WO2022151781A1 - 消光阻焊油墨、led显示模组的制备方法及led显示屏 - Google Patents

消光阻焊油墨、led显示模组的制备方法及led显示屏 Download PDF

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WO2022151781A1
WO2022151781A1 PCT/CN2021/124744 CN2021124744W WO2022151781A1 WO 2022151781 A1 WO2022151781 A1 WO 2022151781A1 CN 2021124744 W CN2021124744 W CN 2021124744W WO 2022151781 A1 WO2022151781 A1 WO 2022151781A1
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Prior art keywords
solder resist
resist ink
matte
component
led display
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PCT/CN2021/124744
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English (en)
French (fr)
Inventor
李小明
徐勋明
夏建平
甘志勇
吴隆云
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惠州市艾比森光电有限公司
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Publication of WO2022151781A1 publication Critical patent/WO2022151781A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the application relates to the technical field of LED display screens, in particular to a matting solder resist ink, a preparation method of an LED display module, and an LED display screen.
  • LED displays have the advantages of high luminous brightness, high luminous efficiency, bright colors, high contrast, wide operating temperature range, short response time, and low energy consumption. They are widely used in the display field, such as common Display of securities trading and financial information, airport flight dynamic information display, port and station passenger guidance information display, sports venue information display, road traffic information display, power dispatching and vehicle dynamic tracking and other dispatching command center information display, shopping malls and other services Business promotion information display and advertising media products in the field.
  • the LED display is generally composed of multiple LED display modules.
  • the LED display module includes a PCB board and a plurality of LED lamp beads welded on the PCB board by Surface Mounted Technology (SMT).
  • SMT Surface Mounted Technology
  • a layer of solder mask ink will be silk-screened on the surface of the PCB board, but the traditional solder mask ink has high gloss and low absorption rate of visible light. It will be reflected to the human eye in the form of specular reflection or near-mirror reflection. The human eye can clearly see the ink color of the solder mask ink, and the slight difference in the ink color of the solder mask ink appears to the human eye.
  • the phenomenon is that the ink color of the PCB board is inconsistent, which leads to The black screen ink color of the LED display screen spliced by the LED display module is inconsistent (see Figure 1).
  • the gap between the LED lamp bead and the lamp bead of the PCB board is ink-jet processed to form an ink layer that can cover the solder mask ink, but this is equivalent to an additional preparation process, which is more efficient.
  • Low it may also make the surface or side of the LED lamp bead stained with inkjet ink, block/absorb the light emission of the lamp bead, and greatly reduce the display effect of the LED display. Therefore, it is necessary to provide a matte solder resist ink with low gloss and high absorption rate of visible light, so as to solve the problem of inconsistent ink color on the black screen of the LED display screen.
  • the present application provides a matting solder resist ink that can be used for LED display screens, which has solder resist and excellent matting properties, which can basically absorb the visible light irradiated on the surface of the PCB board of the LED display screen, and then Ensure the consistency of ink color when the LED display is black.
  • a first aspect of the present application provides a matte solder resist ink
  • the matte solder resist ink includes a first component and a second component
  • the first component includes each raw material in the following mass percentage: oligomer : 20% ⁇ 50%, Photoinitiator: 0.5% ⁇ 15%, Nano black filler: 5% ⁇ 15%, Matting agent: 10% ⁇ 30%, Coupling agent: 0.2% ⁇ 2%, Solvent: 10% ⁇ 30%;
  • the second component includes the following raw materials by mass percentage: epoxy resin: 20%-40%, functional monomer: 5%-40%, matting agent: 10%-20%, coupling agent: 0.2% % ⁇ 2%, solvent: 5% ⁇ 15%;
  • the first component and the second component are stored separately, and when in use, the first component and the second component are mixed to form the matte solder resist ink.
  • the matting solder resist ink has a good matting effect, and has a good absorption rate for visible light. It can be more than 90%, and the dispersibility of each raw material in the matte solder resist ink is good, it can be completely attached to the PCB board, and the high temperature resistance is good.
  • a second aspect of the present application provides a method for preparing an LED display module using the matting solder resist ink described in the first aspect, including:
  • the matte solder resist ink described in the first aspect of the present application is coated or printed on the first surface of the PCB board, and then pre-baking, exposure treatment, development treatment, and post-baking are performed to form a patterned matt solder resist ink Floor;
  • a plurality of LED lamp beads are mounted on the area of the first surface that is not covered by the matte solder resist ink layer to obtain an LED display module.
  • the matte solder resist ink layer formed by the matte solder resist ink described in the first aspect has good insulation, high temperature resistance and solder resistance, and has The good extinction effect can effectively improve the problem of inconsistent black screen ink color of the LED display screen spliced by the LED display module. It is not necessary to perform inkjet treatment on the gap between the lamp beads of the LED display module with the extinction solder resist ink layer. The preparation process of the display module is shortened, the production efficiency is improved, and the production cost is reduced.
  • a third aspect of the present application provides an LED display screen using the matting solder resist ink described in the first aspect
  • the LED display screen includes a plurality of LED display modules, each LED display module includes a PCB board and an LED display module disposed on the PCB board.
  • a plurality of LED lamp beads on the surface of one side of the PCB board, and the surface of one side of the PCB board with the LED lamp beads is also provided with an extinction resist formed by curing the extinction solder resist ink described in the first aspect of the present application
  • a solder ink layer, the matte solder resist ink layer covers the gaps between the plurality of LED lamp beads.
  • the matte solder resist ink layer formed by the matting solder resist ink provided by the present application after curing has a good matting effect, which can effectively improve the ink color difference of the PCB board, thereby improving the inconsistency of the black screen ink color of the LED display screen, and the matting solder resist ink layer has a good matting effect.
  • the bonding force between the ink layer and the PCB board is high, and the high temperature resistance is good, which can meet the use requirements of the LED display.
  • Figure 1 is a photo of the LED display screen when the black screen ink color is inconsistent
  • FIG. 2 is a schematic structural diagram of a display screen provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an LED display module provided by an embodiment of the present application.
  • FIG. 4 is a photo of the LED display screen with the matte solder resist ink layer provided by the embodiment of the application when the black screen ink color is the same.
  • the structure of the display screen 1000 is first introduced.
  • the display screen 1000 is formed by splicing a plurality of display boxes 200, and each display box 200 includes a box frame (not shown in FIG. 2 ) and a plurality of LED display modules 100, and the plurality of LED display modules The groups 100 are regularly fixed on the box frame to form a complete display box 200 .
  • the display screen 1000 includes two display boxes 200 , each display box 200 includes a box frame and four LED display modules 100 , and the box frame of each display box 200 is fixed on the LED display The back of the module 100.
  • the LED display module 100 includes a light board 11 , and the light board 11 includes a PCB board 10 and a plurality of LED lamp beads 20 arranged on one side surface of the PCB board 10 .
  • the plurality of LED lamp beads 20 are arranged at intervals, and the PCB board 10.
  • a matte solder resist ink layer 30 is provided on one side surface of the LED lamp beads 20 (which may be referred to as "first surface” or "front side"), and the matt solder resist ink layer 30 covers the gaps between the plurality of LED lamp beads 20 .
  • the plurality of LED lamp beads 20 may be arranged on the PCB board 10 in an array, or may be arranged in other manners as required.
  • a driving circuit is also provided on the second surface of the PCB board 10 (located opposite to the first surface, which may be referred to as the "back surface") to control the orderly lighting/extinguishing of the lamp beads.
  • Each display module 100 may also include components such as a mask, a bottom case, and the like. The mask and the bottom case are located on two sides of the lamp panel 11 respectively. The shell is located on the second surface of the lamp board 11 (ie, close to the PCB board side).
  • the material of the matte solder resist ink layer 30 provided in the embodiment of the present application and the preparation method thereof will be described in detail below.
  • An embodiment of the present application provides a matte solder resist ink
  • the matte solder resist ink includes a first component and a second component
  • the first component includes each raw material in the following mass percentages: oligomer: 20% ⁇ 50%, photoinitiator: 0.5% ⁇ 15%, nano black filler: 5% ⁇ 15%, matting agent: 10% ⁇ 30%, coupling agent: 0.2% ⁇ 2%, solvent: 10% ⁇ 30%;
  • the second component includes the following raw materials by mass percentage: epoxy resin: 20%-40%, functional monomer: 5%-40%, matting agent: 10%-20%, coupling agent: 0.2% % ⁇ 2%, solvent: 5% ⁇ 15%;
  • the first component and the second component are stored separately, and when in use, the first component and the second component are mixed to form the matte solder resist ink.
  • the matte solder resist ink provided by the present application includes a first component and a second component, which can be stored separately to increase the respective storage time. Both components contain a coupling agent, which can ensure good dispersibility of the raw materials contained in each.
  • the first component and the second component are mixed again, and the resulting matt solder resist ink has good photosensitive properties. Under suitable illumination, the photoinitiator can induce oligomers and functional monomers. Cross-linking polymerization occurs, and the cured film layer can be treated with an alkaline developer to become a patterned matte solder resist ink layer.
  • the matt solder resist ink layer has good electrical insulation and contains a specific matting agent and
  • the high light-absorbing nano-black filler has excellent extinction effect, and the absorption rate of visible light can be above 90%. Therefore, while having good solder resistance performance, it can effectively improve the ink color difference of the PCB board, thereby improving the LED display when the screen is black.
  • Ink color inconsistency; in addition, the epoxy resin contained can provide excellent adhesion and high temperature resistance of the matte solder mask ink layer. Therefore, through the synergistic effect of the above-mentioned specific mass ratios of the raw materials, the matte solder resist ink has good dispersibility and good adhesion, and the coating formed after light curing has good matting and high temperature resistance.
  • the first component and the second component may be mixed in a mass ratio of (3-9):1, and the mass ratio of the two
  • the mass ratio of the two For example, it can be 3:1, 4:1, 5:1, 6:1, 7:1, 8:1 or 9:1.
  • Appropriate mass ratio of the first component and the second component can make the matte solder resist ink better take into account high matte performance, hardness, high temperature resistance and the like.
  • the oligomer in the first component may be an epoxy acrylic resin, which is an acrylate-based resin having an epoxy group.
  • Epoxy acrylic resin is one of the most widely used light-curing oligomers. It can be quickly cross-linked and cured with functional monomers, so that the matte solder resist ink can be cured into a film, and the cured film has good adhesion and heat resistance.
  • the epoxy acrylic resin can include any one or more of bisphenol A type epoxy acrylic resin, epoxy soybean oil acrylic resin, novolac epoxy acrylic resin, and modified o-methyl novolac epoxy acrylic resin kind.
  • the viscosity of the epoxy acrylic resin at 60° C. is 1000 mPa ⁇ s ⁇ 4000 mPa ⁇ s.
  • Epoxy acrylic resin is a matrix resin of matte solder resist ink, and its viscosity is directly related to the viscosity of matt solder resist ink. Under the viscosity of the above range of epoxy acrylic resin, it can ensure that the matt solder resist ink has good coating/ printing performance.
  • the epoxy acrylic resin may have a viscosity at 60°C of 1000 mPa ⁇ s, 1500 mPa ⁇ s, 2000 mPa ⁇ s, 2500 mPa ⁇ s, 2800 mPa ⁇ s, 3000 mPa ⁇ s, or 3500 mPa ⁇ s.
  • the nano-black filler includes any one or more of graphene, carbon microspheres, carbon powder, carbon nanotubes, carbon fibers, carbon shells, and carbon films. These nano-black fillers have excellent light absorption, which can greatly improve the absorption rate of the matte solder resist ink to visible light.
  • the size of the nano-black filler is 1 nm to 100 nm.
  • the nano-scale size enables these nano-black fillers to have good dispersibility in the first component.
  • the overall uniformity of the ink can be ensured and the subsequent coating can be performed.
  • the flatness of the coating formed by printing can be 5 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm or 90 nm.
  • the size of the nano-black filler is 5 nm ⁇ 80 nm.
  • the surface of the nano-black filler can also be surface-modified with a coupling agent or a surfactant, so as to have better dispersibility in the first component.
  • the used coupling agent may be any one or more of a silane-based coupling agent, a titanate-based coupling agent and an aluminate-based coupling agent, preferably a silane-based coupling agent.
  • Surfactants include sodium dodecylbenzenesulfonate, sodium laurate, and polysiloxanes (eg, polydimethylsiloxane).
  • the particle size of the modified nano-black filler can also be in the range of 1 nm to 100 nm.
  • the photoinitiator in the first component can generate free radicals after being irradiated by light, and the polymerization reaction of the functional monomers and oligomers is initiated by the free radicals.
  • the photoinitiator may be any one or more of acetophenones, benzophenones, thioxanthones, and acylphosphine oxides, but is not limited thereto.
  • acetophenones include 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone (907), 1-hydroxy-cyclohexyl-phenylmethane Ketone (184), 2-Hydroxy-2-methyl-1-phenyl-1-propanone (1173), 2-methyl-1-[4-(methylthio)phenyl]-2-(4- morpholinyl)-1-propanone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-dibutoxyacetophenone, etc.
  • the benzophenones include benzophenone, tetraphenylbenzophenone, hydroxybenzophenone, 4,4-dimethylaminobenzophenone, and the like.
  • thioxanthones 2-isopropylthioxanthone (ITX), 1-chloro-4-propoxythioxanthone, etc. are mentioned.
  • acyl phosphine oxides include 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO), 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester ( TPO-L) etc.
  • the maximum light absorption wavelength of the photoinitiator is 270-400 nm. That is, the photoinitiator generates radicals and initiates a polymerization reaction under ultraviolet light irradiation.
  • the epoxy resin plays a role in improving the adhesion of the matte solder resist ink to the PCB board and improving the stability of the resulting matt solder resist ink layer (eg, heat resistance).
  • the epoxy resin may include any one of bisphenol A epoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin, polycyclic aromatic epoxy resin and novolac epoxy resin one or more.
  • the viscosity of the epoxy resin at 25° C. is 1000 mPa ⁇ s to 3000 mPa ⁇ s.
  • Epoxy resin is a matrix resin of matte solder resist ink, and its viscosity is directly related to the viscosity of matt solder resist ink. Under the viscosity of the above range, epoxy resin can ensure that matt solder resist ink has good coating/printing performance .
  • the epoxy resin may have a viscosity at 25°C of 1000 mPa ⁇ s, 1300 mPa ⁇ s, 1500 mPa ⁇ s, 2000 mPa ⁇ s, 2500 mPa ⁇ s, 2900 mPa ⁇ s, or 3000 mPa ⁇ s.
  • the total chlorine content of the epoxy resin is less than or equal to 900ppm, which can ensure that the above-mentioned matting solder resist ink has less corrosive effect on the metal material on the PCB board when it is applied to the PCB board of the LED display screen.
  • the mass percentage content of the epoxy resin in the first component is 22% to 38%. For example, it can be 25%, 28%, 30%, 32%, 35%, 40%. Appropriate content of epoxy resin can improve the adhesion and resistance of matte solder resist ink.
  • the functional monomer contains an unsaturated group, which is mainly used for cross-linking reaction.
  • the functional monomers include any one or more of monofunctional acrylate monomers and difunctional acrylate monomers. Among them, monofunctional or difunctional acrylate monomers have better diluting ability to oligomers, and the film layer formed after curing with oligomers has high adhesion to substrates; The photoreactive activity is high, and the hardness of the film formed after curing with oligomer is high.
  • the functional monomer includes any one or more of difunctional acrylate monomers and multifunctional acrylate monomers.
  • the monofunctional acrylate monomer can be selected from isobornyl acrylate (IBOA), isobornyl methacrylate, propyl methacrylate, glycidyl methacrylate, hydroxyethyl acrylate (HEA), ethyl acetate Any one or more of oxidized hydroxyethyl methacrylate and the like.
  • IBOA isobornyl acrylate
  • HOA hydroxyethyl acrylate
  • ethyl acetate Any one or more of oxidized hydroxyethyl methacrylate and the like.
  • the difunctional acrylate monomer can be selected from tripropylene glycol diacrylate (TPGDA), 1,6-hexanediol diacrylate (HDDA), 1,6-hexanediol dimethacrylate (HDDMA) ), any one or more of triethylene glycol dimethacrylate (TEGDMA) and diethylene glycol dimethacrylate (DEGDMA).
  • TPGDA tripropylene glycol diacrylate
  • HDDA 1,6-hexanediol diacrylate
  • HDDMA 1,6-hexanediol dimethacrylate
  • TEGDMA triethylene glycol dimethacrylate
  • DEGDMA diethylene glycol dimethacrylate
  • the multifunctional acrylate monomer can be selected from pentaerythritol triacrylate (PETA), dipentaerythritol hexaacrylate (DPHA), trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethacrylate (TMPTPA), ethoxylated trimethylolpropane triacrylate (EO-TMPTA), trimethylolpropane trimethacrylate, di-trimethylolpropane tetraacrylate (DITMPTAUV) any one or variety.
  • PETA pentaerythritol triacrylate
  • DPHA dipentaerythritol hexaacrylate
  • TMPTA trimethylolpropane triacrylate
  • TMPTPA trimethylolpropane trimethacrylate
  • EO-TMPTA ethoxylated trimethylolpropane triacrylate
  • DITMPTAUV di-trimethylolpropane te
  • the matting agents in the first component and the second component are respectively selected from any one or more of inorganic matting agents, metal soap matting agents, and matting polymers.
  • the inorganic matting agent includes any one or more of silicon dioxide (can be obtained by gas phase method, precipitation method or gel method), barium sulfate, calcium sulfate, calcium carbonate, diatomaceous earth, kaolin, talc, etc. kind.
  • Metal soap-type matting agents include at least one metal stearate among aluminum stearate, zinc stearate, calcium stearate, magnesium stearate, and the like.
  • the matting polymer includes any one or more of matting resins such as acrylic matting resin, epoxy-modified acrylic matting resin, organic polymer PERGOPAK, polyamide wax micropowder NEW-0401C, and the like.
  • matting resins such as acrylic matting resin, epoxy-modified acrylic matting resin, organic polymer PERGOPAK, polyamide wax micropowder NEW-0401C, and the like.
  • inorganic matting agents can also improve the performance of epoxy acrylate during photocuring, such as enhancing the strength and impact resistance of the resulting ink layer.
  • PERGOPAK can enhance the hardness and abrasion resistance of matte solder resist ink layers without affecting the rheology of the ink.
  • the numerical value of the secondary particle size of the metal soap-based matting agent and the inorganic matting agent is controlled within a range of 10 ⁇ m to 15 ⁇ m.
  • the "secondary particle size” here refers to the size of the particle size that characterizes the agglomerates measured by a Malvern particle sizer or the like.
  • the particle size of the secondary particles of the matting agent is in the above range, which can ensure their uniform dispersion in the ink and good matting effect, and improve the mechanical properties of the cured matting solder resist ink layer.
  • metal soap matting agents and inorganic matting agents can be treated with the following coupling agents and surfactants (such as sodium dodecylbenzenesulfonate, sodium laurate, polydimethylsiloxane, etc.) , organic waxes, silicone resins, etc. are surface-modified to enhance their dispersibility in the first and second components.
  • coupling agents and surfactants such as sodium dodecylbenzenesulfonate, sodium laurate, polydimethylsiloxane, etc.
  • organic waxes, silicone resins, etc. are surface-modified to enhance their dispersibility in the first and second components.
  • the coupling agent may include one or more of a silane-based coupling agent, a titanate-based coupling agent, and an aluminate-based coupling agent.
  • the coupling agent has both groups that can be combined with inorganic materials (such as nano-black fillers, inorganic matting agents) and groups that can be combined with organic materials (such as epoxy resins, oligomers, etc.), which can improve organic materials and inorganic materials.
  • the interfacial properties of the material improve the dispersibility and compatibility of the raw materials in the first component and the second component.
  • the silane coupling agent may include aminopropyltriethoxysilane, aminopropyltrimethoxysilane, 2-aminoethyl-aminopropyltrimethoxysilane and diethylenetriaminopropyltrimethoxysilane any one or more of them.
  • the titanate coupling agent can include isopropyl dioleic acid acyloxy (dioctyl phosphoric acid acyloxy) titanate, isopropyl tris (dioctyl phosphoric acid acyloxy) titanate, triisopropyl Any one or more of isopropyl stearate titanate, isopropyl triisostearate titanate and tetraisopropyl bis(dioctylphosphiteoxy) titanate.
  • the aluminate coupling agent can include any one of distearoyloxyisopropyl aluminate, DL-411, DL-411AF, DL-411D, DL-411DF, anti-settling aluminate ASA, etc. or more.
  • the solvents in the first component and the second component may include, but are not limited to, any one or more of ester solvents, ether solvents, ketone solvents, hydrocarbon solvents, etc., but are not limited thereto.
  • the ester-based solvent includes methyl acetate, ethyl acetate, butyl acetate, ethyl butyrate, dimethyl carbonate, ethylene glycol ethyl ether acetate, propylene glycol methyl ether acetate (PGMEA), propylene glycol ethyl ether acetate Ester, DBE solvent, etc.
  • the ether-based solvent examples include ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol dimethyl ether, dipropylene glycol methyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol Glycol dimethyl ether, etc.
  • the hydrocarbon-based solvent toluene, xylene, tetratoluene, ethylbenzene, and the like can be mentioned.
  • the solvent may be a mixture of various organic solvents.
  • the above-mentioned first component and second component may further contain at least one auxiliary agent, such as a toughening agent, a defoaming agent, a leveling agent, a dispersing agent, and the like, respectively.
  • a toughening agent can improve the toughness of the ink layer formed by the matte solder resist ink, so that the ink layer has high impact resistance.
  • the defoamer can effectively reduce the probability of air bubbles during the preparation and use of the matte solder resist ink, and improve the quality and reliability of the ink layer.
  • the leveling agent can reduce the surface tension of the matte solder resist ink and promote it to form a flat, smooth and uniform ink layer.
  • the dispersant can ensure the uniform dispersion of the raw materials in the ink and improve the stability of the matte solder resist ink.
  • the visible light absorption rate of the matte solder resist ink is greater than or equal to 90%.
  • the matting solder resist ink has a good matting effect, and the absorption rate of visible light can be above 90%.
  • the viscosity of the matte solder resist ink at 25° C. is 160 Pa ⁇ s ⁇ 220 Pa ⁇ s.
  • the viscosity of the matting solder resist ink is moderate, suitable for preparing on the PCB board by screen printing, improving the preparation efficiency, and it is not easy to flow after being printed on the PCB board, so as to ensure that the ink on the PCB board is as close to the silk as possible.
  • the mesh of the graphic part of the screen printing plate corresponds.
  • the viscosity of the matte solder resist ink at 25° C. may be 170 Pa ⁇ s, 180 Pa ⁇ s, 190 Pa ⁇ s, 200 Pa ⁇ s, 210 Pa ⁇ s or 220 Pa ⁇ s.
  • the ratio of each raw material is reasonable and the dispersion performance is good.
  • the patterned matte solder resist ink layer obtained by treatment, post-baking treatment, etc. has good matting effect and high temperature resistance.
  • the above-mentioned matting solder resist ink can be prepared by the following methods:
  • the first component and the second component are stored separately, and when in use, the first component and the second component are mixed in proportion to obtain a matte solder resist ink.
  • the stirring is performed at a temperature less than or equal to 45°C.
  • the lower stirring temperature can ensure that the solvent in the components is not easily volatile.
  • the stirring temperature can be 15°C to 45°C, specifically, but not limited to, 45°C, 40°C, 37°C, 30°C, 25°C, 20°C, and 15°C.
  • the stirring speed can be 500r/min ⁇ 2000r/min; the stirring time can be 20min ⁇ 80min. In some embodiments, the stirring speed is 800r/min ⁇ 1500r/min, and the stirring time can be 40min ⁇ 60min.
  • the equipment used for the grinding may include, but is not limited to, one of a disc grinder, a rotary shaft grinder, and a three-roll grinder.
  • the rotational speed during grinding can be 400r/min ⁇ 600r/min, and the grinding time is 30min ⁇ 60min. In some embodiments, the grinding speed may be 500 r/min, and the grinding time may be 50 min.
  • the range of stirring temperature and time, the range of grinding speed and time in step S02 can be as described in above step S01, and will not be repeated here, but the specific stirring temperature and time value, grinding speed and time value can be different.
  • the preparation method of the above-mentioned matting solder resist ink is simple and suitable for mass production.
  • the embodiments of the present application also provide a method for preparing an LED display module using the above-mentioned matting solder resist ink, comprising the following steps:
  • the matte solder resist ink obtained by mixing the first component and the second component is coated or printed on the first surface of the PCB board, and then subjected to pre-baking, exposure treatment, development treatment, and post-baking, Form a patterned matte solder resist ink layer;
  • the first surface of the PCB is a surface on one side of the PCB to be mounted with LED lamp beads.
  • the above-mentioned coating methods may include brushing, spraying, blade coating or spin coating, etc.
  • the specific printing method may be screen printing, which has high production efficiency.
  • the viscosity of the above-mentioned matting solder resist ink is moderate, and it is suitable for screen printing on the PCB board by means of screen printing.
  • the process of screen printing includes: placing a screen printing plate on a substrate (such as a PCB board), pouring the above-mentioned matting solder resist ink on one end of the screen printing plate, and applying a certain pressure to make the above-mentioned matting solder resist ink
  • the ink is transferred to the substrate through the holes of the screen printing plate to form a matte solder resist ink layer.
  • the wet coating after screen printing is subjected to pre-baking, exposure treatment, development treatment, post-baking, etc. to complete the final transfer of the pattern to obtain a patterned matte solder resist ink layer, so that the required pads are exposed, other place is protected.
  • the required pad corresponds to the to-be-mounted area of the LED lamp bead, that is, the area not covered by the matte solder resist ink layer on the first surface.
  • the pre-baking process may include: placing the PCB board with the matting solder resist ink in an oven with a temperature of 65° C. to 75° C. for a pre-baking time of 35 minutes to 50 minutes, and then naturally Cool to room temperature.
  • the temperature of the pre-baking is 70°C-72°C, and the pre-baking time is 40min-45min.
  • the exposure treatment is to use active light to expose the pre-baked matte solder resist ink through a predetermined photomask, so that the functional monomers and oligomers in the exposed matte solder resist ink are in the photoinitiator.
  • active light may be UV light, ie the exposure is performed under UV light.
  • shape of the photomask corresponds to the shape of the arrangement of the LED lamp beads, and the unexposed part can be subsequently removed by the developer.
  • the exposure energy reaching the matte solder resist ink surface during exposure may be 200 mJ/cm 2 to 400 mJ/cm 2 .
  • the developing treatment is to remove unnecessary parts (referred to in this application as unexposed areas) with a developing solution to obtain a desired patterned matte solder resist ink layer.
  • the developing solution is usually an alkaline solution.
  • solutions of inorganic bases such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, and ammonia water, and alkaline solutions such as diethylamine, trimethylamine, tetramethylammonium hydroxide (TMAH), and triethanolamine can be used.
  • organic amines organic amines.
  • appropriate amounts of water-soluble organic solvents such as methanol and ethanol and surfactants may be added to the developer.
  • the temperature of the developer is 32°C to 40°C.
  • the development time is determined according to the film thickness and the solubility of the matte solder resist ink.
  • Post-baking can further cure the patterned matte solder resist ink layer, improve the compactness of the coating, and stabilize its adhesion to the PCB board.
  • the post-baking may be baked at a temperature of 150° C. ⁇ 160° C. for 50 min ⁇ 70 min.
  • step S200 after the LED lamp beads are mounted on the first surface of the PCB board, it further includes: soldering electronic components such as chips, resistors, capacitors and other electronic components on the second surface of the PCB (set opposite to the first surface) .
  • the PCB board with the LED lamp beads and the above-mentioned electronic components can be called a lamp board.
  • the light board can be installed on the bottom case by locking screws to obtain an LED display module.
  • the matte solder resist ink layer formed on the PCB board by the matte solder resist ink has good insulation and high temperature resistance, and has a good matting effect. , which can effectively improve the inconsistency of the black screen ink color of the LED display screen spliced by the LED display module, without the need for inkjet treatment for the LED display module with the matte solder resist ink, shortening the preparation process and improving the performance. Production efficiency, reduce production costs.
  • the thickness of the matte solder resist ink layer 30 in the LED display module 100 may be 25 ⁇ m ⁇ 35 ⁇ m. Specifically, it may be, but not limited to, 26 ⁇ m, 28 ⁇ m, 30 ⁇ m, 32 ⁇ m or 35 ⁇ m.
  • a matte solder resist ink which can be used for a PCB board of an LED display screen
  • the matte solder resist ink comprises a first component and a second component stored separately, and the first component comprises the following mass percentages of each raw material :
  • Oligomer (specifically, modified o-methyl novolac epoxy acrylic resin, the viscosity at 60°C is 2500 mPa ⁇ s): 35%;
  • Photoinitiator 10%, specifically 7% of 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone and 3% of 2-isopropylthioxanthone ;
  • Nano black filler (specifically carbon microspheres with a particle size of 30nm): 10%;
  • Matting agent specifically, fumed silica, with a secondary particle size of 10 ⁇ m: 18%;
  • Coupling agent (specifically aminopropyltriethoxysilane): 2%;
  • Described second component comprises each raw material of following mass percentage content:
  • Epoxy resin (specifically, novolac epoxy resin, the viscosity at 25°C is 2000mPa ⁇ s): 40%;
  • Matting agent specifically, fumed silica, with a secondary particle size of 10 ⁇ m: 15%;
  • Coupling agent (specifically aminopropyltriethoxysilane): 2%;
  • the first component and the second component are mixed in a mass ratio of 3:1 to obtain a matte solder resist ink.
  • the preparation method of the matte solder resist ink includes:
  • the matte solder resist ink of Example 1 can be applied to the LED display screen in the following manner. Specifically, the matte solder resist ink of Example 1 was screen-printed on the first surface of the PCB board of the LED display screen by screen printing, and placed in an oven with a temperature of 70° C.
  • pre-baking for 45 minutes to remove the solvent, forming a A film layer; then, the film layer is exposed under a UV lamp using a reticle cover, and the exposure energy reaching the matte solder resist ink surface during exposure is 300mJ/cm 2 ; then a 1wt% Na 2 CO 3 solution is used to expose The film layer is developed, and then washed with ultrapure water; finally, post-baking treatment is carried out at 150 ° C for 60 minutes to form a patterned matte solder resist ink layer on the PCB, which does not cover the LED lamp beads to be mounted. pad.
  • a plurality of LED lamp beads are mounted on the area (ie, the pad) that is not covered by the matte solder resist ink layer on the first surface, and electronic components such as chips, resistors, capacitors, etc. are welded on the PCB opposite to the front side.
  • the light board of the LED display screen is obtained, and then the light board is installed on the bottom case by locking screws to obtain the LED display module.
  • a plurality of the LED display modules are spliced and fixed on the box frame to obtain a complete display box; and then a plurality of display boxes are spliced to obtain an LED display screen.
  • a matte solder resist ink comprising a first component and a second component stored separately, and the first component includes each raw material in the following mass percentages:
  • Oligomer (specifically, novolac epoxy acrylic resin, the viscosity at 60°C is 3000 mPa ⁇ s): 33%;
  • Photoinitiator 10% specifically 7% of 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone and 3% of 2-isopropylthioxanthone) ;
  • Nano black filler (specifically carbon microspheres with a particle size of 30nm): 10%;
  • Matting agent specifically, fumed silica, with a secondary particle size of 10 ⁇ m: 20%;
  • Coupling agent (specifically aminopropyltriethoxysilane): 2%;
  • Described second component comprises each raw material of following mass percentage content:
  • Epoxy resin (specifically, bisphenol F type epoxy resin, the viscosity at 25°C is 1500mPa ⁇ s): 35%;
  • Matting agent specifically, fumed silica, with a secondary particle size of 10 ⁇ m: 20%;
  • Coupling agent (specifically aminopropyltriethoxysilane): 2%;
  • the first component and the second component are mixed in a mass ratio of 3:1 to obtain a matte solder resist ink.
  • the matte solder resist ink provided in Example 2 was applied to the LED display screen according to the method described in Example 1.
  • a matte solder resist ink comprising a first component and a second component stored separately, and the first component includes each raw material in the following mass percentages:
  • Oligomer (specifically, bisphenol A type epoxy acrylic resin, the viscosity at 60°C is 2000mPa ⁇ s): 35%;
  • Photoinitiator 10%, specifically 7% of 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone and 3% of 2-isopropylthioxanthone ;
  • Nano black filler (specifically carbon powder, particle size is 20nm): 10%;
  • Matting agent specifically, precipitated silica, with a secondary particle size of 20 ⁇ m: 20%;
  • Coupling agent (specifically aminopropyltriethoxysilane): 2%;
  • Described second component comprises each raw material of following mass percentage content:
  • Epoxy resin (specifically aliphatic epoxy resin, viscosity at 25°C is 2000mPa ⁇ s): 35%;
  • Matting agent specifically, precipitated silica, with a secondary particle size of 10 ⁇ m: 20%;
  • Coupling agent (specifically aminopropyltriethoxysilane): 2%;
  • the first component and the second component are mixed in a mass ratio of 3:1 to obtain a matte solder resist ink.
  • the matte solder resist ink provided in Example 3 was applied to the LED display screen according to the method described in Example 1.
  • the color of the matte solder resist ink provided by the embodiments of the present application is matte black, which is a strong support for the beneficial effects brought by the technical solutions of the embodiments of the present application. See Table 1.
  • Example 1 Example 2
  • Example 3 Viscosity (after mixing) (Pa s) 190 200 200 Density (after mixing) (g/cm 3 ) 1.35 1.39 1.38 Thickness ( ⁇ m) 26 28 28 pencil hardness 6H or more 6H or more 6H or more Insulation resistance ( ⁇ ) 4.0 ⁇ 10 12 4.5 ⁇ 10 12 3.3 ⁇ 10 12 Dielectric constant 4.8 4.6 4.9 Dielectric loss 0.030 0.028 0.034 Visible light absorption (%) 90 92 92 92
  • FIG. 4 is a photo of the LED display screen with a matte solder resist ink layer provided by the embodiment of the application when the screen is black. Compared with the existing LED display screen in FIG. 1, the LED display screen with the matt solder resist ink layer is Black screen ink color consistency is high, giving people a good visual experience.

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Abstract

本申请提供了一种消光阻焊油墨，包括第一组分和第二组分，第一组分包括：低聚物：20％～50％，光引发剂：0.5％～15％，纳米黑色填料：5％～15％，消光剂：10％～30％，偶联剂：0.2％～2％，溶剂：10％～30％；第二组分包括：环氧树脂：20％～40％，功能单体：5％～40％，消光剂：10％～20％，偶联剂：0.2％～2％，溶剂：5％～15％；第一组分与第二组分分开储存，使用时再将二者混合。该消光阻焊油墨具有良好的阻焊性和优异的消光性，可有效改善LED显示屏黑屏时墨色不一致的问题。本申请还提供了采用该消光阻焊油墨的LED显示模组的制备方法及LED显示屏。

Description

消光阻焊油墨、LED显示模组的制备方法及LED显示屏
本申请要求于2021年01月12日提交至中国专利局、申请号为202110038045.8、发明名称为“LED显示屏PCB板用油墨、使用该油墨的LED显示模组的制备方法及LED显示屏”的中国专利申请的优先权，上述在先申请的全部内容以引用的方式并入本申请中。
技术领域
本申请涉及LED显示屏技术领域，具体涉及一种消光阻焊油墨、LED显示模组的制备方法及LED显示屏。
背景技术
发光二极管(light emitting diode，LED)显示屏具有发光亮度高、发光效率高、色彩鲜艳、对比度高、工作温度范围广、响应时间短、能耗低等优点，广泛应用在显示领域，例如比较常见的证券交易和金融信息显示、机场航班动态信息显示、港口和车站旅客引导信息显示、体育场馆信息显示、道路交通信息显示、电力调度和车辆动态跟踪等调度指挥中心信息显示、商场购物中心等服务领域的业务宣传信息显示以及广告媒体产品等。
LED显示屏一般由多个LED显示模组拼接而成，LED显示模组包括PCB板及通过表面组装技术(Surface Mounted Technology，SMT)焊接在PCB板上的多个LED灯珠。为了保护PCB板上的线路，会在PCB板表面丝印一层阻焊油墨，但传统的阻焊油墨光泽度高、对可见光的吸收率低，当可见光照射到阻焊油墨表面时，大量的可见光会以镜面反射或接近镜面反射的形式反射到人眼，人眼能很清晰地看见阻焊油墨墨色，而阻焊油墨墨色的微小差异呈现在人眼的现象就是PCB板的墨色不一致，进而导致由LED显示屏模组拼接而成的LED显示屏黑屏墨色不一致(见图1)。
为消除PCB板的墨色不一致性，行业内有在PCB板的LED灯珠与灯珠间隙进行喷墨处理形成可覆盖阻焊油墨的油墨层，但这相当于是额外增加了一道制备工序，效率较低，还可能会使LED灯珠的表面或侧面沾上喷墨油墨，遮挡/吸收灯珠的发光，大大降低LED显示屏的显示效果。因此，有必要提供一种光泽度低、对可见光吸收率高的消光阻焊油墨，以用于解决LED显示屏黑屏墨色不一致的问题。
发明内容
鉴于此，本申请提供了一种可用于LED显示屏的消光阻焊油墨，其具有阻焊的同时，还具有优异消光性，可将照射到LED显示屏PCB板表面的可见光基本吸收掉，进而保证LED显示屏黑屏时的墨色一致性。
本申请第一方面提供了一种消光阻焊油墨，所述消光阻焊油墨包括第一组分和第二组分，所述第一组分包括以下质量百分含量的各原料：低聚物：20％～50％，光引发剂：0.5％～15％，纳米黑色填料：5％～15％，消光剂：10％～30％，偶联剂：0.2％～2％，溶剂：10％～30％；
所述第二组分包括以下质量百分含量的各原料：环氧树脂：20％～40％，功能单体：5％～40％，消光剂：10％～20％，偶联剂：0.2％～2％，溶剂：5％～15％；
所述第一组分与所述第二组分分开储存，使用时，所述第一组分与所述第二组分混合后形成所述消光阻焊油墨。
本申请通过上述特定质量配比的各原料的协同作用，特别是同时含有的消光性的消光剂及高吸光性的纳米黑色填料，使得消光阻焊油墨具有良好的消光效果，对可见光的吸收率可以在90％以上，且该消光阻焊油墨中各原料的分散性好，在PCB板上能完全附着，耐高温性好。
本申请第二方面提供了一种使用第一方面所述消光阻焊油墨的LED显示模组的制备方法，包括：
将本申请第一方面所述的消光阻焊油墨涂敷或印刷在PCB板的第一表面上，再经预烘烤、曝光处理、显影处理、后烘烤，形成图案化的消光阻焊油墨层；
将多个LED灯珠贴装在所述第一表面上未被所述消光阻焊油墨层覆盖的区域上，得到LED显示模组。
本申请第二方面提供的LED显示模组的制备方法中，通过第一方面所述的消光阻焊油墨形成的消光阻焊油墨层具有良好的绝缘性和耐高温性以及阻焊性，并具有良好的消光效果，可有效地改善由LED显示模组拼接成的LED显示屏黑屏墨色不一致的问题，无需对带该消光阻焊油墨层的LED显示模组的灯珠间隙再进行喷墨处理，缩短了显示模组的制备工序，提高了生产效率、降低了生产成本。
本申请第三方面提供了一种使用第一方面所述消光阻焊油墨的LED显示屏，该LED显示屏包括多个LED显示模组，每个LED显示模组包括PCB板和设置在PCB板的一侧表面上的多个LED灯珠，所述PCB板设有所述LED灯珠的一侧表面上还设有通过本申请第一方面所述的消光阻焊油墨经固化形成的消光阻焊油墨层，所述消光阻焊油墨层覆盖多个 所述LED灯珠之间的间隙。
本申请提供的消光阻焊油墨经固化后所形成的消光阻焊油墨层具有良好的消光效果，可以有效改善PCB板的墨色色差，进而改善LED显示屏黑屏墨色的不一致性，且该消光阻焊油墨层与PCB板之间的结合力高，耐高温性好，可满足LED显示屏的使用要求。
附图说明
图1为LED显示屏在黑屏墨色不一致时的照片；
图2是本申请实施例提供的显示屏的结构示意图；
图3为本申请实施例提供的LED显示模组的结构示意图；
图4为本申请实施例提供的带消光阻焊油墨层的LED显示屏在黑屏墨色一致时的照片。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。
如图2所示，首先介绍显示屏1000的结构。一般地，显示屏1000由多个显示箱体200拼接而成，每个显示箱体200包括一个箱体框架(图2中未示出)和多个LED显示模组100，多个LED显示模组100规律地固定在箱体框架上组成一个完整的显示箱体200。图2中，显示屏1000包括两个显示箱体200，每个显示箱体200均包括一个箱体框架和四个LED显示模组100，每个显示箱体200的箱体框架固定在LED显示模组100的背面。
参见图3，LED显示模组100包括灯板11，灯板11包括PCB板10和设置在PCB板10一侧表面上的多个LED灯珠20，多个LED灯珠20间隔设置，PCB板10设置LED灯珠20的一侧表面(可称为“第一表面”或“正面”)上设置消光阻焊油墨层30，消光阻焊油墨层30覆盖多个LED灯珠20之间的间隙。多个LED灯珠20可以是阵列排布设置在PCB板10上，也可以根据需要按其他方式排布。当然，PCB板10的第二表面(与第一表面相对设置，可称为“背面”)上还设置有驱动电路，以控制灯珠的有序点亮/熄灭。每个显示模组100还可以包括面罩、底壳等组件，面罩和底壳分别位于灯板11的两侧，其中，面罩覆盖在灯板11的第一表面(即，灯珠侧)，底壳位于灯板11的第二表面(即，靠近PCB板侧)。
基于以上显示屏1000的结构，以下详述本申请实施例提供的消光阻焊油墨层30的材 质及其制备方法。
本申请实施例提供了一种消光阻焊油墨，所述消光阻焊油墨包括第一组分和第二组分，所述第一组分包括以下质量百分含量的各原料：低聚物：20％～50％，光引发剂：0.5％～15％，纳米黑色填料：5％～15％，消光剂：10％～30％，偶联剂：0.2％～2％，溶剂：10％～30％；
所述第二组分包括以下质量百分含量的各原料：环氧树脂：20％～40％，功能单体：5％～40％，消光剂：10％～20％，偶联剂：0.2％～2％，溶剂：5％～15％；
所述第一组分与所述第二组分分开储存，使用时，所述第一组分与所述第二组分混合后形成所述消光阻焊油墨。
本申请提供的消光阻焊油墨包括第一组分和第二组分，分开储存可提高各自的贮存时长，两种组分都含有偶联剂，可保证各自所含原料的良好分散性。当需要使用消光阻焊油墨时，将第一组分和第二组分再混合，所得消光阻焊油墨具有良好的感光特性，在合适光照下，光引发剂可引发低聚物与功能单体发生交联聚合，固化形成的膜层可经碱性显影液处理后变成图案化的消光阻焊油墨层，该消光阻焊油墨层具有良好电绝缘性，且因同时含有特定的消光剂及高吸光性的纳米黑色填料而具有优异消光效果，对可见光吸收率可以在90％以上，因此在具有良好阻焊性能的同时，可以有效改善PCB板的墨色色差，进而改善LED显示屏黑屏时的墨色不一致性；此外含有的环氧树脂可以提供消光阻焊油墨层优异的附着性和耐高温性。因此，通过上述特定质量配比的各原料的协同作用，使得消光阻焊油墨的分散性好、附着性好，经光固化后形成的涂层具有良好消光性及耐高温性等。
本申请实施方式中，在使用所述消光阻焊油墨时，所述第一组分与所述第二组分可以按质量比为(3～9)：1的比例混合，二者的质量比例如可以为3:1、4:1、5:1、6:1、7:1、8:1或9:1。合适质量比的第一组分和第二组分可以使消光阻焊油墨更好地兼顾高消光性能及硬度、耐高温性等。
第一组分中的低聚物可以为环氧丙烯酸树脂，其为具有环氧基的丙烯酸酯类树脂。环氧丙烯酸树脂是一种应用最广泛的光固化低聚物，其可与功能单体快速发生交联固化，使消光阻焊油墨固化成膜，且固化膜具有良好的附着力和耐热性。从结构上来说，环氧丙烯酸树脂可以包括双酚A型环氧丙烯酸树脂、环氧大豆油丙烯酸树脂、酚醛环氧丙烯酸树脂、改性邻甲基酚醛环氧丙烯酸树脂中的任意一种或多种。
本申请实施方式中，所述环氧丙烯酸树脂在60℃下的粘度为1000mPa·s～4000mPa·s。环氧丙烯酸树脂作为消光阻焊油墨的一种基体树脂，其粘度与消光阻焊油墨的粘度直接相 关，环氧丙烯酸树脂在以上范围的粘度下，能保证消光阻焊油墨具有良好的涂覆/印刷性能。在一些实施例中，环氧丙烯酸树脂在60℃下的粘度可以为1000mPa·s、1500mPa·s、2000mPa·s、2500mPa·s、2800mPa·s、3000mPa·s或3500mPa·s。
第一组分中，所述纳米黑色填料包括石墨烯、碳微球、碳粉、碳纳米管、碳纤维、碳壳、碳膜中的任意一种或多种。这些纳米黑色填料具有优异的吸光性，可大大提升所述消光阻焊油墨对可见光的吸收率。
本申请中，所述纳米黑色填料的尺寸为1nm～100nm。纳米级别的尺寸可使这些纳米黑色填料在第一组分中具有良好的分散性，在与第二组分混合形成所述消光阻焊油墨后，可保证油墨整体均匀且可使经后续涂覆/印刷形成的涂层平整性。具体地，纳米黑色填料的尺寸可以为5nm、10nm、20nm、30nm、40nm、50nm、60nm、70nm、80nm或90nm。在一些实施方式中，所述纳米黑色填料的尺寸为5nm～80nm。
进一步地，所述纳米黑色填料的表面还可以经偶联剂或表面活性剂进行表面改性，以在第一组分中具有更好的分散性。其中，用于偶联剂可以为硅烷类偶联剂、钛酸酯类偶联剂和铝酸酯类偶联剂中的任意一种或多种，优选为硅烷类偶联剂。表面活性剂可以列举十二烷基苯磺酸钠、月桂酸钠、聚硅氧烷(如聚二甲基硅氧烷等)。其中，改性后的纳米黑色填料的粒径也可在1nm～100nm的范围内。
第一组分中的光引发剂经光照射后可产生自由基，并通过自由基引发所述功能单体、低聚物的聚合反应。其中，光引发剂可以为苯乙酮类、二苯酮类、硫杂蒽酮类、酰基氧化膦类中的任意一种或多种，但不限于此。具体地，对于苯乙酮类，可以列举2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮(907)、1-羟基-环己基-苯基甲酮(184)、2-羟基-2-甲基-1-苯基-1-丙酮(1173)、2-甲基-1-[4-(甲硫基)苯基]-2-(4-吗啉基)-1-丙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二丁氧基苯乙酮等。对于二苯酮类，可以列举二苯酮、四苯基二苯酮、羟基二苯酮、4,4-二甲基氨基二苯酮等。对于硫杂蒽酮类，可以列举2-异丙基硫杂蒽酮(ITX)、1-氯-4-丙氧基硫杂蒽酮等。对于酰基氧化膦类，可以列举2,4,6-三甲基苯甲酰基-二苯基膦氧化物(TPO)、2,4,6-三甲基苯甲酰基苯基膦酸乙酯(TPO-L)等。可选地，所述光引发剂的最大光吸收波长在270～400nm。即，光引发剂在紫外光照射下而产生自由基、引发聚合反应。
第二组分中，环氧树脂起到提高消光阻焊油墨对PCB板的附着性、提高所得消光阻焊油墨层稳定性的作用(如耐热性)。本申请实施方式中，环氧树脂可以包括双酚A型环氧 树脂、双酚F型环氧树脂、脂肪族环氧树脂、多环芳香族环氧树脂和酚醛型环氧树脂中的任意一种或多种。
本申请实施方式中，环氧树脂在25℃下的粘度为1000mPa·s～3000mPa·s。环氧树脂作为消光阻焊油墨的一种基体树脂，其粘度与消光阻焊油墨的粘度直接相关，环氧树脂在以上范围的粘度下，能保证消光阻焊油墨具有良好的涂覆/印刷性能。在一些实施例中，环氧树脂在25℃下的粘度可以为1000mPa·s、1300mPa·s、1500mPa·s、2000mPa·s、2500mPa·s、2900mPa·s或3000mPa·s。可选地，环氧树脂的总氯含量≤900ppm，这样可保证上述消光阻焊油墨在应用到LED显示屏PCB板上时，对PCB板上金属材料的腐蚀作用较小。可选地，环氧树脂在第一组分中的质量百分含量为22％～38％。例如，可以为25％、28％、30％、32％、35％、40％。适当含量的环氧树脂能够提升消光阻焊油墨的附着性和耐性等。
第二组分中，所述功能单体含有不饱和基团，主要用于发生交联反应。本申请实施方式中，所述功能单体包括单官能基丙烯酸酯单体、双官能基丙烯酸酯单体中的任意一种或多种。其中，单官能基或双官能基丙烯酸酯单体对低聚物具有较好的稀释能力，与低聚物固化后形成的膜层对基材的附着力高；多官能基丙烯酸酯单体的光反应活性高，与低聚物固化后形成的膜层硬度高。优选地，所述功能单体包括双官能基丙烯酸酯单体和多官能基丙烯酸酯单体中的任意一种或多种。
具体地，单官能基丙烯酸酯单体可以选自丙烯酸异冰片酯(IBOA)、甲基丙烯酸异冰片酯、甲基丙烯酸丙酯、甲基丙烯酸缩水甘油酯、丙烯酸羟乙酯(HEA)、乙氧化羟乙基甲基丙烯酸酯等中的任意一种或多种。双官能基丙烯酸酯单体可以选自二缩三丙二醇二丙烯酸酯(TPGDA)、1,6-己二醇二丙烯酸酯(HDDA)、1,6-己二醇二甲基二丙烯酸酯(HDDMA)、三乙二醇二甲基丙烯酸酯(TEGDMA)、二乙二醇二甲基丙烯酸酯(DEGDMA)中的任意一种或多种。多官能基丙烯酸酯单体可以选自季戊四醇三丙烯酸酯(PETA)、二季戊四醇六丙烯酸酯(DPHA)、三羟甲基丙烷三丙烯酸酯(TMPTA)、三羟甲基丙烷三甲基三丙烯酸酯(TMPTPA)、乙氧化三羟甲基丙烷三丙烯酸酯(EO-TMPTA)、三羟甲基丙烷三甲基丙烯酸酯、二-三羟甲基丙烷四丙烯酸酯(DITMPTAUV)中的任意一种或多种。
本申请实施方式中，所述第一组分和所述第二组分中的消光剂分别选自无机类消光剂、金属皂类消光剂、消光聚合物中的任意一种或多种。其中，无机类消光剂包括二氧化硅(可通过气相法、沉淀法或凝胶法制得)、硫酸钡、硫酸钙、碳酸钙、硅藻土、高岭土、滑石粉等中的任意一种或多种。金属皂类消光剂包括硬脂酸铝、硬脂酸锌、硬脂酸钙、硬脂酸镁 等中的至少一种金属硬脂酸盐。消光聚合物包括丙烯酸系消光树脂、环氧改性丙烯酸系消光树脂等消光树脂、有机聚合物PERGOPAK、聚酰胺蜡微粉NEW-0401C等中的任意一种或多种。此外，无机类消光剂还可提升环氧丙烯酸酯在光固化过程中的性能，如增强所得油墨层的强度、抗冲击性等。PERGOPAK可以增强消光阻焊油墨层的硬度和抗磨耗性，且不影响油墨的流变性。
本申请一些实施方式中，所述金属皂类消光剂和无机类消光剂的二次颗粒粒径的数值控制在10μm～15μm的范围内。这里的“二次颗粒粒径”是指通过马尔文粒度仪等测得的表征团聚体的粒度大小。消光剂的二次颗粒粒径在上述范围，能保证它们在油墨中的均匀分散性和良好的消光效果，以及提高固化后的消光阻焊油墨层的机械性能。
进一步地，金属皂类消光剂、无机类消光剂的表面可以经下述偶联剂、表面活性剂(如十二烷基苯磺酸钠、月桂酸钠、聚二甲基硅氧烷等)、有机蜡、有机硅树脂等进行表面改性，以增强它们在第一组分和第二组分中的分散性。
本申请实施方式中，偶联剂可以包括硅烷类偶联剂、钛酸酯类偶联剂和铝酸酯类偶联剂中的一种或多种。偶联剂同时具有能和无机材料(如纳米黑色填料、无机类消光剂)结合的基团以及与有机材料(如环氧树脂、低聚物等)结合的基团，可以改善有机材料和无机材料的界面性能，提高第一组分和第二组分中各原料的分散性和相容性。
其中，硅烷类偶联剂可以包括氨丙基三乙氧基硅烷、氨丙基三甲氧基硅烷、2-氨乙基-氨丙基三甲氧基硅烷和二乙烯三氨基丙基三甲氧基硅烷中的任意一种或多种。钛酸酯类偶联剂可以包括异丙基二油酸酰氧基(二辛基磷酸酰氧基)钛酸酯、异丙基三(二辛基磷酸酰氧基)钛酸酯、三异硬酯酸钛酸异丙酯、三异硬酯酸钛酸异丙酯和四异丙基二(二辛基亚磷酸酰氧基)钛酸酯中的任意一种或多种。铝酸酯类偶联剂可以包括二硬脂酰氧异丙基铝酸酯、DL-411、DL-411AF、DL-411D、DL-411DF、防沉降性铝酸酯ASA等中的任意一种或多种。
上述第一组分和第二组分中的溶剂可以包括但不限于酯类溶剂、醚类溶剂、酮类溶剂、烃类溶剂等中的任意一种或多种，但不限于此。对于所述酯类溶剂，可以列举乙酸甲酯、乙酸乙酯、乙酸丁酯、丁酸乙酯、碳酸二甲酯、乙二醇乙醚醋酸酯、丙二醇甲醚醋酸酯(PGMEA)、丙二醇乙醚醋酸酯、DBE溶剂等。对于所述醚类溶剂，可以列举乙二醇二甲醚、二乙二醇二甲醚、二乙二醇二甲醚、二丙二醇甲醚乙二醇单甲醚、丙二醇单甲醚、二甘醇二甲醚等。对于所述烃类溶剂，可以列举甲苯、二甲苯、四甲苯、乙苯等。优选地，所述溶剂可以为多种有机溶剂的混合物。
可选地，上述第一组分和第二组分中还可以分别含有增韧剂、消泡剂、流平剂和分散剂等中的至少一种助剂。其中，添加增韧剂可以提高消光阻焊油墨形成的油墨层的韧性，使油墨层具有高抗冲击性。消泡剂能够有效降低消光阻焊油墨在制备和使用过程中产生气泡的概率，提高油墨层的质量可靠性。流平剂可以降低消光阻焊油墨的表面张力，促使其形成平整、光滑、均匀的油墨层。分散剂能够保证油墨中各原料的均匀分散，提升消光阻焊油墨的稳定性。
可选地，所述消光阻焊油墨的可见光吸收率大于或等于90％。在上述纳米黑色填料及第一组分和第二组分中消光剂的协同作用下，使得消光阻焊油墨具有良好的消光效果，对可见光的吸收率可以在90％以上。
可选地，所述消光阻焊油墨在25℃下的粘度为160Pa·s～220Pa·s。该消光阻焊油墨的粘度适中，适用于通过丝网印刷的方式制备到PCB板上，提高制备效率，且其印刷到PCB板上后不易流动，尽可能保证PCB板上的油墨尽可能与丝网印版的图文部分的网孔对应。具体地，所述消光阻焊油墨在25℃下的粘度可以为170Pa·s、180Pa·s、190Pa·s、200Pa·s、210Pa·s或220Pa·s。
本申请实施例上述提供的消光阻焊油墨中，各原料的配比合理、分散性能好，该消光阻焊油墨可较易在PCB板上完全附着，其可经预烘烤、曝光处理、显影处理、后烘烤处理等得到的图案化的消光阻焊油墨层具有良好消光效果及耐高温性。
其中，上述消光阻焊油墨可以通过以下方法制备：
S01，将低聚物、光引发剂、纳米黑色填料、消光剂、偶联剂和溶剂按比例混合，搅拌均匀后，再经研磨得到第一组分；上述各原料按如下质量百分含量混合：低聚物：20％～50％，光引发剂：0.5％～15％，纳米黑色填料：5％～15％，消光剂：10％～30％，偶联剂：0.2％～2％，溶剂：10％～30％；
S02，将环氧树脂、功能单体、消光剂、偶联剂和溶剂按比例混合，搅拌均匀后，再经研磨得到第二组分；上述各原料按如下质量百分含量混合：环氧树脂：20％～40％，功能单体：5％～40％，消光剂：10％～20％，偶联剂：0.2％～2％，溶剂：5％～15％；
S03，所述第一组分与所述第二组分分开储存，使用时，将所述第一组分与所述第二组分按比例混合，得到消光阻焊油墨。
步骤S01中，所述搅拌是在温度小于或等于45℃进行。较低的搅拌温度可以保证组分中的溶剂不易挥发。例如，搅拌温度可以为15℃～45℃，具体可以但不限于为45℃、40℃、 37℃、30℃、25℃、20℃、15℃。所述搅拌的速度可以为500r/min～2000r/min；搅拌时间可以为20min～80min。在一些实施例中，搅拌速度为800r/min～1500r/min，搅拌时间可以为40min～60min。所述研磨采用的设备可以包括圆盘式研磨机、转轴式研磨机和三辊研磨机等中的一种，但不限于此。研磨时的转速可以为400r/min～600r/min，研磨时间为30min～60min。在一些实施例中，研磨转速可以为500r/min，研磨时间为50min。
步骤S02中搅拌温度及时间的范围、研磨转速及时间的范围可以如上述步骤S01所述，在此不再赘述，但具体的搅拌温度及时间值、研磨转速及时间值可以不同。上述消光阻焊油墨的制备方法简单，适合进行大规模生产。
相应地，本申请实施例还提供了一种使用上述消光阻焊油墨的LED显示模组的制备方法，包括以下步骤：
S100，将上述第一组分与第二组分混合后得到的消光阻焊油墨涂敷或印刷在PCB板的第一表面上，再经预烘烤、曝光处理、显影处理、后烘烤，形成图案化的消光阻焊油墨层；
S200，将多个LED灯珠贴装在所述第一表面上未被所述消光阻焊油墨层覆盖的区域上，得到LED显示模组。
步骤S100中，PCB板的第一表面为PCB板待贴装LED灯珠的一侧表面。上述涂敷的方式可以包括刷涂、喷涂、刮涂或旋涂等，印刷的具体方式可以为丝网印刷，其生产效率较高。上述消光阻焊油墨的粘度适中，适合通过丝网印刷的方式丝印到PCB板上。其中，丝网印刷的过程包括：将丝网印版放置于承印物(如PCB板)上，在丝网印版的一端倒入上述消光阻焊油墨，施加一定的压力，使上述消光阻焊油墨通过丝网印版的孔眼转移到承印物上，形成消光阻焊油墨层。之后将丝网印刷后的湿涂层通过预烘烤、曝光处理、显影处理、后烘烤等完成图形的最终转移，得到图案化的消光阻焊油墨层，使所需要的焊盘裸露，其它的地方被保护起来。其中，所需要的焊盘对应LED灯珠的待贴装区域，也即是在所述第一表面未被所述消光阻焊油墨层覆盖的区域。
具体地，所述预烘烤的目的是将所述消光阻焊油墨中的有机溶剂挥发掉，使其凝固，减少流动性。本申请一些实施方式中，所述预烘烤的过程可以包括：将带有消光阻焊油墨的PCB板放到温度为65℃～75℃的烤箱中，预烘烤时间35min～50min，之后自然冷却至室温。优选地，所述预烘烤的温度为70℃～72℃，预烘烤时间为40min～45min。
所述曝光处理是利用活性光线隔着预定的光掩模板对预烘烤后的消光阻焊油墨进行曝光，以使被曝光的消光阻焊油墨中的功能单体与低聚物在光引发剂的作用下发生交联反应 形成交联结构。可选地，活性光线可以为紫外光，即，所述曝光是在紫外光下进行。其中，光掩模板的形状与LED灯珠的排布形状相对应，未被曝光部分后续可被显影液除去。本申请一些实施方式中，所述曝光时到达消光阻焊油墨面的曝光能量可以为200mJ/cm 2～400mJ/cm 2。
所述显影处理是利用显影液除去不必要的部分(本申请中是指未曝光区域)，得到所需的图案化的消光阻焊油墨层。其中，所述显影液通常为碱性溶液。具体地可使用氢氧化钠、氢氧化钾、碳酸钠、碳酸氢钠、氨水等无机碱的溶液，二乙胺、三甲基胺、四甲基氢氧化铵(TMAH)、三乙醇胺等碱性有机胺。此外，所述显影液还可添加适当量的甲醇、乙醇等的水溶性有机溶剂及表面活性剂。可选地，显影液的温度为32℃～40℃。显影时间根据膜厚、消光阻焊油墨的溶解性而确定。
后烘烤可以以使图案化的消光阻焊油墨层进一步固化，提升涂层的致密性、稳定其与PCB板的附着力等。可选地，所述后烘烤可以在150℃～160℃的温度烘烤50min～70min。
步骤S200中，在将LED灯珠贴装到PCB板的第一表面上之后，还包括：将芯片、电阻、电容等电子元器件焊接在PCB的第二表面上(与第一表面相对设置)。此时，带有LED灯珠、上述电子元器件的PCB板，可称为灯板。之后，可以将该灯板通过锁螺丝的方式安装在底壳上，得到LED显示模组。
本申请实施例提供的使用消光阻焊油墨的LED显示模组，通过上述消光阻焊油墨在PCB板上形成的消光阻焊油墨层具有良好的绝缘性和耐高温性，并具有良好的消光效果，可有效地改善由该LED显示模组拼接成的LED显示屏黑屏墨色不一致性的问题，无需再给带该消光阻焊油墨的LED显示模组进行喷墨处理，缩短了制备工序，提高了生产效率、降低了生产成本。
本申请一些实施方式中，图3中，LED显示模组100中的消光阻焊油墨层30的厚度可以为25μm～35μm。具体可以但不限于为26μm、28μm、30μm、32μm或35μm。通过在LED显示模组上设置上述厚度的消光阻焊油墨层30，能够较好地改善LED显示屏黑屏墨色不一致性，且不会因厚度过厚而影响LED灯珠20的焊接。
下面分多个实施例对本申请实施方式进行进一步地说明。
实施例1
一种消光阻焊油墨，可用于LED显示屏的PCB板，该消光阻焊油墨包括分开储存的 第一组分和第二组分，所述第一组分包括以下质量百分含量的各原料：
低聚物(具体为改性邻甲基酚醛环氧丙烯酸树脂，60℃下的粘度为2500mPa·s)：35％；
光引发剂：10％，具体为7％的2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮和3％的2-异丙基硫杂蒽酮；
纳米黑色填料(具体为碳微球，粒径为30nm)：10％；
消光剂(具体为气相法二氧化硅，二次颗粒粒径为10μm)：18％；
偶联剂(具体为氨丙基三乙氧基硅烷)：2％；
DBE溶剂：25％；
所述第二组分包括以下质量百分含量的各原料：
环氧树脂(具体为酚醛型环氧树脂，25℃下的粘度为2000mPa·s)：40％；
功能单体(具体为DPHA)：33％；
消光剂(具体为气相法二氧化硅，二次颗粒粒径为10μm)：15％；
偶联剂(具体为氨丙基三乙氧基硅烷)：2％；
DBE溶剂：10％；
使用时，将第一组分和第二组分按3：1的质量比混合，得到消光阻焊油墨。
该消光阻焊油墨的制备方法包括：
(1)按以上第一组分的原料配比来称取各原料，并加入到配料容器中进行搅拌，搅拌时温度小于或等于45℃，搅拌速度为1000r/min，搅拌时间为50min；搅拌均匀后，在三辊研磨机进行研磨，研磨转速为500r/min，时间为50min，得到分散均匀的第一组分；
(2)按以上第二组分的原料配比来称取各原料，并加入到配料容器中进行搅拌，搅拌时温度小于或等于45℃，搅拌速度为800r/min，搅拌时间为60min；搅拌均匀后，在三辊研磨机进行研磨，研磨转速为600r/min，时间为60min，得到分散均匀的第二组分；在需要使用该消光阻焊油墨时，再将第一组分和第二组分混合。
可通过以下方式将实施例1的消光阻焊油墨应用到LED显示屏上。具体地，将实施例1的消光阻焊油墨通过丝网印刷的方式丝印在LED显示屏的PCB板的第一表面上，放入温度为70℃的烤箱中预烘烤45min以除去溶剂，形成一膜层；之后对该膜层采用掩模版罩在紫外灯下进行曝光处理，曝光时到达消光阻焊油墨面的曝光能量300mJ/cm 2；之后采用1wt％的Na 2CO 3溶液对曝光后的膜层进行显影，之后用超纯水清洗；最后在150℃下进行60min的后烘处理，在PCB板上形成图案化的消光阻焊油墨层，且其未覆盖待贴装LED灯珠的 焊盘。
之后将多个LED灯珠贴装在第一表面未被消光阻焊油墨层覆盖的区域(即，焊盘)上，将芯片、电阻、电容等电子元器件焊接在PCB的与正面相对设置的背面上，得到LED显示屏的灯板，再将灯板通过锁螺丝的方式安装在底壳上，得到LED显示模组。
将多个所述LED显示模组进行拼接并固定在箱体框架上，得到一个完整的显示箱体；再将多个显示箱体拼接，得到LED显示屏。
实施例2
一种消光阻焊油墨，包括分开储存的第一组分和第二组分，所述第一组分包括以下质量百分含量的各原料：
低聚物(具体为酚醛环氧丙烯酸树脂，60℃下的粘度为3000mPa·s)：33％；
光引发剂10％，具体为7％的2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮和3％的2-异丙基硫杂蒽酮)；
纳米黑色填料(具体为碳微球，粒径为30nm)：10％；
消光剂(具体为气相法二氧化硅，二次颗粒粒径为10μm)：20％；
偶联剂(具体为氨丙基三乙氧基硅烷)：2％；
DBE溶剂：25％；
所述第二组分包括以下质量百分含量的各原料：
环氧树脂(具体为双酚F型环氧树脂，25℃下的粘度为1500mPa·s)：35％；
功能单体(具体为DPHA)：30％；
消光剂(具体为气相法二氧化硅，二次颗粒粒径为10μm)：20％；
偶联剂(具体为氨丙基三乙氧基硅烷)：2％；
DBE溶剂：13％；
使用时，将第一组分和第二组分按3：1的质量比混合，得到消光阻焊油墨。
将实施例2提供的消光阻焊油墨根据实施例1记载的方式，应用到LED显示屏上。
实施例3
一种消光阻焊油墨，包括分开储存的第一组分和第二组分，所述第一组分包括以下质量百分含量的各原料：
低聚物(具体为双酚A型环氧丙烯酸树脂，60℃下的粘度为2000mPa·s)：35％；
光引发剂：10％，具体为7％的2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮和3％的2-异丙基硫杂蒽酮；
纳米黑色填料(具体为碳粉，粒径为20nm)：10％；
消光剂(具体为沉淀法二氧化硅，二次颗粒粒径为20μm)：20％；
偶联剂(具体为氨丙基三乙氧基硅烷)：2％；
DBE溶剂：23％；
所述第二组分包括以下质量百分含量的各原料：
环氧树脂(具体为脂肪族环氧树脂，25℃下的粘度为2000mPa·s)：35％；
功能单体(具体为DPHA)：30％；
消光剂(具体为沉淀法二氧化硅，二次颗粒粒径为10μm)：20％；
偶联剂(具体为氨丙基三乙氧基硅烷)：2％；
DBE溶剂：13％；
使用时，将第一组分和第二组分按3：1的质量比混合，得到消光阻焊油墨。
将实施例3提供的消光阻焊油墨根据实施例1记载的方式，应用到LED显示屏上。
本申请实施例提供的消光阻焊油墨的颜色呈哑光黑色，为对本申请实施例的技术方案带来的有益效果进行有力支持，特提供各实施例的消光阻焊油墨的性能测试结果，如见表1所示。
表1实施例1-3制得消光阻焊油墨和消光阻焊油墨层的性能参数表
测试项目 实施例1 实施例2 实施例3
粘度(混合后)(Pa·s) 190 200 200
密度(混合后)(g/cm 3) 1.35 1.39 1.38
厚度(μm) 26 28 28
铅笔硬度 6H以上 6H以上 6H以上
绝缘电阻(Ω) 4.0×10 12 4.5×10 12 3.3×10 12
介电常数 4.8 4.6 4.9
介电损耗 0.030 0.028 0.034
可见光吸收率(％) 90 92 92
从表1可以获知，本申请实施例1-3提供的消光阻焊油墨的粘度较高，适合通过丝网印刷的方式制备在PCB板上；形成的图案化消光阻焊油墨层的光泽度较低，对可见光的吸收率较高，在90％以上，消光效果良好；另外，消光阻焊油墨层的硬度高、绝缘性好，可具有良好阻焊效果。此外，图4为本申请实施例提供的带消光阻焊油墨层的LED显示屏在黑屏时的照片，与图1的现有LED显示屏相比，带消光阻焊油墨层的LED显示屏在黑屏墨色一致性高，给人的视觉感受好。

Claims (15)

  1. 一种消光阻焊油墨，其特征在于，所述消光阻焊油墨包括第一组分和第二组分，所述第一组分包括以下质量百分含量的各原料：低聚物：20％～50％，光引发剂：0.5％～15％，纳米黑色填料：5％～15％，消光剂：10％～30％，偶联剂：0.2％～2％，溶剂：10％～30％；
    所述第二组分包括以下质量百分含量的各原料：环氧树脂：20％～40％，功能单体：5％～40％，消光剂：10％～20％，偶联剂：0.2％～2％，溶剂：5％～15％；
    所述第一组分与所述第二组分分开储存，使用时，所述第一组分与所述第二组分混合后形成所述消光阻焊油墨。
  2. 如权利要求1所述的消光阻焊油墨，其特征在于，所述纳米黑色填料包括石墨烯、碳微球、碳粉、碳纳米管、碳纤维、碳壳、碳膜中的任意一种或多种。
  3. 如权利要求1所述的消光阻焊油墨，其特征在于，所述纳米黑色填料的尺寸为5nm-80nm。
  4. 如权利要求1所述的消光阻焊油墨，其特征在于，所述第一组分和所述第二组分中的消光剂分别选自金属皂类消光剂、无机类消光剂、消光聚合物中的任意一种或多种。
  5. 如权利要求4所述的消光阻焊油墨，其特征在于，所述金属皂类消光剂和所述无机类消光剂的二次颗粒粒径的数值控制在10μm～15μm的范围内。
  6. 如权利要求1所述的消光阻焊油墨，其特征在于，所述低聚物为环氧丙烯酸树脂，所述环氧丙烯酸树脂在60℃下的粘度为1000mPa·s～4000mPa·s。
  7. 如权利要求6所述的消光阻焊油墨，其特征在于，所述环氧丙烯酸树脂包括双酚A型环氧丙烯酸树脂、环氧大豆油丙烯酸树脂、酚醛环氧丙烯酸树脂、改性邻甲基酚醛环氧丙烯酸树脂中的任意一种或多种。
  8. 如权利要求1所述的消光阻焊油墨，其特征在于，所述环氧树脂在25℃下的粘度为1000mPa·s～3000mPa·s。
  9. 如权利要求1所述的消光阻焊油墨，其特征在于，所述环氧树脂包括双酚A型环氧树脂、双酚F型环氧树脂、脂肪族环氧树脂、多环芳香族环氧树脂和酚醛型环氧树脂中的任意一种或多种。
  10. 如权利要求8所述的消光阻焊油墨，其特征在于，所述环氧树脂的总氯含量≤900ppm。
  11. 如权利要求1所述的消光阻焊油墨，其特征在于，在使用所述消光阻焊油墨时，所述第一组分与所述第二组分按质量比为(3～9)：1的比例混合。
  12. 如权利要求1-11任一项所述的消光阻焊油墨，其特征在于，所述消光阻焊油墨的可见光吸收率大于或等于90％。
  13. 如权利要求12所述的消光阻焊油墨，其特征在于，所述消光阻焊油墨在25℃下的粘度为160Pa·s～220Pa·s。
  14. 一种LED显示模组的制备方法，其特征在于，包括：
    将如权利要求1-13任一项所述的消光阻焊油墨涂敷或印刷在PCB板的第一表面上，再经预烘烤、曝光处理、显影处理、后烘烤，形成图案化的消光阻焊油墨层；
    将多个LED灯珠贴装在所述第一表面未被所述消光阻焊油墨层覆盖的区域上，得到LED显示模组。
  15. 一种LED显示屏，其特征在于，包括多个LED显示模组，每个LED显示模组包括PCB板和设置在PCB板上的多个LED灯珠，所述PCB板设有所述LED灯珠的一侧表面上还设有如权利要求1-13任一项所述的消光阻焊油墨经固化形成的消光阻焊油墨层，所述消光阻焊油墨层覆盖多个所述LED灯珠之间的间隙。
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CN116741062A (zh) * 2023-08-15 2023-09-12 长春希龙显示技术有限公司 一种led显示模块的封装工艺方法及led显示模块
CN117613155A (zh) * 2024-01-23 2024-02-27 长春希龙显示技术有限公司 一种黑度一致性的显示模组及其封装方法
CN117613155B (zh) * 2024-01-23 2024-06-07 长春希龙显示技术有限公司 一种黑度一致性的显示模组及其封装方法

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