • the number of substituted alkyl groups is preferably 2-6. From the viewpoint of crystallinity, the number of substituted alkyl groups is preferably an even number of 2, 4, or 6.
  • the substituted alkyl group is preferably an alkyl group having 1 to 6 carbon atoms, such as methyl group, ethyl group, phenyl group and allyl group. Specific examples include dimethylbiphenol, tetramethylbiphenol, diallylbiphenol, diethylbiphenol, tetraethylbiphenol and diphenylbiphenol.
  • a 4- to 6-substituted biphenol compound when the substituted alkyl group is a methyl group or an ethyl group, a 4- to 6-substituted biphenol compound is preferable, and when the substituted alkyl group is a phenyl group or an allyl group, a disubstituted biphenol compound is preferable.
  • Disubstituted methyl or ethyl groups with small alkyl groups have high reactivity, so even if the molecular weight is small and the initial viscosity is low, the reactivity increases, and as a result, there is a risk that the fluidity will decrease. be.
  • a phenyl group or an allyl group having a large substituent group has a large effect, and tetra-substitution may conversely make the reaction difficult.
  • the total carbon number of the substituent is preferably 2-12, more preferably 4-10.
  • the component (B) used in the present invention may be commercially available or may be produced by a known method.
  • Specific compounds available as commercial products include, for example, 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl (manufactured by Tokyo Chemical Industry Co., Ltd.; melting point: 223-225°C; molecular weight: 242. 32 Total carbon number of substituents 4), 3,3'-dimethyl-4,4'-biphenol (manufactured by Songwon International Japan Co., Ltd.
  • the phenolic resin mixture of the present invention is obtained by uniformly mixing component (A) and component (B). However, it is preferable to mix at a temperature below the melting point of the component (B) and knead and mix so that the crystals are dispersed. Specifically, it is preferable to knead the mixture at a temperature below the melting point of the crystalline alkyl-substituted bifer compound and use it as an organic filler. In this case, if the crystals are not homogeneously dispersed, the ratio of the blended components (A) and (B) will change, which is undesirable because partial curing failure will occur. Specifically, it is preferable to knead at a temperature lower than 100°C.
  • the temperature exceeds 100°C, aggregation of the crystalline phenolic resin proceeds during cooling to room temperature, and the crystals are not uniformly dispersed. In addition, when heated and melted, it affects the stickiness of the obtained phenolic resin mixture, making it difficult to take out. Furthermore, there is a risk of productivity problems, such as difficulty in charging into the inlet. Therefore, in the present invention, kneading/mixing at a temperature below the melting point is preferred.
  • the obtained tablet-like, powder-like, sheet-like or granular mixture is characterized by being non-sticky even when stored at 20°C.
  • the phenolic resin mixture can be obtained by sufficiently mixing using an extruder, a kneader, a roll, or the like.
  • the weight ratio of component (A) and component (B) is usually 95/5 to 85/15, preferably 90/10 to 85/15. If the weight ratio of component (A) is greater than 95, fluidity will be poor. On the other hand, if the weight ratio of component (A) is less than 85, part of the phenolic resin mixture will crystallize unevenly at 20°C. That is, when the weight ratio of component (A) and component (B) is 95/5 to 85/15, it has fluidity at high temperatures and becomes non-sticky and uniform semi-crystalline at 20°C. Therefore, it has both fluidity and handling.
  • the hydroxyl equivalent of the phenolic resin mixture of the present invention is preferably 130-200 g/eq, more preferably 163-200/eq, and particularly preferably 186-200 g/eq. If the hydroxyl equivalent is less than 130 g/eq, the functional groups are contained in a large amount, so that the curing speed is increased, and sufficient fluidity may not be obtained. On the other hand, when the hydroxyl equivalent is more than 200 g/eq, the curability is poor and sufficient hardness may not be obtained.
  • the ICI melt viscosity (cone plate method) at 150° C. of the present invention is preferably 0.001 to 0.20 Pa s, more preferably 0.005 to 0.15 Pa s, particularly preferably 0.01 to It is 0.1 Pa ⁇ s.
  • the melt viscosity is lower than 0.001 Pa s, the melt viscosity is too low to maintain the dispersed state of the filler.
  • the shrinkage rate of the encapsulating material increases.
  • the curable resin composition of the present invention contains an epoxy resin.
  • epoxy resins that can be used include novolac type epoxy resins, bisphenol A type epoxy resins, biphenyl type epoxy resins, triphenylmethane type epoxy resins, and phenol aralkyl type epoxy resins.
  • bisphenol A bisphenol S, thiodiphenol, fluorene bisphenol, terpene diphenol, 4,4′-biphenol, 2,2′-biphenol, 3,3′,5,5′-tetramethyl-[ 1,1'-biphenyl]-4,4'-diol, hydroquinone, resorcinol, naphthalenediol, tris-(4-hydroxyphenyl)methane, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, phenol (phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetophenone, o-hydroxyacetophenone,
  • the curable resin composition of the invention may contain an inorganic filler.
  • Inorganic fillers include powders of crystalline silica, fused silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, boron nitride, zirconia, fosterite, steatite, spinel, titania, talc, etc. Beads formed by spheroidizing are included, but are not limited to these. These may be used independently and may use 2 or more types.
  • crystalline silica, fused silica, and alumina are preferred from the viewpoint of the balance of properties when it is assumed to be used as a semiconductor sealing material.
  • the content of these inorganic fillers is preferably 70 to 96% by mass with respect to 100% by mass of the curable resin composition of the present invention. In particular, it is preferably 70 to 93% by mass.
  • the fluidity is particularly high, if the amount of the inorganic filler is too small, the balance between the inorganic filler and the resin is disturbed, resulting in portions with a large amount of inorganic filler and portions with a small amount of inorganic filler in the molded product of the resin composition. Unfavorable in terms of iso-characteristics. Moreover, if the content of the inorganic filler exceeds 96%, it is not preferable because the fluidity cannot be obtained.
  • the phenolic resin mixture acts as a curing agent for the epoxy resin.
  • a curing agent not only the phenolic resin mixture of the present invention, but also other curing agents may be used in combination.
  • Other curing agents that can be used include phenolic compounds other than the phenolic resin of the present invention, amine compounds, acid anhydride compounds, amide compounds, carboxylic acid compounds, and the like.
  • phenolic resins and phenolic compounds include bisphenol A, bisphenol F, 3,3'-dimethyl-4,4'-bisphenol A, 3,3'-dimethyl-4,4'-bisphenol F, 3,3' , 5,5′-tetramethyl-4,4′-bisphenol A, 3,3′,5,5′-tetramethyl-4,4′-bisphenol F, bisphenol S, fluorene bisphenol, terpene diphenol, 4, 4'-biphenol, 2,2'-biphenol, hydroquinone, resorcinol, naphthalenediol, tris-(4-hydroxyphenyl)methane, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, phenols (phenol , alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde
  • phenol resins include phenol aralkyl resins (resins having an aromatic alkylene structure), and particularly preferably a structure having at least one selected from phenol, naphthol, and cresol, the alkylene moiety serving as a linker being benzene. structure, biphenyl structure, and naphthalene structure (specifically, Zyloc, naphthol Zyloc, phenolbiphenylene novolak resin, cresol-biphenylene novolak resin, phenol-naphthalene novolak resin, etc.) It is possible.).
  • amine-based compounds and amide-based compounds include nitrogen-containing compounds such as diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, and polyamide resin synthesized from a dimer of linolenic acid and ethylenediamine.
  • Acid anhydride compounds and carboxylic acid compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, and nadic anhydride.
  • hexahydrophthalic anhydride methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo[2,2,1]heptane-2,3-dicarboxylic anhydride, methylbicyclo[2,2,1]heptane- Acid anhydrides such as 2,3-dicarboxylic anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride; addition of various alcohols, carbinol-modified silicones, and the aforementioned acid anhydrides Examples include carboxylic acid resins obtained by reaction. Other examples include imidazole, trifluoroborane-amine complexes, and guanidine derivative compounds. The above and other curing agents are not limited to these. Moreover, these may be used independently and may use 2 or more types. In the present invention, it is particularly preferable to use a phenolic compound from the aspect of reliability.
  • the amount of the epoxy resin and the curing agent used is preferably 0.7 to 1.2 equivalents per equivalent of the epoxy group of the total epoxy resin. If the amount is less than 0.7 equivalents or if the amount exceeds 1.2 equivalents with respect to 1 equivalent of the epoxy group, curing may be incomplete and good cured physical properties may not be obtained.
  • the curable resin composition of the present invention may further contain a curing accelerator.
  • curing accelerators that can be used include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-(dimethylaminomethyl)phenol, 1,8-diaza -tertiary amines such as bicyclo(5,4,0)undecene-7, phosphines such as triphenylphosphine, tetrabutylammonium salts, triisopropylmethylammonium salts, trimethyldecanylammonium salts, cetyltrimethylammonium salts, etc.
  • quaternary phosphonium salts such as quaternary ammonium salts, triphenylbenzylphosphonium salts, triphenylethylphosphonium salts, and tetrabutylphosphonium salts.
  • the counter ions of the quaternary salt are halogen, organic acid ions, hydroxide ions, and the like, and are not particularly specified, but organic acid ions and hydroxide ions are particularly preferred.
  • metal compounds such as tin octylate;
  • the curing accelerator is used in an amount of 0.01 to 5.0 parts by mass based on 100 parts by mass of the epoxy resin.
  • the curable resin composition of the present invention contains various additives such as release agents such as silane coupling agents, stearic acid, palmitic acid, zinc stearate and calcium stearate, surfactants, dyes, pigments and ultraviolet absorbers. Compounding agents and various thermosetting resins can be added.
  • the curable resin composition of the present invention can be blended with a binder resin as needed.
  • binder resins include butyral resins, acetal resins, acrylic resins, epoxy-nylon resins, NBR-phenol resins, epoxy-NBR resins, polyamide resins, polyimide resins, and silicone resins. , but not limited to these.
  • the blending amount of the binder resin is preferably within a range that does not impair the flame retardancy and heat resistance of the cured product. Parts by mass are used as needed.
  • the curable resin composition of the present invention can contain a known maleimide compound as necessary.
  • usable maleimide compounds include 4,4′-diphenylmethanebismaleimide, polyphenylmethanemaleimide, m-phenylenebismaleimide, 2,2′-bis[4-(4-maleimidophenoxy)phenyl]propane, 3 ,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethanebismaleimide, 4-methyl-1,3-phenylenebismaleimide, 4,4′-diphenyletherbismaleimide, 4,4′-diphenylsulfone Bismaleimide, 1,3-bis(3-maleimidophenoxy)benzene, 1,3-bis(4-maleimidophenoxy)benzene, biphenylaralkyl-type maleimide, etc., but not limited thereto.
  • a curing accelerator may be blended as necessary, and the above-mentioned curing accelerators, organic peroxides, radical polymerization initiators such as azo compounds, and the like can be used.
  • the curable resin composition of the present invention is obtained by uniformly mixing the above-mentioned respective components in a predetermined ratio, usually precured at 130 to 180 ° C. for 30 to 500 seconds, and further cured at 150 to 200 ° C. After curing for 2 to 15 hours at , the curing reaction proceeds sufficiently to obtain the cured product of the present invention. It is also possible to uniformly disperse or dissolve the components of the curable resin composition in a solvent or the like, remove the solvent, and then cure the composition.
  • the curable resin composition of the present invention thus obtained has moisture resistance, heat resistance, high adhesiveness, low dielectric constant and low dielectric loss tangent. Therefore, the curable resin composition of the present invention can be used in a wide range of fields requiring moisture resistance, heat resistance, high adhesiveness, low dielectric constant and low dielectric loss tangent. Specifically, it is useful as an insulating material, laminate (printed wiring board, BGA substrate, build-up substrate, etc.), sealing material, resist, and all other materials for electrical and electronic parts. In addition to molding materials and composite materials, it can also be used in fields such as paint materials, adhesives, and 3D printing. Particularly in semiconductor encapsulation, solder reflow resistance is beneficial.
  • a semiconductor device has one sealed with the curable resin composition of the present invention.
  • semiconductor devices include DIP (dual in-line package), QFP (quad flat package), BGA (ball grid array), CSP (chip size package), SOP (small outline package), TSOP (thin small outline package), and TQFP. (think quad flat package) and the like.
  • the method for preparing the curable resin composition of the present invention is not particularly limited, it may be prepared by dispersing or dissolving each component in a solvent or the like, uniformly mixing, and optionally distilling off the solvent. , or may be prepolymerized.
  • the phenolic resin mixture epoxy resin of the present invention, amine compounds, maleimide compounds, cyanate ester compounds, phenolic resins, curing agents such as acid anhydride compounds, and other additives may be heated in the presence or absence of a solvent. prepolymerized by addition.
  • Mixing or prepolymerization of each component is carried out by using, for example, an extruder, kneader, rolls, etc. in the absence of a solvent, and by using a reactor equipped with a stirrer in the presence of a solvent.
  • a uniform curable resin composition is obtained by kneading using a device such as a kneader, roll, planetary mixer, etc. at a temperature within the range of 50 to 100 ° C. do.
  • a device such as a kneader, roll, planetary mixer, etc.
  • After pulverizing the obtained curable resin composition it is molded into a cylindrical tablet by a molding machine such as a tablet machine, or it is made into a granular powder or a powdery molding, or these compositions are used as a surface support. It is also possible to form a sheet having a thickness of 0.05 mm to 10 mm by melting above and forming a curable resin composition molded body.
  • the obtained molded article becomes a non-sticky molded article at 0 to 20°C, and its fluidity and curability hardly deteriorate even when stored at -25 to 0°C for 1 week or longer.
  • the resulting molded product can be molded into a cured product using a transfer molding machine or a compression molding machine.
  • An organic solvent can be added to the curable resin composition of the present invention to form a varnish-like composition (hereinafter simply referred to as varnish).
  • the curable resin composition of the present invention is dissolved in a solvent such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc. to form a varnish.
  • a solvent such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc.
  • Polyester fiber, polyamide fiber, alumina fiber, paper, etc. is impregnated into a base material and heat-dried to obtain a prepreg, which is hot-press molded to obtain a cured product of the curable resin composition of the present invention. .
  • the solvent is usually used in an amount of 10 to 70% by weight, preferably 15 to 70% by weight in the mixture of the curable resin composition of the present invention and the solvent. If the amount of solvent is less than this range, the viscosity of the varnish will increase and the workability will be deteriorated. Moreover, if it is a liquid composition, it is possible to obtain a curable resin-cured product containing carbon fibers by, for example, the RTM method.
  • the cured product of the present invention can be used for various purposes.
  • adhesives include adhesives for civil engineering, construction, automobiles, general office and medical use, as well as adhesives for electronic materials.
  • adhesives for electronic materials include interlayer adhesives for multilayer substrates such as build-up substrates, die bonding agents, adhesives for semiconductors such as underfill, underfill for BGA reinforcement, anisotropic conductive films ( ACF), mounting adhesives such as anisotropic conductive paste (ACP), and the like.
  • it is mainly used as a sealing material for semiconductors, but it can also be used as a substrate or as a mold underfill (MUF).
  • the main applications of encapsulants currently in use are potting, dipping, transfer molding encapsulation for capacitors, transistors, diodes, light-emitting diodes, ICs, LSIs, IC packages such as QFPs, BGAs, and CSPs.
  • Examples include sealing (including reinforcing underfill) at the time of similar mounting.
  • the gel time is the time required for the sealing material to lose its fluidity when heated at a constant temperature, and can be appropriately selected in relation to curing properties.
  • NC-3000 biphenyl aralkyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 277 g / eq)
  • MSR-2102 High-purity spherical silica filler (manufactured by Tatsumori Co., Ltd.)
  • TPP Triphenylphosphine (manufactured by Junsei Chemical Co., Ltd.)
  • the curable resin composition of the present invention can be used for insulating materials for electric and electronic parts, laminates (printed wiring boards, build-up boards, etc.) and carbon fiber reinforced composite materials (hereinafter also referred to as "CFRP"). It is useful for various composite materials, adhesives, paints, etc. It is particularly useful as a semiconductor encapsulating material for protecting semiconductor elements.

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JP2013006328A (ja) * 2011-06-23 2013-01-10 Sumitomo Bakelite Co Ltd 積層板、回路基板、および半導体パッケージ
JP2014210860A (ja) * 2013-04-19 2014-11-13 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP2015067615A (ja) * 2013-09-26 2015-04-13 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、およびその硬化物
JP2020070303A (ja) * 2017-03-07 2020-05-07 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

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JP2003041096A (ja) 2001-07-31 2003-02-13 Sumitomo Bakelite Co Ltd エポキシ樹脂成形材料の製造方法及び半導体装置
JP5899498B2 (ja) 2011-10-13 2016-04-06 パナソニックＩｐマネジメント株式会社 半導体封止用エポキシ樹脂組成物とその製造方法および半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013006328A (ja) * 2011-06-23 2013-01-10 Sumitomo Bakelite Co Ltd 積層板、回路基板、および半導体パッケージ
JP2014210860A (ja) * 2013-04-19 2014-11-13 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP2015067615A (ja) * 2013-09-26 2015-04-13 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、およびその硬化物
JP2020070303A (ja) * 2017-03-07 2020-05-07 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

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