WO2022201831A1 - Procédé de commande d'échappement pour armoire à liquide de traitement et dispositif de traitement de substrat - Google Patents

Procédé de commande d'échappement pour armoire à liquide de traitement et dispositif de traitement de substrat Download PDF

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Publication number
WO2022201831A1
WO2022201831A1 PCT/JP2022/002648 JP2022002648W WO2022201831A1 WO 2022201831 A1 WO2022201831 A1 WO 2022201831A1 JP 2022002648 W JP2022002648 W JP 2022002648W WO 2022201831 A1 WO2022201831 A1 WO 2022201831A1
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WIPO (PCT)
Prior art keywords
exhaust
processing liquid
cabinet
forced
condition
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PCT/JP2022/002648
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English (en)
Japanese (ja)
Inventor
祥司 吉田
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2022201831A1 publication Critical patent/WO2022201831A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to an exhaust control method for a processing liquid cabinet and a substrate processing apparatus.
  • a substrate processing apparatus for processing substrates is known.
  • the substrate processing apparatus is suitably used for processing semiconductor substrates.
  • a substrate processing apparatus processes a substrate using a processing liquid such as a chemical liquid.
  • Patent Literature 1 describes a substrate cleaning apparatus that supplies an organic substance-free gas with a controlled amount of organic contamination to a chemical solution preparation cabinet to prevent the chemical solution from coming into contact with the ambient atmosphere.
  • the organic substance-free gas supplied to the space above the chemical liquid surface in the concentration and temperature adjustment container is exhausted through the exhaust duct from the pipe provided in the upper part of the concentration and temperature adjustment container.
  • a chemical liquid pipe and a concentration temperature adjusting container are arranged in a chemical liquid preparation cabinet. If the chemical solution flowing through the chemical solution piping and the concentration and temperature adjustment container leaks into the chemical solution preparation cabinet, it is exhausted by the exhaust duct. However, if the amount of exhaust air flowing through the exhaust duct is low, the leaked chemical solution cannot be sufficiently exhausted. On the other hand, if the exhaust amount of the exhaust duct is set high, it will be necessary to drive the blower mechanism at high speed, which will impose an excessive load on the environment.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide an exhaust control method for a processing liquid cabinet capable of appropriately exhausting the atmosphere in the processing liquid cabinet according to the state of liquid leakage in the processing liquid cabinet. to provide.
  • an exhaust control method for a processing liquid cabinet exhausts an atmosphere in a space defined by a processing liquid cabinet in which processing liquid pipes through which a processing liquid supplied to a substrate processing unit flows is arranged.
  • a method comprising: a standard exhaust step of exhausting the atmosphere in the processing liquid cabinet under standard exhaust conditions; a liquid leakage detection step of detecting liquid leakage that has occurred in the processing liquid cabinet; a liquid leakage state determination step of determining the state of liquid leakage in the processing liquid cabinet based on the detection result; A forced exhaust condition determining step of determining a set forced exhaust condition, and a forced exhaust step of exhausting the atmosphere in the processing liquid cabinet under the forced exhaust condition determined in the forced exhaust condition determining step.
  • the forced exhaust process shifts from the standard exhaust process to a first forced exhaust condition that is set to a first forced exhaust amount larger than the exhaust amount under the standard exhaust condition. and a first forced evacuation step of exhausting the atmosphere of the standard evacuation step, and if no liquid leakage is detected in the processing liquid cabinet after a predetermined time has passed since the shift from the standard evacuation step to the first forced evacuation step, the standard evacuation a second forced exhaust step of exhausting the atmosphere in the processing liquid cabinet under a second forced exhaust condition set to a second forced exhaust amount larger than the conditional exhaust amount and smaller than the first forced exhaust amount.
  • the standard exhaust condition is set based on the type of the processing liquid flowing through the piping in the processing liquid cabinet or the flow rate of the processing liquid flowing through the piping.
  • the forced exhaust step sets an exhaust condition for exhausting the atmosphere in the processing liquid cabinet based on a temporal change in the liquid leakage state in the processing liquid cabinet determined in the forced exhaust step. is returned to the standard exhaust condition.
  • the processing liquid cabinet includes a first processing liquid housing and a second processing liquid housing connected to a common exhaust pipe common to the first processing liquid housing, and the liquid leakage detection is performed.
  • the step when liquid leakage in the first processing liquid case is detected, in the forced exhaust step, the atmosphere in the first processing liquid case is exhausted under the forced exhaust condition.
  • the amount of exhaust gas flowing through the common exhaust pipe is increased.
  • the amount of exhaust gas flowing through the common exhaust pipe is not changed.
  • the exhaust amount of the first processing liquid housing is increased.
  • the liquid leakage state determination step determines the liquid leakage state by comparing a predetermined reference value with the detection result, and determines the liquid leakage state with the reference value in the determination corresponding to the first processing liquid housing.
  • a certain first reference value is different from a second reference value, which is a reference value in determination corresponding to the second treatment liquid case.
  • a first enclosure forced evacuation condition corresponding to the first treatment liquid enclosure and a second enclosure forced evacuation condition corresponding to the second treatment liquid enclosure are determined. is determined, and the condition for forced evacuation of the first enclosure is different from the condition for forced evacuation of the second enclosure.
  • a dummy cabinet connected to a common exhaust pipe shared with the processing liquid cabinet is exhausted.
  • the amount of exhaust gas is reduced below that of the standard exhaust process, and the exhaust amount of the processing liquid cabinet is increased above that of the standard exhaust process.
  • a substrate processing apparatus includes a substrate processing unit for processing a substrate, a processing liquid cabinet in which a processing liquid pipe for circulating a processing liquid supplied to the substrate processing unit is arranged, and It comprises a liquid leakage detection section for detecting liquid leakage in the processing liquid cabinet, an exhaust section for exhausting the atmosphere within the processing liquid cabinet, and a control section for controlling the exhaust section.
  • the control unit controls the exhaust unit so as to exhaust the atmosphere within the processing liquid cabinet under standard exhaust conditions, and the control unit causes the liquid leakage detection unit to detect liquid leakage generated within the processing liquid cabinet.
  • the control unit Based on the detection result, the liquid leakage state in the processing liquid cabinet is determined, and the control unit sets an exhaust amount larger than the standard exhaust condition based on the determination result of the liquid leakage state.
  • the forced exhaust condition is determined, and the control unit controls the exhaust unit to exhaust the atmosphere in the processing liquid cabinet under the forced exhaust condition.
  • control unit removes the atmosphere in the processing liquid cabinet under a first forced exhaust condition that is shifted from the standard exhaust condition and set to a first forced exhaust amount larger than the exhaust amount under the standard exhaust condition. and if no liquid leakage is detected in the processing liquid cabinet after a predetermined time has elapsed since the standard exhaust condition was shifted to the first forced exhaust condition, the standard exhaust The exhaust unit is controlled to exhaust the atmosphere in the processing liquid cabinet under a second forced exhaust condition set to a second forced exhaust amount larger than the conditional exhaust amount and smaller than the first forced exhaust amount.
  • control unit sets the standard exhaust condition based on the type of processing liquid flowing through the piping in the processing liquid cabinet or the flow rate of the processing liquid flowing through the piping.
  • control unit releases the processing liquid based on a temporal change in the state of liquid leakage in the processing liquid cabinet determined when the atmosphere within the processing liquid cabinet is exhausted under the forced exhaust condition. It is determined whether or not the exhaust condition for exhausting the atmosphere in the cabinet should be returned to the standard exhaust condition.
  • the processing liquid cabinet includes a first processing liquid housing and a second processing liquid housing connected to a common exhaust pipe common to the first processing liquid housing, and the control unit comprises: and controlling the exhaust unit to exhaust the atmosphere in the first processing liquid case under the forced exhaust condition when the liquid leakage detection unit detects liquid leakage in the first processing liquid case.
  • control unit increases the amount of exhaust gas flowing through the common exhaust pipe under forced exhaust conditions.
  • the control section when the liquid leakage detection section detects liquid leakage in the first processing liquid housing, changes the amount of exhaust gas flowing through the common exhaust pipe under the forced exhaust condition. To increase the exhaust amount of the first processing liquid housing without reducing the pressure.
  • control unit determines the liquid leakage state by comparing a detection result with a predetermined reference value, and determines the first liquid leakage state, which is the reference value in the determination corresponding to the first processing liquid housing.
  • the reference value is different from the second reference value, which is the reference value in the determination corresponding to the second treatment liquid case.
  • control unit sets, as the forced evacuation conditions, a first enclosure forced evacuation condition corresponding to the first treatment liquid enclosure and a second enclosure forced evacuation condition corresponding to the second treatment liquid enclosure.
  • An exhaust condition is determined, and is different from the first casing forced exhaust condition and the second casing forced exhaust condition.
  • the substrate processing apparatus further includes a dummy cabinet and a common exhaust pipe connected to each of the processing liquid cabinet and the dummy cabinet.
  • the control unit reduces the exhaust amount of the dummy cabinet below the exhaust amount under the standard exhaust condition, and reduces the exhaust amount of the processing liquid cabinet. is increased from the displacement under the standard exhaust condition.
  • the atmosphere inside the processing liquid cabinet can be appropriately exhausted according to the liquid leakage state inside the processing liquid cabinet.
  • FIG. 3 is a schematic diagram of a substrate processing unit in the substrate processing apparatus of the present embodiment
  • FIG. 3 is a schematic diagram of a processing liquid cabinet in the substrate processing apparatus of the present embodiment
  • FIG. It is a block diagram of the substrate processing apparatus of this embodiment.
  • (a) to (c) are schematic diagrams for explaining the exhaust control method for the treatment liquid cabinet according to the present embodiment.
  • 4(a) and 4(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet according to the present embodiment.
  • FIG. 4 is a flowchart of a method for controlling exhaust of a processing liquid cabinet according to the present embodiment; 4(a) and 4(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet according to the present embodiment.
  • FIG. 4 is a flowchart of a method for controlling exhaust of a processing liquid cabinet according to the present embodiment; 4(a) and 4(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet according to the present embodiment.
  • (a) to (c) are schematic diagrams for explaining the exhaust control method for the treatment liquid cabinet according to the present embodiment.
  • (a) to (c) are schematic diagrams for explaining the exhaust control method for the treatment liquid cabinet according to the present embodiment.
  • FIG. 3 is a schematic diagram of a processing liquid cabinet in the substrate processing apparatus of the present embodiment
  • FIG. (a) and (b) are schematic diagrams of a processing liquid cabinet in the substrate processing apparatus of the present embodiment.
  • (a) and (b) are schematic diagrams of a processing liquid cabinet in the substrate processing apparatus of the present embodiment.
  • 4(a) and 4(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet according to the present embodiment.
  • (a) and (b) are schematic diagrams of a processing liquid cabinet and a common exhaust pipe in the substrate processing apparatus of the present embodiment.
  • (a) and (b) are schematic diagrams of a processing liquid cabinet and a common exhaust pipe in the substrate processing apparatus of the present embodiment.
  • FIG. (a) is a schematic diagram of a processing liquid cabinet, a dummy cabinet and a common exhaust pipe in the substrate processing apparatus of the present embodiment
  • (b) is a schematic diagram of the processing liquid cabinet in the substrate processing apparatus of the present embodiment
  • (c) is a schematic diagram of a dummy cabinet in the substrate processing apparatus of this embodiment
  • (d) is a schematic diagram of a processing liquid cabinet, a dummy cabinet, and a common exhaust pipe in the substrate processing apparatus of this embodiment.
  • . 3 is a schematic diagram of a processing liquid cabinet, a dummy cabinet, and a common exhaust pipe in the substrate processing apparatus of this embodiment
  • FIG. (a) and (b) are schematic diagrams of a dummy cabinet in the substrate processing apparatus of the present embodiment.
  • FIG. 1 is a schematic plan view of a substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 processes substrates W.
  • the substrate processing apparatus 100 processes the substrate W such that the substrate W is subjected to at least one of etching, surface treatment, characterization, treatment film formation, removal of at least a portion of the film, and cleaning.
  • the substrate W is used as a semiconductor substrate.
  • the substrate W comprises a semiconductor wafer.
  • the substrate W is substantially disc-shaped.
  • the substrate processing apparatus 100 processes substrates W one by one.
  • the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid box 110, a processing liquid cabinet 120, a plurality of load ports LP, an indexer robot IR, and a center robot CR. , and a control device 101 .
  • the control device 101 controls the load port LP, the indexer robot IR and the center robot CR.
  • Control device 101 includes control unit 102 and storage unit 104 .
  • Each of the load ports LP accommodates a plurality of substrates W stacked one on top of another.
  • the indexer robot IR transports substrates W between the load port LP and the center robot CR.
  • the center robot CR transports substrates W between the indexer robot IR and the substrate processing units 10 .
  • Each of the substrate processing units 10 processes the substrate W by ejecting a processing liquid onto the substrate W.
  • FIG. The processing liquid cabinet 120 contains processing liquids.
  • the plurality of substrate processing units 10 form a plurality of towers TW (four towers TW in FIG. 1) arranged to surround the center robot CR in plan view.
  • Each tower TW includes a plurality of vertically stacked substrate processing units 10 (three substrate processing units 10 in FIG. 1).
  • Each processing liquid box 110 corresponds to a plurality of towers TW.
  • the processing liquid in the processing liquid cabinet 120 is supplied to the tower TW corresponding to the processing liquid box 110 via one of the processing liquid boxes 110 . Gas may be supplied to the substrate processing unit 10 and the processing liquid cabinet 120 in addition to the processing liquid.
  • the processing liquid may contain a so-called chemical liquid.
  • the chemical contains hydrofluoric acid.
  • hydrofluoric acid may be heated to 40° C. or higher and 70° C. or lower, or may be heated to 50° C. or higher and 60° C. or lower.
  • hydrofluoric acid does not have to be heated.
  • the chemical solution may contain water or phosphoric acid.
  • the chemical solution may contain hydrogen peroxide.
  • the chemical solution may also include SC1 (ammonia-hydrogen peroxide solution mixture), SC2 (hydrochloric acid-hydrogen peroxide solution mixture), or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).
  • the treatment liquid may contain a so-called rinse liquid.
  • the rinse liquid can be deionized water (DIW), carbonated water, electrolytic ion water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm), or reduced water (hydrogen water ).
  • a specific space within the substrate processing apparatus 100 is defined by the processing liquid cabinet 120 .
  • a boundary wall BW is arranged between an area where the center robot CR and the substrate processing units 10 are installed and an area where the processing liquid cabinet 120 is installed.
  • the processing liquid cabinet 120 defines a part of the space outside the boundary wall BW of the substrate processing apparatus 100 .
  • the processing liquid cabinet 120 partitions a specific space within the substrate processing apparatus 100 with a housing.
  • the processing liquid cabinet 120 has processing liquid pipes through which the processing liquid flows within the housing.
  • the processing liquid cabinet 120 also typically has a preparation bath (tank) for preparing the processing liquid.
  • the processing liquid cabinet 120 may have a preparation tank for one type of processing liquid, or may have a preparation tank for a plurality of types of processing liquids.
  • the processing liquid cabinet 120 may also have pumps, nozzles and/or filters for distributing processing liquids.
  • the processing liquid cabinet 120 has a first processing liquid housing 122a and a second processing liquid housing 122b.
  • the first processing liquid housing 122a and the second processing liquid housing 122b are arranged to face each other.
  • a specific space in the substrate processing apparatus 100 is defined by the first processing liquid housing 122a and the second processing liquid housing 122b.
  • the processing liquid in the first processing liquid housing 122a corresponds to the processing liquid box 110 through one of the processing liquid boxes 110.
  • the flow supplied to the tower TW is shown, and the flow of the processing liquid inside the second processing liquid housing 122b is omitted.
  • Control device 101 controls various operations of the substrate processing apparatus 100 .
  • Control device 101 includes control unit 102 and storage unit 104 .
  • the control unit 102 has a processor.
  • the control unit 102 has, for example, a central processing unit (CPU).
  • the control unit 102 may have a general-purpose computer.
  • the storage unit 104 stores data and computer programs.
  • the data includes recipe data.
  • Recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure of the substrate W.
  • the data includes exhaust conditions for evacuating the atmosphere within the processing liquid cabinet 120 .
  • the evacuation conditions may include standard evacuation conditions and forced evacuation conditions.
  • the control unit 102 exhausts the atmosphere inside the processing liquid cabinet 120 according to the exhaust conditions stored in the storage unit 104 .
  • the control unit 102 exhausts the atmosphere in the processing liquid cabinet 120 according to the standard exhaust condition or forced exhaust condition stored in the storage unit 104 .
  • the storage unit 104 may have a table classified according to at least one of the type of processing liquid corresponding to the processing liquid cabinet 120 and the flow rate of the processing liquid. Further, the storage unit 104 has a table classified according to a combination of at least one of the type of processing liquid and the flow rate of the processing liquid corresponding to the processing liquid cabinet 120 and the liquid leakage state in the processing liquid cabinet 120. You may
  • the storage unit 104 may store a predetermined reference value that serves as a reference when determining the exhaust condition.
  • the predetermined reference value determines the leak condition within the processing liquid cabinet 120 by comparing it with the detected leak within the processing liquid cabinet 120 .
  • the predefined reference value may be a threshold.
  • the storage unit 104 includes a main storage device and an auxiliary storage device.
  • the main storage device is, for example, a semiconductor memory.
  • Auxiliary storage devices are, for example, semiconductor memories and/or hard disk drives.
  • Storage unit 104 may include removable media.
  • the control unit 102 executes a computer program stored in the storage unit 104 to perform substrate processing operations.
  • FIG. 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100. As shown in FIG.
  • the substrate processing unit 10 includes a chamber 12 , a substrate holding section 20 and a processing liquid supply section 30 .
  • the chamber 12 accommodates the substrate W.
  • the substrate holding part 20 holds the substrate W. As shown in FIG.
  • the chamber 12 has a substantially box shape with an internal space.
  • the chamber 12 accommodates the substrate W.
  • the substrate processing apparatus 100 is of a single substrate type that processes the substrates W one by one, and the substrates W are accommodated in the chamber 12 one by one.
  • a substrate W is accommodated within the chamber 12 and processed within the chamber 12 .
  • At least part of each of the substrate holding part 20 and the processing liquid supply part 30 is accommodated in the chamber 12 .
  • the substrate holding part 20 holds the substrate W.
  • the substrate holding part 20 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. Further, the substrate holding part 20 rotates the substrate W while holding the substrate W. As shown in FIG. The substrate holder 20 rotates the substrate W while holding it.
  • the substrate holding part 20 may be of a clamping type that clamps the edge of the substrate W.
  • the substrate holding part 20 may have any mechanism for holding the substrate W from the back surface Wb.
  • the substrate holder 20 may be of a vacuum type. In this case, the substrate holding part 20 horizontally holds the substrate W by sucking the central portion of the back surface Wb of the substrate W, which is the non-device forming surface, onto the upper surface.
  • the substrate holding unit 20 may be a combination of a clamping type in which a plurality of chuck pins are brought into contact with the peripheral edge surface of the substrate W and a vacuum type.
  • the substrate holder 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25.
  • the chuck member 22 is provided on the spin base 21 .
  • the chuck member 22 chucks the substrate W.
  • the spin base 21 is provided with a plurality of chuck members 22 .
  • the shaft 23 is a hollow shaft.
  • the shaft 23 extends vertically along the rotation axis Ax.
  • a spin base 21 is coupled to the upper end of the shaft 23 .
  • a substrate W is placed above the spin base 21 .
  • the spin base 21 is disc-shaped and supports the substrate W horizontally.
  • Shaft 23 extends downward from the central portion of spin base 21 .
  • the electric motor 24 gives rotational force to the shaft 23 .
  • the electric motor 24 rotates the shaft 23 in the rotational direction to rotate the substrate W and the spin base 21 about the rotation axis Ax.
  • a housing 25 surrounds the shaft 23 and the electric motor 24 .
  • the processing liquid supply unit 30 supplies the substrate W with the processing liquid. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. As shown in FIG.
  • the treatment liquid supply unit 30 includes a pipe 32, a valve 34, and a nozzle 36.
  • the nozzle 36 ejects the processing liquid onto the upper surface Wa of the substrate W.
  • a nozzle 36 is connected to the pipe 32 .
  • a processing liquid is supplied to the pipe 32 from a supply source.
  • the valve 34 opens and closes the flow path inside the pipe 32 .
  • the nozzle 36 is preferably configured to be movable with respect to the substrate W. As shown in FIG.
  • the nozzle 36 can move horizontally and/or vertically according to a movement mechanism controlled by the controller 102 . It should be noted that the moving mechanism has been omitted in this specification to avoid over-complicating the drawings.
  • the valve 34 adjusts the opening degree of the pipe 32 to adjust the flow rate of the processing liquid supplied to the pipe 32 .
  • the valve 34 includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator (not shown) that moves the valve body between an open position and a closed position. not shown).
  • the substrate processing apparatus 100 further includes a cup 80.
  • the cup 80 collects the processing liquid scattered from the substrate W. As shown in FIG. The cup 80 moves up and down. For example, the cup 80 rises vertically upward to the side of the substrate W while the processing liquid supply unit 30 supplies the substrate W with the processing liquid. In this case, the cup 80 collects the processing liquid that scatters from the substrate W as the substrate W rotates. Further, the cup 80 descends vertically downward from the side of the substrate W when the period during which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends.
  • control device 101 includes the control unit 102 and the storage unit 104.
  • the control section 102 controls the substrate holding section 20 , the processing liquid supply section 30 and/or the cup 80 .
  • controller 102 controls electric motor 24 and valve 34 .
  • the substrate processing apparatus 100 of the present embodiment is suitably used for fabricating semiconductor elements provided with semiconductors. Typically, in a semiconductor device, a conductive layer and an insulating layer are laminated on a substrate.
  • the substrate processing apparatus 100 is preferably used for cleaning and/or processing (e.g., etching, characteristic change, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
  • the processing liquid supply section 30 can supply one type of processing liquid to the substrate W, but the processing liquid supply section 30 supplies a plurality of types of processing liquid to the substrate W. can be supplied to
  • the treatment liquid supply unit 30 may include multiple pipes 32 , valves 34 and nozzles 36 .
  • FIG. 3 is a schematic diagram of the processing liquid cabinet 120 in the substrate processing apparatus 100 of this embodiment.
  • the treatment liquid cabinet 120 has a housing 122 , an air inlet 123 , an exhaust section 124 , a liquid leakage detection section 130 , a treatment liquid pipe 132 and a preparation tank 134 .
  • the housing 122 is provided with an intake port 123 and an exhaust section 124 . Further, the housing 122 accommodates the liquid leakage detector 130 . A housing 122 partitions the processing liquid cabinet 120 .
  • the housing 122 has a door 122d that can be opened and closed. The operator can enter the housing 122 by opening the door 122d.
  • a suction port 123 is provided in the housing 122 . Outside air is drawn into the housing 122 through the intake port 123 .
  • the intake port 123 is provided in the door 122d.
  • the exhaust unit 124 exhausts the atmosphere inside the housing 122 .
  • the exhaust unit 124 can exhaust the atmosphere in the housing 122 by changing the exhaust amount per unit time.
  • the exhaust amount per unit time may be simply referred to as "exhaust amount”.
  • An airflow is formed in the housing 122 by the positions of the intake port 123 and the exhaust section 124 in the housing 122 .
  • the gas sucked into the housing 122 through the intake port 123 is exhausted to the outside through the exhaust portion 124 .
  • the intake port 123 and the exhaust section 124 are preferably arranged at positions separated from each other.
  • the intake port 123 and the exhaust portion 124 are arranged on the facing wall surfaces, one of the intake port 123 and the exhaust portion 124 is arranged at a relatively high position, and the other of the intake port 123 and the exhaust portion 124 is arranged at a relatively low position. position is preferred.
  • the intake port 123 is arranged at the same height as the bottom of the preparation tank 134
  • the exhaust part 124 is arranged at a position higher than the upper part of the preparation tank 134 .
  • the housing 122 may be provided with one exhaust section 124 and a plurality of intake ports 123 . As a result, stagnation of the gas within the housing 122 can be suitably suppressed.
  • the exhaust section 124 may have an exhaust pipe 125 and an exhaust amount adjusting mechanism 126 .
  • the exhaust pipe 125 When the atmosphere inside the housing 122 is exhausted, the gas inside the housing 122 flows through the exhaust pipe 125 and is discharged to the outside.
  • the exhaust volume adjustment mechanism 126 adjusts the amount of gas flowing through the exhaust pipe 125 (exhaust volume).
  • the exhaust volume adjustment mechanism 126 can increase or decrease the exhaust volume flowing through the exhaust pipe 125 .
  • the exhaust amount adjusting mechanism 126 may be arranged inside the processing liquid cabinet 120 or may be arranged outside the processing liquid cabinet 120 .
  • the exhaust amount adjustment mechanism 126 may be arranged at the end of the exhaust pipe 125 .
  • the exhaust amount adjustment mechanism 126 may be arranged inside the exhaust pipe 125 .
  • the exhaust volume adjustment mechanism 126 may include a damper that adjusts the opening of the exhaust pipe 125.
  • the exhaust volume adjustment mechanism 126 may include a fan that determines the flow rate of exhaust gas flowing through the exhaust pipe 125 .
  • the liquid leakage detection unit 130 detects liquid leakage in the treatment liquid cabinet 120 . Based on the detection result of the liquid leakage detection unit 130 , the control unit 102 determines the liquid leakage state inside the treatment liquid cabinet 120 .
  • the liquid leakage detection unit 130 may include a liquid detection sensor. Typically, the liquid detection sensor detects leaked processing liquid within the processing liquid cabinet 120 .
  • the liquid leakage detection unit 130 may include a gas detection sensor.
  • the gas detection sensor detects liquid leakage in the processing liquid cabinet 120 by detecting gas generated by vaporization of the processing liquid generated in the processing liquid cabinet 120 .
  • the liquid leakage detection unit 130 may include a camera.
  • a camera has an imaging element. Typically, the camera captures an image of the inside of the processing liquid cabinet 120 and performs image analysis on the captured image to detect liquid leakage that has occurred within the processing liquid cabinet 120 .
  • the liquid leakage detection unit 130 may include two or more flowmeters. Typically, leaks occurring within the processing liquid cabinet 120 may be detected according to the difference between two or more flow meters.
  • the liquid leakage detection unit 130 may acquire a detection amount obtained by quantifying the detection result.
  • the control unit 102 may obtain a detection amount indicating the degree of liquid leakage in the processing liquid cabinet 120 by quantifying the detection result from the liquid leakage detection unit 130 .
  • the treatment liquid pipe 132 distributes the treatment liquid.
  • the processing liquid pipe 132 communicates with the processing liquid supply section 30 of the substrate processing unit 10 and distributes the processing liquid to the processing liquid supply section 30 .
  • the preparation tank 134 stores the processing liquid. Processing liquid flows through processing liquid line 132 to preparation vessel 134 and then out of preparation vessel 134 through processing liquid line 132 .
  • control device 101 includes the control unit 102 and the storage unit 104.
  • Control unit 102 controls exhaust unit 124 and liquid leakage detection unit 130 .
  • the control unit 102 determines the liquid leakage state in the processing liquid cabinet 120 based on the detection result of the liquid leakage detection unit 130 .
  • the control unit 102 determines exhaust conditions based on the state of liquid leakage in the processing liquid cabinet 120, and controls the exhaust unit 124 according to the determined exhaust conditions.
  • FIG. 4 is a block diagram of the substrate processing apparatus 100. As shown in FIG.
  • the control device 101 controls various operations of the substrate processing apparatus 100 .
  • the control device 101 controls the indexer robot IR, the center robot CR, the substrate holding section 20 and the processing liquid supply section 30 .
  • the control device 101 transmits control signals to the indexer robot IR, the center robot CR, the substrate holder 20, and the processing liquid supply unit 30, thereby causing the indexer robot IR, the center robot CR, the substrate holder 30 to 20, the processing liquid supply unit 30, the exhaust unit 124, and the liquid leakage detection unit 130 are controlled.
  • control unit 102 controls the indexer robot IR to transfer the substrate W by the indexer robot IR.
  • the control unit 102 controls the center robot CR to transfer the substrate W by the center robot CR.
  • the center robot CR receives an unprocessed substrate W and loads the substrate W into one of the substrate processing units 10 .
  • the center robot CR receives the processed substrate W from the substrate processing unit 10 and unloads the substrate W. As shown in FIG.
  • the control unit 102 controls the substrate holding unit 20 to start rotation of the substrate W, change the rotation speed, and stop rotation of the substrate W.
  • the controller 102 can control the substrate holder 20 to change the number of rotations of the substrate holder 20 .
  • the controller 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 24 of the substrate holder 20 .
  • the control unit 102 can control the valve 34 of the processing liquid supply unit 30 to switch the state of the valve 34 between an open state and a closed state. Specifically, the control unit 102 controls the valve 34 of the processing liquid supply unit 30 to open the valve 34, thereby allowing the processing liquid flowing through the pipe 32 toward the nozzle 36 to pass through. . Further, the control unit 102 can stop the supply of the processing liquid flowing through the pipe 32 toward the nozzle 36 by controlling the valve 34 of the processing liquid supply unit 30 to close the valve 34 . .
  • the control unit 102 can control the exhaust of the exhaust unit 124 by switching exhaust conditions for exhausting the atmosphere in the processing liquid cabinet 120 . Specifically, the control unit 102 can control the exhaust unit 124 by switching the exhaust condition to either the standard exhaust condition or the forced exhaust condition. Furthermore, the control unit 102 can determine any one of a plurality of forced exhaust conditions and control the exhaust unit 124 according to the determined forced exhaust condition. Note that the control unit 102 may stop the exhaust by the exhaust unit 124 .
  • the control unit 102 can control the liquid leakage detection unit 130 to detect liquid leakage occurring inside the processing liquid cabinet 120 . Further, the control unit 102 can determine the liquid leakage state in the processing liquid cabinet 120 based on the detection result from the liquid leakage detection unit 130 .
  • the substrate processing apparatus 100 of this embodiment is suitably used for forming semiconductor elements.
  • the substrate processing apparatus 100 is preferably used to process a substrate W used as a semiconductor device having a laminated structure.
  • the semiconductor device is a memory (storage device) having a so-called 3D structure.
  • the substrate W is suitably used as a NAND flash memory.
  • FIGS. 5A to 5C are schematic diagrams for explaining the exhaust control method of the processing liquid cabinet 120 of this embodiment. 5(a) to 5(c), the processing liquid pipe 132 and the preparation tank 134 are omitted for the purpose of simplifying the drawings.
  • the atmosphere in the processing liquid cabinet 120 is exhausted under the standard exhaust condition set to the standard exhaust amount.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition.
  • the standard exhaust conditions are set based on the type of processing liquid flowing through the processing liquid piping 132 in the processing liquid cabinet 120 or the flow rate of the processing liquid flowing through the piping.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under standard exhaust conditions. As the air is exhausted by the exhaust unit 124 , air is sucked into the processing liquid cabinet 120 through the intake port 123 .
  • the standard exhaust can prevent the atmosphere inside the housing 122 from leaking to the outside of the housing 122 .
  • the exhaust unit 124 sets the atmosphere in the processing liquid cabinet 120 to a forced exhaust rate larger than the standard exhaust rate. Exhaust under forced exhaust conditions. Specifically, when the processing liquid leaks within the processing liquid cabinet 120 , the liquid leakage detection unit 130 detects the liquid leakage within the processing liquid cabinet 120 . The control unit 102 determines the liquid leakage state in the processing liquid cabinet 120 based on the detection result of the liquid leakage detection unit 130 . The control unit 102 determines forced exhaust conditions according to the liquid leakage state.
  • the forced exhaust condition is set based on a combination of the type of processing liquid flowing through the processing liquid pipe 132 in the processing liquid cabinet 120 or the flow rate of the processing liquid flowing through the processing liquid pipe 132 and the leakage state.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 according to the determined forced exhaust conditions.
  • the liquid leakage detection unit 130 detects a small amount of processing liquid inside the processing liquid cabinet 120 .
  • the control unit 102 determines a forced exhaust condition set to a forced exhaust amount larger than the standard exhaust amount according to the liquid leakage state.
  • the control unit 102 controls the exhaust unit 124 under the determined forced exhaust conditions so that the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 .
  • the exhaust unit 124 sets the atmosphere in the processing liquid cabinet 120 to a forced exhaust rate larger than the standard exhaust rate. Exhaust under forced exhaust conditions.
  • the control unit 102 determines the forced evacuation condition set to a larger forced evacuation amount according to the liquid leakage state. .
  • the control unit 102 controls the exhaust unit 124 under the determined forced exhaust conditions so that the exhaust unit 124 can forcibly exhaust the atmosphere in the processing liquid cabinet 120 .
  • the exhaust amount of the exhaust section 124 can be controlled according to the liquid leakage state in the processing liquid cabinet 120 . Therefore, the atmosphere in the processing liquid cabinet 120 can be appropriately exhausted according to the amount of the processing liquid that has leaked in the processing liquid cabinet 120 .
  • liquid leakage state and the forced exhaust condition in the processing liquid cabinet 120 are divided into two stages, but the present embodiment is not limited to this. Leakage conditions and forced evacuation conditions within the processing liquid cabinet 120 may be divided into as many stages as three or more.
  • FIGS. 6(a) and 6(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet 120 according to this embodiment.
  • the horizontal axis indicates time
  • the vertical axis indicates the detection amount obtained by quantifying the detection state. The larger the amount of leaked processing liquid in the processing liquid cabinet 120, the higher the detection amount.
  • the processing liquid does not leak in the processing liquid cabinet 120 at first.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the atmosphere within the processing liquid cabinet 120 is exhausted at a standard exhaust rate.
  • the detection amount increases.
  • the exhaust condition is changed from the standard exhaust condition to the forced exhaust condition.
  • the threshold t1 is used as a reference for the presence or absence of liquid leakage within the processing liquid cabinet 120 .
  • Threshold t1 is an example of a predetermined reference value.
  • the control unit 102 changes the exhaust condition from the standard exhaust condition to the forced exhaust condition, and the exhaust unit 124 exhausts the atmosphere inside the processing liquid cabinet 120 according to the forced exhaust condition.
  • the displacement of the forced exhaust condition is larger than the standard displacement. After that, the detection amount starts to decrease due to the forced exhaust according to the forced exhaust conditions.
  • the exhaust condition returns from the forced exhaust condition to the standard exhaust condition.
  • the control unit 102 changes the exhaust condition from the forced exhaust condition to the standard exhaust condition, and the exhaust unit 124 causes the inside of the processing liquid cabinet 120 to decompress according to the standard exhaust condition. Evacuate the atmosphere.
  • the exhaust volume under the standard exhaust condition is smaller than the forced exhaust volume.
  • the atmosphere in the processing liquid cabinet 120 can be efficiently exhausted by changing the forced exhaust condition according to the detection amount indicating the liquid leakage state in the processing liquid cabinet 120 .
  • the exhaust condition may be switched between the standard exhaust condition and the forced exhaust condition depending on whether or not the detected amount exceeds the threshold value t1.
  • the detection amount indicating the amount of leakage of the processing liquid within the processing liquid cabinet 120 was relatively small, but a larger amount of processing liquid may leak within the processing liquid cabinet 120. For example, if a large amount of processing liquid leaks from the processing liquid pipe 132 in the processing liquid cabinet 120, the amount of detection cannot be reduced unless the exhaust amount is considerably increased.
  • the processing liquid does not leak in the processing liquid cabinet 120 at first.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the atmosphere within the processing liquid cabinet 120 is exhausted at a standard exhaust rate. Therefore, the detection amount is maintained at a low value.
  • the detection amount increases. For example, when the detected amount exceeds the threshold value t1, the control unit 102 changes the exhaust condition from the standard exhaust condition to the first forced exhaust condition, and the exhaust unit 124 moves the inside of the processing liquid cabinet 120 according to the first forced exhaust condition. exhaust the atmosphere.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the first forced exhaust condition set to the first forced exhaust amount larger than the standard exhaust amount.
  • the control unit 102 changes the exhaust condition from the first forced exhaust condition to the second forced exhaust condition, and the exhaust unit 124 causes the processing liquid cabinet 120 to operate according to the second forced exhaust condition.
  • Exhaust the atmosphere inside. Threshold t2 is an example of a predetermined reference value.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the second forced exhaust condition set to the second forced exhaust amount larger than the first forced exhaust amount.
  • the control unit 102 changes the exhaust condition from the second forced exhaust condition to the third forced exhaust condition, and the exhaust unit 124 operates the processing liquid cabinet according to the third forced exhaust condition.
  • the atmosphere within 120 is evacuated.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the third forced exhaust condition set to the third forced exhaust amount.
  • the third forced exhaust amount is smaller than the second forced exhaust amount and larger than the standard exhaust amount.
  • the third forced exhaust amount may be equal to the first forced exhaust amount, and the third forced exhaust condition may be equal to the first forced exhaust condition.
  • the control unit 102 changes the exhaust condition from the third forced exhaust condition to the standard exhaust condition, and the exhaust unit 124 adjusts the atmosphere in the processing liquid cabinet 120 according to the standard exhaust condition. to exhaust.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under standard exhaust conditions set to a standard exhaust amount smaller than the third forced exhaust amount.
  • the atmosphere within the processing liquid cabinet 120 can be efficiently adjusted according to the environment of the processing liquid cabinet 120. can be exhausted.
  • FIG. 7 is a flowchart of the exhaust control method for the processing liquid cabinet 120 of this embodiment.
  • step S102 the atmosphere in the processing liquid cabinet 120 is exhausted under the standard exhaust condition set to the standard exhaust amount.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 according to the standard exhaust condition.
  • step S104 it is determined whether or not liquid leakage is detected within the processing liquid cabinet 120.
  • the liquid leakage detection unit 130 detects the liquid leakage.
  • the liquid leakage detection unit 130 detects the treatment liquid leaking from the treatment liquid pipe 132 .
  • the liquid leakage detection unit 130 may detect the liquid amount of the treatment liquid that contacts the liquid detection sensor.
  • the liquid leakage detection unit 130 detects gas generated inside the processing liquid cabinet 120 .
  • the gas detection sensor may detect the gas concentration of the processing liquid generated within the processing liquid cabinet 120 .
  • the liquid leakage detection unit 130 When the liquid leakage detection unit 130 includes a camera, the liquid leakage detection unit 130 takes an image of the inside of the processing liquid cabinet 120 .
  • the camera or controller 102 may detect leaks in the processing liquid cabinet 120 by processing captured images.
  • the leak detector 130 may include a temperature sensor. If the leak detector 130 includes a temperature sensor, the leak detector 130 measures the temperature inside the processing liquid cabinet 120 . In this case, if the processing liquid leaks in the processing liquid cabinet 120, the leak can be detected by the temperature sensor.
  • the temperature sensor may be contact or non-contact. The temperature sensor may detect infrared rays emitted by the treatment liquid.
  • step S104 If no liquid leakage is detected within the treatment liquid cabinet 120 (No in step S104), the process returns to step S102. As a result, the exhaust unit 124 can repeat detection and determination of liquid leakage while exhausting the atmosphere in the processing liquid cabinet 120 according to the standard exhaust conditions. On the other hand, if liquid leakage is detected within the treatment liquid cabinet 120 (Yes in step S104), the process proceeds to step S106.
  • step S ⁇ b>106 the control unit 102 determines the liquid leakage state within the treatment liquid cabinet 120 .
  • the control unit 102 determines the liquid leakage state in the processing liquid cabinet 120 based on the detection result of the liquid leakage detection unit 130 .
  • the control unit 102 may determine the liquid leakage state in the treatment liquid cabinet 120 according to the detection amount based on the detection result of the liquid leakage detection unit 130 .
  • step S108 the control unit 102 determines forced exhaust conditions.
  • the control unit 102 determines a forced exhaust condition according to the liquid leakage state from a plurality of forced exhaust conditions.
  • a plurality of forced exhaust conditions are set to a forced exhaust amount larger than the standard exhaust amount.
  • the control unit 102 determines a forced exhaust condition according to the liquid leakage state from two stages of forced exhaust conditions.
  • the control unit 102 determines a forced exhaust condition according to the liquid leakage state from three or more stages of forced exhaust conditions.
  • step S110 the control unit 102 controls the exhaust unit 124 according to the determined forced exhaust condition to exhaust the atmosphere in the processing liquid cabinet 120. Therefore, the processing liquid cabinet 120 is forcibly evacuated.
  • step S112 it is determined again whether or not liquid leakage is detected within the processing liquid cabinet 120. If the processing liquid has not been exhausted from the processing liquid cabinet 120, the liquid leakage detection unit 130 detects liquid leakage.
  • step S112 When liquid leakage is detected within the treatment liquid cabinet 120 (Yes in step S112), the process returns to step S110. In this case, the exhaust unit 124 continues forced exhaust of the processing liquid cabinet 120 . If no liquid leakage is detected in processing liquid cabinet 120 (No in step S112), the process proceeds to step S114.
  • step S114 it is determined whether or not to end the exhaust process.
  • the controller 102 receives an instruction to end the exhaust process, it ends the exhaust process.
  • the control unit 102 terminates the exhaust process.
  • step S114 If the exhaust process is not to end (No in step S114), the process returns to S102. In this case, the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under standard exhaust conditions. On the other hand, if it is determined to end the exhaust process (Yes in step S114), the process ends.
  • the forced exhaust condition of the processing liquid cabinet 120 can be changed according to the state of liquid leakage in the processing liquid cabinet 120 .
  • the atmosphere in the processing liquid cabinet 120 can be exhausted according to the degree of liquid leakage in the processing liquid cabinet 120 .
  • the exhaust condition is changed immediately according to the change in the detected amount, but the present embodiment is not limited to this. It is not necessary to immediately change the exhaust condition according to the change in the detected amount.
  • FIGS. 8(a) and 8(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet 120 according to this embodiment.
  • the processing liquid does not leak in the processing liquid cabinet 120 at first.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the atmosphere within the processing liquid cabinet 120 is exhausted at a standard exhaust rate. Therefore, the detection amount is maintained at a low value.
  • the detection amount increases.
  • the detection amount is controlled according to the detected amount after a predetermined time Ta has elapsed since the detected amount exceeded the threshold value t1.
  • the control unit 102 changes the exhaust condition to the forced exhaust condition according to the detected amount, and the exhaust unit 124 , the atmosphere in the processing liquid cabinet 120 is exhausted under forced exhaust conditions set to a forced exhaust amount larger than the standard exhaust amount.
  • the control unit 102 changes the exhaust condition from the forced exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition. . Even if the exhaust condition is changed from the forced exhaust condition to the standard exhaust condition, the detection amount is further reduced. However, the slope of the decrease in the detection amount becomes smaller due to the change in the exhaust condition.
  • the exhaust condition is changed so that the exhaust amount increases after the predetermined time has passed since the detected amount exceeded the threshold value t1. Not limited.
  • the exhaust condition is changed so that the displacement increases after the detected amount reaches the threshold, and after a predetermined period of time has elapsed since the change in the exhaust condition, the exhaust condition is changed so that the displacement decreases. good too.
  • the processing liquid does not leak in the processing liquid cabinet 120 at first.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the atmosphere within the processing liquid cabinet 120 is exhausted at a standard exhaust rate. Therefore, the detection amount is maintained at a low value.
  • the control unit 102 When the processing liquid starts to leak in the processing liquid cabinet 120 after a predetermined time has passed, the detection amount increases.
  • the control unit 102 does not immediately change the exhaust condition and continues acquiring the detection amount for a predetermined time. After that, the control unit 102 changes the exhaust condition after the detection amount exceeds the threshold value t2.
  • the control unit 102 changes the exhaust condition from the standard exhaust condition to the first forced exhaust condition, and the exhaust unit 124 causes the processing liquid cabinet 120 to operate according to the first forced exhaust condition. Exhaust the atmosphere inside.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the first forced exhaust condition set to the first forced exhaust amount larger than the standard exhaust amount.
  • the detected amount once increases even after the exhaust condition is changed from the standard exhaust condition to the first forced exhaust condition, and then begins to decrease.
  • the control unit 102 continues acquiring the detection amount for a predetermined time without changing the exhaust condition immediately. After that, the control unit 102 controls the exhaust condition according to the detection amount acquired after a predetermined time Tb has elapsed since the detection amount reached the threshold value t2. In this embodiment, since the detected amount after the predetermined time Tb has passed is lower than the threshold value t1, the control unit 102 changes the exhaust condition from the first forced exhaust condition to the second forced exhaust condition, and the exhaust unit 124 , the atmosphere in the processing liquid cabinet 120 is exhausted under the second forced exhaust condition.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the second forced exhaust condition set to the second forced exhaust amount larger than the standard exhaust amount and smaller than the first forced exhaust amount. Even if the exhaust condition is changed from the first forced exhaust condition to the second forced exhaust condition, the detection amount itself continues to decrease.
  • the exhaust condition is controlled according to the detection amount acquired after a predetermined time Tc has passed since the first forced exhaust condition was changed to the second forced exhaust condition.
  • the control unit 102 since the detected amount after the predetermined time Tc has passed is lower than the threshold value t1, the control unit 102 changes the exhaust condition from the second forced exhaust condition to the standard exhaust condition, and the exhaust unit 124 2.
  • the atmosphere in the processing liquid cabinet 120 is exhausted under standard exhaust conditions set to a standard exhaust amount smaller than the forced exhaust amount.
  • the detection amount is further reduced.
  • the slope of the decrease in the detection amount becomes even smaller.
  • FIG. 9 is a flowchart of the exhaust control method for the processing liquid cabinet 120 of this embodiment.
  • the flow chart of FIG. 9 has the same processes as the flow chart shown in FIG. 7 except that the forced evacuation process (step S110) is divided into a plurality of steps, and is duplicated for the purpose of avoiding redundancy. Description is omitted.
  • steps S102 to S106 are the same as steps S102 to S106 shown in FIG. 7, and description thereof will be omitted.
  • step S108 the control unit 102 determines forced exhaust conditions.
  • the control unit 102 determines forced exhaust conditions according to the liquid leakage state. For example, the control unit 102 determines the forced exhaust condition according to the leak state from two or more stages of forced exhaust conditions.
  • step S110 the control unit 102 controls the exhaust unit 124 according to the determined forced exhaust condition to exhaust the atmosphere in the processing liquid cabinet 120. Therefore, the processing liquid cabinet 120 is forcibly exhausted under the forced exhaust condition set to a forced exhaust amount larger than the standard exhaust amount.
  • step S110a the exhaust condition is controlled based on the detected amount. For example, when the detected amount exceeds the threshold value t2, the control unit 102 changes the exhaust condition from the standard exhaust condition to the first forced exhaust condition, and the exhaust unit 124 changes the atmosphere in the processing liquid cabinet 120 to the first forced exhaust condition. to exhaust.
  • the displacement under the first forced exhaust condition is larger than that under the standard exhaust condition.
  • step S110b it is determined whether or not a predetermined time Tb has passed. If predetermined time Tb has not elapsed (No in step S110b), the process returns to step S110a. Therefore, the forced exhaust continues until the predetermined time Tb elapses. If predetermined time Tb has passed (Yes in step S110b), the process proceeds to step S110c.
  • step S110c it is determined whether or not liquid leakage is detected within the treatment liquid cabinet 120.
  • the liquid leakage detection unit 130 detects the liquid leakage. For example, the control unit 102 determines whether or not the detection amount is lower than the threshold value t1.
  • step S110c When liquid leakage is detected within the treatment liquid cabinet 120 (Yes in step S110c), the process returns to step S110a. In this case, the controller 102 continues forced evacuation of the processing liquid cabinet 120 . If no liquid leakage is detected in the processing liquid cabinet 120 (No in step S110c), the process proceeds to step S110d.
  • step S110d the exhaust condition is changed from the first forced exhaust condition to the second forced exhaust condition.
  • the second forced exhaust amount set for the second forced exhaust condition is larger than the standard exhaust amount and smaller than the first forced exhaust amount.
  • step S110e it is determined whether or not the predetermined time Tc has passed. If predetermined time Tc has not elapsed (No in step S110e), the process returns to step S110d. In this case, the exhaust unit 124 continues to exhaust the atmosphere in the processing liquid cabinet 120 under the second forced exhaust condition until the predetermined time Tc elapses. If predetermined time Tc has passed (Yes in step S110e), the process proceeds to step S112.
  • step S112 The steps after step S112 are the same as those described above with reference to FIG.
  • the exhaust control method of the processing liquid cabinet 120 of the present embodiment the exhaust amount of the processing liquid cabinet 120 can be controlled according to the liquid leakage state in the processing liquid cabinet 120 .
  • the exhaust condition is changed based on the detected amount after the predetermined time has elapsed, so that it is possible to prevent the exhaust condition from being changed excessively according to the fluctuation of the detected amount.
  • the exhaust condition is
  • the exhaust condition may be changed based on the time change of the sensed state.
  • 10(a) and 10(b) are graphs showing temporal changes in the detected amount in the exhaust control method for the processing liquid cabinet 120 according to this embodiment.
  • the processing liquid does not leak in the processing liquid cabinet 120 at first.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the atmosphere within the processing liquid cabinet 120 is exhausted at a standard exhaust rate. Therefore, the detection amount is maintained at a low value.
  • the detection amount increases.
  • the control unit 102 changes the exhaust condition from the standard exhaust condition to the forced exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the forced exhaust condition.
  • the displacement under the forced exhaust condition is larger than that under the standard exhaust condition.
  • the amount of detection quickly decreases due to forced exhaust.
  • the ratio ( ⁇ S/ ⁇ T) between the difference ( ⁇ S) between the peak value of the detection amount and the threshold value t1 and the time ( ⁇ T) from when the peak value of the detection amount is reached to when the threshold value t1 is reached is the ratio threshold bigger than
  • the exhaust condition is returned from the forced exhaust condition to the standard exhaust condition.
  • the control unit 102 changes the exhaust condition from the forced exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under standard exhaust conditions set to a standard exhaust amount smaller than the forced exhaust amount. Even if the exhaust condition is changed from the forced exhaust condition to the standard exhaust condition, the detection amount is further reduced. However, the slope of the decrease in the detection amount becomes smaller due to the change in the exhaust condition.
  • the exhaust condition is changed when the detection amount becomes lower than the threshold value t1, but the present embodiment is not limited to this.
  • the exhaust condition may be changed based not only on the detected amount but also on the temporal change of the detected amount.
  • the processing liquid does not leak in the processing liquid cabinet 120 at first.
  • the control unit 102 sets the exhaust condition to the standard exhaust condition, and the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under the standard exhaust condition.
  • the atmosphere within the processing liquid cabinet 120 is exhausted at a standard exhaust rate. Therefore, the detection amount is maintained at a low value.
  • the detection amount increases.
  • the exhaust condition is changed from the standard exhaust condition to the forced exhaust condition.
  • the displacement of the forced exhaust condition is larger than the standard displacement. After that, the detection amount starts to decrease due to the forced exhaust according to the forced exhaust conditions.
  • the amount of detection tends to decrease due to forced exhaust.
  • the detection amount fluctuates greatly with the passage of time, and the detection amount gradually decreases while fluctuating.
  • the ratio ( ⁇ S / ⁇ T) between the difference ( ⁇ S) between the peak value of the detection amount and the threshold t1 and the time ( ⁇ T) from the time when the peak value of the detection amount is reached to the threshold t1 is higher than the ratio threshold small.
  • the control unit 102 does not return the exhaust condition from the forced exhaust condition to the standard exhaust condition. Therefore, even if the detected amount reaches the threshold value t1, the control unit 102 maintains the exhaust condition as the forced exhaust condition, and the exhaust unit 124 continues exhausting the atmosphere in the processing liquid cabinet 120 under the forced exhaust condition.
  • the control unit 102 changes the exhaust condition from the forced exhaust condition to the standard exhaust condition, and the exhaust unit 124 sets the atmosphere in the processing liquid cabinet 120 to the standard condition.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under standard exhaust conditions set to a standard exhaust amount smaller than the forced exhaust amount. Even if the exhaust condition is changed from the forced exhaust condition to the standard exhaust condition, the detection amount is further reduced. However, the slope of the decrease in the detection amount becomes smaller due to the change in the exhaust condition.
  • the condition for changing the exhaust condition may be changed based on the ratio ( ⁇ S/ ⁇ T) to the time ( ⁇ T) until reaching the point. In this manner, it may be determined whether or not to return the exhaust condition from the controlled exhaust condition to the standard exhaust condition based on the pattern of temporal change in the liquid leakage state.
  • the exhaust amount adjustment mechanism 126 may be a damper that adjusts the opening degree of the exhaust pipe 125 .
  • FIG. 11(a) to 11(c) are schematic diagrams for explaining the exhaust control method of the processing liquid cabinet 120 according to this embodiment.
  • the exhaust section 124 has an exhaust pipe 125 and a damper 127 .
  • a damper 127 controls the opening of the exhaust pipe 125 .
  • the damper 127 functions as an exhaust amount adjustment mechanism for the exhaust pipe 125 .
  • the damper 127 may control the degree of opening by a cylinder or a motor. Alternatively, damper 127 may control the degree of opening by turning off the lock pin.
  • the damper 127 is positioned outside the exhaust pipe 125 . Specifically, the damper 127 is arranged at a position covering the end of the exhaust pipe 125 . The opening degree of damper 127 is controlled by control unit 102 .
  • FIG. 11(a) no liquid leakage is detected in the processing liquid cabinet 120.
  • the atmosphere in the processing liquid cabinet 120 is exhausted under the standard exhaust condition set to the standard exhaust amount.
  • the control unit 102 controls the opening of the damper 127 to be relatively narrow, so that the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 under standard exhaust conditions. As the air is exhausted by the exhaust unit 124 , air is sucked into the processing liquid cabinet 120 through the intake port 123 .
  • the exhaust unit 124 sets the atmosphere in the processing liquid cabinet 120 to a forced exhaust rate larger than the standard exhaust rate. Exhaust under forced exhaust conditions. Specifically, when the processing liquid leaks within the processing liquid cabinet 120 , the liquid leakage detection unit 130 detects the liquid leakage within the processing liquid cabinet 120 . The control unit 102 determines the liquid leakage state in the processing liquid cabinet 120 based on the detection result of the liquid leakage detection unit 130 . The control unit 102 determines forced exhaust conditions according to the liquid leakage state and widens the opening of the damper 127 . The exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 according to the determined forced exhaust conditions.
  • the liquid leakage detection unit 130 detects a small amount of processing liquid inside the processing liquid cabinet 120 .
  • the control unit 102 determines a forced exhaust condition set to a forced exhaust amount larger than the standard exhaust amount according to the liquid leakage state.
  • the control unit 102 controls the exhaust unit 124 under the determined forced exhaust conditions so that the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 .
  • the exhaust unit 124 sets the atmosphere in the processing liquid cabinet 120 to a forced exhaust rate larger than the standard exhaust rate. Exhaust under forced exhaust conditions.
  • the control unit 102 determines the forced evacuation condition set to a larger forced evacuation amount according to the liquid leakage state. . In this case, control unit 102 further widens the opening of damper 127 .
  • the control unit 102 controls the exhaust unit 124 under the determined forced exhaust conditions so that the exhaust unit 124 can forcibly exhaust the atmosphere in the processing liquid cabinet 120 .
  • the exhaust control method of the processing liquid cabinet 120 of the present embodiment by adjusting the opening degree of the damper 127 according to the liquid leakage state in the processing liquid cabinet 120, the exhaust amount of the exhaust section 124 is can be controlled. Therefore, the atmosphere in the processing liquid cabinet 120 can be appropriately exhausted according to the amount of the processing liquid that has leaked in the processing liquid cabinet 120 .
  • air is sucked into the processing liquid cabinet 120 through the intake port 123 by exhausting the atmosphere in the processing liquid cabinet 120 by the exhaust unit 124.
  • This embodiment is not limited to this. Gas may be supplied into the processing liquid cabinet 120 as the exhaust unit 124 exhausts the gas.
  • FIGS. 12(a) to 12(c) are schematic diagrams for explaining the exhaust control method of the processing liquid cabinet 120 of this embodiment.
  • the treatment liquid cabinet 120 further includes an air supply section 128 .
  • the air supply unit 128 is arranged within the housing 112 .
  • the gas supply unit 128 supplies gas to the processing liquid cabinet 120 .
  • the processing liquid cabinet 120 does not have an air inlet 123 .
  • the exhaust 124 exhausts the atmosphere within the processing liquid cabinet 120 while the processing liquid cabinet 120 is supplied with air by the air supply 128 .
  • the air supply unit 128 may supply inert gas. Inert gases include nitrogen. Alternatively, the air supply section 128 may supply air. In this case, the air supply unit 128 may supply the air used for the downflow of the clean room.
  • the processing liquid cabinet 120 does not have the intake port 123, even if the processing liquid leaks inside the processing liquid cabinet 120, the processing liquid can be prevented from leaking to the outside. In addition, it is possible to prevent external light from entering the processing liquid cabinet 120, and to prevent the characteristics of the processing liquid from fluctuating.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 at a standard exhaust amount, and the air supply unit 128 supplies the processing liquid cabinet 120 with a standard air supply amount. Thereby, the inside of the processing liquid cabinet 120 can be maintained at a constant atmospheric pressure.
  • the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 with a forced exhaust amount larger than the standard exhaust amount.
  • the liquid leakage detection unit 130 detects a small amount of liquid leakage within the processing liquid cabinet 120 .
  • the control unit 102 determines a forced exhaust condition set to a forced exhaust amount larger than the standard exhaust amount according to the liquid leakage state, and the exhaust unit 124 sets the atmosphere in the processing liquid cabinet 120 to the forced exhaust condition. to exhaust. Further, the controller 102 sets a forced air supply amount larger than the standard air supply amount according to the liquid leakage state, and the air supply unit 128 supplies air into the processing liquid cabinet 120 at the forced air supply amount.
  • the control unit 102 controls the exhaust unit 124 under the determined forced exhaust condition and controls the air supply unit 128 according to the set forced air supply amount, whereby the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120. can be cleaned.
  • the exhaust unit 124 when a relatively large amount of the processing liquid leaks from the processing liquid cabinet 120, the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120 with a larger exhaust rate than the standard exhaust rate. .
  • the liquid leakage detection unit 130 detects a large amount of liquid leakage within the treatment liquid cabinet 120 .
  • the control unit 102 sets a forced exhaust amount larger than the standard exhaust amount according to the liquid leakage state.
  • the air supply unit 128 supplies a larger amount of air to the processing liquid cabinet 120 according to the liquid leakage state.
  • the control unit 102 controls the exhaust unit 124 under the determined forced exhaust condition and controls the air supply unit 128 according to the set air supply amount, whereby the exhaust unit 124 exhausts the atmosphere in the processing liquid cabinet 120. can.
  • the state of liquid leakage in the processing liquid cabinet 120 is divided into two stages, but the present embodiment is not limited to this.
  • a leak condition within the processing liquid cabinet 120 may be divided into many stages, three or more.
  • FIG. 13 is a schematic diagram of the processing liquid cabinet 120 in the substrate processing apparatus 100 of this embodiment.
  • the processing liquid cabinet 120 includes a housing 122, an air inlet 123, an exhaust section 124, a liquid leakage detection section 130, a processing liquid pipe 132 and a preparation tank 134, as well as a pump 136a and a temperature controller 136b. and a filter 136c.
  • the processing liquid pipe 132 supplies the processing liquid to the preparation tank 134 .
  • the processing liquid pipe 132 flows the processing liquid from the preparation tank 134 to the outside.
  • the processing liquid pipe 132 extends from the outside of the processing liquid cabinet 120 to the inside of the processing liquid cabinet 120 . Also, the processing liquid pipe 132 extends from the inside of the processing liquid cabinet 120 to the outside of the processing liquid cabinet 120 .
  • the boundary portion of the processing liquid pipe 132 through which the processing liquid flows from the outside of the processing liquid cabinet 120 toward the inside of the processing liquid cabinet 120 is referred to as an inflow port 132p.
  • a boundary portion through which the processing liquid flows toward the outside of the processing liquid cabinet 120 is referred to as an outflow port 132q.
  • the portion of the processing liquid pipe 132 from the inlet 132p to the preparation tank 134 may be referred to as the upstream processing liquid pipe 132a, and the portion from the preparation tank 134 to the outlet 132q may be referred to as the downstream side. It may be described as a side treatment liquid pipe 132b.
  • a pump 136 a , a temperature control device 136 b and a filter 136 c are attached to the treatment liquid pipe 132 .
  • the pump 136a, the temperature controller 136b and the filter 136c are attached to the downstream processing liquid pipe 132b.
  • the pump 136 a sends the processing liquid to the processing liquid pipe 132 .
  • the temperature control device 136 b heats the processing liquid flowing through the processing liquid pipe 132 .
  • the temperature of the treatment liquid is adjusted by the temperature controller 136b.
  • the filter 136 c filters the processing liquid flowing through the processing liquid pipe 132 .
  • the liquid leakage detection unit 130 may be arranged below the preparation tank 134 . Alternatively, the liquid leakage detector 130 may be arranged near the processing liquid pipe 132 .
  • a space for arranging electrical components may be provided in the upper part of the housing 122 .
  • liquid leakage detectors 130 may be arranged in the treatment liquid cabinet 120 .
  • liquid leakage in the treatment liquid cabinet 120 may be determined based on the detection result of one of the multiple types of liquid leakage detection units 130 or a combination of multiple detection results.
  • FIG. 14A is a schematic diagram of the processing liquid cabinet 120 in the substrate processing apparatus 100 of this embodiment.
  • the treatment liquid cabinet 120 shown in FIG. 14(a) has the same configuration as the treatment liquid cabinet 120 shown in FIG. redundant description is omitted for the purpose of avoiding redundancy.
  • the liquid leakage detection unit 130 includes a liquid detection sensor 130a and a camera 130b.
  • the liquid detection sensor 130 a is arranged below the housing 122 .
  • Camera 130 b is arranged above housing 122 .
  • the liquid leakage detection unit 130 may detect liquid leakage from the treatment liquid cabinet 120 based on the detection result of either the liquid detection sensor 130a or the camera 130b. Alternatively, the liquid leakage detection unit 130 may detect liquid leakage from the treatment liquid cabinet 120 based on detection results from both the liquid detection sensor 130a and the camera 130b.
  • the liquid leakage detection unit 130 may detect liquid leakage from the processing liquid cabinet 120 based on the flow rate of the liquid flowing through the processing liquid pipe 132 .
  • FIG. 14(b) is a schematic diagram of the processing liquid cabinet 120 in the substrate processing apparatus 100 of this embodiment.
  • the treatment liquid cabinet 120 shown in FIG. 14(b) is similar to that shown in FIG. 14(a) except that the liquid leakage detector 130 includes a flowmeter 136d and a flowmeter 136e instead of the liquid detection sensor 130a and the camera 130b. has the same configuration as the treatment liquid cabinet 120 shown in FIG.
  • the processing liquid cabinet 120 further includes a flowmeter 136d and a flowmeter 136e.
  • the flow meter 136d is attached to the upstream processing liquid pipe 132a and measures the flow rate of the processing liquid flowing through the upstream processing liquid pipe 132a.
  • the flow meter 136e is attached to the downstream processing liquid pipe 132b and measures the flow rate of the processing liquid flowing through the downstream processing liquid pipe 132b.
  • the flow rate measured by the flow meter 136d is equal to the flow rate measured by the flow meter 136e.
  • the flow rate measured at flow meter 136d is equal to the flow rate measured at flow meter 136e.
  • the flow meters 136 d and 136 e can detect liquid leakage in the processing liquid cabinet 120 , and the flow meters 136 d and 136 e can function as the liquid leakage detector 130 .
  • processing liquid cabinet 120 has one partitioned space in the above description with reference to FIGS. 1 to 14, the processing liquid cabinet 120 may have a plurality of partitioned spaces. .
  • FIG. 15(a) and 15(b) are schematic top views of the processing liquid cabinet 120 in the substrate processing apparatus 100 of this embodiment.
  • the processing liquid cabinet 120 has a first processing liquid housing 122a and a second processing liquid housing 122b.
  • the first processing liquid housing 122a and the second processing liquid housing 122b are arranged adjacent to each other.
  • the processing liquid cabinet 120 is partitioned from other members.
  • the first treatment liquid housing 122a and the second treatment liquid housing 122b are respectively partitioned. Thereby, the treatment liquid cabinet 120 has a plurality of partitioned spaces.
  • a processing liquid pipe 132 and a preparation tank 134 are arranged in the first processing liquid housing 122a.
  • a processing liquid pipe 132 and a preparation tank 134 are arranged in the second processing liquid housing 122b.
  • the processing liquid flowing through the first processing liquid housing 122a may be the same as the processing liquid flowing through the second processing liquid housing 122b, or may be different.
  • the processing liquid in the first processing liquid housing 122a may be of a different type than the processing liquid in the second processing liquid housing 122b.
  • the concentration of the processing liquid in the first processing liquid housing 122a may be different from the concentration of the processing liquid in the second processing liquid housing 122b.
  • one of the processing liquids in the first processing liquid housing 122a and the second processing liquid housing 122b supplies the processing liquid to the substrate processing unit 10, and the other one supplies the processing liquid to the substrate processing unit 10 before supplying the processing liquid to the substrate processing unit 10. may be circulated.
  • the first processing liquid housing 122a has an exhaust section 124a.
  • the exhaust section 124a has an exhaust pipe 125a and a damper 127a.
  • the second treatment liquid housing 122b has an exhaust section 124b.
  • the exhaust section 124b has an exhaust pipe 125b and a damper 127b.
  • a common exhaust pipe 140 is attached to the treatment liquid cabinet 120 .
  • the common exhaust pipe 140 is connected to the exhaust pipe 125a of the first processing liquid housing 122a and the exhaust pipe 125b of the second processing liquid housing 122b. Therefore, the atmosphere in the first processing liquid housing 122a is exhausted through the exhaust pipe 125a and the common exhaust pipe 140, and the atmosphere in the second processing liquid housing 122b is exhausted through the exhaust pipe 125b and the common exhaust pipe 140. exhausted through
  • the common exhaust pipe 140 has a connecting pipe 142 and a main pipe 144 .
  • the communication pipe 142 connects the exhaust pipe 125 a of the first processing liquid housing 122 a, the exhaust pipe 125 b of the second processing liquid housing 122 b, and the main pipe 144 .
  • the atmosphere inside the first treatment liquid housing 122 a is exhausted via the exhaust pipe 125 a , the connecting pipe 142 and the main pipe 144 .
  • the atmosphere in the second processing liquid housing 122b is exhausted via the exhaust pipe 125b, the connecting pipe 142 and the main pipe 144. As shown in FIG.
  • the liquid leakage detection unit 130 of the first processing liquid housing 122a detects the liquid leakage in the processing liquid cabinet 120. do.
  • the control unit 102 determines the liquid leakage state within the processing liquid cabinet 120 .
  • the control unit 102 sets the forced exhaust amount according to the liquid leakage state.
  • the controller 102 increases the opening degree of the damper 127a according to the leakage state.
  • the processing liquid does not leak inside the second processing liquid housing 122b. Therefore, the liquid leakage detection unit 130 of the second processing liquid housing 122 b does not detect liquid leakage within the processing liquid cabinet 120 . Therefore, the controller 102 keeps the opening of the damper 127b constant according to the leakage state.
  • the first processing liquid housing 122a and the second processing liquid housing 122b are separated from each other with a relatively simple configuration.
  • the atmosphere in the first processing liquid housing 122a and the second processing liquid housing 122b can be exhausted integrally.
  • the processing liquids flowing through the first processing liquid housing 122a and the second processing liquid housing 122b may be different.
  • the processing liquids flowing through the first processing liquid housing 122a and the second processing liquid housing 122b are common in terms of either acidity, alkalinity, or organic solvent. In this case, the exhaust that has flowed through the common exhaust pipe 140 can be collectively treated.
  • the volume of the first processing liquid housing 122a and the second processing liquid housing 122b, the type, temperature, and application of the processing liquid flowing through the first processing liquid housing 122a and the second processing liquid housing 122b are different.
  • the criteria for determining leakage and/or the criteria for determining leakage status in the first processing liquid enclosure 122a and the second processing liquid enclosure 122b may be different.
  • the forced exhaust condition for the first processing liquid housing 122a may be different from the forced exhaust condition for the second processing liquid housing 122b.
  • FIG. 16(a) is a graph showing temporal changes in the detected amount in the exhaust control method of the first processing liquid housing 122a of the processing liquid cabinet 120 according to this embodiment
  • FIG. 2 is a graph showing temporal changes in the amount detected in the exhaust control method of the second processing liquid housing 122b of the processing liquid cabinet 120 according to FIG.
  • the processing liquid does not leak in the first processing liquid housing 122a at first.
  • the detection amount increases. For example, when the detected amount exceeds the threshold value t1a, the control unit 102 changes the exhaust condition from the standard exhaust condition to the first forced exhaust condition, and the exhaust unit 124a operates the first processing liquid container according to the first forced exhaust condition.
  • the atmosphere within body 122a is evacuated.
  • the exhaust unit 124a exhausts the atmosphere in the first processing liquid housing 122a under the first forced exhaust condition set to the first forced exhaust amount larger than the standard exhaust amount.
  • the control unit 102 changes the exhaust condition from the first forced exhaust condition to the second forced exhaust condition, and the exhaust unit 124a discharges the first processing liquid according to the second forced exhaust condition.
  • the atmosphere inside the housing 122a is exhausted.
  • the exhaust unit 124a exhausts the atmosphere in the first processing liquid housing 122a under the second forced exhaust condition set to the second forced exhaust amount larger than the first forced exhaust amount.
  • the control unit 102 changes the exhaust condition from the second forced exhaust condition to the third forced exhaust condition, and the exhaust unit 124a performs the first process according to the third forced exhaust condition.
  • the atmosphere in the liquid housing 122a is exhausted.
  • the exhaust section 124a exhausts the atmosphere in the first processing liquid housing 122a under the third forced exhaust condition set to the third forced exhaust amount.
  • control unit 102 changes the exhaust condition from the third forced exhaust condition to the standard exhaust condition, and the exhaust unit 124a moves the first processing liquid housing 122a according to the standard exhaust condition. Exhaust the atmosphere inside.
  • the second processing liquid housing 122b may be set to an exhaust condition different from that of the first processing liquid housing 122a. Also, the threshold for determining the exhaust condition in the second processing liquid housing 122b may be different from the threshold for determining the exhaust condition in the first processing liquid housing 122a.
  • the processing liquid does not leak inside the second processing liquid housing 122b at first.
  • the detection amount increases. For example, when the detected amount exceeds the threshold value t1b, the control unit 102 changes the exhaust condition from the standard exhaust condition to the forced exhaust condition, and the exhaust unit 124b causes the second treatment liquid case 122b to decompress according to the forced exhaust condition. Evacuate the atmosphere.
  • the threshold t1b may be different from the threshold t1a.
  • the forced exhaust condition by the exhaust part 124b may be different from the first forced exhaust condition by the exhaust part 124a.
  • the control unit 102 maintains the forced exhaust condition as the exhaust condition, and the exhaust unit 124b exhausts the atmosphere in the second processing liquid housing 122b according to the forced exhaust condition.
  • the threshold t2b may be different from the threshold t2a.
  • the control unit 102 changes the exhaust condition from the forced exhaust condition to the standard exhaust condition, and the exhaust unit 124b causes the second processing liquid case 122b to decompress according to the standard exhaust condition. Evacuate the atmosphere.
  • control unit 102 can individually set the liquid leakage detection, liquid leakage state determination, and/or exhaust conditions according to the first processing liquid housing 122a and the second processing liquid housing 122b. good.
  • the first processing liquid housing 122a and the second processing liquid housing 122b are arranged adjacent to each other, but the present embodiment is not limited to this.
  • the first treatment liquid enclosure 122a and the second treatment liquid enclosure 122b may be arranged at different locations. Further, when the first processing liquid housing 122a and the second processing liquid housing 122b are connected to the common exhaust pipe 140, the amount of exhaust flowing through the common exhaust pipe 140 may be changed.
  • FIGS. 1 to 17 are schematic diagrams of the processing liquid cabinet 120 and the common exhaust pipe 140 in the substrate processing apparatus 100 of this embodiment.
  • the processing liquid cabinet 120 is connected to a common exhaust pipe 140 .
  • the treatment liquid cabinet 120 includes a first treatment liquid enclosure 122a, a second treatment liquid enclosure 122b, and a third treatment liquid enclosure 122c.
  • the first processing liquid housing 122a, the second processing liquid housing 122b and the third processing liquid housing 122c are positioned apart.
  • the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c each have the same configuration.
  • the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c may be arranged adjacent to each other.
  • a blower mechanism 146 is arranged in the common exhaust pipe 140 .
  • the blowing mechanism 146 blows air in the common exhaust pipe 140 so that the gas in the common exhaust pipe 140 flows away from the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c. Therefore, the gas in the common exhaust pipe 140 is circulated by the blower mechanism 146, and the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c are exhausted.
  • blower mechanism 146 has a fan.
  • FIG. 17A shows the exhaust amounts of the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, and the common exhaust pipe 140, respectively.
  • the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c are respectively 1.0, 1.0, and 1.0, and the exhaust volume of the common exhaust pipe 140 is 3.0.
  • the liquid leakage detection unit 130 of the first processing liquid housing 122a detects the leakage in the first processing liquid housing 122a. Detect liquid.
  • the processing liquid does not leak inside the second processing liquid housing 122b and the third processing liquid housing 122c.
  • the control unit 102 determines the state of liquid leakage in the first processing liquid housing 122a. After that, the control unit 102 determines forced exhaust conditions for the first processing liquid housing 122a according to the liquid leakage state, and the exhaust unit 124 of the first processing liquid housing 122a operates to control the inside of the first processing liquid housing 122a. The atmosphere is exhausted under forced exhaust conditions. Further, the control unit 102 maintains the standard exhaust conditions of the second processing liquid housing 122b and the third processing liquid housing 122c, and the exhaust section of each of the second processing liquid housing 122b and the third processing liquid housing 122c. 124 exhausts the atmosphere in the second processing liquid housing 122b and the third processing liquid housing 122c under standard exhaust conditions.
  • the control unit 102 increases the exhaust amount of the common exhaust pipe 140 by the blower mechanism 146 as the exhaust amount of the exhaust unit 124 of the first processing liquid housing 122a increases.
  • the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c are 1.5, 1.0, and 1.0, respectively.
  • the displacement is 3.5.
  • control unit 102 increases the exhaust amount of the first processing liquid housing 122a and increases the exhaust amount of the common exhaust pipe 140 according to the liquid leakage state in the first processing liquid housing 122a. . As a result, the leaked first processing liquid housing 122a can be efficiently exhausted.
  • the air blowing mechanism 146 is controlled to adjust the exhaust amount of the common exhaust pipe 140 according to the occurrence of liquid leakage, but the present embodiment is not limited to this. It is not necessary to adjust the exhaust amount of the common exhaust pipe 140 regardless of the presence or absence of liquid leakage.
  • FIGS. 18(a) and 18(b) are schematic diagrams for explaining the exhaust control method of the processing liquid cabinet 120 of this embodiment.
  • the processing liquid cabinet 120 is connected to a common exhaust pipe 140 .
  • the treatment liquid cabinet 120 includes a first treatment liquid enclosure 122a, a second treatment liquid enclosure 122b, and a third treatment liquid enclosure 122c.
  • no liquid leakage is detected in each of the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c.
  • FIG. 18(a) shows the respective exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, and the common exhaust pipe 140.
  • the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c are respectively 1.0, 1.0, and 1.0, and the exhaust volume of the common exhaust pipe 140 is 3.0.
  • the liquid leakage detection unit 130 of the first processing liquid housing 122a detects the leakage in the first processing liquid housing 122a. Detect liquid.
  • the processing liquid does not leak inside the second processing liquid housing 122b and the third processing liquid housing 122c.
  • the control unit 102 determines the state of liquid leakage in the first processing liquid housing 122a. After that, the control unit 102 determines forced exhaust conditions for the first processing liquid housing 122a according to the liquid leakage state, and the exhaust unit 124 of the first processing liquid housing 122a operates to control the inside of the first processing liquid housing 122a. The atmosphere is exhausted under forced exhaust conditions. In addition, the control unit 102 maintains the standard exhaust conditions of the second processing liquid housing 122b and the third processing liquid housing 122c, and the exhaust section of each of the second processing liquid housing 122b and the third processing liquid housing 122c. 124 exhausts the atmosphere in the second processing liquid housing 122b and the third processing liquid housing 122c under standard exhaust conditions.
  • the control unit 102 does not increase the exhaust amount of the common exhaust pipe 140 by the blower mechanism 146 . Therefore, the exhaust amount of the first processing liquid housing 122a increases, and the exhaust amounts of the second processing liquid housing 122b and the third processing liquid housing 122c decrease.
  • the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c are respectively 1.4, 0.8, and 0.8, and the exhaust volume of the common exhaust pipe 140 is is kept at 3.0.
  • control unit 102 increases the exhaust amount of the first processing liquid housing 122a according to the liquid leakage state in the first processing liquid housing 122a, The exhaust amount of the processing liquid housing 122c is reduced. As a result, the leaked first processing liquid housing 122 a can be efficiently exhausted without increasing the load on the air blowing mechanism 146 .
  • the first processing liquid housing 122a to the third processing liquid housing 122c have the same configuration, but the present embodiment is not limited to this. .
  • the first processing liquid housing 122a to the third processing liquid housing 122c may have different configurations.
  • the volumes of the first processing liquid housing 122a to the third processing liquid housing 122c may differ.
  • the common exhaust pipe 140 is connected to the first processing liquid housing 122a to the third processing liquid housing 122c provided with the processing liquid pipe 132.
  • This embodiment is not limited to this.
  • a cabinet without the processing liquid pipe 132 may be connected to the common exhaust pipe 140 .
  • FIG. 19(a) and 19(d) are schematic diagrams of the processing liquid cabinet 120, the common exhaust pipe 140 and the dummy cabinet 150 in the substrate processing apparatus 100 of this embodiment.
  • FIG. 19(b) is a schematic diagram of the processing liquid cabinet 120 in the substrate processing apparatus 100 of this embodiment
  • FIG. 19(c) is a schematic diagram of the dummy cabinet 150 in the substrate processing apparatus 100 of this embodiment. .
  • the common exhaust pipe 140 is connected to the processing liquid cabinet 120 and the dummy cabinet 150 .
  • the atmosphere in the processing liquid cabinet 120 and the atmosphere in the dummy cabinet 150 can be exhausted by the common exhaust pipe 140 .
  • the processing liquid cabinet 120 includes a first processing liquid housing 122a, a second processing liquid housing 122b, and a third processing liquid housing 122c.
  • the first processing liquid housing 122 a , the second processing liquid housing 122 b , and the third processing liquid housing 122 c include at least processing liquid piping 132 .
  • the dummy cabinet 150 does not have the processing liquid piping 132 .
  • the first processing liquid housing 122a to the third processing liquid housing 122c have the same configuration. Therefore, the volumes of the first processing liquid housing 122a to the third processing liquid housing 122c are equal to each other. On the other hand, the volume of the dummy cabinet 150 is smaller than the volumes of the first processing liquid housing 122a to the third processing liquid housing 122c. Here, no liquid leakage is detected in each of the first processing liquid housing 122a, the second processing liquid housing 122b, and the third processing liquid housing 122c.
  • FIG. 19(a) shows the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, the dummy cabinet 150, and the common exhaust piping 140.
  • the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, and the dummy cabinet 150 are 1.0, 1.0, 1.0, and 0.5, respectively.
  • the exhaust amount of the common exhaust pipe 140 is 3.5.
  • the first processing liquid housing 122a includes a housing 122, an air inlet 123, an exhaust section 124, a liquid leakage detection section 130, a processing liquid pipe 132, a preparation tank 134, and a pump. 136a, a temperature controller 136b, and a filter 136c.
  • the configuration of the first processing liquid housing 122a is the same as that of the processing liquid cabinet 120 described above with reference to FIG. 13, and detailed description thereof will be omitted here. Further, the configurations of the second processing liquid housing 122b and the third processing liquid housing 122c are similar to the configuration of the first processing liquid housing 122a.
  • the dummy cabinet 150 includes a housing 152, an air inlet 153, and an air outlet 154.
  • the first processing liquid housing 122a to the third processing liquid housing 122c no processing liquid flows through the dummy cabinet 150.
  • the exhaust section 154 has an exhaust pipe 155 and an exhaust amount adjusting mechanism 156 .
  • the exhaust pipe 155 When the atmosphere inside the housing 152 is exhausted, the gas inside the housing 152 flows through the exhaust pipe 155 and is discharged to the outside.
  • the exhaust volume adjustment mechanism 156 adjusts the amount of gas flowing through the exhaust pipe 155 (exhaust volume).
  • the exhaust volume adjustment mechanism 156 can increase or decrease the exhaust volume flowing through the exhaust pipe 155 .
  • the dummy cabinet 150 may include the liquid leakage detector 130 .
  • the dummy cabinet 150 includes the liquid leakage detection unit 130 , it can be detected that the treatment liquid has entered the dummy cabinet 150 through the intake port 153 .
  • the liquid leakage detection unit 130 of the first processing liquid housing 122a detects the leakage in the first processing liquid housing 122a. Detect liquid.
  • the processing liquid does not leak inside the second processing liquid housing 122b and the third processing liquid housing 122c.
  • the control unit 102 determines the state of liquid leakage in the first processing liquid housing 122a. After that, the control unit 102 determines forced exhaust conditions for the first processing liquid housing 122a according to the liquid leakage state, and the exhaust unit 124 of the first processing liquid housing 122a operates to control the inside of the first processing liquid housing 122a. The atmosphere is exhausted under forced exhaust conditions. Further, the control unit 102 maintains the standard exhaust conditions of the second processing liquid housing 122b and the third processing liquid housing 122c, and the exhaust section of each of the second processing liquid housing 122b and the third processing liquid housing 122c. 124 exhausts the atmosphere in the second processing liquid housing 122b and the third processing liquid housing 122c under standard exhaust conditions.
  • control unit 102 stops driving the exhaust unit 154 of the dummy cabinet 150 as the exhaust condition of the first treatment liquid housing 122a is changed from the standard exhaust condition to the forced exhaust condition. Therefore, the control unit 102 can increase the exhaust amount of the first processing liquid housing 122 a without increasing the exhaust amount of the common exhaust pipe 140 by the blower mechanism 146 .
  • the exhaust volumes of the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, and the dummy cabinet 150 are 1.5 and 1.5, respectively. 0, 1.0, 0.5, and the exhaust amount of the common exhaust pipe 140 is maintained at 3.5.
  • control unit 102 increases the displacement of the first treatment liquid housing 122a and reduces the displacement of the dummy cabinet 150 according to the state of liquid leakage in the first treatment liquid housing 122a. .
  • the leaked first processing liquid housing 122 a can be efficiently exhausted without increasing the load on the air blowing mechanism 146 .
  • processing liquid cabinet 120 is directly connected to the common exhaust pipe 140 in the substrate processing apparatus 100 shown in FIGS. 14 to 19, the present embodiment is not limited to this.
  • the processing liquid cabinet 120 may be connected to a common exhaust line 140 via a dummy cabinet 150 .
  • FIG. 20 is a schematic diagram of the processing liquid cabinet 120, the common exhaust pipe 140 and the dummy cabinet 150 in the substrate processing apparatus 100 of this embodiment.
  • a dummy cabinet 150 is connected to the common exhaust pipe 140, and the treatment liquid cabinet 120 is connected to the dummy cabinet 150.
  • the processing liquid cabinet 120 includes first processing liquid enclosures 122a to third processing liquid enclosures 122c.
  • the first processing liquid housing 122 a to the third processing liquid housing 122 c are connected to the dummy cabinet 150 .
  • 21(a) and 21(b) show a dummy cabinet 150 to which the exhaust pipes 125a to 125c of the first processing liquid housing 122a to the third processing liquid housing 122c in the substrate processing apparatus 100 of this embodiment are connected. It is a schematic diagram of.
  • the dummy cabinet 150 is connected to the first processing liquid housing 122a to the third processing liquid housing 122c. Specifically, the dummy cabinet 150 is connected to the first processing liquid housing 122a to the third processing liquid housing 122c. Also, the dummy cabinet 150 is connected to the common exhaust pipe 140 .
  • the exhaust section 154 has an exhaust pipe 155 and a damper 157 .
  • the exhaust pipe 155 is arranged inside the housing 152 .
  • a damper 157 controls the opening of the exhaust pipe 155 .
  • the damper 157 functions as an exhaust amount adjustment mechanism for the exhaust pipe 155 .
  • the exhaust amounts of the exhaust pipe 155 through the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, and the damper 157 are respectively 1.0, 1.0, 1.0, When it is 0.5, the exhaust amount of the common exhaust pipe 140 is 3.5.
  • the liquid leakage detection unit 130 of the first processing liquid housing 122a detects the leakage in the first processing liquid housing 122a. Detect liquid.
  • the processing liquid does not leak inside the second processing liquid housing 122b and the third processing liquid housing 122c.
  • the control unit 102 determines the state of liquid leakage in the first processing liquid housing 122a. After that, the control unit 102 determines forced exhaust conditions for the first processing liquid housing 122a according to the liquid leakage state, and the exhaust unit 124 of the first processing liquid housing 122a operates to control the inside of the first processing liquid housing 122a. The atmosphere is exhausted under forced exhaust conditions. Further, the control unit 102 maintains the standard exhaust conditions of the second processing liquid housing 122b and the third processing liquid housing 122c, and the exhaust section of each of the second processing liquid housing 122b and the third processing liquid housing 122c. 124 exhausts the atmosphere in the second processing liquid housing 122b and the third processing liquid housing 122c under standard exhaust conditions.
  • control unit 102 reduces the exhaust amount of the exhaust pipe 155 via the damper 157 as the exhaust condition of the first treatment liquid housing 122a is changed from the standard exhaust condition to the forced exhaust condition.
  • the control unit 102 further narrows the opening of the damper 157 so that the exhaust unit 154 can maintain the overall exhaust volume, and the control unit 102 increases the exhaust volume of the common exhaust pipe 140 by the blower mechanism 146. It doesn't have to be.
  • the exhaust amounts of the exhaust piping 155 through the first processing liquid housing 122a, the second processing liquid housing 122b, the third processing liquid housing 122c, and the damper 157 are respectively 1.4, 1.0, 1.0, 0.1, and the exhaust amount of the common exhaust pipe 140 may remain at 3.5.
  • the leaked first processing liquid housing 122 a can be efficiently exhausted without increasing the load on the air blowing mechanism 146 .
  • the present invention is suitably used for exhausting the processing liquid cabinet.
  • substrate processing unit 12 chamber 20 substrate holder 30 processing liquid supply unit 100 substrate processing apparatus 110 processing liquid box 120 processing liquid cabinet W substrate

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Abstract

Le procédé de commande d'échappement pour armoire à liquide de traitement (120) de l'invention comprend une étape d'échappement standard pour évacuer l'atmosphère de l'intérieur de l'armoire à liquide de traitement (120) dans une condition d'échappement standard, une étape de détection de fuite de liquide pour détecter une fuite de liquide qui s'est produite à l'intérieur de l'armoire à liquide de traitement (120), une étape d'évaluation de l'état de fuite de liquide pour utiliser le résultat de la détection dans l'étape de détection de fuite de liquide pour évaluer l'état de fuite de liquide à l'intérieur de l'armoire à liquide de traitement (120), une étape de détermination d'une condition d'échappement forcé pour utiliser le résultat de l'évaluation dans l'étape d'évaluation de l'état de fuite de liquide afin de déterminer un ensemble de conditions d'échappement forcé de manière à produire une quantité d'échappement supérieure à la quantité d'échappement produite par la condition d'échappement standard, et une étape d'échappement forcé pour évacuer l'atmosphère de l'intérieur de l'armoire à liquide de traitement (120) dans la condition d'échappement forcé déterminée dans l'étape de détermination de la condition d'échappement forcé.
PCT/JP2022/002648 2021-03-25 2022-01-25 Procédé de commande d'échappement pour armoire à liquide de traitement et dispositif de traitement de substrat WO2022201831A1 (fr)

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