WO2022186356A1 - Procédé et dispositif d'élimination de film - Google Patents

Procédé et dispositif d'élimination de film Download PDF

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Publication number
WO2022186356A1
WO2022186356A1 PCT/JP2022/009237 JP2022009237W WO2022186356A1 WO 2022186356 A1 WO2022186356 A1 WO 2022186356A1 JP 2022009237 W JP2022009237 W JP 2022009237W WO 2022186356 A1 WO2022186356 A1 WO 2022186356A1
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WIPO (PCT)
Prior art keywords
film
oxygen
scanning
laser light
laser
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Application number
PCT/JP2022/009237
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English (en)
Japanese (ja)
Inventor
紗世 菅
昌充 金子
和行 梅野
真有 佐武
史香 西野
知道 安岡
Original Assignee
古河電気工業株式会社
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Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to JP2023503958A priority Critical patent/JPWO2022186356A1/ja
Publication of WO2022186356A1 publication Critical patent/WO2022186356A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the present invention relates to a film removing method and a film removing apparatus.
  • Patent document 1 a film removing method and a film removing apparatus have been known that remove the film of an electric wire by irradiating it with a laser beam to expose the conductor covered by the film.
  • one of the objects of the present invention is to obtain, for example, an improved and novel film removing method and film removing apparatus.
  • the film removing method of the present invention is, for example, a film removing method for removing the insulating film of an electric wire having a core wire and an insulating film made of an organic polymer material by irradiating a laser beam, and supplying oxygen.
  • the insulating film is removed by irradiating the laser light while the insulating film is being irradiated.
  • the oxygen may be supplied from the side opposite to the remaining portion of the insulating film with respect to the boundary with the removal area of the remaining portion.
  • the oxygen may be supplied toward the boundary or onto the core wire of the removal area.
  • the removal region may expand in the first direction, and the oxygen may be supplied in a direction including the component in the first direction.
  • the laser light may be a continuous wave.
  • the laser beam may be scanned along the surface of the electric wire.
  • the oxygen may be supplied in a direction including a scanning direction component of the beam.
  • the length of the irradiation region of the beam in the direction intersecting the scanning direction may be longer than the length of the irradiation region in the scanning direction.
  • the irradiation region extends over both ends of the predetermined range in a direction intersecting the scanning direction. good too.
  • the beam may be shaped by a beam shaper.
  • the scanning direction of the beam may change over time.
  • the oxygen supply direction may be switched in accordance with the change in the scanning direction over time.
  • the oxygen may be supplied only when the beam is scanned in a specific direction when the scanning direction changes over time.
  • the beam may be moved in a spiral or folding manner on the surface so that the removal area of the insulating coating gradually expands in at least a part of the scanning of the beam.
  • the irradiation power of the laser light per unit area of the surface may be changed while the beam is scanned over a predetermined range of the surface to remove the insulating film.
  • the coating removal method may include a step of lowering the irradiation power of the laser beam per unit area of the surface during the period of scanning the beam over a predetermined range of the surface to remove the insulating coating. .
  • the irradiation power of the laser light per unit area of the surface may be changed by changing at least one of the scanning speed of the laser light and the output of the light source of the laser light.
  • the wire and the beam may move relative to each other in the axial direction of the wire in at least a part of the scanning of the beam.
  • the electric wire and the beam may relatively move in a direction crossing the axial direction of the electric wire in at least a part of the scanning of the beam.
  • the electric wire and the beam may relatively move in the circumferential direction around the central axis of the electric wire in at least a part of the scanning of the beam.
  • the higher the combustibility of the insulating film material, the lower the concentration of the supplied oxygen may be set.
  • the film removing method includes a first step of removing the first insulating film by irradiating the first insulating film as the insulating film with the laser beam while supplying the oxygen at a first concentration; removing the second insulating coating by irradiating the second insulating coating as the insulating coating having lower combustibility than the first insulating coating with the laser beam while supplying the oxygen at a second concentration higher than the concentration; and two steps.
  • the first insulating coating is provided so as to surround the second insulating coating
  • the coating removing method includes supplying the oxygen at the first concentration to the first insulating coating a first step of removing the first insulating film by irradiating the laser beam to expose the second insulating film; and supplying the oxygen at the second concentration to the second insulating film while the laser beam and a second step of removing the second insulating coating by irradiating with.
  • the second insulating film may be removed at a position distant from the first insulating film.
  • the oxygen-containing gas may be supplied at a flow rate of 3.0 [m/s] or more and 35 [m/s] or less.
  • the film removing apparatus of the present invention is, for example, a laser device that outputs a laser beam, and an electric wire having a core wire and an insulating film made of an organic polymer material.
  • An optical head for irradiating a surface, and an oxygen supply mechanism for supplying oxygen toward the irradiation position of the laser beam on the electric wire are provided.
  • the oxygen supply mechanism may have a plurality of nozzles that supply oxygen in different directions, and a switching mechanism that switches between supply and stop of oxygen supply by the plurality of nozzles.
  • FIG. 1 is an exemplary and schematic perspective view of a portion of an electric wire from which a coating is removed by the coating removal method of the first embodiment.
  • FIG. 2 is an exemplary schematic configuration diagram of the film removing device of the first embodiment.
  • FIG. 3 is an exemplary block diagram of the film removing device of the embodiment.
  • FIG. 4 is an exemplary and schematic side view of a portion of the wire from which the coating is removed by the coating removal method of the first embodiment.
  • FIG. 5 is a schematic diagram showing directions of oxygen supplied by the film removing method of the first embodiment.
  • FIG. 6 is an exemplary and schematic side view of part of the wire from which the coating is removed by the coating removal method of the first embodiment, showing a case where the oxygen supply position is different from that in FIG. .
  • FIG. 1 is an exemplary and schematic perspective view of a portion of an electric wire from which a coating is removed by the coating removal method of the first embodiment.
  • FIG. 2 is an exemplary schematic configuration diagram of the film removing device of the first embodiment
  • FIG. 7 is an exemplary and schematic front view of part of the film removing device of the second embodiment.
  • FIG. 8 is an exemplary and schematic rear view of a part of the wire from which the coating is removed by the coating removal method of the second embodiment.
  • FIG. 9 is a schematic diagram showing the direction of oxygen supplied by the film removing method of the second embodiment.
  • FIG. 10 is an exemplary and schematic front view of part of the film removing apparatus of the third embodiment.
  • FIG. 11 is an exemplary and schematic front view of part of the film removing apparatus of the fourth embodiment.
  • FIG. 12 is an exemplary and schematic front view of part of the film removing apparatus of the fifth embodiment.
  • FIG. 13 is an exemplary and schematic perspective view of an electric wire from which the coating is removed by the coating removal method of the sixth embodiment.
  • FIG. 14 is an exemplary and schematic side view of a portion of the wire from which the coating is removed by the coating removal method of the sixth embodiment.
  • FIG. 15 is a diagram showing an example of a laser beam irradiation region in the film removing method of the sixth embodiment.
  • FIG. 16 is a diagram showing a modification of the laser light irradiation area in the film removing method of the sixth embodiment.
  • FIG. 17 is a diagram showing a modification of the laser light irradiation area in the film removing method of the sixth embodiment.
  • FIG. 18 is a diagram showing a modification of the laser light irradiation area in the film removing method of the sixth embodiment.
  • FIG. 15 is a diagram showing an example of a laser beam irradiation region in the film removing method of the sixth embodiment.
  • FIG. 16 is a diagram showing a modification of the laser light irradiation area in the film removing method of the sixth embodiment.
  • FIG. 17 is a diagram showing a modification of the laser
  • FIG. 19 is a diagram showing a modified example of the irradiation area of the laser light in the film removing method of the sixth embodiment.
  • FIG. 20 is a diagram showing a modification of the laser light irradiation area in the film removing method of the sixth embodiment.
  • FIG. 21 is a plan view showing an example of an image of an electric wire obtained by the film removing method of the sixth embodiment.
  • FIG. 22 is a plan view showing an example of an image of an electric wire obtained by the film removing method of the sixth embodiment.
  • FIG. 23 is a plan view showing an example of an image of an electric wire obtained by the film removing method of the sixth embodiment.
  • FIG. 24 is a plan view showing an example of an image of an electric wire obtained by the film removing method of the sixth embodiment.
  • FIG. 21 is a plan view showing an example of an image of an electric wire obtained by the film removing method of the sixth embodiment.
  • FIG. 22 is a plan view showing an example of an image of an electric wire obtained by the film
  • FIG. 25 is an exemplary and schematic perspective view of a part of the electric wire before the coating is removed by the coating removal method of the seventh embodiment.
  • FIG. 26 is an exemplary and schematic perspective view of a portion of the wire from which the outer coating has been removed by the coating removing method of the seventh embodiment.
  • FIG. 27 is an exemplary and schematic perspective view of part of the electric wire from which the outer and inner coatings have been removed by the coating removal method of the seventh embodiment.
  • the X direction is indicated by an arrow X
  • the Y direction is indicated by an arrow Y
  • the Z direction is indicated by an arrow Z.
  • the X-, Y-, and Z-directions intersect each other and are orthogonal to each other.
  • the X direction can also be called the longitudinal direction or the extension direction
  • the Y direction can also be called the lateral direction or the width direction
  • the Z direction can also be called the thickness direction.
  • FIG. 1 is a perspective view of an electric wire 10 from which an insulating coating 12 is removed by the coating removing method of the first embodiment.
  • the electric wire 10 is, for example, a flat wire having a flat rectangular cross section.
  • the electric wire 10 has a conductor 11 having a strip-like and plate-like shape and an insulating coating 12 surrounding the conductor 11 .
  • the conductor 11 is an example of a core wire.
  • the conductor 11 is made of, for example, a copper-based material such as oxygen-free copper or copper alloy.
  • the insulating film 12 is made of an organic polymer material such as polyimide, polyetheretherketone, polyamideimide, polyurethane, polyester, or polyesterimide.
  • the insulating coating 12 is removed, for example, in a predetermined range A from the end of the conductor 11 .
  • the position where the insulating coating 12 is removed is not limited to the end of the electric wire 10, and may be, for example, a midway position in the longitudinal direction of the electric wire 10.
  • the insulating film 12 is removed by irradiating the surface 10a of the electric wire 10 set at the position where the laser beam is irradiated with the laser beam.
  • the insulating coating 12 is burned and removed at the spot irradiated position.
  • the scanning direction of the spot may change over time. In this embodiment, the spot moves repeatedly while being folded back on the surface 10a.
  • the spot and the electric wire 10 move relatively in directions (width direction, width direction, Y direction and opposite direction Yo to the Y direction) crossing the axial direction (longitudinal direction, X direction) of the electric wire 10 .
  • Scanning of the spot includes scanning in the scanning direction SD1 (Y direction) and scanning in the scanning direction SD2 (the opposite direction Yo to the Y direction).
  • the spot is scanned from the surface 10a of the electric wire 10 to a position off the surface 10a, and is folded back at the position off the surface 10a in the Y direction.
  • the output of the laser light may be reduced or stopped at positions outside the surface 10a.
  • the present invention is not limited to this, and between scanning in the scanning direction SD1 and scanning in the scanning direction SD2, the spot and the wire 10 move in the axial direction of the wire 10 on the surface 10a.
  • the spot may be scanned axially over the surface 10a.
  • the removal region macroscopically expands in the removal direction RD over time, and microscopically expands in the scanning direction SD1 and the scanning direction SD2 as the spot (beam) is scanned.
  • the scanning range, turn-around position, scanning direction, number of times, etc. are not limited to those shown in FIG.
  • the scanning trajectory is not limited to a folded shape, and may be a spiral shape.
  • the removal area of the insulating film 12 gradually expands as the spot moves spirally.
  • the insulating film 12 can be removed in the same manner from the surface different from that shown in FIG.
  • the electric wire 10 may be, for example, an electric wire different from a rectangular wire, such as a round wire having a conductor 11 with a circular cross section.
  • the cross-sectional shape of the electric wire 10 is not limited to a rectangular shape or a circular shape.
  • FIG. 2 is a schematic configuration diagram of the laser processing apparatus 100A (100). As shown in FIG. 2, the laser processing device 100A (100) has a laser device 111, a laser device 112, an optical head 120, and an optical fiber .
  • the laser devices 111 and 112 each have a laser oscillator, and as an example, are configured to output laser light with a power of several kW.
  • the laser devices 111 and 112 for example, have a plurality of semiconductor laser elements inside, and are configured to output multimode laser light with a power of several kW as the total output of the plurality of semiconductor laser elements. good too.
  • the laser devices 111 and 112 may have various laser light sources such as fiber lasers, YAG lasers, and disk lasers.
  • the laser device 111 outputs first laser light with a wavelength of 800 [nm] or more and 1200 [nm] or less.
  • Laser device 111 is also referred to as a first laser device.
  • a laser oscillator included in the laser device 111 is a light source and can also be referred to as a first laser oscillator.
  • the laser device 112 outputs a second laser beam with a wavelength of 300 [nm] or more and 600 [nm] or less.
  • the laser device 112 is also called a second laser device, and the laser oscillator included in the laser device 112 is a light source and can also be called a second laser oscillator.
  • Each of the laser devices 111 and 112 may output a continuous wave of laser light, or may output a pulse of laser light.
  • the optical fiber 130 guides the laser beams output from the laser devices 111 and 112 to the optical head 120, respectively.
  • the optical head 120 is an optical device for irradiating the electric wire 10 with laser light input from the laser devices 111 and 112 .
  • the optical head 120 has a collimator lens 121 , a condenser lens 122 , a mirror 123 and a filter 124 .
  • Collimating lens 121, condensing lens 122, mirror 123, and filter 124 may also be referred to as optics.
  • the optical head 120 is configured to be able to change its position relative to the wire 10 in order to scan the laser beam while irradiating the surface 10a of the wire 10 with the laser beam.
  • the scanning of the spot on the surface 10a may be achieved by at least one of movement of the optical head 120, movement of the wire 10, and change in the direction of emission of the laser beam from the optical head 120. .
  • the optical head 120 may have a galvanometer scanner or the like (not shown) so that the surface 10a can be scanned with a laser beam.
  • the collimating lenses 121 (121-1, 121-2) collimate the laser light input via the optical fiber 130, respectively.
  • the collimated laser light becomes parallel light.
  • the mirror 123 reflects the first laser light collimated by the collimating lens 121-1.
  • the first laser beam reflected by the mirror 123 travels in the opposite direction of the Z direction and travels toward the filter 124 . Note that the mirror 123 is not necessary in the configuration in which the first laser light is input so as to travel in the direction opposite to the Z direction in the optical head 120 .
  • the filter 124 is a high-pass filter that transmits the first laser beam and reflects the second laser beam without transmitting it.
  • the first laser beam passes through the filter 124 and travels in the opposite direction of the Z direction to the condenser lens 122 .
  • the filter 124 reflects the second laser beam collimated by the collimating lens 121-2.
  • the second laser beam reflected by the filter 124 travels in the opposite direction of the Z direction and travels toward the condenser lens 122 .
  • the condensing lens 122 converges the first laser beam and the second laser beam as parallel light, and irradiates the irradiation point P on the surface 10a of the electric wire 10 as laser light (output light).
  • the irradiation point P is an example of an irradiation position.
  • the optical head 120 has a DOE 125 (diffractive optical element) between the collimator lens 121-1 and the mirror 123.
  • the DOE 125 can appropriately shape the shape of the beam of the first laser light.
  • DOE 125 is an example of a beam shaper.
  • the laser processing apparatus 100 also includes a drive mechanism 150 and an oxygen supply mechanism 160.
  • the drive mechanism 150 changes the relative position of the optical head 120 with respect to the electric wire 10 .
  • the drive mechanism 150 includes, for example, a rotation mechanism such as a motor, a reduction mechanism that reduces the rotation output of the rotation mechanism, a motion conversion mechanism that converts the rotation reduced by the reduction mechanism into direct motion, and the like.
  • the control device 140 can control the drive mechanism 150 so that the relative position of the optical head 120 with respect to the wire 10 in the X, Y and Z directions is changed.
  • the oxygen supply mechanism 160 supplies oxygen gas Go (oxygen-containing gas) toward the irradiation point P through the pipe 161 .
  • the oxygen gas Go is discharged at a predetermined flow rate from a discharge port 161a of a nozzle provided at the tip of the pipe 161 and facing the irradiation point P.
  • the laser processing apparatus 100 removes the insulating film 12 from the wire 10 by irradiating laser light while supplying the oxygen gas Go.
  • the supply of the oxygen gas Go promotes the combustion of the insulation coating 12, and the removal performance of the insulation coating 12 can be improved compared to the case where the oxygen gas Go is not supplied.
  • the distance L between the discharge port 161a and the irradiation point P is preferably 10 [mm] or more and 25 [mm] or less, and more preferably 12 [mm] or more and 20 [mm] or less. It turned out to be more preferable to have Further, it was found that the flow velocity of the oxygen gas Go is preferably 3.0 [m/s] or more and 35 [m/s] or less at the discharge port 161a. Furthermore, it is preferable that the inner diameter of the discharge port 161a (nozzle) is equal to or larger than the width of the electric wire 10 so that the amount of oxygen supplied is less likely to vary across the width of the electric wire 10 .
  • the flow rate of the oxygen gas Go required to obtain the above-described flow velocity of 3.0 [m / s] or more and 35 [m / s] or less is 10 [L /min] or more and 100 [L/min] or less.
  • the flow rate of the oxygen gas Go is preferably 30 [L/min] or more, more preferably 50 [L/min] or more, and 70 [L/min] or more. was found to be even more preferable. If the distance L is too short, the thermal effect on the nozzle will increase. In addition, it was found that when the flow rate of the oxygen gas Go was less than 50 [L/min] in the range of the distance L, the removal performance of the insulating film 12 was lowered.
  • the laser processing apparatus 100 can achieve a thickness of the insulating coating 12 of 30 [ ⁇ m] or more, 50 [ ⁇ m] or more, or even 70 [ ⁇ m]. It was confirmed that the insulating film 12 can be quickly removed from the electric wire 10 described above, and a high-quality conductor 11 surface with little residue can be obtained.
  • the laser processing device 100 is an example of a film removing device.
  • the laser processing apparatus 100 also includes a control device 140 that controls the operations of the laser devices 111 and 112, the drive mechanism 150, and the oxygen supply mechanism 160.
  • FIG. 3 is a block diagram of the laser processing device 100.
  • the control device 140 is a computer and has a controller 141 , a main storage section 142 and an auxiliary storage device 143 .
  • the controller 141 is, for example, a processor (circuit) such as a CPU (central processing unit).
  • the main storage unit 142 is, for example, RAM (random access memory) or ROM (read only memory).
  • the auxiliary storage device 143 is, for example, a non-volatile storage device such as an SSD (solid state drive) or HDD (hard disk drive).
  • the controller 141 reads programs stored in the ROM of the main storage unit 142 and the auxiliary storage device 143 and executes each process, thereby operating as an output control unit 141a, a drive control unit 141b, and an oxygen supply control unit 141c. .
  • the program can be provided as an installable file or an executable file recorded on a computer-readable recording medium.
  • a recording medium may also be referred to as a program product.
  • Values used in arithmetic processing by programs and processors, and information such as tables and maps may be pre-stored in the ROM or auxiliary storage device 143, or may be stored in a storage unit of a computer connected to a communication network. It may be stored in auxiliary storage device 143 by being downloaded via a communication network.
  • Auxiliary storage device 143 stores data written by the processor. Also, the arithmetic processing by the controller 141 may be at least partially performed by hardware.
  • the controller 141 may include, for example, an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit). Note that the controller 141 may include control units other than the output control unit 141a, the drive control unit 141b, and the oxygen supply control unit 141c.
  • the output control unit 141a can control the operation of the laser devices 111 and 112, for example, to output the laser light, stop the output of the laser light, or change the output intensity of the laser light. can.
  • the drive control unit 141b controls the drive mechanism so that, for example, the irradiation point P of the laser beam on the electric wire 10 is moved and the irradiation point P is scanned, that is, the relative position between the optical head 120 and the electric wire 10 is changed. 150 can be controlled.
  • the oxygen supply control unit 141c controls the operation of the oxygen supply mechanism 160, for example, to supply the oxygen gas Go, stop the supply of the oxygen gas Go, or change the supply flow rate of the oxygen gas Go. can do.
  • the concentration of oxygen in the oxygen gas Go is set according to the combustibility of the material of the insulation coating 12 . Specifically, the higher the combustibility of the material of the insulation coating 12 is, the lower the concentration of oxygen to be supplied is set, and the lower the combustibility of the material of the insulation coating 12 is, the higher the concentration of oxygen to be supplied is set.
  • the concentration of oxygen is adjusted, for example, by a switching mechanism such as an electromagnetic valve that can change the discharge flow rate from the oxygen tank.
  • the concentration of oxygen is assumed to be the concentration at a fixed position such as the tip of the nozzle of the pipe 161, for example. With such a configuration and setting, for example, it is possible to suppress combustion exceeding the desired range of the insulating coating 12, and to achieve more efficient and rapid combustion.
  • the concentration of oxygen in the oxygen gas Go is appropriately set within a range equal to or higher than the oxygen concentration in air and equal to or lower than the oxygen concentration in pure oxygen.
  • FIG. 4 is a side view of part of the electric wire 10, showing the vicinity of the boundary Bo in the X direction between the removed region Ar and the remaining portion Pr of the insulating film 12.
  • FIG. 4 the end surface 12a of the insulating coating 12 appears at the boundary Bo by scanning the spot (beam) as illustrated in FIG.
  • the end face 12a is located at the opposite end of the insulating coating 12 in the X direction and faces in the opposite direction to the removal direction RD.
  • the end surface 12a is schematically depicted as extending substantially along the Z direction, but in reality, the end surface 12a may extend obliquely with respect to the Z direction. However, it may have an uneven shape.
  • the oxygen gas Go is supplied from the side opposite to the remaining portion Pr with respect to the boundary Bo, and is also supplied toward the boundary Bo.
  • the oxygen gas Go is supplied from the side opposite to the removal area Ar with respect to the boundary Bo, that is, if the oxygen gas is supplied from the right side or the upper right side of the boundary Bo in FIG.
  • the oxygen gas interferes with the remaining portion Pr of the insulating film 12, and the surface 11a, particularly near the boundary Bo, for example, the corner C between the surface 11a and the end face 12a of the remaining portion Pr, is sufficiently There is a risk that it will not be supplied.
  • the oxygen gas Go is supplied to the boundary Bo from the side opposite to the remaining portion Pr, so that the oxygen gas Go is supplied to the corner portion C without being hindered by the remaining portion Pr. , the burning of the insulating coating 12 by the irradiation of the laser light is facilitated, and the residue on the surface 11a can be further reduced. Further, even when the flow rate of the oxygen gas Go is increased and the residue is blown off by the oxygen gas Go, the oxygen gas Go is blown to the surface 11a up to the corner C to avoid interference with the remaining portion Pr. From the viewpoint of heating, it is preferable that the oxygen gas Go is supplied from the side opposite to the remaining portion Pr with respect to the boundary Bo and is supplied toward the boundary Bo.
  • the angle is 10° or more and 70° or less from the viewpoints of avoiding interference between the pipe 161 in the optical head 120 and the laser light emitting end and from the viewpoint of supplying sufficient oxygen to the vicinity of the boundary Bo of the surface 11a. and more preferably 20° or more and 50° or less.
  • FIG. 5 is a schematic diagram showing vector components in the supply direction of the oxygen gas Go.
  • the supply direction of the oxygen gas Go (arrow Go in FIG. 5) can be decomposed into a component Go_rd in the X direction (removal direction RD) and a component Go_z in the opposite direction to the Z direction. That is, the oxygen gas Go is supplied in a direction opposite to the Z direction, that is, in a direction including a component in the direction opposite to the normal direction of the surface 11a and a component in the removal direction RD.
  • the removal direction RD is an example of the first direction.
  • FIG. 6 is a side view showing the same position as in FIG. 4, and shows a case where the supply position of the oxygen gas Go is different from that in FIG.
  • the oxygen gas Go is supplied toward a position away from the boundary Bo (corner C) in the direction opposite to the removal direction RD (backward of the removal direction RD).
  • the oxygen gas Go is supplied from the side opposite to the remaining portion Pr with respect to the boundary Bo, and the supply direction of the oxygen gas Go is the same as in the case of FIGS.
  • the oxygen gas Go is also supplied to the corner C without being hindered by the remaining portion Pr. can leave less residue. Also, even if the flow rate of the oxygen gas Go is increased and the residue is blown off by the oxygen gas Go, the same effect as in the case of FIG. 4 can be obtained.
  • FIG. 7 is a front view showing part of the laser processing apparatus 100B (100) of the second embodiment.
  • a laser processing apparatus 100B has the same configuration as that of the first embodiment except for the portion illustrated in FIG.
  • the spot (beam) is scanned on the surface 10a in the same manner as in the first embodiment. That is, in this embodiment as well, as shown in FIG. 1, scanning of the spot includes scanning in the scanning direction SD1 (Y direction) and scanning in the scanning direction SD2 (the opposite direction Yo to the Y direction). included. Therefore, also in the present embodiment, the removal area Ar expands macroscopically in the removal direction RD and microscopically in the scanning directions SD1 and SD2 as the spot is scanned over time.
  • the optical head 120 includes a pipe 161-1 (161) for supplying the oxygen gas Go in a direction between the Y direction and the direction opposite to the Z direction.
  • control device 140 controls the oxygen supply mechanism 160 so that the oxygen gas Go is supplied only during scanning in the scanning direction SD1 and is not supplied during scanning in the scanning direction SD2.
  • FIG. 8 is a rear view (partial cross-sectional view) of a part of the electric wire 10 when viewed in the X direction, showing the removal area Ar of the insulating film 12 while the spot is being scanned in the scanning direction SD1. and a residual portion Pr in the vicinity of a boundary Bo1 in the Y direction.
  • the end face 12a1 is schematically depicted as extending substantially along the Z direction, but in reality, the end face 12a1 may extend obliquely with respect to the Z direction. However, it may have an uneven shape.
  • an end surface 12a1 of the insulating coating 12 appears at the boundary Bo1.
  • the end face 12a1 is located at the end of the insulating coating 12 opposite to the scanning direction SD1 and faces the opposite direction to the scanning direction SD1.
  • the end face 12a1 (boundary Bo1) moves in the scanning direction SD1, and the removal area Ar expands in the scanning direction SD1 over time.
  • the oxygen gas Go is supplied from the opposite side of the boundary Bo1 to the remaining portion Pr and is supplied toward the boundary Bo1.
  • the oxygen gas Go is supplied to the corner C1 between the surface 11a and the end surface 12a1 without being blocked by the remaining portion Pr. Burning of the insulating coating 12 by irradiation is facilitated, and the residue on the surface 11a can be further reduced. Further, even when the flow rate of the oxygen gas Go is increased and the residue is blown off by the oxygen gas Go, the oxygen gas Go is blown to the surface 11a up to the corner C1 to avoid interference with the remaining portion Pr. From the standpoint of replenishment, the oxygen gas Go is supplied to the boundary Bo1 from the side opposite to the remaining portion Pr, and is supplied toward the boundary Bo1 or from the boundary Bo1 (corner C1) in the direction opposite to the scanning direction SD1. It is preferably directed to a position spaced apart in the direction (behind the scanning direction SD1).
  • FIG. 9 is a schematic diagram showing vector components in the supply direction of the oxygen gas Go in the state of FIG.
  • the supply direction of the oxygen gas Go (arrow Go in FIG. 9) can be decomposed into a component Go_sd in the Y direction (scanning direction SD) and a component Go_z in the opposite direction to the Z direction. That is, the oxygen gas Go is supplied in a direction opposite to the Z direction, that is, in a direction including a component in the direction opposite to the normal direction of the surface 11a and a component in the scanning direction SD.
  • the supply direction of the oxygen gas Go may further have a component in the removal direction RD.
  • FIG. 10 is a front view showing part of the laser processing apparatus 100C (100) of the third embodiment.
  • a laser processing apparatus 100C has the same configuration as that of the first embodiment except for the portion illustrated in FIG.
  • the spot (beam) is scanned on the surface 10a in the same manner as in the first embodiment. That is, in this embodiment as well, as shown in FIG. 1, scanning of the spot includes scanning in the scanning direction SD1 (Y direction) and scanning in the scanning direction SD2 (the opposite direction Yo to the Y direction). included. Therefore, also in the present embodiment, the removal area Ar expands macroscopically in the removal direction RD and microscopically in the scanning directions SD1 and SD2 as the spot is scanned over time.
  • the optical head 120 includes a pipe 161-1 (161) for supplying the oxygen gas Go in a direction between the Y direction and the direction opposite to the Z direction, and a pipe 161-1 (161) for supplying the oxygen gas Go in the Y direction. and a pipe 161-2 (161) for supplying in a direction between the opposite direction Yo and the opposite direction of the Z direction. That is, the optical head 120 has a plurality of pipes 161 (nozzles) capable of supplying the oxygen gas Go in different directions.
  • control device 140 switches the supply direction of the oxygen gas Go in accordance with the change over time of the spot scanning direction. Specifically, the control device 140 supplies oxygen gas Go from the pipe 161-1 during scanning in the scanning direction SD1, and supplies oxygen gas Go from the pipe 161-2 during scanning in the scanning direction SD2. Control mechanism 160 .
  • the oxygen supply mechanism 160 has a switching mechanism, such as an electromagnetic valve (not shown), for switching between supply and stop of the oxygen gas Go through each pipe 161 .
  • the direction in which the oxygen gas Go is supplied from the pipe 161-1 is the direction opposite to the Z direction, that is, the direction opposite to the normal direction of the surface 11a, and the component in the scanning direction SD1, as in the second embodiment. , is the direction including Also, the supply direction of the oxygen gas Go from the pipe 161-2 is a direction including a component opposite to the Z direction and a component in the scanning direction SD2. Also in this case, the supply directions of the oxygen gas Go from the pipes 161-1 and 161-2 may each have a component in the removal direction RD.
  • the same effects as those of the first embodiment and the second embodiment can be obtained in the present embodiment as described above. Moreover, in this embodiment, since the oxygen gas Go can be supplied in both the scanning directions SD1 and SD2, it is possible to more reliably remove the residue.
  • FIG. 11 is a front view showing part of the laser processing apparatus 100D (100) of the fourth embodiment.
  • the optical head 120 has the same configuration as in the third embodiment.
  • the spot (beam) is scanned on the surface 10a by rotating the electric wire 10 in the circumferential direction around its central axis Ax relative to the optical head 120 . That is, in this embodiment, the electric wire 10 and the beam relatively move in the circumferential direction around the central axis Ax.
  • the controller 140 controls the oxygen supply mechanism 160 to supply the oxygen gas Go from the pipe 161-1.
  • the controller 140 controls the oxygen supply mechanism 160 to supply the oxygen gas Go from the pipe 161-2.
  • the supply direction of the oxygen gas Go also has a component in the sweep direction of the spot on the surface 10a in this embodiment. Therefore, this embodiment also provides the same effects as those of the third embodiment.
  • FIG. 12 is a front view showing part of the laser processing apparatus 100E (100) of the fifth embodiment.
  • a laser processing apparatus 100E has the same configuration as that of the first embodiment except for the portion illustrated in FIG. That is, in this embodiment, the optical head 120 has a galvanometer scanner 126 in front of the condenser lens 122 .
  • the galvanometer scanner 126 has a plurality of mirrors 126a and 126b. By changing the angles of the plurality of mirrors 126a and 126b, the emission direction of the laser light from the optical head 120 is switched. The angles of mirrors 126a and 126b are each changed by motors (neither shown) controlled by controller 140, for example. In this case, for example, the spot can be scanned in the scanning directions SD1 and SD2 on the surface 10a without relatively moving the electric wire 10 and the optical head 120. FIG. Note that the movement or scanning of the spot in the X direction may be realized by moving at least one of the wire 10 and the optical head 120 .
  • FIG. 13 is a perspective view of the same wire 10 as in FIG. 1, showing a different beam and scanning method than in FIG.
  • the irradiation area Ae of the laser light beam has an elongated linear shape and is scanned in the direction opposite to the X direction.
  • the Y-direction length of the irradiation region Ae is longer than the X-direction length of the irradiation region Ae.
  • the X direction is an example of the scanning direction SD
  • the Y direction is an example of a direction crossing the scanning direction SD.
  • the irradiation area Ae extends across both ends 10b of the surface 10a in the Y direction in a predetermined range A where the insulating coating 12 from the ends of the conductors 11 is removed.
  • the ends Ae1 on both sides of the irradiation area Ae in the Y direction are located on the opposite side of the end 10b of the predetermined range A from the center of the predetermined range A in the Y direction.
  • a region Ae is arranged so as to straddle the surface 10a.
  • FIG. 14 is a side view of part of the electric wire 10, showing the vicinity of the boundary Bo in the X direction between the removed region Ar and the remaining portion Pr of the insulating film 12.
  • FIG. 14 By irradiating the spot (beam) as illustrated in FIG. 13, an end surface 12a of the insulating coating 12 as illustrated in FIG. 14 appears at the boundary Bo.
  • the end face 12a is located at the end of the insulating film 12 opposite to the scanning direction SD (removal direction RD) and faces the opposite direction to the scanning direction SD.
  • the end surface 12a boundary Bo
  • the removal area Ar expands in the scanning direction SD (removal direction RD) over time.
  • the oxygen gas Go is supplied from the side opposite to the remaining portion Pr with respect to the boundary Bo, and is also supplied toward the boundary Bo. be.
  • the oxygen gas Go is supplied to the corner C between the surface 11a and the end surface 12a without being blocked by the remaining portion Pr. Burning of the insulating coating 12 by irradiation is facilitated, and the residue on the surface 11a can be further reduced. Further, even when the flow rate of the oxygen gas Go is increased and the residue is blown off by the oxygen gas Go, the oxygen gas Go is blown to the surface 11a up to the corner C to avoid interference with the remaining portion Pr.
  • the oxygen gas Go is supplied from the side opposite to the remaining portion Pr with respect to the boundary Bo, and is directed toward the boundary Bo or from the boundary Bo (corner C) in the direction opposite to the scanning direction SD. It is preferably directed to a position spaced apart in the direction (behind the scanning direction SD).
  • the end surface 12a is schematically depicted as extending substantially along the Z direction, but in reality, the end surface 12a may extend obliquely with respect to the Z direction. However, it may have an uneven shape. Also, although not shown, in this embodiment as well, the supply direction of the oxygen gas Go (arrow Go in FIG.
  • the oxygen gas Go is supplied in a direction opposite to the Z direction, that is, in a direction including a component in the direction opposite to the normal direction of the surface 11a and a component in the scanning direction SD.
  • 15 to 20 are diagrams showing various modifications of the irradiation area Ae (beam B) of the laser light. Both of these can be shaped by a DOE 125 (see FIG. 1) as a beam shaper.
  • the irradiation area Ae has a long and narrow linear shape extending in the Y direction.
  • the irradiation area Ae has two linear shapes that are spaced apart in the X direction and extend parallel to the Y direction.
  • the irradiation area Ae has a triangular wave shape extending in the Y direction.
  • adjacent spots touch each other.
  • a plurality of spots are alternately arranged in a zigzag along the Y direction as in FIG. 17, but in this example adjacent spots are spaced apart from each other. That is, the irradiation area Ae has a plurality of dotted spots separated from each other.
  • the irradiation area Ae has a sinusoidal shape extending in the Y direction.
  • FIG. 20 shows a circular irradiation area Ae including a beam B1 of the first laser beam and a beam B2 of the second laser beam.
  • the irradiation area Ae (beam B) includes a plurality of laser beams B1 and B2 having different wavelengths.
  • the beam B2 of the second laser light which is a blue laser or a green laser, is arranged in the center
  • the beam B1 of the first laser light which is an infrared laser
  • a blue laser or a green laser has a higher absorption rate and a lower reflectance than an infrared laser. Therefore, by irradiating the electric wire 10 in which the conductor 11 is made of a copper-based material, by irradiating the infrared laser, the film in the irradiated area is directly heated, and the laser that reaches the copper-based material and is reflected Since the light can apply heat to the film, heat can also be applied from the side where the insulating film 12 and the copper-based material are in contact with each other, and the film can be removed efficiently. At this time, the first laser beam and the second laser beam may be applied to different regions.
  • the insulating coating 12 can be efficiently removed by the first laser light of moderate intensity in a wider range than the beam B1 is irradiated.
  • the irradiation of the beam B2 efficiently gives heat to the conductor 11 from which the insulation coating 12 has been removed, and the temperature of the insulation coating 12 that has not been removed is preliminarily increased to facilitate efficient combustion. be done.
  • the arrangement of the plurality of beams B1 and B2 and the specifications such as size and area ratio are not limited to the example of FIG.
  • the area irradiated with only the first laser beam with respect to the area of the spot irradiated with only the second laser beam or both the first laser beam and the second laser beam (in the case of FIG. 20, the area of B2) (In the case of FIG. 20, the area of B1-B2) ratio, that is, (area of B1-B2) / (area of B2) is preferably 0.2 or more and 3.0 or less, and 0.5 or more and 1.8 It is more preferable that it is below.
  • the area of B1-B2 is preferably 0.03 [mm 2 ] or more and 0.4 [mm 2 ] or less, and is 0.05 [mm 2 ] or more and 0.2 [mm 2 ] or less. is more preferred.
  • Table 1 shows the experimental results when the insulating film 12 was removed by scanning the linear irradiation area Ae shown in FIG. 15 with infrared laser light having a wavelength of 1070 [nm]. ], the spot scanning speed [mm/s], and the laser beam output [W], experimental results of actually removing the insulating film 12 are shown.
  • ⁇ indicates that there is almost no residue such as the insulating film 12 or unburned residue, and the resistance value on the surface of the exposed conductor 11 is sufficiently low (for example, less than 2 [ ⁇ ]).
  • ⁇ indicates a "good” state in which there is little remaining insulating film 12 or residue and the resistance value is low (for example, 2 [ ⁇ ] or more and less than 20 [ ⁇ ]);
  • x indicates a “defective” state with a large amount of residue and a high resistance value.
  • FIG. 21 is an image I1 of the electric wire 10 from which the insulating coating 12 has been removed at an oxygen flow rate of 0 [L/min], a scanning speed of 100 [mm/s], and a laser beam output of 200 [W].
  • FIG. 22 is an image I2 of the electric wire 10 from which the insulating coating 12 has been removed at an oxygen flow rate of 50 [L/min], a scanning speed of 100 [mm/s], and a laser beam output of 500 [W].
  • FIG. 23 is an image I3 of the electric wire 10 from which the insulating coating 12 has been removed at an oxygen flow rate of 50 [L/min], a scanning speed of 250 [mm/s], and a laser beam output of 500 [W].
  • FIG. 21 shows a "bad” state in which the insulating coating 12 is incompletely burned due to the lack of oxygen supply, and black unburned residue remains in the predetermined range A as a whole.
  • FIG. 22 shows the "excellent” state in which the insulating coating 12 is almost completely removed in the predetermined range A by good combustion.
  • FIG. 23 shows a “bad” state in which the insulating coating 12 is incompletely burned due to insufficient irradiation power per unit time, and black unburned residue remains in the predetermined range A as a whole.
  • FIG. 24 shows the "excellent” state in which the insulating coating 12 is almost completely removed in the predetermined range A by good combustion.
  • the irradiation power of the laser light per unit area can be changed by changing at least one of the scanning speed of the laser light and the output of the light source of the laser light. The higher the scanning speed of the laser light or the lower the output of the light source of the laser light, the lower the irradiation power of the laser light per unit area.
  • the irradiation power of the laser light per unit area in the latter half of the irradiation time of the laser light is the same as the power per unit area in the first half of the irradiation time of the laser light. is preferably 0.8 times or less, and more preferably 0.5 times or less, the irradiation power of the laser light.
  • the irradiation power of the laser light may be made lower than in the Y-direction central region. Since the vicinity of the ends of the wire 10 in the Y direction has less heat escape than the central region in the Y direction, the insulating film 12 can be efficiently removed even with a smaller power, and the wire 10 is unnecessary in the process of removing the insulating film 12. oxidation can be suppressed. More specifically, for example, the ratio of the distance from each Y-direction end to the Y-direction width of the electric wire 10 is 0.2 or less, more preferably 0.1 or less.
  • the irradiation power of the laser light is preferably lower than the irradiation power of the laser light at the center of the wire 10 in the Y direction, and more preferably lower by 20% or more.
  • FIG. 25 is a perspective view of an electric wire 10A (10) to be processed by the film removing method of this embodiment.
  • the electric wire 10A has a conductor 11 and insulating coatings 12A and 12B (12) surrounding the conductor 11 in multiple layers.
  • Insulating coating 12B surrounds conductor 11, and insulating coating 12A surrounds insulating coating 12B.
  • the insulating coating 12A is an example of a first insulating coating
  • the insulating coating 12B is an example of a second insulating coating.
  • the insulating coatings 12A and 12B are made of different materials.
  • insulating coating 12B is made of polyurethane and insulating coating 12A is made of polyetheretherketone.
  • the combustibility combustion of each insulation coating 12 should be considered. If the combustibility is different, for example, the insulation coating 12 with high combustibility does not leave any residue, but the insulation coating 12 with low combustibility tends to leave residue, or the insulation coating 12 with high combustibility is within the desired range. because it burns or does
  • steps for removing the insulation coating 12 are set, and the oxygen concentration is set in each step according to the combustibility of the material of the insulation coating 12 .
  • FIG. 25 is a perspective view of the electric wire 10 before performing the coating removal method of this embodiment.
  • 26 is a perspective view showing a state in which the outer insulating coating 12A has been removed
  • FIG. 27 is a perspective view showing a state in which the inner insulating coating 12B has been removed.
  • a spot having an elongated irradiation area Ae (see FIGS. 13, 14, etc.) whose length in the Y direction is longer than the length in the X direction is scanned in the scanning direction SD. Then, the insulating film 12 is removed. Also in this embodiment, the removal direction RD is the scanning direction SD.
  • the spot is moved in the X direction from position x1 to a position beyond position xe, thereby removing the insulating film 12A (first step).
  • the spot is moved in the X direction from the position x2 to a position beyond the position xe, thereby removing the insulating film 12B (second step).
  • the oxygen concentration is made higher in the second step than in the first step.
  • the oxygen concentration in the second step is the second oxygen concentration.
  • the position x2 at which removal of the insulating film 12B is started is separated in the X direction from the position x1 at which removal of the insulating film 12A is started. That is, in the second step, the insulating coating 12B is removed at a position away from the insulating coating 12A. Thereby, in the second step in which the oxygen concentration is increased, it is possible to more reliably suppress unintentional combustion of the insulating coating 12A, which is more combustible.
  • the electric wire 10A after the second step has an exposed portion 11a1 which is a part of the surface 11a of the conductor 11 and an exposed portion 12b of the inner insulating coating 12B. , will have Exposed portion 12b is adjacent to exposed portion 11a1.
  • the exposed portion 11a1 is an example of a first exposed portion
  • the exposed portion 12b is an example of a second exposed portion.
  • setting the concentration of oxygen according to the combustibility of the material of the insulation coating 12 as in the present embodiment may be achieved by covering the insulation coating 12 with higher combustibility with the insulation coating 12 with lower insulation, for example. It is also applicable to a configuration in which a plurality of insulating coatings 12 made of different materials are arranged in the longitudinal direction.
  • the insulating film 12 of the wire 10 is removed by irradiating the laser beam while supplying oxygen. , the combustion of the insulating coating 12 is promoted.
  • This provides advantages such as, for example, obtaining a wire 10 with an exposed high-quality surface 11a with less residue, and more energy-efficient coating removal.
  • the insulating film 12 can be removed more easily or quickly with less residue.
  • the insulating film may have a thickness of 50 [ ⁇ m] or more.
  • the insulating film may have a thickness of 70 [ ⁇ m] or more.
  • the distance between the discharge port of the oxygen nozzle facing the irradiation position of the laser beam and the irradiation position of the laser beam is 10 [mm] or more and 25 [mm] or less, and the oxygen The supply flow rate may be 30 [L/min] or more.
  • the core wire may be made of a copper-based material.
  • the electric wire may be a rectangular wire or a round wire.
  • the wavelength of the laser light may be 300 [nm] or more and 1200 [nm] or less.
  • the laser light may include a beam having a wavelength of 300 [nm] or more and 600 [nm] or less.
  • the laser light may include a beam having a wavelength of 800 [nm] or more and 1200 [nm] or less.
  • the laser light may include a plurality of beams with different wavelengths.
  • the present invention can be used for a film removing method and a film removing apparatus.
  • Reference Signs List 10 10A Electric wire 10a Surface 10b Ends 10b1, 10b2 Corner 11 Conductor (core wire) 11a... Surface 11a1... Exposed portion (first exposed portion) 12... Insulating film 12A... Insulating film (first insulating film) 12B... Insulating film (second insulating film) 12a, 12a1... end face 12b... exposed portion (second exposed portion) 100, 100A to 100E ... laser processing equipment (film removal equipment) 111... Laser device (light source) 112... Laser device (light source) 120... Optical head 121, 121-1, 121-2... Collimating lens 122... Collecting lens 123... Mirror 124... Filter 125... DOE DESCRIPTION OF SYMBOLS 126...
  • Optical fiber 140 Control device 141... Controller 141a... Output control part 141b... Drive control part 141c... Oxygen supply control part 142... Main storage part 143... Auxiliary storage device 150...

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé d'élimination de film qui utilise une irradiation par lumière laser pour éliminer un film isolant constitué d'un matériau polymère organique, par exemple d'un fil électrique qui comprend un fil d'âme et le film isolant. Le film isolant est éliminé en irradiant une lumière laser tout en amenant de l'oxygène. Le dispositif d'élimination de film comporte, par exemple: une source lumineuse qui délivre une lumière laser; une tête optique qui irradie la lumière laser délivrée à partir de la source lumineuse vers la surface d'un fil électrique qui comprend un fil d'âme et un film isolant constitué d'un matériau polymère organique; et un mécanisme d'amenée d'oxygène qui amène de l'oxygène vers la position d'irradiation par lumière laser sur le fil électrique. La lumière laser peut être une onde continue. Le faisceau de la lumière laser peut effectuer un balayage le long de la surface du fil électrique.
PCT/JP2022/009237 2021-03-03 2022-03-03 Procédé et dispositif d'élimination de film WO2022186356A1 (fr)

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232303A (ja) * 1988-03-14 1989-09-18 Nippon Telegr & Teleph Corp <Ntt> 光ファイバ心線被覆除去方法及び除去装置
JPH02206313A (ja) * 1989-02-03 1990-08-16 Fujitsu Ltd ワイヤスプリット装置
JPH077825A (ja) * 1993-06-16 1995-01-10 Riken Densen Kk 絶縁被覆電線の剥離方法
JP2837936B2 (ja) * 1990-08-10 1998-12-16 松下電工株式会社 絶縁層剥離方法およびその装置
JP2008109753A (ja) * 2006-10-24 2008-05-08 Tdk Corp 被覆剥離方法
JP5859880B2 (ja) * 2011-03-15 2016-02-16 アルプス電気株式会社 平型ケーブルの被覆材除去方法
JP5861864B2 (ja) * 2011-09-15 2016-02-16 日本電気硝子株式会社 ガラス板切断方法およびガラス板切断装置
JP6346827B2 (ja) * 2014-08-13 2018-06-20 株式会社ディスコ 加工方法
JP2019155375A (ja) * 2018-03-07 2019-09-19 トヨタ自動車株式会社 絶縁皮膜剥離方法
JP2020054155A (ja) * 2018-09-27 2020-04-02 トヨタ自動車株式会社 コイル線の被膜層除去方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232303A (ja) * 1988-03-14 1989-09-18 Nippon Telegr & Teleph Corp <Ntt> 光ファイバ心線被覆除去方法及び除去装置
JPH02206313A (ja) * 1989-02-03 1990-08-16 Fujitsu Ltd ワイヤスプリット装置
JP2837936B2 (ja) * 1990-08-10 1998-12-16 松下電工株式会社 絶縁層剥離方法およびその装置
JPH077825A (ja) * 1993-06-16 1995-01-10 Riken Densen Kk 絶縁被覆電線の剥離方法
JP2008109753A (ja) * 2006-10-24 2008-05-08 Tdk Corp 被覆剥離方法
JP5859880B2 (ja) * 2011-03-15 2016-02-16 アルプス電気株式会社 平型ケーブルの被覆材除去方法
JP5861864B2 (ja) * 2011-09-15 2016-02-16 日本電気硝子株式会社 ガラス板切断方法およびガラス板切断装置
JP6346827B2 (ja) * 2014-08-13 2018-06-20 株式会社ディスコ 加工方法
JP2019155375A (ja) * 2018-03-07 2019-09-19 トヨタ自動車株式会社 絶縁皮膜剥離方法
JP2020054155A (ja) * 2018-09-27 2020-04-02 トヨタ自動車株式会社 コイル線の被膜層除去方法

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