JP6947664B2 - 絶縁皮膜剥離方法 - Google Patents
絶縁皮膜剥離方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 60
- 238000009413 insulation Methods 0.000 title claims description 21
- 239000004020 conductor Substances 0.000 claims description 8
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- 238000000576 coating method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 12
- 238000004804 winding Methods 0.000 description 7
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- 238000011156 evaluation Methods 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004904 shortening Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
- H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
- H02G1/1275—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by applying heat
- H02G1/128—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by applying heat using radiant energy, e.g. a laser beam
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/0056—Manufacturing winding connections
- H02K15/0068—Connecting winding sections; Forming leads; Connecting leads to terminals
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/04—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings, prior to mounting into machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Manufacture Of Motors, Generators (AREA)
Description
一方側から他方側に向かってレーザ光の照射位置を移動し、他方側に達した後、他方側から一方側に向かってレーザ光の照射位置を移動する折返し走査を行う第一領域走査工程と、領域境界から剥離境界までの第二領域について、一方側から他方側に向かってレーザ光の照射を行い、他方側に達したら、レーザ光の照射を止めた状態で一方側に戻る一方向走査を行う第二領域走査工程と、を含む。
Claims (7)
- 導線と前記導線を被覆する絶縁皮膜とを有する絶縁皮膜付導線の長手方向の先端部にレーザ光を照射して、前記先端部から測って予め定めた所定の剥離長さの剥離境界までの部分の前記絶縁皮膜を剥離する絶縁皮膜剥離方法であって、
前記先端部から測って前記剥離境界の手前に予め定めた領域境界までの第一領域について、一方側から他方側に向かって前記レーザ光の照射位置を移動し、前記他方側に達した後、前記他方側から前記一方側に向かって前記レーザ光の照射位置を移動する折返し走査を行う第一領域走査工程と、
前記領域境界から前記剥離境界までの第二領域について、一方側から他方側に向かって前記レーザ光の照射を行い、前記他方側に達したら、前記レーザ光の照射を止めた状態で前記一方側に戻る一方向走査を行う第二領域走査工程と、
を含む、絶縁皮膜剥離方法。 - 導線と前記導線を被覆する絶縁皮膜とを有する絶縁皮膜付導線の長手方向の先端部にレーザ光を照射して、前記先端部から測って予め定めた所定の剥離長さの剥離境界までの部分の前記絶縁皮膜を剥離する絶縁皮膜剥離方法であって、
前記先端部から測って前記剥離境界の手前に予め定めた領域境界までの第一領域について、中間位置から他方側に向かって前記レーザ光の照射位置を移動し、前記他方側に達した後、前記他方側から前記一方側に向かって前記レーザ光の照射位置を移動して折り返し、前記一方側に達した後、前記一方側から前記中間位置に向かって前記レーザ光の照射位置を移動して折り返し前記中間位置に戻る折返し走査を行う第一領域走査工程と、
前記領域境界から前記剥離境界までの第二領域について、一方側から他方側に向かって前記レーザ光の照射を行い、前記他方側に達したら、前記レーザ光の照射を止めた状態で前記一方側に戻る一方向走査を行う第二領域走査工程と、
を含む、絶縁皮膜剥離方法。 - 前記第一領域走査工程において、
前記一方側は、前記先端部であり、前記他方側は、前記領域境界であり、
前記第二領域走査工程において、
前記一方側は、前記領域境界であり、前記他方側は、前記剥離境界である、請求項1または請求項2に記載の絶縁皮膜剥離方法。 - 前記レーザ光の移動は、照射ピッチ毎の微小移動である、請求項1または請求項2に記載の絶縁皮膜剥離方法。
- 前記絶縁皮膜付導線が延びる方向を長手方向とし 前記絶縁皮膜付導線の幅に沿って右側を幅方向の右側とし左側を幅方向の左側として、
前記第一領域走査工程においては、
前記長手方向の前記一方側を前記先端部とし、前記長手方向の前記他方側を前記領域境界として、
前記レーザ光の移動は、
前記右側と前記左側との間で照射ピッチ毎の微小移動による微小走査による幅方向の折返し走査を行い、
前記先端部から前記領域境界へ向かって前記幅方向の折返し走査を繰り返して長手方向について前記先端部から前記領域境界に向かう往路走査を行い、往路走査の後、前記領域境界から前記先端部へ向かって前記幅方向の折返し走査を繰り返して前記長手方向について前記領域境界から前記先端部に向かう復路走査を行い、これを所定回数繰り返して第一領域走査における折返し走査とし、
前記第二領域走査工程においては、
前記長手方向の前記一方側を前記領域境界とし、前記長手方向の前記他方側を前記剥離境界として、
前記レーザ光の移動は、
前記領域境界から前記剥離境界へ向かって照射ピッチ毎の微小移動による微小走査による長手方向の一方向折返し走査を行い、
前記幅方向の右側から前記幅方向の左側へ向かって前記長手方向の一方向折返し走査を行い、これを所定回数繰り返して第二領域走査における一方向走査とする、請求項1または請求項2に記載の絶縁皮膜剥離方法。 - 前記第一領域走査工程は、
前記第一領域を複数のサブ領域に分け、
各前記サブ領域について、前記サブ領域の中間位置を照射開始位置とする、請求項2に記載の絶縁皮膜剥離方法。 - 前記第二領域走査工程において、
前記レーザ光の移動は、
前記絶縁皮膜付導線の長手方向に対し所定の角度で傾斜した走査方向に沿った照射ピッチ毎の微小移動である、請求項1または2に記載の絶縁皮膜剥離方法。
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JP2018041006A JP6947664B2 (ja) | 2018-03-07 | 2018-03-07 | 絶縁皮膜剥離方法 |
US16/286,794 US11251591B2 (en) | 2018-03-07 | 2019-02-27 | Insulation film peeling method |
CN201910159903.7A CN110238529B (zh) | 2018-03-07 | 2019-03-04 | 绝缘被膜剥离方法 |
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US20230006521A1 (en) * | 2020-01-31 | 2023-01-05 | Aisin Corporation | Conductor wire insulating film separating method |
DE102020211026A1 (de) * | 2020-09-02 | 2022-03-03 | Ford Global Technologies, Llc | Abisolierverfahren für Leiterelemente für eine Haarnadelspule |
DE102020212087A1 (de) * | 2020-09-25 | 2022-03-31 | Trumpf Laser- Und Systemtechnik Gmbh | Mehrstufiges Laser-Entlacken eines stabförmigen Leiters |
WO2022186356A1 (ja) * | 2021-03-03 | 2022-09-09 | 古河電気工業株式会社 | 皮膜除去方法および皮膜除去装置 |
WO2023175671A1 (ja) * | 2022-03-14 | 2023-09-21 | 株式会社 東芝 | レーザ除去方法、回転電機の製造方法、およびレーザ除去装置 |
DE102022117276A1 (de) | 2022-07-12 | 2024-01-18 | Schaeffler Technologies AG & Co. KG | Verfahren zur Herstellung einer Wellenwicklung mit abisolierten Drahtenden |
WO2024053744A1 (ja) * | 2022-09-08 | 2024-03-14 | 古河電気工業株式会社 | 皮膜除去方法および皮膜除去装置 |
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JPH08182142A (ja) * | 1994-12-26 | 1996-07-12 | Fujikura Ltd | レーザ加工方法 |
JP4275120B2 (ja) | 2005-08-31 | 2009-06-10 | Tdk株式会社 | コイル部品の製造方法及び製造装置 |
US20070193985A1 (en) * | 2006-02-20 | 2007-08-23 | Howard Patrick C | Method for removing a coating from a substrate using a defocused laser beam |
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US11251591B2 (en) | 2022-02-15 |
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CN110238529B (zh) | 2021-05-04 |
CN110238529A (zh) | 2019-09-17 |
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