JPWO2022202333A1 - - Google Patents

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Publication number
JPWO2022202333A1
JPWO2022202333A1 JP2022548392A JP2022548392A JPWO2022202333A1 JP WO2022202333 A1 JPWO2022202333 A1 JP WO2022202333A1 JP 2022548392 A JP2022548392 A JP 2022548392A JP 2022548392 A JP2022548392 A JP 2022548392A JP WO2022202333 A1 JPWO2022202333 A1 JP WO2022202333A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022548392A
Other languages
Japanese (ja)
Other versions
JP7160511B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2022202333A1 publication Critical patent/JPWO2022202333A1/ja
Application granted granted Critical
Publication of JP7160511B1 publication Critical patent/JP7160511B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2022548392A 2021-03-23 2022-03-09 フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物 Active JP7160511B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021048212 2021-03-23
JP2021048212 2021-03-23
PCT/JP2022/010360 WO2022202333A1 (ja) 2021-03-23 2022-03-09 フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JPWO2022202333A1 true JPWO2022202333A1 (ko) 2022-09-29
JP7160511B1 JP7160511B1 (ja) 2022-10-25

Family

ID=83395705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022548392A Active JP7160511B1 (ja) 2021-03-23 2022-03-09 フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物

Country Status (5)

Country Link
JP (1) JP7160511B1 (ko)
KR (1) KR20230158497A (ko)
CN (1) CN117043219A (ko)
TW (1) TW202302693A (ko)
WO (1) WO2022202333A1 (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003041096A (ja) 2001-07-31 2003-02-13 Sumitomo Bakelite Co Ltd エポキシ樹脂成形材料の製造方法及び半導体装置
JP2013006328A (ja) * 2011-06-23 2013-01-10 Sumitomo Bakelite Co Ltd 積層板、回路基板、および半導体パッケージ
JP5899498B2 (ja) 2011-10-13 2016-04-06 パナソニックＩｐマネジメント株式会社 半導体封止用エポキシ樹脂組成物とその製造方法および半導体装置
JP6120363B2 (ja) * 2013-04-19 2017-04-26 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP2015067615A (ja) * 2013-09-26 2015-04-13 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、およびその硬化物
JP2020070303A (ja) * 2017-03-07 2020-05-07 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP7160511B1 (ja) 2022-10-25
CN117043219A (zh) 2023-11-10
TW202302693A (zh) 2023-01-16
WO2022202333A1 (ja) 2022-09-29
KR20230158497A (ko) 2023-11-20

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