JPWO2022186356A1 - - Google Patents

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Publication number
JPWO2022186356A1
JPWO2022186356A1 JP2023503958A JP2023503958A JPWO2022186356A1 JP WO2022186356 A1 JPWO2022186356 A1 JP WO2022186356A1 JP 2023503958 A JP2023503958 A JP 2023503958A JP 2023503958 A JP2023503958 A JP 2023503958A JP WO2022186356 A1 JPWO2022186356 A1 JP WO2022186356A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023503958A
Other versions
JP7516654B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed filed Critical
Publication of JPWO2022186356A1 publication Critical patent/JPWO2022186356A1/ja
Application granted granted Critical
Publication of JP7516654B2 publication Critical patent/JP7516654B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Laser Beam Processing (AREA)
JP2023503958A 2021-03-03 2022-03-03 皮膜除去方法および皮膜除去装置 Active JP7516654B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021033102 2021-03-03
JP2021033102 2021-03-03
PCT/JP2022/009237 WO2022186356A1 (ja) 2021-03-03 2022-03-03 皮膜除去方法および皮膜除去装置

Publications (2)

Publication Number Publication Date
JPWO2022186356A1 true JPWO2022186356A1 (ja) 2022-09-09
JP7516654B2 JP7516654B2 (ja) 2024-07-16

Family

ID=83155394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503958A Active JP7516654B2 (ja) 2021-03-03 2022-03-03 皮膜除去方法および皮膜除去装置

Country Status (2)

Country Link
JP (1) JP7516654B2 (ja)
WO (1) WO2022186356A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232303A (ja) * 1988-03-14 1989-09-18 Nippon Telegr & Teleph Corp <Ntt> 光ファイバ心線被覆除去方法及び除去装置
JPH02206313A (ja) * 1989-02-03 1990-08-16 Fujitsu Ltd ワイヤスプリット装置
JP2837936B2 (ja) * 1990-08-10 1998-12-16 松下電工株式会社 絶縁層剥離方法およびその装置
JPH077825A (ja) * 1993-06-16 1995-01-10 Riken Densen Kk 絶縁被覆電線の剥離方法
JP2008109753A (ja) * 2006-10-24 2008-05-08 Tdk Corp 被覆剥離方法
CN102684110B (zh) * 2011-03-15 2015-04-01 阿尔卑斯电气株式会社 扁平型电缆的被覆材料除去方法
JP5861864B2 (ja) 2011-09-15 2016-02-16 日本電気硝子株式会社 ガラス板切断方法およびガラス板切断装置
JP6346827B2 (ja) * 2014-08-13 2018-06-20 株式会社ディスコ 加工方法
JP6947664B2 (ja) * 2018-03-07 2021-10-13 トヨタ自動車株式会社 絶縁皮膜剥離方法
JP7125230B2 (ja) * 2018-09-27 2022-08-24 トヨタ自動車株式会社 コイル線の被膜層除去方法

Also Published As

Publication number Publication date
JP7516654B2 (ja) 2024-07-16
WO2022186356A1 (ja) 2022-09-09

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