WO2022177008A1 - 樹脂組成物、硬化物、積層体、透明アンテナ及びその製造方法、並びに、画像表示装置 - Google Patents
樹脂組成物、硬化物、積層体、透明アンテナ及びその製造方法、並びに、画像表示装置 Download PDFInfo
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- WO2022177008A1 WO2022177008A1 PCT/JP2022/006958 JP2022006958W WO2022177008A1 WO 2022177008 A1 WO2022177008 A1 WO 2022177008A1 JP 2022006958 W JP2022006958 W JP 2022006958W WO 2022177008 A1 WO2022177008 A1 WO 2022177008A1
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- WIPO (PCT)
- Prior art keywords
- transparent
- conductive member
- meth
- acrylate
- resin composition
- Prior art date
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Definitions
- the present disclosure relates to a resin composition, a cured product, a laminate, a transparent antenna and its manufacturing method, an image display device, and the like.
- Image display devices are used in various electronic devices such as personal computers, car navigation systems, mobile phones, watches, and electronic dictionaries.
- the image display device has an image display section that displays an image, and a bezel section (frame section) positioned around the image display section.
- a transparent antenna connected to the bezel portion via a circuit is arranged in the image display portion.
- Various members have been studied as members for obtaining a transparent antenna (see, for example, Patent Document 1 below).
- a transparent antenna may include a transparent base material and a conductive member arranged on the transparent base material, and the transparent base material may be formed from a cured product of a resin composition. Such a cured product is required to have a low yellowness from the viewpoint of achieving good color reproducibility in image display devices and the like.
- An object of one aspect of the present disclosure is to provide a resin composition capable of obtaining a cured product with a low degree of yellowness. Another aspect of the present disclosure aims to provide a cured product of the resin composition. Another aspect of the present disclosure aims to provide a laminate using the resin composition or the cured product. Another aspect of the present disclosure aims to provide a transparent antenna using the cured product. Another aspect of the present disclosure aims to provide an image display device using the transparent antenna. Another aspect of the present disclosure aims to provide a method for manufacturing a transparent antenna using the laminate described above.
- One aspect of the present disclosure relates to a resin composition containing an elastomer, a (meth)acrylic compound, and a thermal polymerization initiator.
- a resin composition containing an elastomer, a (meth)acrylic compound, and a thermal polymerization initiator.
- Another aspect of the present disclosure relates to a cured product of the resin composition described above.
- Another aspect of the present disclosure is a laminate comprising a base film and a transparent resin layer disposed on the base film, wherein the transparent resin layer contains the above-described resin composition or the above-described cured product.
- Another aspect of the present disclosure relates to a transparent antenna including a transparent base material and a conductive member disposed on the transparent base material, wherein the transparent base material contains the cured product described above.
- Another aspect of the present disclosure relates to an image display device including the transparent antenna described above.
- Another aspect of the present disclosure relates to a method for manufacturing a transparent antenna, in which the transparent resin layer in the laminate is laminated on a transparent member.
- the laminate described above includes a first conductive member disposed on the transparent resin layer and a second conductive member disposed on the first conductive member. and a member, wherein the first conductive member and the second conductive member contain copper, wherein the transparent resin layer and the conductive member in the laminate are laminated on the transparent member.
- the present invention relates to a method for manufacturing a transparent antenna, wherein the second conductive member is removed while the second conductive member is in a closed state.
- a resin composition capable of obtaining a cured product with a low degree of yellowness.
- FIG. 1 is a schematic cross-sectional view showing an example of an image display device
- FIG. 1 is a schematic cross-sectional view showing an example of an image display device
- FIG. 1 is a schematic cross-sectional view showing an example of an image display device
- the numerical range "above A” means A and the range exceeding A.
- “A or less” in a numerical range means A and a range less than A.
- the upper limit value or lower limit value of the numerical range in one step can be arbitrarily combined with the upper limit value or lower limit of the numerical range in another step.
- the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
- “A or B” may include either A or B, or may include both. The materials exemplified in this specification can be used singly or in combination of two or more unless otherwise specified.
- each component in the composition refers to the total amount of the multiple substances present in the composition when there are multiple substances corresponding to each component in the composition, unless otherwise specified.
- layer and “film” include not only a shape structure formed over the entire surface but also a shape structure formed partially when viewed as a plan view.
- process is included in the term not only as an independent process, but also as long as the intended action of the process is achieved even if it is not clearly distinguishable from other processes.
- (Meth)acrylate means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic”.
- the (meth)acrylic compound content means the total amount of the acrylic compound and the methacrylic compound.
- the resin composition according to this embodiment contains an elastomer, a (meth)acrylic compound, and a thermal polymerization initiator.
- the resin composition according to this embodiment is a thermosetting resin composition.
- a cured product according to the present embodiment is obtained by curing (thermosetting) the resin composition according to the present embodiment, and is a cured product (thermosetting product) of the resin composition according to the present embodiment.
- a cured product may be obtained by curing (heat curing) the resin composition at 170° C. for 1 hour.
- the cured product according to this embodiment may be in a semi-cured state or in a fully cured state.
- the resin composition according to the present embodiment it is possible to obtain a cured product with a low degree of yellowness.
- the image display device can be used in high-frequency band communication equipment to achieve high-speed, large-capacity communication. Communication in a high frequency band tends to have a large transmission loss. Therefore, the members that constitute the transparent antenna are required to have excellent dielectric properties. According to one aspect of the resin composition according to the present embodiment, it is possible to obtain a cured product having an excellent dielectric constant (low dielectric constant). Moreover, according to one aspect of the resin composition according to the present embodiment, it is possible to obtain a cured product having an excellent dielectric loss tangent (low dielectric loss tangent).
- a cured product having excellent transmittance can be obtained.
- a cured product having excellent haze can be obtained.
- a cured product having excellent elongation can be obtained.
- the resin composition according to this embodiment contains an elastomer.
- elastomers include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, and silicone-based elastomers.
- the elastomer may contain a styrene-based elastomer from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured product.
- a styrene-based elastomer has a styrene compound as a monomer unit, and may have a monomer unit derived from the styrene compound.
- Styrene compounds include styrene; alkylstyrenes such as methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, triethylstyrene, propylstyrene, butylstyrene, hexylstyrene, heptylstyrene, and octylstyrene; fluorostyrene, chlorostyrene, halogenated styrenes such as bromostyrene, dibromostyrene, iodostyrene; nitrostyrene; acetylstyrene; methoxy
- Styrenic elastomers include styrene-butadiene random copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene-styrene block copolymers, styrene-ethylene-butylene-styrene block copolymers, styrene-ethylene-propylene-styrene block copolymers, and the like. Examples include hydrogenated elastomers.
- the content of the styrene elastomer is the total mass of the elastomer (resin composition
- the total amount of elastomer contained in the product) may be 50% by mass or more, 70% by mass or more, 90% by mass or more, 95% by mass or more, or 99% by mass or more.
- the elastomer contained in the resin composition is substantially composed of a styrene elastomer (an aspect in which the content of the styrene elastomer is substantially 100% by mass based on the total mass of the elastomer contained in the resin composition). It's okay.
- the weight average molecular weight (Mw) or number average molecular weight (Mn) of the elastomer is a viewpoint that it is easy to obtain a cured product with a low degree of yellowness, and a viewpoint that it is easy to obtain excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured product. to the following range.
- the weight or number average molecular weight of the elastomer may be 1000 or greater, 3000 or greater, 4000 or greater, 5000 or greater, 10000 or greater, 30000 or greater, 50000 or greater, 80000 or greater, or 100000 or greater.
- the weight average molecular weight or number average molecular weight of the elastomer may be 500,000 or less, 300,000 or less, 200,000 or less, 150,000 or less, or 100,000 or less. From these points of view, the elastomer may have a weight average molecular weight or number average molecular weight of 1,000 to 500,000, 3,000 to 300,000, 4,000 to 200,000, or 5,000 to 150,000.
- the weight average molecular weight and number average molecular weight (Mn) can be obtained by measuring by gel permeation chromatography (GPC) under the following conditions and converting from a standard polystyrene calibration curve.
- the MFR (melt flow rate, 230°C, 5 kgf, unit: g/10 minutes) of the elastomer measured according to ISO 1133 may be within the following range.
- the MFR of the elastomer is 1 or more, 2 or more, 3 or more, 4 or more, 5 or more, or 6 from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining an excellent dielectric constant in the cured product. or more.
- the MFR of the elastomer may be 7 or more from the viewpoint of easily obtaining an excellent haze and a further excellent dielectric constant in the cured product.
- the MFR of the elastomer is 10 or less, 9 or less, 8 or less, 7 or less, or 6 or less from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining an excellent transmittance in the cured product. good.
- the MFR of the elastomer may be 5 or less from the viewpoint of easily obtaining excellent haze and further excellent transmittance in the cured product. From these perspectives, the MFR of the elastomer may be 1-10, 3-8, 5-7, 4-6, or 6-8.
- the Vicat softening temperature of the elastomer measured in accordance with ISO 306 may be within the following range.
- the Vicat softening temperature of the elastomer is 50° C. or higher, 60° C. or higher, 70° C. or higher, 72° C. or higher, 75° C. or higher, 80° C. or higher, and 81° C. from the viewpoint of easily obtaining excellent haze, dielectric loss tangent and elongation in the cured product. or higher, or 83° C. or higher.
- the Vicat softening temperature of the elastomer may be 100° C. or less, 90° C. or less, 85° C. or less, or 83° C.
- the Vicat softening temperature of the elastomer may be 81° C. or lower, 80° C. or lower, 75° C. or lower, or 72° C. or lower from the viewpoint of easily obtaining excellent elongation in the cured product. From these points of view, the Vicat softening temperature of the elastomer may be 50-100°C, 60-90°C, or 70-85°C.
- the elastomer in the resin composition according to the present embodiment may contain an elastomer component that provides a tensile modulus (25°C) within the following range in a single film (film composed of the target elastomer component).
- the tensile elastic modulus is 1 MPa or higher, 5 MPa or higher, 10 MPa or higher, 50 MPa or higher, 100 MPa or higher, 150 MPa or higher, 200 MPa or higher, 250 MPa or higher, 300 MPa or higher, 310 MPa or higher, from the viewpoint of easily obtaining excellent haze and elastic modulus in the cured product. It may be 320 MPa or higher, 350 MPa or higher, or 380 MPa or higher.
- the tensile modulus may be 500 MPa or less, 450 MPa or less, 400 MPa or less, 380 MPa or less, 350 MPa or less, 320 MPa or less, or 310 MPa or less from the viewpoint of easily obtaining a cured product with a low yellowness. From these points of view, the tensile modulus may be 1-500 MPa, 100-400 MPa, 200-400 MPa, 300-400 MPa, 200-350 MPa, or 310-400 MPa.
- the content of the elastomer is the total mass of the resin composition (organic solvent ), or based on the total amount of the elastomer, (meth)acrylic compound and thermal polymerization initiator, the range may be as follows.
- the elastomer content may be 50 wt% or more, more than 50 wt%, 60 wt% or more, 65 wt% or more, 70 wt% or more, 75 wt% or more, or 78 wt% or more.
- the content of elastomer may be 95% by weight or less, 90% by weight or less, 85% by weight or less, or 80% by weight or less. From these points of view, the elastomer content may be 50 to 95% by weight, 60 to 90% by weight, or 70 to 85% by weight.
- the content of the elastomer is the total amount of the elastomer and (meth)acrylic compound from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured product. may be in the following ranges based on The elastomer content may be 50 wt% or more, 50 wt% or more, 60 wt% or more, 65 wt% or more, 70 wt% or more, 75 wt% or more, or 80 wt% or more.
- the content of elastomer may be 95% by weight or less, 90% by weight or less, 85% by weight or less, or 80% by weight or less. From these points of view, the elastomer content may be 50 to 95% by weight, 60 to 90% by weight, or 70 to 85% by weight.
- the resin composition according to this embodiment contains a (meth)acrylic compound.
- a (meth)acrylic compound is a compound having a (meth)acryloyl group.
- the (meth)acrylic compound may or may not have an epoxy group.
- the (meth)acrylic compound is selected from the group consisting of monofunctional (meth)acrylic compounds and polyfunctional (meth)acrylic compounds (bifunctional (meth)acrylic compounds or trifunctional or higher (meth)acrylic compounds). may contain at least one
- a "bifunctional (meth)acrylic compound” means a compound having two acryloyl groups and two methacryloyl groups in one molecule.
- the (meth)acrylic compound may contain a bifunctional (meth)acrylic compound from the viewpoint of easily obtaining a cured product with a low degree of yellowness.
- Monofunctional (meth)acrylic compounds include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, butoxyethyl (meth)acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octylheptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, Lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate,
- bifunctional (meth)acrylic compounds include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, and polyethylene glycol di(meth)acrylate.
- propylene glycol di(meth)acrylate dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxylated polypropylene glycol di( meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate ) acrylate, 1,6-hexanediol di(meth)acrylate, 2-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, nonanediol di(meth)acrylate (e.g.
- 1,9-nonanediol di(meth)acrylate decanediol di(meth)acrylate (eg 1,10-decanediol di(meth)acrylate), dodecanediol di(meth)acrylate (eg 1,12-decanediol di(meth)acrylate) , glycerin di(meth)acrylate, ethoxylated 2-methyl-1,3-propanediol di(meth)acrylate (e.g.
- the (meth)acrylic compound may contain an aliphatic (meth)acrylate from the viewpoint of easily obtaining a cured product with a low degree of yellowness.
- the (meth)acrylic compound may contain an alkanediol di(meth)acrylate from the viewpoint of easily obtaining a cured product with a low degree of yellowness.
- the (meth)acrylic compound includes nonanediol di(meth)acrylate, decanediol di(meth)acrylate, dodecanediol di(meth)acrylate, and tricyclode, from the viewpoint of easily obtaining a cured product having an excellent elastic modulus.
- the (meth)acrylic compound may contain an acrylic compound from the viewpoint of easily obtaining excellent elongation in the cured product.
- the (meth)acrylic compound may contain a methacrylic compound from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining an excellent dielectric loss tangent in the cured product.
- the (meth)acrylic compound may contain a compound represented by the following general formula (I) from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining an excellent elastic modulus.
- R 1 represents a group containing 9 or less carbon atoms and 2 or more oxygen atoms
- R 2a and R 2b each independently represent a hydrogen atom or a methyl group.
- the carbon atoms of R 1 are 1-9.
- the carbon atoms of R 1 may be 2 or more, 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more from the viewpoint of easily obtaining a cured product with a low yellowness.
- the number of oxygen atoms in R 1 may be 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less from the viewpoint of easily obtaining a cured product with a low yellowness.
- the content of the compound represented by the general formula (I) is the total mass of the (meth)acrylic compound (total amount of the (meth)acrylic compound contained in the resin composition) from the viewpoint of easily obtaining a cured product with a low degree of yellowness. ), it may be 50% by mass or more, 70% by mass or more, 90% by mass or more, 95% by mass or more, or 99% by mass or more.
- the (meth)acrylic compound contained in the resin composition is substantially composed of the compound represented by the general formula (I) (the content of the compound represented by the general formula (I) is (Embodiment in which it is substantially 100% by mass based on the total mass of the (meth)acrylic compound contained).
- the molecular weight of the (meth)acrylic compound may be within the following range from the viewpoint of easily obtaining a cured product with a low degree of yellowness.
- the (meth)acrylic compound has a molecular weight of 80 or more, 100 or more, 120 or more, 150 or more, 180 or more, 200 or more, 220 or more, 250 or more, 260 or more, 280 or more, 290 or more, 300 or more, or 320 or more. It's okay.
- the molecular weight of the (meth)acrylic compound may be 1000 or less, 800 or less, 600 or less, 550 or less, 500 or less, 450 or less, 400 or less, 350 or less, 320 or less, 300 or less, or 280 or less. From these points of view, the (meth)acrylic compound may have a molecular weight of 80-1000, 100-600, 100-500, 250-600, or 200-400.
- the content of the (meth)acrylic compound is the total weight of the resin composition (excluding the weight of the organic solvent), or the elastomer, the (meth)acrylic compound and the thermal polymerization initiation, from the viewpoint of easily obtaining a cured product with a low degree of yellowness. Based on the total amount of the agent, it may be in the following range.
- the content of the (meth) acrylic compound may be 50% by mass or less, less than 50% by mass, 40% by mass or less, 35% by mass or less, 30% by mass or less, 25% by mass or less, or 20% by mass or less. .
- the content of the (meth)acrylic compound may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, or 18% by mass or more. From these points of view, the content of the (meth)acrylic compound may be 1 to 50% by mass, 10 to 40% by mass, or 15 to 25% by mass.
- the content of the (meth)acrylic compound may be within the following range based on the total amount of the elastomer and the (meth)acrylic compound, from the viewpoint of easily obtaining a cured product with a low degree of yellowness.
- the content of the (meth) acrylic compound may be 50% by mass or less, less than 50% by mass, 40% by mass or less, 35% by mass or less, 30% by mass or less, 25% by mass or less, or 20% by mass or less. .
- the content of the (meth)acrylic compound may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more. From these points of view, the content of the (meth)acrylic compound may be 1 to 50% by mass, 10 to 40% by mass, or 15 to 25% by mass.
- the resin composition according to this embodiment contains a thermal polymerization initiator.
- the thermal polymerization initiator is a compound that initiates polymerization by heating, and may include a thermal radical polymerization initiator and a thermal cationic polymerization initiator.
- Thermal polymerization initiators include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methyl cyclohexanone peroxide; 1,1-bis(tert-butylperoxy)cyclohexane, 1,1-bis(tert-butylperoxy )-2-methylcyclohexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-hexylperoxy)cyclohexane, 1,1-bis(tert -hexylperoxy)-peroxyketals such as 3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; ⁇ , ⁇ '-bis(tert-butylperoxy)diisopropylbenzene, dicumyl dialkyl peroxide such as peroxide, tert-but
- the thermal polymerization initiator may contain a peroxide, may contain a dialkyl peroxide, and ⁇ , ⁇ '-bis(tert-butylperoxy)diisopropylbenzene. may contain.
- the content of the thermal polymerization initiator may be in the following range based on the total mass of the resin composition (excluding the mass of the organic solvent), or the total amount of the elastomer, (meth)acrylic compound and thermal polymerization initiator. .
- the content of the thermal polymerization initiator is 0.01% by mass or more, 0.03% by mass or more, and 0.05% by mass from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining excellent curability. % or more, 0.08 mass % or more, or 0.09 mass % or more.
- the content of the thermal polymerization initiator is 10% by mass or less, 5% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.5% by mass or less, from the viewpoint of easily obtaining a cured product with a low yellowness. It may be 0.3% by mass or less, 0.2% by mass or less, or 0.1% by mass or less. From these points of view, the content of the thermal polymerization initiator may be 0.01 to 10% by mass, 0.03 to 1% by mass, or 0.05 to 0.5% by mass.
- the content of the thermal polymerization initiator may be within the following ranges based on the total amount of the elastomer and (meth)acrylic compound.
- the content of the thermal polymerization initiator is 0.01% by mass or more, 0.03% by mass or more, and 0.05% by mass from the viewpoint of easily obtaining a cured product with a low degree of yellowness and from the viewpoint of easily obtaining excellent curability. % or more, 0.08 mass % or more, or 0.1 mass % or more.
- the content of the thermal polymerization initiator is 10% by mass or less, 5% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.5% by mass or less, from the viewpoint of easily obtaining a cured product with a low yellowness.
- the content of the thermal polymerization initiator may be 0.01 to 10% by mass, 0.03 to 1% by mass, or 0.05 to 0.5% by mass.
- the resin composition according to this embodiment may contain additives other than the elastomer, (meth)acrylic compound, and thermal polymerization initiator.
- additives include polymerizable compounds (excluding compounds corresponding to (meth)acrylic compounds), curing accelerators, antioxidants, ultraviolet absorbers, visible light absorbers, colorants, plasticizers, stabilizers. , fillers, and the like.
- polymerizable compounds include vinylidene halides, vinyl ethers, vinyl esters, vinylpyridines, vinylamides, and vinyl arylates.
- the resin composition according to this embodiment may contain an organic solvent.
- Organic solvents include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4 - ketones such as methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate and ⁇ -butyrolactone; carbonate esters such as ethylene carbonate and propylene carbonate; N,N-dimethylformamide, N , N-dimethylacetamide, and amides such as N-methylpyrrolidon
- the laminate according to the present embodiment includes a base film (support film) and a transparent resin layer disposed on the base film, and the transparent resin layer comprises the resin composition according to the present embodiment, or , including the cured product according to the present embodiment.
- the base film includes polyester (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefin (polyethylene, polypropylene, etc.), polycarbonate, polyamide, polyimide, polyamideimide, polyetherimide, and polyether. Sulfide, polyether sulfone, polyether ketone, polyphenylene ether, polyphenylene sulfide and the like.
- the thickness of the base film may be 1-200 ⁇ m, 10-100 ⁇ m, or 20-50 ⁇ m.
- the thickness of the transparent resin layer is 1000 ⁇ m or less, 800 ⁇ m or less, 500 ⁇ m or less, 300 ⁇ m or less, 250 ⁇ m or less, 200 ⁇ m or less, 150 ⁇ m or less, from the viewpoint of easily obtaining excellent transmittance and from the viewpoint of easily thinning the image display device. Alternatively, it may be 100 ⁇ m or less.
- the thickness of the transparent resin layer is 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, 20 ⁇ m or more, 30 ⁇ m or more, 50 ⁇ m or more, 80 ⁇ m or more, or It may be 100 ⁇ m or more. From these viewpoints, the thickness of the transparent resin layer may be 1 to 1000 ⁇ m, 10 to 500 ⁇ m, 20 to 200 ⁇ m, or 50 to 200 ⁇ m.
- the first aspect of the laminate according to this embodiment may include a protective film arranged on the transparent resin layer.
- a second aspect of the laminate according to the present embodiment may include a conductive member disposed on the transparent resin layer.
- the constituent material of the protective film As the constituent material of the protective film, the constituent material described above as the constituent material of the base film can be used.
- the protective film may be the same film as the base film or a different film from the base film.
- the thickness of the protective film may be 1-200 ⁇ m, 10-100 ⁇ m, or 20-50 ⁇ m.
- the conductive member may be solid and may have a patterned portion (may be patterned). In a conductive member having a patterned portion (hereinafter referred to as “patterned conductive member”), part or all of the conductive member may be patterned. Examples of the shape of the patterned portion include a mesh shape and a spiral shape. When using a transparent antenna with a solid conductive member, the conductive member need not be patterned (eg, meshed).
- the pattern-like (for example, mesh-like) conductive member may be composed of wires (for example, metal wires). Materials constituting the conductive member include metal materials, carbon materials (for example, graphene), conductive polymers, and the like. Metal materials include copper, silver, and gold.
- the conductive member may contain copper from the viewpoint of easily obtaining excellent conductivity and from the viewpoint of easily reducing the manufacturing cost.
- the conductive member may be a single layer or multiple layers.
- the multi-layer conductive member includes, for example, a first conductive member (for example, a metal member) arranged on the transparent resin layer and a second conductive member (for example, a metal member) arranged on the first conductive member. , may have At least one selected from the group consisting of the first conductive member and the second conductive member may be solid or patterned (for example, mesh).
- the second conductive member can be used as a protective layer that suppresses contamination, damage, etc. of the first conductive member, thereby improving the handleability of the laminate. At least one selected from the group consisting of the first conductive member and the second conductive member may contain copper, and the first conductive member and the second conductive member may contain copper.
- the thickness of the conductive member (total thickness when the conductive member is multi-layered), the thickness of the first conductive member, or the thickness of the second conductive member may be within the following ranges.
- the thickness is 50 ⁇ m or less, 45 ⁇ m or less, 40 ⁇ m or less, 35 ⁇ m or less, or 30 ⁇ m or less from the viewpoint of resistance to chipping of the conductive member and the viewpoint of easy patterning when a solid conductive member is patterned (for example, mesh processing). , 25 ⁇ m or less, 20 ⁇ m or less, 15 ⁇ m or less, 10 ⁇ m or less, 8 ⁇ m or less, 5 ⁇ m or less, 3 ⁇ m or less, 2 ⁇ m or less, or 1.5 ⁇ m or less.
- the thickness may be 0.1 ⁇ m or more, 0.3 ⁇ m or more, 0.5 ⁇ m or more, 0.8 ⁇ m or more, 1 ⁇ m or more, or 1.2 ⁇ m or more from the viewpoint of easily obtaining excellent elongation. From these points of view, the thickness may be 0.1-50 ⁇ m, 0.1-30 ⁇ m, 0.1-20 ⁇ m, 0.1-10 ⁇ m, 0.5-5 ⁇ m, or 1-3 ⁇ m.
- the thickness of the first conductive member may be smaller than the thickness of the second conductive member.
- the thickness (total thickness) of the conductive member or the thickness of the second conductive member is 1.5 ⁇ m or more, 2 ⁇ m or more, 3 ⁇ m or more, 5 ⁇ m or more, 8 ⁇ m or more, or 10 ⁇ m or more. , 15 ⁇ m or more, or 20 ⁇ m or more.
- a laminate 10 in FIG. 1A includes a base film 10a, a transparent resin layer 10b placed on the base film 10a, and a protective film 10c placed on the transparent resin layer 10b.
- the transparent resin layer 10b is made of the resin composition according to this embodiment or the cured product according to this embodiment.
- the laminate 20 of FIG. 1B includes a substrate film 20a, a transparent resin layer 20b arranged on the substrate film 20a, and a conductive member 20c arranged on the transparent resin layer 20b.
- the transparent resin layer 20b is made of the resin composition according to this embodiment or the cured product according to this embodiment.
- the transparent resin layer 30b is made of the resin composition according to this embodiment or the cured product according to this embodiment.
- a transparent antenna according to this embodiment includes a transparent base material and a conductive member disposed on the transparent base material, and the transparent base material contains the cured product according to this embodiment.
- the conductive member may be a single layer.
- the configuration of the conductive member the configuration described above regarding the conductive member in the laminate according to the second aspect can be used.
- the conductive member may contain copper.
- the conductive member may be solid or patterned (for example, meshed).
- the thickness of the transparent substrate the thickness described above regarding the transparent resin layer of the laminate according to the present embodiment can be used.
- the transparent antenna according to this embodiment may comprise a transparent member supporting a transparent substrate, i.e., a transparent member, a transparent substrate disposed on the transparent member, and a conductive member disposed on the transparent substrate. and may be provided.
- the shape of the transparent member is not particularly limited, and may be film-like (transparent film), substrate-like (transparent substrate), irregular shape, or the like.
- a resin material, an inorganic material, etc. are mentioned as a constituent material of the transparent member.
- resin materials include polyester (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefin (polyethylene, polypropylene, cycloolefin polymer, etc.), polycarbonate, polyamide, polyimide, polyamideimide, polyetherimide, polyether. Sulfide, polyether sulfone, polyether ketone, polyphenylene ether, polyphenylene sulfide and the like. Glass etc. are mentioned as an inorganic material.
- the transparent member may be made of a material having a total light transmittance of 90% or more.
- the transparent member may contain polyolefin from the viewpoint of low dielectric.
- a first aspect of the method for manufacturing a transparent antenna according to the present embodiment involves patterning a conductive member (a solid conductive member) disposed on a transparent substrate containing a cured product according to the present embodiment (for example, in a mesh shape). process).
- a patterned conductive member is etched in a state in which a patterned resist layer is disposed on the conductive member of a laminate including a transparent base material and a conductive member disposed on the transparent base material.
- a (eg, mesh-like) conductive member may be obtained.
- the resist layer may be removed after etching the conductive member.
- the patterned resist layer is obtained by irradiating (exposure) actinic rays (e.g., ultraviolet rays) to the photosensitive layer placed on the conductive member, and then removing (developing) the unexposed or exposed portions of the resist layer. can be done.
- actinic rays e.g., ultraviolet rays
- a laminate comprising a conductive member arranged on a transparent substrate may be obtained by forming a conductive member on a transparent substrate containing the cured product according to the present embodiment. It may be obtained by forming a conductive member on the transparent resin layer after removing the protective film of (1).
- the laminate including the conductive member arranged on the transparent substrate may be the laminate according to the second aspect.
- a second aspect of the method for manufacturing a transparent antenna according to the present embodiment is a patterned (for example, mesh-shaped) metal in a state in which a patterned resist layer is arranged on a transparent substrate containing a cured product according to the present embodiment.
- a forming step of forming the member is provided.
- the resist layer may be used as a mask to form a patterned (for example, mesh-shaped) metal member by plating or sputtering.
- the resist layer may be removed after the forming process.
- a third aspect of the method for manufacturing a transparent antenna according to the present embodiment is removing the base film in the laminate when the conductive member in the laminate according to the second aspect is patterned (for example, mesh-like).
- the removing step removes the laminate of the transparent substrate (transparent resin layer) and the pattern-like (for example, mesh-like) conductive member as the transparent antenna.
- the transparent base material transparent base material
- the transparent base material can be used as a transparent antenna by curing the transparent resin layer (the resin composition of the transparent resin layer) after the removing step. resin layer) and a patterned (for example, mesh-shaped) conductive member laminate can be obtained.
- a fourth aspect of the method for manufacturing the transparent antenna according to the present embodiment includes a lamination step of laminating the transparent resin layer in the laminate according to the present embodiment on the transparent member.
- the transparent member the transparent member described above with respect to the transparent antenna can be used.
- the transparent resin layer may be laminated on the transparent member with the base film removed in the laminate according to the present embodiment, and the transparent resin layer may be laminated with the protective film removed in the laminate according to the first aspect.
- a resin layer may be laminated to the transparent member.
- the method for manufacturing a transparent antenna according to the fourth aspect may include a removing step A for removing the base film in the laminate according to the present embodiment, and a removing step B for removing the protective film in the laminate according to the first aspect. may be provided.
- the transparent resin layer and the conductive member may be laminated on the transparent member in such a manner that the transparent resin layer is positioned closer to the transparent member than the conductive member.
- the transparent resin layer and the conductive member may be laminated on the transparent member while being in contact with the transparent member.
- the transparent resin layer and the conductive member can be laminated on the transparent member with the base film removed from the laminate according to the second aspect.
- the transparent member is subjected to surface treatment (plasma treatment, corona treatment, etc.). and may complicate the manufacturing process of the laminate.
- plasma treatment corona treatment, etc.
- a conductive member for example, a metal material such as copper
- the transparent member and the conductive member can be used as the transparent antenna while obtaining sufficient adhesion between the transparent member and the conductive member without requiring surface treatment of the transparent member.
- a laminate having a transparent member, a transparent resin layer and a conductive member can be obtained, for example, sufficient adhesion between a transparent member containing polyolefin and a conductive member containing copper can be obtained.
- a transparent antenna can be obtained while Further, according to the method for manufacturing a transparent antenna according to the fourth aspect, by laminating the laminate according to the present embodiment on the transparent member, it is possible to collectively supply the transparent resin layer and the conductive member onto the transparent member.
- a transparent antenna can be obtained by a simple method. Furthermore, according to the method for manufacturing a transparent antenna according to the fourth aspect, by using a material having excellent dielectric properties (dielectric constant, dielectric loss tangent, etc.) as a constituent material of the transparent resin layer, excellent antenna properties can be obtained. A transparent antenna can be obtained.
- the transparent resin layers in the removing step A, removing step B, and lamination step may be uncured or cured.
- the method for manufacturing the transparent antenna according to the fourth aspect may include a curing step of curing the transparent resin layer (the resin composition of the transparent resin layer) after the lamination step.
- the conductive member in the removing step A, removing step B, and lamination step may be solid or patterned (for example, meshed).
- the method for manufacturing the transparent antenna according to the fourth aspect may include a processing step of patterning the conductive member (for example, processing it into a mesh shape) after the lamination step.
- the conductive member in the removing step A, the removing step B, and the laminating step may be a plurality of layers, and the first conductive member disposed on the transparent resin layer; and a second conductive member disposed on the one conductive member.
- At least one selected from the group consisting of the first conductive member and the second conductive member may be solid or patterned (for example, mesh).
- At least one selected from the group consisting of the first conductive member and the second conductive member may contain copper, and the first conductive member and the second conductive member may contain copper.
- the transparent resin layer and the conductive member are placed in a state in which the first conductive member is located closer to the transparent member than the second conductive member. It may be laminated to a transparent member.
- the method for manufacturing a transparent antenna according to the fourth aspect may include a removing step C of removing the second conductive member after the laminating step. In the removing step C, the second conductive member can be separated from the first conductive member.
- the method for manufacturing a transparent antenna according to the fourth aspect may include, after the removing step C, a processing step of patterning the first conductive member (for example, processing it into a mesh shape).
- the first conductive member may be etched with a patterned resist layer disposed on the first conductive member.
- the method for manufacturing a transparent antenna according to the fourth aspect includes adding a transparent resin layer (transparent resin layer A curing step of curing the resin composition) may be provided.
- a fifth aspect of the method for manufacturing a transparent antenna according to the present embodiment includes the above-described base film, the above-described transparent resin layer, and the above-described conductive member having a first conductive member and a second conductive member.
- the second and a removing step C for removing the conductive member.
- the transparent resin layer and the conductive layer are formed before removing the second conductive member, after removing the second conductive member, or before and after removing the second conductive member.
- a curing step of curing the transparent resin layer (the resin composition of the transparent resin layer) in a state where the member is laminated on the transparent member may be provided.
- the transparent resin layer may be cured in a state in which the transparent resin layer and the conductive member are laminated on the transparent member while the transparent resin layer is located closer to the transparent member than the conductive member.
- a method for manufacturing a transparent antenna according to the fifth aspect includes a processing step of patterning (for example, processing into a mesh) the first conductive member after removing the second conductive member (after the removing step C).
- a processing step of patterning for example, processing into a mesh
- An example of a method for manufacturing a transparent antenna according to the fifth aspect includes the base film described above, the transparent resin layer described above (uncured transparent resin layer), and the above-described antenna having the first conductive member and the second conductive member.
- a manufacturing method using a laminate comprising: a conductive member, comprising the above-described removal step A (first removal step), lamination step, curing step, and removal step C (second removal step).
- At least one selected from the group consisting of the first conductive member and the second conductive member may contain copper, and the first conductive member and the second conductive member may contain copper.
- the member may contain copper.
- the first conductive member in the laminate may be solid or patterned (for example, meshed).
- the steps, configurations, etc. described above for each aspect may be combined with each other.
- the steps, configurations, etc. described above with respect to the method for manufacturing the transparent antenna according to the fourth aspect can be used.
- the image display device includes the transparent antenna according to this embodiment.
- the image display device may have an image display section that displays an image, and a bezel section (frame section) positioned around the image display section, and the transparent antenna may be arranged in the image display section.
- the image display device may be used in various electronic devices such as personal computers, car navigation systems, mobile phones, watches, and electronic dictionaries.
- FIG. 3 and 4 are schematic cross-sectional views showing an example of an image display device, showing an image display section of the image display device.
- the image display device 100 of FIG. 3 includes a transparent antenna 110 , a protective layer 120 arranged on the transparent antenna 110 , and a transparent covering member 130 arranged on the protective layer 120 .
- the transparent antenna 110 includes a transparent substrate 110a and a mesh-like conductive member 110b arranged on the transparent substrate 110a.
- the image display device 200 of FIG. 4 includes a transparent antenna 210 , a protective layer 220 arranged on the transparent antenna 210 , and a transparent covering member 230 arranged on the protective layer 220 .
- the transparent antenna 210 includes a transparent member 210a, a transparent substrate 210b arranged on the transparent member 210a, and a mesh-like conductive member 210c arranged on the transparent substrate 210b.
- the transparent substrates 110a and 210b are made of the cured product according to this embodiment.
- Conductive members 110b and 210c are made of copper.
- the transparent member 210a is made of polyolefin.
- the protective layers 120, 220 cover the transparent substrates 110a, 210b and the conductive members 110b, 210c.
- the protective layers 120 and 220 may be formed of the resin composition or cured product according to this embodiment, and may be formed of a material having a total light transmittance of 90% or more.
- the covering member 130, 230 may be a glass plate.
- elastomer 1 styrene elastomer, hydrogenated styrene-butadiene rubber, manufactured by JSR Corporation, trade name: DYNARON 2324P, weight average molecular weight: 1.0 ⁇ 10 5
- acrylic compound 1 acrylic monomer , 1,9-nonanediol diacrylate, manufactured by Showa Denko Materials Co., Ltd., trade name: FA-129AS, molecular weight 268
- thermal polymerization initiator thermal radical polymerization initiator, ⁇ , ⁇ '-bis
- a resin varnish was obtained by mixing 0.1 part by mass of tert-butylperoxy)diisopropylbenzene, trade name: Perbutyl P) manufactured by NOF Corporation, and 125 parts by mass of a solvent (toluene).
- the elastic modulus (tensile elastic modulus) of a single film of elastomer 1 was measured by the following procedure. First, after preparing a toluene solution (solid content concentration: 40% by mass) of Elastomer 1, a knife coater (manufactured by Yasui Seiki Co., Ltd., trade name: SNC-300) was used to coat the surface with a release-treated PET film (Teijin DuPont This toluene solution was applied onto the release-treated surface of Film Co., Ltd., product name: Purex A31, thickness: 38 ⁇ m. Then, after drying at 100 ° C.
- a single film (length: 50 mm, width: 10 mm, thickness) was obtained by removing the PET film. thickness: 100 ⁇ m).
- the stress-strain curve of a single film was measured using an autograph (manufactured by Shimadzu Corporation, trade name: EZ-S), and the elastic modulus was obtained from the stress-strain curve.
- the chuck-to-chuck distance during measurement was set to 20 mm, and the tensile speed was set to 50 mm/min.
- the modulus of elasticity the value at a load of 0.5N to 1.0N was measured.
- the elastic modulus of a single membrane of Elastomer 1 was 10 MPa.
- the elastic moduli of the following single membranes were measured by the same procedure as for the single membrane of Elastomer 1.
- Examples 2-5) Resin varnishes were obtained in the same manner as in Example 1, except that elastomers 2 to 5 (styrene elastomer, styrene-butadiene rubber) shown in Table 1 were used instead of elastomer 1.
- elastomers 2 to 5 styrene elastomer, styrene-butadiene rubber
- Elastomer 2 manufactured by CRAY VALLEY, trade name "Ricon 100", number average molecular weight 4500
- Elastomer 3 Asahi Kasei Corporation, trade name "Asaflex 810", MFR (ISO 1133, 200 ° C., 5 kgf) 5 g / 10 minutes, Vicat softening temperature (ISO 306, 10 N, 50 ° C./h) 83 ° C., single Membrane elastic modulus 314 MPa
- Elastomer 4 Asahi Kasei Corporation, trade name "Asaflex 830", MFR (ISO 1133, 200 ° C., 5 kgf) 6 g / 10 minutes, Vicat softening temperature (ISO 306, 10 N, 50 ° C./h) 72 ° C., single Membrane elastic modulus 301 MPa
- Elastomer 5 Asahi Kasei Corporation, trade name "Asaflex 840", MFR (ISO 1133, 200 ° C.,
- Example 6 to 11 A resin varnish was obtained in the same manner as in Example 1 except that acrylic compounds 2 to 3 or methacrylic compounds 1 to 4 shown in Table 1 were used instead of acrylic compound 1.
- Acrylic compound 2 1,10-decanediol diacrylate, manufactured by Tokyo Chemical Industry Co., Ltd., trade name "1,10-Bis (acryloyloxy) decane”
- Acrylic compound 3 Tricyclodecanedimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., trade name “A-DCP”
- Methacrylic compound 1 1,9-nonanediol dimethacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., trade name “NOD-N”
- Methacrylic compound 2 1,10-decanediol dimethacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., trade name “DOD-N”
- Methacrylic compound 3 1,12-dodecanediol dimethacrylate, manufactured by Tokyo Chemical Industry Co., Ltd., trade name "1,12-Dodecanediol Dimethacrylate”
- Methacrylic compound 4 Tricyclodecane
- Photopolymerization initiator photoradical generator, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, manufactured by BASF, trade name: Irgacure 819) in place of 0.1 part by mass of thermal polymerization initiator1.
- a resin varnish was obtained in the same manner as in Example 1 except that 5 parts by mass was used and the amount of the solvent was adjusted so that the total amount of the resin varnish was the same as in Example 1.
- a surface release-treated PET film (trade name: Purex A31, thickness: 38 ⁇ m, manufactured by Teijin DuPont Films Japan Limited) was prepared as a base film.
- a knife coater (manufactured by Yasui Seiki Co., Ltd., trade name: SNC-300)
- the above resin varnish was applied onto the release-treated surface of the PET film.
- it was dried at 100° C. for 20 minutes in a dryer (manufactured by Futaba Kagaku Co., Ltd., trade name: MSO-80TPS) to form a resin film.
- the thickness of the resin film after drying was adjusted to 100 ⁇ m.
- the release-treated surface of the protective film was attached to the resin film to obtain a laminated film.
- the laminated film having the resin film obtained using the resin varnishes of Examples 1 to 11 was heat-treated at 170 ° C. for 1 hour.
- a film for evaluation comprising a cured film was obtained by thermosetting the resin film.
- the laminated film having the resin film obtained using the resin varnish of Comparative Example 1 was irradiated with ultraviolet rays (wavelength: 365 nm) at 2000 mJ/cm.
- a film for evaluation provided with a cured film was obtained by photocuring the resin film by 2 irradiation.
- ⁇ Characteristic evaluation> (YI, total light transmittance and haze) After cutting out a laminate having a length of 30 mm and a width of 30 mm from the evaluation film described above, a test piece was obtained by removing the base film and protective film of the laminate. The YI (Yellow Index), total light transmittance and haze of the test piece were measured at 25° C. using a spectral haze meter (trade name: SH7000, manufactured by Nippon Denshoku Industries Co., Ltd.). Table 1 shows the results.
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Abstract
Description
検出器:L-3300型RI[株式会社日立ハイテクノロジーズ製]
カラムオーブン:L-655A-52[株式会社日立ハイテクノロジーズ製]
ガードカラム及びカラム:TSK Guardcolumn HHR-L+TSKgel G4000HHR+TSKgel G2000HHR[全て東ソー株式会社製、商品名]
カラムサイズ:6.0×40mm(ガードカラム)、7.8×300mm(カラム)
溶離液:テトラヒドロフラン
試料濃度:30mg/5mL
注入量:20μL
流量:1.00mL/分
測定温度:40℃
(実施例1)
攪拌しながら、エラストマー1(スチレン系エラストマー、水素添加型スチレンブタジエンゴム、JSR株式会社製、商品名:ダイナロン2324P、重量平均分子量:1.0×105)80質量部、アクリル化合物1(アクリルモノマー、1,9-ノナンジオールジアクリレート、昭和電工マテリアルズ株式会社製、商品名:FA-129AS、分子量268)20質量部、熱重合開始剤(熱ラジカル重合開始剤、α,α’-ビス(tert-ブチルパーオキシ)ジイソプロピルベンゼン、日本油脂株式会社製、商品名:パーブチルP)0.1質量部、及び、溶剤(トルエン)125質量部を混合することにより樹脂ワニスを得た。
エラストマー1に代えて、表1に示すエラストマー2~5(スチレン系エラストマー、スチレンブタジエンゴム)を用いたことを除き実施例1と同様に行うことにより樹脂ワニスを得た。
エラストマー3:旭化成株式会社製、商品名「アサフレックス 810」、MFR(ISO 1133、200℃、5kgf)5g/10分、ビカット軟化温度(ISO 306、10N、50℃/h)83℃、単一膜の弾性率314MPa
エラストマー4:旭化成株式会社製、商品名「アサフレックス 830」、MFR(ISO 1133、200℃、5kgf)6g/10分、ビカット軟化温度(ISO 306、10N、50℃/h)72℃、単一膜の弾性率301MPa
エラストマー5:旭化成株式会社製、商品名「アサフレックス 840」、MFR(ISO 1133、200℃、5kgf)7g/10分、ビカット軟化温度(ISO 306、10N、50℃/h)81℃、単一膜の弾性率387MPa
アクリル化合物1に代えて、表1に示すアクリル化合物2~3又はメタクリル化合物1~4を用いたことを除き実施例1と同様に行うことにより樹脂ワニスを得た。
アクリル化合物3:トリシクロデカンジメタノールジアクリレート、新中村化学工業株式会社製、商品名「A-DCP」
メタクリル化合物1:1,9-ノナンジオールジメタクリレート、新中村化学工業株式会社製、商品名「NOD-N」
メタクリル化合物2:1,10-デカンジオールジメタクリレート、新中村化学工業株式会社製、商品名「DOD-N」
メタクリル化合物3:1,12-ドデカンジオールジメタクリレート、東京化成工業株式会社製、商品名「1,12-Dodecanediol Dimethacrylate」
メタクリル化合物4:トリシクロデカンジメタノールジメタクリレート、新中村化学工業株式会社製、商品名「DCP」
0.1質量部の熱重合開始剤に代えて光重合開始剤(光ラジカル発生剤、ビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキシド、BASF社製、商品名:イルガキュア819)1.5質量部を用いたこと、及び、樹脂ワニスの総量が実施例1と同等であるように溶剤の量を調整したことを除き実施例1と同様に行うことにより樹脂ワニスを得た。
基材フィルムとして表面離型処理PETフィルム(帝人デュポンフィルム株式会社製、商品名:ピューレックスA31、厚さ:38μm)を準備した。ナイフコータ(株式会社康井精機製、商品名:SNC-300)を用いて、このPETフィルムの離型処理面上に上述の樹脂ワニスを塗布した。次いで、乾燥機(株式会社二葉科学製、商品名:MSO-80TPS)中において100℃で20分乾燥することにより樹脂フィルムを形成した。塗工機のギャップを調節することにより、乾燥後の樹脂フィルムの厚さを100μmに調整した。基材フィルムと同じ表面離型処理PETフィルムを保護フィルムとして準備した後、保護フィルムの離型処理面を樹脂フィルムに貼り付けることにより積層フィルムを得た。
(YI、全光線透過率及びヘイズ)
上述の評価用フィルムから長さ30mm、幅30mmの積層体を切り出した後、この積層体の基材フィルム及び保護フィルムを除去することにより試験片を得た。試験片のYI(Yellow Index)、全光線透過率及びヘイズ(Haze)を25℃の環境下、分光ヘイズメータ(日本電色工業株式会社製、商品名:SH7000)を用いて測定した。結果を表1に示す。
上述の評価用フィルムから長さ80mm、幅80mmの積層体を試験片として切り出した後、ベクトル型ネットワークアナライザ(アジレントテクノロジー社製、商品名:E8364B)及び10GHz共振器(株式会社関東電子応用開発製、商品名:CP531)を用いて、25℃の環境下、スプリットポスト誘電体共振器法(SPDR法)によりこの試験片全体の比誘電率及び誘電正接を測定した。また、上述の基材フィルム及び保護フィルムのみを積層した積層体(長さ:80mm、幅:80mm)を作製した後、同様の手法によりこの積層体の比誘電率及び誘電正接を測定した。上述の試験片の測定結果から上述の積層体の測定結果を差し引くことにより、硬化フィルムの比誘電率及び誘電正接を得た。結果を表1に示す。
上述の評価用フィルムから長さ40mm、幅10mmの積層体を切り出した後、この積層体の基材フィルム及び保護フィルムを除去することにより試験片を得た。25℃の環境下、オートグラフ(株式会社島津製作所製、商品名:EZ-S)を用いて試験片の応力-ひずみ曲線を測定し、応力-ひずみ曲線から伸び率及び弾性率(引張弾性率)を求めた。測定時のチャック間距離は20mmに設定し、引張速度は50mm/minに設定した。伸び率として、試験片が破断した際の破断伸び率を測定した。弾性率として、荷重0.5Nから1.0Nにおける値を測定した。結果を表1に示す。
Claims (20)
- エラストマーと、(メタ)アクリル化合物と、熱重合開始剤と、を含有する、樹脂組成物。
- 前記(メタ)アクリル化合物がアルカンジオールジ(メタ)アクリレートを含む、請求項1に記載の樹脂組成物。
- 前記熱重合開始剤が過酸化物を含む、請求項1~3のいずれか一項に記載の樹脂組成物。
- 前記熱重合開始剤がジアルキルパーオキシドを含む、請求項1~4のいずれか一項に記載の樹脂組成物。
- 前記エラストマーがスチレン系エラストマーを含む、請求項1~5のいずれか一項に記載の樹脂組成物。
- 請求項1~6のいずれか一項に記載の樹脂組成物の硬化物。
- 基材フィルムと、当該基材フィルム上に配置された透明樹脂層と、を備え、
前記透明樹脂層が、請求項1~6のいずれか一項に記載の樹脂組成物、又は、請求項7に記載の硬化物を含む、積層体。 - 前記透明樹脂層上に配置された導電部材を更に備える、請求項8に記載の積層体。
- 前記導電部材が銅を含有する、請求項9に記載の積層体。
- 前記導電部材の厚さが2μm以下である、請求項9又は10に記載の積層体。
- 前記導電部材が、前記透明樹脂層上に配置された第1の導電部材と、当該第1の導電部材上に配置された第2の導電部材と、を有し、
前記第1の導電部材及び前記第2の導電部材が銅を含有する、請求項9に記載の積層体。 - 透明基材と、当該透明基材上に配置された導電部材と、を備え、
前記透明基材が、請求項7に記載の硬化物を含む、透明アンテナ。 - 前記導電部材がメッシュ状である、請求項13に記載の透明アンテナ。
- 前記導電部材が銅を含有する、請求項13又は14に記載の透明アンテナ。
- 請求項13~15のいずれか一項に記載の透明アンテナを備える、画像表示装置。
- 請求項8~12のいずれか一項に記載の積層体における前記透明樹脂層を透明部材に積層する、透明アンテナの製造方法。
- 請求項12に記載の積層体における前記透明樹脂層が前記導電部材よりも透明部材側に位置しつつ前記透明樹脂層及び前記導電部材が前記透明部材に積層された状態で前記第2の導電部材を除去する、透明アンテナの製造方法。
- 前記第2の導電部材を除去する前に、前記透明樹脂層及び前記導電部材が前記透明部材に積層された状態で前記透明樹脂層を硬化させる、請求項18に記載の透明アンテナの製造方法。
- 前記第2の導電部材を除去した後に、前記第1の導電部材をメッシュ状に加工する、請求項18又は19に記載の透明アンテナの製造方法。
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JP2023500959A JPWO2022177008A1 (ja) | 2021-02-22 | 2022-02-21 | |
KR1020237026916A KR20230152659A (ko) | 2021-02-22 | 2022-02-21 | 수지 조성물, 경화물, 적층체, 투명 안테나 및 그 제조방법, 및, 화상 표시 장치 |
CN202280015541.4A CN116867811A (zh) | 2021-02-22 | 2022-02-21 | 树脂组合物、固化物、层叠体、透明天线及其制造方法、以及图像显示装置 |
US18/547,235 US20240141150A1 (en) | 2021-02-22 | 2022-02-21 | Resin composition, cured product, laminate, transparent antenna, manufacturing method therefor, and image display device |
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WO2022177006A1 (ja) | 2022-08-25 |
CN116867811A (zh) | 2023-10-10 |
TW202239886A (zh) | 2022-10-16 |
KR20230152658A (ko) | 2023-11-03 |
US20240150549A1 (en) | 2024-05-09 |
WO2022177009A1 (ja) | 2022-08-25 |
JPWO2022177008A1 (ja) | 2022-08-25 |
JPWO2022177009A1 (ja) | 2022-08-25 |
TW202243912A (zh) | 2022-11-16 |
TW202235549A (zh) | 2022-09-16 |
US20240141150A1 (en) | 2024-05-02 |
JPWO2022177006A1 (ja) | 2022-08-25 |
CN116940600A (zh) | 2023-10-24 |
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