JP7488684B2 - レーザ加工装置及びレーザ加工方法 - Google Patents
レーザ加工装置及びレーザ加工方法 Download PDFInfo
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- B23K26/382—Removing material by boring or cutting by boring
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
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- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
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- G03H1/22—Processes or apparatus for obtaining an optical image from holograms
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- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- G—PHYSICS
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Description
上記のレーザ加工装置及びレーザ加工方法において、制御部は(制御ステップでは)、被加工物の少なくとも一部の領域において、少なくとも2つの照射点の光強度を互いに異ならせてもよい。また、被加工物は2種類以上の材質を含み、制御部は(制御ステップでは)、複数の照射点それぞれにおける材質に応じて、複数の照射点の光強度を互いに独立して制御してもよい。
Claims (12)
- レーザ光源から出力されたレーザ光を入力し、二次元配列された複数の画素それぞれにおいて前記レーザ光の位相を変調するホログラムを呈示して、前記ホログラムにより位相変調した後のレーザ光を出力する空間光変調器と、
前記空間光変調器の後段に設けられた集光光学系と、
前記空間光変調器から出力された位相変調後の前記レーザ光を前記集光光学系により被加工物の複数の照射点に集光させるホログラムを前記空間光変調器に呈示させる制御部と、
を備え、
前記被加工物は2種類以上の材質を含み、
前記制御部は、前記複数の照射点に含まれる少なくとも2つの前記照射点の光強度を互いに独立して制御し、前記被加工物の少なくとも一部の領域において、前記少なくとも2つの照射点の光強度を互いに異ならせ、前記少なくとも2つの照射点それぞれにおける材質に応じて前記少なくとも2つの照射点の光強度を互いに独立して制御することにより前記少なくとも2つの照射点において加工速度を揃える、レーザ加工装置。 - レーザ光源から出力されたレーザ光を入力し、二次元配列された複数の画素それぞれにおいて前記レーザ光の位相を変調するホログラムを呈示して、前記ホログラムにより位相変調した後のレーザ光を出力する空間光変調器と、
前記空間光変調器の後段に設けられた集光光学系と、
前記空間光変調器から出力された位相変調後の前記レーザ光を前記集光光学系により被加工物の複数の照射点に集光させるホログラムを前記空間光変調器に呈示させる制御部と、
を備え、
前記制御部は、前記複数の照射点に含まれる少なくとも2つの前記照射点の光強度を互いに独立して制御し、
前記制御部は、前記被加工物に照射される位相変調後の前記レーザ光の光軸と交差する第1の面内において前記複数の照射点により画成される被加工領域と、前記光軸と交差し前記第1の面から前記光軸の方向に離れている第2の面内において前記複数の照射点により画成される被加工領域との、形状及び大きさのうち少なくとも一方を互いに異ならせる、レーザ加工装置。 - 観察光を前記被加工物に照射する観察用光源と、
前記被加工物において反射した前記観察光を検出する光検出器と、
を更に備え、
前記制御部は、前記光検出器による検出結果に基づいて各照射点における材質の変化を検出し、各照射点の光強度を前記材質の変化に応じて変更する、請求項1または2に記載のレーザ加工装置。 - 前記被加工物の材質分布に応じた、各照射点の光強度に関するデータを予め記憶する記憶部を更に備え、
前記制御部は、各照射点の光強度を前記データに基づいて制御する、請求項1~3のいずれか1項に記載のレーザ加工装置。 - 前記制御部は、前記複数の照射点により画成される被加工領域を画定する仮想線に沿って各照射点の位置を変更する複数のホログラムを前記空間光変調器に順次呈示させる、請求項1~4のいずれか1項に記載のレーザ加工装置。
- 前記制御部は、ホログラムを変更する際に、或るホログラムを消去してから別のホログラムを呈示するまでの間、前記レーザ光の光強度を前記被加工物のいずれの部位においても加工閾値未満とするホログラムを前記空間光変調器に呈示させる、請求項1~5のいずれか1項に記載のレーザ加工装置。
- 被加工物を加工するレーザ加工方法であって、
二次元配列された複数の画素それぞれにおいて光の位相を変調するホログラムを空間光変調器に呈示させる制御ステップと、
レーザ光源から出力されたレーザ光を前記空間光変調器に入力し、前記ホログラムにより前記レーザ光の位相変調を行う光変調ステップと、
位相変調後の前記レーザ光を集光する集光ステップと、
を繰り返し行い、
前記被加工物は2種類以上の材質を含み、
前記制御ステップでは、前記空間光変調器から出力された位相変調後の前記レーザ光を前記集光ステップにより前記被加工物の複数の照射点に集光させるホログラムを前記空間光変調器に呈示させるとともに、前記複数の照射点に含まれる少なくとも2つの前記照射点の光強度を互いに独立して制御し、前記被加工物の少なくとも一部の領域において、前記少なくとも2つの照射点の光強度を互いに異ならせ、前記少なくとも2つの照射点それぞれにおける材質に応じて、前記少なくとも2つの照射点の光強度を互いに独立して制御することにより前記少なくとも2つの照射点において加工速度を揃える、レーザ加工方法。 - 二次元配列された複数の画素それぞれにおいて光の位相を変調するホログラムを空間光変調器に呈示させる制御ステップと、
レーザ光源から出力されたレーザ光を前記空間光変調器に入力し、前記ホログラムにより前記レーザ光の位相変調を行う光変調ステップと、
位相変調後の前記レーザ光を集光する集光ステップと、
を繰り返し行い、
前記制御ステップでは、前記空間光変調器から出力された位相変調後の前記レーザ光を前記集光ステップにより被加工物の複数の照射点に集光させるホログラムを前記空間光変調器に呈示させるとともに、前記複数の照射点に含まれる少なくとも2つの前記照射点の光強度を互いに独立して制御し、
前記制御ステップにおいて、前記被加工物に照射される位相変調後の前記レーザ光の光軸と交差する第1の面内において前記複数の照射点により画成される被加工領域と、前記光軸と交差し前記第1の面から前記光軸の方向に離れている第2の面内において前記複数の照射点により画成される被加工領域との、形状及び大きさのうち少なくとも一方を互いに異ならせる、レーザ加工方法。 - 観察光を前記被加工物に照射し、前記被加工物において反射した前記観察光を検出する光検出ステップを更に含み、
前記制御ステップにおいて、前記光検出ステップによる検出結果に基づいて各照射点における材質の変化を検出し、前記各照射点の光強度を前記材質の変化に応じて変更する、請求項7または8に記載のレーザ加工方法。 - 前記制御ステップの前に、前記被加工物の材質分布に応じた、各照射点の光強度に関するデータを予め記憶する記憶ステップを更に含み、
前記制御ステップにおいて、各照射点の光強度を前記データに基づいて制御する、請求項7~9のいずれか1項に記載のレーザ加工方法。 - 前記制御ステップでは、前記複数の照射点により画成される被加工領域を画定する仮想線に沿って各照射点の位置を変更する複数のホログラムを前記空間光変調器に順次呈示させる、請求項7~10のいずれか1項に記載のレーザ加工方法。
- 前記制御ステップでは、ホログラムを変更する際に、或るホログラムを消去してから別のホログラムを呈示するまでの間、前記レーザ光の光強度を前記被加工物のいずれの部位においても加工閾値未満とするホログラムを前記空間光変調器に呈示させる、請求項7~11のいずれか1項に記載のレーザ加工方法。
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